TDoc | Title | Source |
---|---|---|
R1-2407585 | Draft Agenda of RAN1#118bis meeting | RAN1 Chair |
R1-2407588 | RAN1#118bis Meeting Timelines, Scope, Process | RAN1 Chair, ETSI MCC |
TDoc | Title | Source |
---|---|---|
R1-2407586 | Highlights from RAN#105 | RAN1 Chair |
TDoc | Title | Source |
---|---|---|
R1-2407587 | Report of RAN1#118 meeting | ETSI MCC |
TDoc | Title | Source |
---|---|---|
R1-2407589 | LS on IUC Scheme-2 and Random Selection | RAN2, OPPO |
R1-2407590 | LS on common TA in a regenerative payload scenario | RAN2, CMCC |
R1-2407591 | LS on power control parameters for unified TCI state framework | RAN2, Ericsson |
R1-2407592 | Reply LS on Rel-18 higher-layers parameter list | RAN2, Ericsson |
R1-2407593 | LS on data block sizes for Ambient IoT | RAN2, MediaTek |
R1-2407594 | RAN2 inputs to TR 38.843 | RAN2, Ericsson |
R1-2407595 | Reply LS on UE capability for multi-carrier enhancements | RAN2, NTT DOCOMO |
R1-2407596 | LS on Early TA acquisition for the inter-DU scenario | RAN3, Google |
R1-2407597 | LS to RAN1 on clarification of section 12.2.1 of TR 38.858 | RAN4, Charter Communications, Inc. |
R1-2407598 | Reply LS to RAN2 on UL synchronization for contention based Msg3 transmission without Msg1/Msg2 | RAN4, ZTE |
R1-2407599 | LS on RAN4 UE feature list for Rel-18 (version 6) | RAN4, CMCC |
R1-2407600 | Reply LS on Clarification of requirements for Ambient IoT | SA1, Ericsson |
R1-2407601 | Reply LS on terminology definitions for AI-ML in NG-RAN | SA5, NEC Corporation |
R1-2407602 | LS on Channel Measurements and Modeling for Joint/Integrated Communication and Sensing, as well as 7-24 GHz Communication | ATIS’ Next G Alliance |
R1-2407603 | LS on LTM L1 intra and inter-frequency measurements capabilities | RAN2, Intel |
R1-2407604 | LS on applicable functionality reporting for beam management UE-sided model | RAN2, Intel |
R1-2407605 | LS on CSI-RS/SRS for spatial relation in RRC_INACTIVE | RAN2, ZTE |
R1-2407606 | LS on correction on network verification of UE location | RAN2, CATT |
R1-2407607 | LS on AIML data collection | RAN, InterDigital |
R1-2407642 | On RAN2 LS on data block sizes for Ambient IoT | Ericsson |
R1-2407673 | Discussion on RAN2 LS on Clarification of data block sizes for Ambient IoT | Huawei, HiSilicon |
R1-2407682 | Discussion on LS on CSI-RS/SRS for spatial relation in RRC_INACTIVE | Huawei, HiSilicon |
R1-2407691 | Discussion on LS on common TA in a regenerative payload scenario | Spreadtrum Communications |
R1-2407692 | Discussion on LS on applicable functionality reporting for beam management UE-sided model | Spreadtrum Communications |
R1-2407693 | Discussion on LS IUC Scheme-2 and Random Selection | Spreadtrum Communications |
R1-2407727 | Discussion on RAN2 LS on data block sizes for Ambient IoT | China Telecom |
R1-2407778 | Draft reply LS to RAN2 on LTM L1 intra and inter-frequency measurements capabilities | ZTE Corporation, Sanechips |
R1-2407791 | Discussion on LS on data block sizes for Ambient IoT | Spreadtrum Communications |
R1-2407795 | Discussion and reply LS on applicable functionality reporting for beam management UE-sided model | ZTE Corporation, Sanechips |
R1-2407825 | Draft LS reply on IUC Scheme-2 and Random Selection | vivo |
R1-2407826 | Draft LS reply on LTM L1 intra and inter-frequency measurements capabilities | vivo |
R1-2407827 | Draft reply LS on data block sizes for Ambient IoT | vivo |
R1-2407828 | Draft Reply LS on CSI-RS/SRS for spatial relation in RRC_INACTIVE | vivo |
R1-2407829 | Draft reply LS on applicable functionality reporting for beam management UE-sided model | vivo |
R1-2407830 | Draft reply LS on common TA in a regenerative payload scenario | vivo |
R1-2407831 | Draft reply LS on DL coverage enhancements | vivo |
R1-2407885 | Discussion on applicable functionality reporting for beam management UE-sided model | CMCC |
R1-2407886 | Discussion on RAN2 LS on data block size for Ambient IOT | CMCC |
R1-2407887 | Draft reply LS on data block size for Ambient IoT | CMCC |
R1-2407888 | Discussion on the LS on common TA in a regenerative payload scenario | CMCC |
R1-2407889 | Draft reply LS on common TA in a regenerative payload scenario | CMCC |
R1-2407890 | Discussion on RAN4 LS on clarification of TR 38.858 | CMCC |
R1-2407891 | Draft CR for TR 38.858 on regulatory aspects for deploying SBFD in TDD unpaired spectrum | CMCC |
R1-2407929 | Discussion on LS on common TA in a regenerative payload scenario | ZTE Corporation, Sanechips |
R1-2407930 | Discussion on LS on correction on network verification of UE location | ZTE Corporation, Sanechips |
R1-2407942 | Discussion on RAN2 LS on data block sizes for Ambient IoT | Xiaomi |
R1-2407943 | Draft reply LS on RAN2 LS on data block sizes for Ambient IoT | Xiaomi |
R1-2407944 | Discussion on the UL synchronization for contention based Msg3 transmission without Msg1/Msg2 | Xiaomi |
R1-2407945 | Discussion on LS on applicable functionality reporting | Xiaomi |
R1-2407946 | Draft reply LS on applicable functionality reporting | Xiaomi |
R1-2407982 | Draft Reply LS on applicable functionality reporting for beam management UE-sided model | |
R1-2407998 | Discussion on reply LS on applicable functionality reporting for beam management UE-sided model | CATT |
R1-2407999 | Draft Reply LS on IUC Scheme-2 and Random Selection | CATT, CICTCI |
R1-2408000 | Discussion on CSI-RS/SRS for spatial relation in RRC_INACTIVE | CATT |
R1-2408001 | Draft reply LS on CSI-RS/SRS for spatial relation in RRC_INACTIVE | CATT |
R1-2408002 | Draft reply LS on LTM L1 intra and inter-frequency measurements capabilities | CATT |
R1-2408003 | Discussion on LS reply on common TA in a regenerative payload | CATT |
R1-2408004 | Discussion on LS on correction on network verification of UE location | CATT |
R1-2408005 | Draft reply LS on applicable functionality reporting for beam management UE-sided model | CATT |
R1-2408063 | Discussion on data block sizes for Ambient IoT | ZTE Corporation, Sanechips |
R1-2408064 | Draft reply to LS on data block sizes for Ambient IoT | ZTE Corporation, Sanechips |
R1-2408124 | Discussion on LS on LTM L1 intra and inter-frequency measurements capabilities | OPPO |
R1-2408125 | Discussion on IUC scheme 2 and random selection in NR SL | OPPO |
R1-2408126 | Draft reply LS on IUC scheme 2 and random selection in NR SL | OPPO |
R1-2408140 | Discussion on RAN2 LS about the common TA issue in regenerative payload scenario | OPPO |
R1-2408141 | Draft LS reply on common TA in regenerative payload scenario | OPPO |
R1-2408151 | Discussion on LS from RAN2 on data block sizes for Ambient IoT | OPPO |
R1-2408152 | Draft reply LS to RAN2 on data block sizes for Ambient IoT | OPPO |
R1-2408163 | Discussion on LS on applicable functionality reporting for beam management UE-sided model | OPPO |
R1-2408169 | Discussion the RAN2 LS on R18 LTM UE features | Huawei, HiSilicon |
R1-2408170 | Discussion on the reply of LS on common TA in a regenerative payload scenario | Huawei, HiSilicon |
R1-2408171 | Draft reply LS on common TA in a regenerative payload scenario | Huawei, HiSilicon |
R1-2408181 | Discussion on the LS reply to RAN2 related with functionality | Huawei, HiSilicon |
R1-2408185 | Discussion on RAN2 LS on IUC Scheme-2 and Random Selection | Huawei, HiSilicon |
R1-2408186 | Draft CR to capture the clarification on SBFD co-existence in TR 38.858 | Huawei, HiSilicon |
R1-2408204 | Draft Reply LS on LTM L1 intra and inter-frequency measurements capabilities | Lenovo |
R1-2408225 | Discussion on RAN2 LS on applicable functionality reporting for beam management UE-sided model | NEC |
R1-2408226 | Discussion on RAN2 LS on common TA in a regenerative payload scenario | NEC, TCL |
R1-2408286 | Draft Reply LS on CSI-RS/SRS for spatial relation in RRC_INACTIVE | Intel Corporation |
R1-2408297 | Discussion on LS on IUC Scheme-2 and Random Selection | LG Electronics |
R1-2408306 | Discussion of RAN2 LS reply on applicable functionality reporting for beam management | Ericsson |
R1-2408331 | Discussion on reply LS on applicable functionality reporting for beam management UE-sided model | Sharp |
R1-2408396 | Discussion on the LS on common TA in a regenerative payload scenario | THALES |
R1-2408397 | Draft reply LS on common TA in a regenerative payload scenario | THALES |
R1-2408398 | Discussion on LS on correction on network verification of UE location | THALES |
R1-2408427 | Discussion on the reply to LS on applicable functionality reporting for beam management UE-sided model | Lenovo |
R1-2408439 | Draft Reply LS to RAN2 on IUC Scheme-2 and Random Selection | Apple |
R1-2408440 | Discussion on RAN2 LS on DL Coverage Enhancements | Apple |
R1-2408441 | Draft Reply LS to RAN2 on DL Coverage Enhancements | Apple |
R1-2408442 | Discussion on RAN2 LS on Common TA in a Regenerative Payload Scenario | Apple |
R1-2408443 | Draft Reply LS to RAN2 on Common TA in a Regenerative Payload Scenario | Apple |
R1-2408444 | Draft reply LS on LTM L1 intra and inter-frequency measurements capabilities | Apple |
R1-2408445 | Discussion on RAN2 LS on data block sizes for AIoT | Apple |
R1-2408446 | Draft reply LS to RAN2 on data block sizes for AIoT | Apple |
R1-2408447 | Discussion on RAN2 LS on applicable functionality reporting for beam management UE-sided model | Apple |
R1-2408509 | Draft reply LS on CSI-RS and SRS for spatial relation | ZTE Corporation, Sanechips |
R1-2408521 | Draft reply LS on IUC Scheme-2 and Random Selection | ZTE Corporation, Sanechips |
R1-2408549 | Draft LS reply on applicable functionality reporting for AI/ML beam management | Nokia |
R1-2408550 | Discussion on applicable functionality reporting for AI/ML beam management | Nokia |
R1-2408556 | Discussion on common TA in a regenerative payload scenario | ETRI |
R1-2408612 | Discussion on RAN2 LS on common TA in a regenerative payload scenario | Samsung |
R1-2408613 | Draft LS reply on CSI-RS/SRS for spatial relation in RRC_INACTIVE | Samsung |
R1-2408614 | Draft LS reply on LTM L1 intra and inter-frequency measurements capabilities | Samsung |
R1-2408615 | Draft LS reply on applicable functionality reporting for beam management | Samsung |
R1-2408616 | Discussion on RAN2 LS about IUC Scheme-2 and Random Selection | Samsung |
R1-2408696 | Discussion on RAN2 LS on data block sizes for Ambient IoT | MediaTek Inc. |
R1-2408697 | Draft reply LS to RAN2 on data block sizes for Ambient IoT | MediaTek Inc. |
R1-2408698 | Discussion on reply LS on common TA in regenerative payload in NTN NR | MediaTek Inc. |
R1-2408723 | Discussion on RAN2 LS on Rel-18 LTM UE Features | Nokia |
R1-2408725 | Discussion on RAN2 LS on data block sizes for Ambient IoT | InterDigital, Inc. |
R1-2408726 | Discussion on LS on common TA in a regenerative payload scenario | Nokia |
R1-2408737 | Rel-18 higher-layers parameter name corrections for TS 38.214 | Nokia |
R1-2408769 | Discussion on applicable functionality reporting for beam management UE-sided model | NTT DOCOMO, INC. |
R1-2408770 | Draft reply LS on data block sizes for Ambient IoT | NTT DOCOMO, INC. |
R1-2408771 | Discussion on RAN2 LS of SL IUC scheme 2 and random selection | NTT DOCOMO, INC. |
R1-2408772 | Discussion on RAN2 LS of common TA for regenerative payload | NTT DOCOMO, INC. |
R1-2408831 | Draft reply LS on data block sizes for Ambient IoT | Qualcomm Incorporated |
R1-2408832 | Draft reply LS on IUC Scheme-2 and Random Selection | Qualcomm Incorporated |
R1-2408833 | Discussion for LS reply on applicable functionality reporting | Qualcomm Incorporated |
R1-2408897 | Draft Reply to ATIS LS on Channel Measurements and Modeling for Joint/Integrated Communication and Sensing, as well as 7-24 GHz Communication | Nokia |
R1-2408906 | Discussion on RAN2 LS on common TA in a regenerative payload scenario | Ericsson |
R1-2408912 | Discussion on LS on IUC Scheme-2 and Random Selection | Ericsson |
R1-2408913 | Discussion on CSI-RS and SRS for spatial relation in RRC_INACTIVE | Ericsson |
R1-2408914 | Draft reply LS on IUC Scheme-2 and Random Selection | Ericsson |
R1-2408915 | Draft reply LS on CSI-RS and SRS for spatial relation in RRC_INACTIVE | Ericsson |
R1-2408947 | [Draft ]Reply LS on IUC Scheme-2 and Random Selection | Nokia |
R1-2409024 | On RAN2 LS on data block sizes for Ambient IoT | Ericsson |
R1-2409172 | Moderator summary #1 for RAN1 reply to RAN2 LS on IUC Scheme-2 and Random Selection | Moderator (OPPO) |
R1-2409173 | Draft reply LS on IUC Scheme-2 and Random Selection | OPPO |
R1-2409174 | Reply LS on IUC Scheme-2 and Random Selection | RAN1, OPPO |
R1-2409287 | CR for TR 38.858 on regulatory aspects for deploying SBFD in TDD unpaired spectrum | Moderator (CMCC), Charter Communications Inc, Huawei, Ericsson, New H3C, TCL, ZTE, Samsung |
TDoc | Title | Source |
---|---|---|
R1-2408448 | Draft CR on alignment of high layer parameter for PUR | Apple |
R1-2408449 | Draft CR on alignment of high layer parameter for PUR (Rel-17 mirror) | Apple |
R1-2408450 | Draft CR on alignment of high layer parameter for PUR (Rel-18 mirror) | Apple |
R1-2409081 | Moderator summary of discussion on alignment of high layer parameter for PUR | Moderator (Apple) |
R1-2409214 | Session notes for 6 (Pre-Rel-18 E-UTRA maintenance) | Ad-Hoc Chair (CMCC) |
R1-2409320 | Corrections to higher-layers parameters for Additional MTC Enhancements for LTE and Additional enhancements for NB-IoT | Motorola Mobility |
R1-2409321 | Rel-16 corrections to higher-layers parameters for Additional MTC Enhancements for LTE and Additional enhancements for NB-IoT | Motorola Mobility |
R1-2409323 | Rel-16 corrections to higher-layers parameters for Additional MTC Enhancements for LTE and Additional enhancements for NB-IoT | Motorola Mobility |
TDoc | Title | Source |
---|---|---|
R1-2407779 | Discussion on SRS power scaling once extending Pcmax | ZTE Corporation, Sanechips |
R1-2407785 | Discussion on QCL relationship for SSB with additional PCI | ZTE Corporation, Sanechips |
R1-2407786 | Draft CR on QCL relationship of SSBs transmitted with the same block index in TS 38.211 | ZTE Corporation, Sanechips |
R1-2407788 | Discussion on higher layer parameters for TCI state of SRS transmission | ZTE Corporation, Sanechips |
R1-2407822 | Discussion on timeline for determining activated TCI state(s) in unified TCI framework | ZTE Corporation, Sanechips |
R1-2407823 | Draft CR on timeline for determining activated TCI state(s) in unified TCI framework in TS 38.214 | ZTE Corporation, Sanechips, Ericsson, MediaTek, Samsung, NTT DOCOMO |
R1-2407832 | Discussion on power scaling for multiple simultaneous SRS transmission | vivo |
R1-2407833 | Draft CR on CPU occupation for L1-SINR | vivo |
R1-2407834 | Draft CR on CPU occupation for L1-SINR (Rel-17 mirror) | vivo |
R1-2407835 | Draft CR on CPU occupation for L1-SINR (Rel-18 mirror) | vivo |
R1-2407836 | Draft CR on default TCI state determined by CORESET with the lowest ID in the latest slot in HST-SFN scheme | vivo |
R1-2407837 | Draft CR on default TCI state determined by CORESET with the lowest ID in the latest slot in HST-SFN scheme (Rel-18 mirror) | vivo |
R1-2407838 | Draft CR on default TCI state for PDSCH without TCI field in DCI in HST-SFN scheme | vivo |
R1-2407839 | Draft CR on default TCI state for PDSCH without TCI field in DCI in HST-SFN scheme (Rel-18 mirror) | vivo |
R1-2407947 | Continuation of the discussion on UE procedure for applying transform precoding on PUSCH from Rel-17 | Xiaomi |
R1-2407948 | Discussion on SRS and PUCCH collision handling | Xiaomi |
R1-2407949 | Draft CR for 38.214 on SRS and PUCCH collision handling | Xiaomi |
R1-2407983 | Discussion on SRS power scaling | |
R1-2408006 | Continued discussions on UE procedure for applying transform precoding on PUSCH | CATT, Nokia |
R1-2408007 | Correction on UE capability of partial cancellation of configured UL transmissions | CATT |
R1-2408008 | Discussion on SRS power scaling and transmission | CATT |
R1-2408009 | Clarification on SRS power scaling for non-codebook based UL transmission | CATT |
R1-2408010 | Discussion on PUCCH transmission cancellation due to aperiodic SRS | CATT |
R1-2408011 | Draft CR on PUCCH transmission cancellation due to aperiodic SRS | CATT |
R1-2408012 | Draft CR on determination of SRS power control parameters in unified TCI framework | CATT |
R1-2408013 | Clarification on the first CG PUSCH and SPS PDSCH in overriding handling | CATT |
R1-2408085 | Discussion on Rel-17 unified TCI framework | MediaTek Inc. |
R1-2408173 | Discussion on transmission power for simultaneously transmitted SRS resources | Huawei, HiSilicon |
R1-2408178 | Discussion on open-loop power control parameters for Scell | Huawei, HiSilicon |
R1-2408179 | Corrections on open-loop power control parameters for Scell | Huawei, HiSilicon |
R1-2408197 | Draft CR on DCI-based unified TCI state update | MediaTek Inc. |
R1-2408198 | Draft CR on PDSCH reception scheduled by CORESET not following the unified TCI state | MediaTek. Inc, NTT DOCOMO. INC, Ericsson |
R1-2408205 | Draft CR on value of dmrs-TypeA-Position in TS 38.211 | NEC |
R1-2408516 | Correction on antenna port description for DMRS associated with a PSBCH in TS 38.211 | ZTE Corporation, Sanechips |
R1-2408586 | Discussion on PUSCH waveform determination in RACH procedure | Ericsson |
R1-2408709 | Clarification on interaction between SSSG and BWP or SR or RA | MediaTek Inc. |
R1-2408712 | RedCap NCD-SSB MIB parameters | MediaTek Inc. |
R1-2408834 | NCD-SSB for RedCap | Qualcomm Incorporated |
R1-2408953 | Rank restricted UE with 1024QAM | Nokia |
R1-2408954 | MIB contents of NCD-SSB | Nokia |
R1-2408961 | Draft CR on PTRS-DMRS Association | Ericsson |
R1-2408963 | Draft CR on SRI and TPMI for Multi-TRP PUSCH Repetition | Ericsson |
R1-2408979 | Correction on TCI activation for mDCI based mTRP in 38.214 | Huawei, HiSilicon |
R1-2408980 | Correction on TCI activation for mDCI based mTRP in 38.214 (mirror on Rel-18) | Huawei, HiSilicon |
R1-2408982 | Correction on the determination of multi-DCI multi-TRP for PDSCH | Huawei, HiSilicon |
R1-2409021 | Summary of NR Pre-Rel18 maintenance discussion for SRS power scaling and transmission occasion | Moderator (Ericsson) |
R1-2409025 | Correction on virtual PHR calculation in 38.213 | Huawei, HiSilicon |
R1-2409056 | Summary on PDSCH reception scheduled by CORESET not following the unified TCI state (Rel-17 MIMO) | Moderator (MediaTek Inc.) |
R1-2409073 | Moderator summary 1 of interaction between SSSG and BWP or SR or RA | Moderator (MediaTek Inc.) |
R1-2409074 | Moderator summary 2 of interaction between SSSG and BWP or SR or RA | Moderator (MediaTek Inc.) |
R1-2409076 | void | ETSI MCC |
R1-2409077 | void | ETSI MCC |
R1-2409082 | Summary of PUCCH cancellation due to A-SRS | Moderator (CATT) |
R1-2409083 | Summary of UE capability of partial cancellation of configured UL transmissions | Moderator (CATT) |
R1-2409084 | Summary of UE procedure for applying transform precoding on PUSCH | Moderator (CATT) |
R1-2409085 | Summary of clarification on the first CG PUSCH and SPS PDSCH in overriding handling | Moderator (CATT) |
R1-2409132 | Summary on default TCI state determined by CORESET with the lowest ID in the latest slot in HST-SFN scheme | Moderator (vivo) |
R1-2409133 | Summary on discussion on default TCI state for PDSCH without TCI field in DCI in HST-SFN scheme | Moderator (vivo) |
R1-2409137 | Correction on TCI activation for mDCI based mTRP in 38.214 | Huawei, HiSilicon, New H3C, ZTE, Samsung |
R1-2409138 | Correction on TCI activation for mDCI based mTRP in 38.214 | Huawei, HiSilicon, New H3C, ZTE, Samsung |
R1-2409139 | Summary on the SRS and PUCCH collision handling (Rel-17 MIMO) | Moderator (Xiaomi) |
R1-2409143 | FLS #1 on antenna port description for DMRS associated with a PSBCH | Moderator (ZTE ) |
R1-2409148 | Moderator summary of correction on dmrs-TypeA-Position value | Moderator (NEC) |
R1-2409182 | Summary of QCL relationship of SSBs transmitted with the same block index | Moderator (ZTE) |
R1-2409183 | Summary of higher layer parameters for TCI state of SRS transmission | Moderator (ZTE) |
R1-2409184 | Summary#1 of Discussion on open-loop power control parameters for SCell | Moderator (Huawei) |
R1-2409188 | Moderator summary #1: RedCap NCD-SSB MIB parameters | Moderator (MediaTek) |
R1-2409189 | Summary on timeline for determining activated TCI state(s) in Rel-17 UTCI framework | Moderator (ZTE) |
R1-2409191 | Summary on SRS PC parameter determination | Moderator (CATT) |
R1-2409198 | Correction on antenna port description for DMRS associated with a PSBCH in TS 38.211 | ZTE, Sanechips |
R1-2409199 | Correction on antenna port description for DMRS associated with a PSBCH in TS 38.211 | ZTE, Sanechips |
R1-2409200 | Summary of NR Pre-Rel18 Maintenance Discussion on SRI and TPMI for Multi-TRP PUSCH Repetition | Moderator (Ericsson) |
R1-2409203 | Summary of NR Pre-Rel18 Maintenance Discussion on PTRS-DMRS Association | Moderator (Ericsson) |
R1-2409211 | Moderator summary#2 of correction on dmrs-TypeA-Position value | Moderator (NEC) |
R1-2409213 | Summary on discussion for mDCI mTRP PDSCH | Moderator (Huawei) |
R1-2409215 | Session notes for 7 (Pre-Rel-18 NR maintenance) | Ad-Hoc Chair (CMCC) |
R1-2409235 | Summary#2 of NR Pre-Rel18 Maintenance Discussion on SRI and TPMI for Multi-TRP PUSCH Repetition | Moderator (Ericsson) |
R1-2409246 | Summary#2 on SRS PC parameter determination | Moderator (CATT) |
R1-2409247 | Summary#2 of UE procedure for applying transform precoding on PUSCH | Moderator (CATT) |
R1-2409248 | Summary of clarification on the first CG PUSCH and SPS PDSCH in overriding handling | Moderator (CATT) |
R1-2409252 | Moderator summary #2: RedCap NCD-SSB MIB parameters | Moderator (MediaTek) |
R1-2409253 | PUCCH transmission cancellation due to aperiodic SRS | Moderator (CATT), Ericsson, Samsung, New H3C |
R1-2409264 | Summary#2 on PDSCH reception scheduled by CORESET not following the unified TCI state | Moderator (MediaTek Inc.) |
R1-2409267 | CR on timeline for determining activated TCI state(s) in unified TCI framework in TS 38.214 | Moderator (ZTE), ZTE Corporation, Sanechips, Ericsson, MediaTek, Samsung, NTT DOCOMO, Google, New H3C, Huawei, HiSilicon |
R1-2409268 | CR on timeline for determining activated TCI state(s) in unified TCI framework in TS 38.214 | Moderator (ZTE), ZTE Corporation, Sanechips, Ericsson, MediaTek, Samsung, NTT DOCOMO, Google, New H3C, Huawei, HiSilicon |
R1-2409269 | Summary#2 on the SRS and PUCCH collision handling (Rel-17 MIMO) | Moderator (Xiaomi) |
R1-2409270 | Summary#2 on discussion for mDCI mTRP PDSCH | Moderator (Huawei) |
R1-2409271 | Draft CR on timeline for determining activated TCI state(s) in unified TCI framework in TS 38.214 | Moderator (ZTE), ZTE Corporation, Sanechips, Ericsson, MediaTek, Samsung, NTT DOCOMO, Google, New H3C, Huawei, HiSilicon |
R1-2409292 | Draft CR on PTRS-DMRS Association | Moderator (Ericsson) |
R1-2409298 | Summary#2 of NR Pre-Rel18 Maintenance Discussion on PTRS-DMRS Association | Moderator (Ericsson) |
R1-2409299 | Summary#2 of NR Pre-Rel18 maintenance discussion for SRS power scaling and transmission occasion | Moderator (Ericsson) |
R1-2409300 | Draft LS on waveform determination for PUSCH scheduled by fallbackRAR UL grant and MsgA PUSCH | CATT |
R1-2409301 | LS on waveform determination for PUSCH scheduled by fallbackRAR UL grant and MsgA PUSCH | RAN1, CATT |
R1-2409302 | PUCCH transmission cancellation due to aperiodic SRS | Moderator (CATT), Ericsson, Samsung, New H3C |
R1-2409303 | PUCCH transmission cancellation due to aperiodic SRS | Moderator (CATT), Ericsson, Samsung, New H3C |
R1-2409310 | CR on PTRS-DMRS Association | Moderator (Ericsson), Samsung |
R1-2409313 | Correction on PTRS-DMRS Association | Moderator (Ericsson), Samsung, ZTE |
R1-2409314 | Correction on the determination of multi DCI multi TRP | Moderator (Huawei), HiSilicon, Samsung, ZTE |
R1-2409315 | Correction on the determination of multi DCI multi TRP | Moderator (Huawei), HiSilicon, Samsung, ZTE |
R1-2409316 | CR on default TCI state for PDSCH without TCI field in DCI in HST-SFN scheme | vivo |
R1-2409317 | CR on default TCI state for PDSCH without TCI field in DCI in HST-SFN scheme | vivo |
R1-2409318 | CR on timeline for determining activated TCI state(s) in unified TCI framework in TS 38.214 | Moderator (ZTE), ZTE Corporation, Sanechips, Ericsson, MediaTek, Samsung, NTT DOCOMO, Google, New H3C, Huawei, HiSilicon |
R1-2409324 | Alignment of parameter names | Ericsson |
R1-2409325 | Alignment of parameter names | Ericsson |
R1-2409328 | Rel-17 editorial corrections for TS 38.213 | Samsung |
R1-2409330 | Rel-17 editorial corrections for TS 38.213 (mirrored to Rel-18) | Samsung |
R1-2409332 | Rel-17 editorial corrections for TS 38.214 | Nokia |
R1-2409333 | Rel-17 editorial corrections for TS 38.214 mirrored to Rel-18 | Nokia |
TDoc | Title | Source |
---|---|---|
R1-2409322 | Corrections to higher-layers parameters for IoT (Internet of Things) NTN (non-terrestrial network) enhancements | Motorola Mobility |
R1-2409326 | Alignment of parameter names | Ericsson |
R1-2409327 | Rel-18 editorial corrections for TS 38.212 | Huawei |
R1-2409329 | Rel-18 editorial corrections for TS 38.213 | Samsung |
R1-2409331 | TS 38.213 alignment with TS 38.331 for Rel-18 | Samsung |
R1-2409334 | Rel-18 higher-layers parameter name corrections for TS 38.214 | Nokia |
R1-2409335 | Alignment of parameter names | Intel Corporation |
TDoc | Title | Source |
---|---|---|
R1-2407623 | Alignment corrections for 36.212 RRC parameters | FUTUREWEI |
R1-2407659 | Maintenance of Rel-18 Multicarrier Enhancements | Huawei, HiSilicon |
R1-2407780 | Draft CR on implicit BFD-RS determination for S-DCI based MTRP in TS 38.213 | ZTE Corporation, Sanechips |
R1-2407781 | Discussion on precoding determination of STxMP SDM/SFN scheme in TS38.211 | ZTE Corporation, Sanechips |
R1-2407782 | Draft CR on precoding determination of STxMP SDM/SFN scheme in TS38.211 | ZTE Corporation, Sanechips |
R1-2407783 | Discussion on the maximum number of PL RS maintained simultaneously for candidate cells | ZTE Corporation, Sanechips |
R1-2407784 | Draft CR on the maximum number of PL RS maintained simultaneously for candidate cells in TS 38.213 | ZTE Corporation, Sanechips |
R1-2407787 | Draft CR on capturing intra-band CA for beam collision in both S-DCI and M-DCI based MTRP | ZTE Corporation, Sanechips |
R1-2407789 | Draft CR on the antenna port index for DMRS precoding and physical resources mapping in TS 38.211 | ZTE Corporation, Sanechips |
R1-2407790 | Draft CR on the higher layer parameters for TAG index in TS 38.214 | ZTE Corporation, Sanechips |
R1-2407804 | Draft CR on applicable PDSCH TDRA for multicast reception in RRC_INACTIVE | ZTE Corporation, Sanechips |
R1-2407805 | Draft CR on indicated unified TCI state for multi-cell scheduling | ZTE Corporation, Sanechips |
R1-2407806 | Draft CR on the DCI format 0_3 and 1_3 | ZTE Corporation, Sanechips |
R1-2407840 | Draft CR on spatial relation of SRS for positioning in RRC_INACTIVE Mode | vivo |
R1-2407841 | Draft CR on active semi-persistent SRS resource configuration | vivo |
R1-2407842 | Draft CR on alignment on the parameter of beam relation for scheduling an initial PUSCH transmission in RACH-less handover in NTN | vivo |
R1-2407843 | Draft CR on CSI processing criteria of CSI-ReportConfig containing a list of L sub-configurations | vivo |
R1-2407844 | Draft CR on PHR report for mDCI-based sTxMP | vivo |
R1-2407845 | Discussion on PHR report for mDCI-based sTxMP | vivo |
R1-2407846 | Discussion on EPRE of CSI-RS and PDSCH for NES | vivo |
R1-2407984 | Discussion on RO Validation for Two TA | |
R1-2407985 | Draft CR on RO Validation for Two TA | |
R1-2407986 | Discussion on Collision Handling Between PRACH and SSB for Two TA | |
R1-2407987 | Draft CR on Collision Handling Between PRACH and SSB for Two TA | |
R1-2408014 | Draft CR on CSI report on PUSCH triggered by DCI format 0_3 before UE CSI computation time | CATT |
R1-2408015 | Draft CR on PUSCH triggered by DCI format 0_3 before UE PUSCH preparation procedure time | CATT |
R1-2408016 | Draft CR on T-DAI field in DCI format 1_3 | CATT |
R1-2408017 | Draft CR on Type-3 HARQ-ACK codebook triggered by DCI format 1_3 | CATT |
R1-2408018 | Draft CR on BWP change indication for SCell switching to dormant BWP | CATT |
R1-2408019 | Draft CR on BWP change indication for switching to non-dormant BWP | CATT |
R1-2408020 | Draft CR on last DCI determination of DCI format 1_3 for HARQ-ACK codebook | CATT |
R1-2408021 | Draft CR on HARQ-ACK generation for the PDSCHs scheduled by DCI 1_3 including HARQ-ACK retransmission information | CATT |
R1-2408022 | Draft CR on resource allocation in frequency for DCI format 0_3 | CATT |
R1-2408023 | Correction on TA indication for 2-step RACH in 2TA | CATT |
R1-2408024 | Correction on PHR for simultaneous uplink multi-panel transmission | CATT |
R1-2408025 | Correction on reducing the overlapped duration of the two UL transmission\n for 2TA enhancement in NR Rel-18 MIMO | CATT |
R1-2408081 | Draft CR on RRC parameter alignment for STxMP UL transmission in TS 38.213 | ZTE Corporation, Sanechips |
R1-2408082 | Draft CR on UE capability alignment for two TAs in TS 38.213 | ZTE Corporation, Sanechips |
R1-2408127 | Draft CR for correction on CSI-RS resource configuration in SL CA | OPPO |
R1-2408128 | Draft CR for indication of remaining channel occupancy duration | OPPO, Qualcomm |
R1-2408172 | Discussions on remaining issues of R18 NR sidelink from RAN1#118 | Huawei, HiSilicon |
R1-2408174 | Discussion on SRS configuration for BW aggregation in RRC_INACTIVE | Huawei, HiSilicon |
R1-2408175 | Correction on SRS configuration for BW aggregation in RRC_INACTIVE | Huawei, HiSilicon |
R1-2408176 | Correction to the collision rule for RedCap SRS frequency hopping | Huawei, HiSilicon |
R1-2408180 | Extend the measurement time window to TRP | Huawei, HiSilicon |
R1-2408182 | Correction on the repetition number of PUCCH for Msg4 ACK in TS 38.213 | Huawei, HiSilicon |
R1-2408183 | Correction on the higher layer parameter subject to UE capability for UE Rx-Tx time difference measurement and reporting | Huawei, HiSilicon |
R1-2408184 | Draft CR on the number of repetitions for time period | Huawei, HiSilicon |
R1-2408194 | FL Summary on Maintenance of 8TX | Moderator (InterDigital, Inc.) |
R1-2408245 | Correction on Minimum Scheduling Offset for Rel-18 Multi-Carrier Enhancements | Langbo |
R1-2408246 | Correction on Minimum Scheduling Offset for Rel-18 Multi-Carrier Enhancements | Langbo |
R1-2408249 | Correction on determination of PSFCH candidate resources in SL-U | Sharp |
R1-2408287 | Discussion on collision handling for SRS for positioning with frequency hopping | Intel Corporation |
R1-2408288 | Corrections to TS 38.214 on SRS for positioning with frequency hopping | Intel Corporation |
R1-2408354 | Draft CR for correction on PSFCH power control | OPPO, ZTE, Sanechips, LG Electronics, Apple |
R1-2408451 | Draft CR on NR NTN Network Verification of UE Location | Apple |
R1-2408507 | Discussion on power offset for type 1 spatial domain adaptation | Fujitsu |
R1-2408510 | Draft CR for collision handling of positioning SRS with Tx hopping in TDD system | ZTE Corporation, Sanechips |
R1-2408511 | Discussion on collision handling of positioning SRS with Tx hopping in TDD system | ZTE Corporation, Sanechips |
R1-2408512 | Corrections on positioning in TS 38.213 | ZTE Corporation, Sanechips |
R1-2408513 | Correction on Pcmax of positioning SRS transmission for UE in validity area | ZTE Corporation, Sanechips |
R1-2408517 | Correction on antenna port description for DMRS associated with a PSBCH in TS 38.211 | ZTE Corporation, Sanechips |
R1-2408518 | Correction on rate matching in TS 38.212 | ZTE Corporation, Sanechips |
R1-2408519 | Correction on TBS determination in TS 38.214 | ZTE Corporation, Sanechips |
R1-2408520 | Correction on contiguous RB based resource allocation in TS 38.214 | ZTE Corporation, Sanechips |
R1-2408557 | Draft CR on RRC parameter alignment of HARQ-ACK repetition in TS38.213 | ETRI |
R1-2408585 | Draft CR for 38.213 aligning higher layer parameters for 2TA | Ericsson |
R1-2408604 | Draft CR for 38.212 on names of LTM parameters | Ericsson |
R1-2408611 | Draft CR for 38.213 on UE-based TA measurement | Ericsson |
R1-2408617 | Draft CR for Aligning RRC Parameter Names in TS 38.212 | Samsung |
R1-2408618 | Draft CR for Aligning RRC Parameter Names in TS 38.213 | Samsung |
R1-2408619 | Draft CR for Mapping PSFCH to Physical Resources | Samsung |
R1-2408620 | Draft CR for CP Extension for S-SS/PSBCH Block | Samsung |
R1-2408621 | Moderator summary on maintenance issues for Rel-18 CSI enhancements | Samsung (Moderator) |
R1-2408622 | Draft CR on support of differential RSRP reporting for Rel-18 STx2P | Samsung |
R1-2408623 | Draft CR on applying apply-IndicatedTCIState to PDCCH repetition | Samsung |
R1-2408624 | Draft CR on cell-specific beam resetting for MDCI MTRP under eUTCI | Samsung |
R1-2408625 | Draft CR on TCI state application for the candidate cell | Samsung |
R1-2408627 | Remaining issues on network energy saving | Samsung |
R1-2408628 | Correction on power assumption for type 1 spatial domain adaptation | Samsung |
R1-2408629 | Draft CR on open-loop power control parameter set indication field in DCI format 0_3 | Samsung |
R1-2408744 | Correction on SSB-RO mapping for LTM | |
R1-2408745 | Correction on early UL synchronization for LTM | |
R1-2408766 | SRS Resource Power Scaling Near Pcmax | Ericsson |
R1-2408812 | Correction on BW aggregation based on positioning SRS | Nokia |
R1-2408813 | Discussion on power offset for spatial domain adaptation for Rel-18 NES | Ericsson |
R1-2408814 | Draft CR on power offset for spatial domain adaptation for Rel-18 NES | Ericsson |
R1-2408815 | Draft CR for resolving square brackets for Rel-18 NES UE capability parameters | Ericsson |
R1-2408835 | Maintenance on NR MIMO Evolution for Downlink and Uplink | Qualcomm Incorporated |
R1-2408888 | Draft CR on LTM PRACH and serving UL transmition in the same band | MediaTek Inc. |
R1-2408889 | Draft CR on LTM TA command application time | MediaTek Inc. |
R1-2408902 | Draft CR on clarification of activation and deactivation time for cell DTX for NTN | Ericsson |
R1-2408905 | Draft CR on addition of parameter nr-NTN-UE-RxTxMeasurementsRequest | Ericsson |
R1-2408916 | Draft CR for correction to SRS for positioning with tx hopping in 38.214 | Ericsson |
R1-2408955 | Correction of XYZ placeholders | Nokia |
R1-2408956 | NR-NTN correction to RRC parameter and UE capability on network verification of UE location | Nokia |
R1-2408960 | Draft CR on Multi-Resource SRS Power Scaling Near Pcmax | Ericsson |
R1-2408962 | Draft CR on SRI and TPMI for Multi-TRP PUSCH Repetition and STxMP | Ericsson |
R1-2408969 | Corrections to the Pathloss RS in LTM TCI state in TS38.213 | Huawei, HiSilicon |
R1-2408970 | Correction on SCell dormancy indication case 2 in case of BWP switching | Huawei, HiSilicon |
R1-2408971 | Corrections on bit-width determination of Type-1B DCI field for multi-cell scheduling | Huawei, HiSilicon |
R1-2408972 | Corrections on determination of DCI format 0_3 for unpaired spectrum operation | Huawei, HiSilicon |
R1-2408973 | Corrections on default QCL assumption for DCI format 1_3 in 38.214 | Huawei, HiSilicon |
R1-2408974 | Corrections on simultaneous configuration of mTRP and multi-carrier scheduling in 38.214 | Huawei, HiSilicon |
R1-2408975 | Correction on the open loop timing advance calculation for ATG | Huawei, HiSilicon |
R1-2408976 | Correction on the support of open loop timing advance calculation for ATG | Huawei, HiSilicon |
R1-2408977 | Correction on virtual PHR calculation in 38.213 | Huawei, HiSilicon |
R1-2408978 | Correction on parameter for two TA operation in 38.214 | Huawei, HiSilicon |
R1-2408981 | Correction on DMRS enhancement in 38.211 | Huawei, HiSilicon |
R1-2408983 | Correction on the repetition number of PUCCH for Msg4 ACK in TS 38.212 | Huawei, HiSilicon |
R1-2408994 | Summary on Rel-18 STxMP | Moderator (OPPO) |
R1-2409033 | FL summary on Rel-18 MIMO DMRS | Moderator (NTT DOCOMO) |
R1-2409034 | FL Summary #1 for AI 8.1: Sidelink CA operation | Moderator (LG Electronics) |
R1-2409035 | FL Summary #2 for AI 8.1: Sidelink CA operation | Moderator (LG Electronics) |
R1-2409036 | FL Summary for maintenance on NR carrier phase positioning | Moderator (CATT) |
R1-2409049 | FL summary#1 for AI 8.1 SL-U physical channel design framework in RAN1#118b | Moderator (Huawei) |
R1-2409050 | FL summary#2 for AI 8.1 SL-U physical channel design framework in RAN1#118b | Moderator (Huawei) |
R1-2409051 | RAN1 agreements for R18 NR SL-U PHY channel design until RAN1#118b | Moderator (Huawei) |
R1-2409052 | FL summary #1 for AI 8.1: SL-U channel access and RA | Moderator (OPPO) |
R1-2409053 | FL summary #2 for AI 8.1: SL-U channel access and RA | Moderator (OPPO) |
R1-2409054 | FL summary for AI 8.1: SL-U channel access and RA (EOM) | Moderator (OPPO) |
R1-2409055 | Moderator summary for maintenance of Rel-18 MIMO on unified TCI extension (Round 0) | Moderator (MediaTek Inc.) |
R1-2409078 | Feature Lead summary #1 for Maintenance of Positioning for RedCap UEs | Moderator (Ericsson) |
R1-2409079 | Feature Lead summary #2 for Maintenance of Positioning for RedCap UEs | Moderator (Ericsson) |
R1-2409080 | Feature Lead summary #3 for Maintenance of Positioning for RedCap UEs | Moderator (Ericsson) |
R1-2409093 | Moderator Summary for maintenance on Two TAs for multi-DCI | Moderator (Ericsson) |
R1-2409095 | FL summary 1 of Maintenance on Further NR Mobility Enhancements | Moderator (Fujitsu) |
R1-2409096 | Moderator summary on activation and deactivation time for cell DTX for NR-NTN | Moderator (Ericsson) |
R1-2409097 | Reply LS on CSI-RS and SRS for spatial relation | RAN1, ZTE |
R1-2409098 | Summary on LS of CSI-RS and SRS for spatial relation | Moderator (ZTE) |
R1-2409099 | Summary #1 for BW aggregation positioning | Moderator (ZTE ) |
R1-2409100 | Summary #2 for BW aggregation positioning | Moderator (ZTE ) |
R1-2409111 | Feature lead summary#1 on multi-cell scheduling with a single DCI | Moderator (Lenovo) |
R1-2409112 | Feature lead summary#2 on multi-cell scheduling with a single DCI | Moderator (Lenovo) |
R1-2409113 | Feature lead summary#3 on multi-cell scheduling with a single DCI | Moderator (Lenovo) |
R1-2409140 | Summary of discussion on the timing advance calculation and pre-compensation for ATG | Moderator (Huawei) |
R1-2409141 | Correction on the open loop timing advance calculation for ATG | Moderator (Huawei), HiSilicon |
R1-2409142 | Draft CR on the open loop timing advance calculation for ATG | Moderator (Huawei) |
R1-2409147 | Correction on the support of open loop timing advance calculation for ATG | Moderator (Huawei), HiSilicon |
R1-2409178 | Moderator Summary #2 for maintenance on Two TAs for multi-DCI | Moderator (Ericsson) |
R1-2409179 | LS on TDD UL/DL Configuration for Two TA | RAN1, Ericsson |
R1-2409180 | Correction on TA indication for 2-step RACH in 2 TA | Moderator (Ericsson), CATT, Samsung, New H3C, Ericsson |
R1-2409181 | Summary#2 on Rel-18 STxMP | Moderator (OPPO) |
R1-2409185 | Summary#1 of discussion on the time period for R18 preamble repetition | Moderator (Huawei) |
R1-2409186 | [Draft] LS on the time period for R18 preamble repetition | Huawei |
R1-2409190 | FL summary#2 on Rel-18 MIMO DMRS | Moderator (NTT DOCOMO) |
R1-2409194 | CR on capturing intra-band CA for beam collision in both S-DCI and M-DCI based MTRP | Moderator (MediaTek. INC), ZTE Corporation, Sanechips, Samsung |
R1-2409196 | CR on Collision Handling Between PRACH and SSB for Two TA | Moderator (Ericsson), Google, Samsung, Ericsson |
R1-2409201 | CR on CSI processing criteria of CSI-ReportConfig containing a list of L sub-configurations | vivo |
R1-2409202 | Summary #1 for low power high accuracy positioning | Moderator (CMCC) |
R1-2409205 | Correction on mapping PSFCH to physical resources | Moderator (Huawei), Samsung, ITL |
R1-2409206 | Correction on TCI state application for candidate cell | Moderator (Fujitsu), Samsung, Nokia, Ericsson, Huawei, ZTE, NTT DOCOMO |
R1-2409207 | Correction on SSB-RO mapping for LTM | Moderator (Fujitsu), Google, Nokia, Ericsson, Huawei, ZTE, Samsung, NTT DOCOMO |
R1-2409208 | [draft] LS on pathloss maintenance for candidate cells | Moderator (Fujitsu) |
R1-2409209 | Correction on TCI state application for candidate cell | Moderator (Fujitsu), Samsung, Nokia, Ericsson, Huawei, ZTE, NTT DOCOMO |
R1-2409216 | Session notes for 8.1 (Maintenance on Rel-18 work items - Coverage enhancements ) | Ad-Hoc Chair (CMCC) |
R1-2409217 | Session notes for 8.1 (Maintenance on Rel-18 work items - Mobility Enhancement) | Ad-Hoc Chair (CMCC) |
R1-2409218 | Session notes for 8.1 (Maintenance on Rel-18 work items – Multi-Carrier) | Ad-Hoc Chair (CMCC) |
R1-2409219 | Session notes for 8.1 (Maintenance on Rel-18 work items - IoT NTN/NR NTN Enhancement) | Ad-Hoc Chair (Huawei) |
R1-2409220 | Session notes for 8.1 (Maintenance on Rel-18 work items - Sidelink Enhancement) | Ad-Hoc Chair (Huawei) |
R1-2409221 | Session notes for 8.1 (Maintenance on Rel-18 work items - MBS Enhancement) | Ad-Hoc Chair (Huawei) |
R1-2409229 | Session notes for 8.1 (Maintenance on Rel-18 work items - Positioning enhancements ) | Ad-Hoc Chair (Huawei) |
R1-2409230 | Summary#2 of discussion on the time period for R18 preamble repetition | Moderator (Huawei) |
R1-2409231 | Correction on the open loop timing advance calculation for ATG | Moderator (Huawei), HiSilicon, Samsung |
R1-2409232 | Correction on the support of open loop timing advance calculation for ATG | Moderator (Huawei), HiSilicon, Samsung |
R1-2409233 | Summary of discussion on repetition number of PUCCH for Msg4 ACK in TS 38.212 | Moderator (Huawei) |
R1-2409245 | Summary#2 on LS of CSI-RS and SRS for spatial relation | Moderator (ZTE) |
R1-2409251 | CR on CSI processing criteria of CSI-ReportConfig containing a list of L sub-configurations | vivo, Ericsson |
R1-2409260 | Alignment corrections for 36.212 RRC parameters | FUTUREWEI |
R1-2409261 | [Draft] LS on the time period for R18 preamble repetition | Huawei |
R1-2409262 | LS on the time period for R18 preamble repetition | RAN1, Huawei |
R1-2409263 | Correction on CP Extension for S-SS/PSBCH Block | Moderator (OPPO), Samsung, Huawei, HiSilicon |
R1-2409272 | FL summary#3 for AI 8.1 SL-U physical channel design framework in RAN1#118b | Moderator (Huawei) |
R1-2409273 | Summary #2 for low power high accuracy positioning | Moderator (CMCC) |
R1-2409275 | Correction on the open loop timing advance calculation for ATG | Moderator (Huawei), HiSilicon, Samsung |
R1-2409276 | Correction on the support of open loop timing advance calculation for ATG | Moderator (Huawei), HiSilicon, Samsung |
R1-2409277 | Correction on the repetition number of PUCCH for Msg4 ACK in TS 38.212 | Moderator (Huawei) |
R1-2409281 | CR on Collision Handling Between PRACH and SSB for Two TA | Moderator (Ericsson), Google, Samsung, Ericsson, ZTE |
R1-2409284 | Final FL summary of Maintenance on Further NR Mobility Enhancements | Moderator (Fujitsu) |
R1-2409290 | Corrections to TS 38.214 on SRS for positioning with frequency hopping | Moderator (Ericsson) |
R1-2409291 | Corrections to TS 38.214 on SRS for positioning with frequency hopping | Moderator (Ericsson), Intel, ZTE, Huawei/HiSilicon, Ericsson, CATT |
R1-2409293 | CR on positioning SRS BW aggregation | Moderator (ZTE Corporation), Nokia |
R1-2409294 | CR on spatial relation of SRS for positioning in RRC_INACTIVE Mode | Moderator (ZTE Corporation), vivo, Ericsson, Intel |
R1-2409312 | Summary#2 of discussion on repetition number of PUCCH for Msg4 ACK in TS 38.212 | Moderator (Huawei) |
TDoc | Title | Source |
---|---|---|
R1-2407650 | UE features for Rel-18 WIs | Huawei, HiSilicon |
R1-2407847 | UE features for Rel-18 NES | vivo |
R1-2408026 | Remaining issues on UE features for Rel-18 MCE | CATT |
R1-2408626 | UE features for Rel-18 work items | Samsung |
R1-2408767 | Rel-18 UE Features | Ericsson |
R1-2408836 | UE features for Rel-18 | Qualcomm Incorporated |
R1-2408957 | Remaining issues on Rel-18 UE Features | Nokia |
R1-2409040 | Summary of discussion on UE features for MC enhancements | Moderator (NTT DOCOMO, INC.) |
R1-2409041 | Summary#2 of discussion on UE features for MC enhancements | Moderator (NTT DOCOMO, INC.) |
R1-2409042 | Session Notes of AI 8.2 | Ad-Hoc Chair (NTT DOCOMO, INC.) |
R1-2409043 | Updated RAN1 UE features list for Rel-18 NR after RAN1 #118bis | Moderators (AT&T, NTT DOCOMO, INC.) |
R1-2409044 | Draft LS on updated Rel-18 RAN1 UE features lists for NR after RAN1#118bis | Moderators (AT&T, NTT DOCOMO, INC.) |
R1-2409045 | LS on Rel-18 RAN1 UE features list for NR after RAN1#118bis | RAN1, AT&T, NTT DOCOMO, INC. |
R1-2409130 | Summary of discussion on LTM L1 intra and inter-frequency measurements capabilities | Moderator (NTT DOCOMO, INC.) |
R1-2409131 | Summary#2 of discussion on LTM L1 intra and inter-frequency measurements capabilities | Moderator (NTT DOCOMO, INC.) |
R1-2409134 | Summary #1 of UE features for other Rel-18 work items (Topics B) | Moderator (AT&T) |
R1-2409135 | Summary #2 of UE features for other Rel-18 work items (Topics B) | Moderator (AT&T) |
R1-2409136 | Final Summary of UE features for other Rel-18 work items (Topics B) | Moderator (AT&T) |
TDoc | Title | Source |
---|---|---|
R1-2408102 | Towards Rel-19 Completion in RAN1 | RAN1 Chair |
TDoc | Title | Source |
---|---|---|
R1-2409222 | Session notes for 9.1 (AI/ML for NR Air Interface) | Ad-Hoc Chair (CMCC) |
TDoc | Title | Source |
---|---|---|
R1-2407616 | Discussion on specification support for AI/ML-based beam management | FUTUREWEI |
R1-2407653 | Discussion on AI/ML for beam management | Huawei, HiSilicon |
R1-2407690 | Specification Support for AI/ML for Beam Management | Kyocera |
R1-2407694 | Discussion on AIML for beam management | Spreadtrum Communications |
R1-2407728 | Discussion on AI/ML for beam management | China Telecom |
R1-2407746 | Specification support for beam management | Tejas Network Limited |
R1-2407796 | Discussion on AI/ML-based beam management | ZTE Corporation, Sanechips |
R1-2407848 | Specification support for beam management | vivo |
R1-2407892 | Discussion on specification support for beam management | CMCC |
R1-2407938 | Discussion on AIML beam management | TCL |
R1-2407950 | Specification support for beam management | Xiaomi |
R1-2407988 | AI/ML based Beam Management | |
R1-2408027 | Discussion on AI/ML-based beam management | CATT |
R1-2408103 | Discussion on specification support for beam management | Fujitsu |
R1-2408116 | Discussion on specification support for AI/ML beam management | Transsion Holdings |
R1-2408158 | On specification for AI/ML-based beam management | OPPO |
R1-2408221 | Discussion on specification support for beam management | NEC |
R1-2408268 | AI/ML for beam management | Ericsson |
R1-2408279 | Discussion on AI/ML for beam management | InterDigital, Inc. |
R1-2408289 | Specification support for AI/ML for beam management | Intel Corporation |
R1-2408332 | Discussions on AI/ML for beam management | LG Electronics |
R1-2408365 | Specification support for beam management | Fraunhofer HHI, Fraunhofer IIS |
R1-2408380 | Discussion on specification support for beam management | Ruijie Networks Co. Ltd |
R1-2408390 | Specification support for AI-enabled beam management | NVIDIA |
R1-2408401 | Discussions on AI/ML for beam management | Sony |
R1-2408428 | AI/ML specification support for beam management | Lenovo |
R1-2408452 | Discussion on AI/ML beam management | Apple |
R1-2408533 | Discussion on specification support for beam management | Panasonic |
R1-2408544 | AI/ML for Beam Management | Nokia |
R1-2408558 | Discussion on specification support for beam management | ETRI |
R1-2408608 | Discussions on specification support for beam management | Sharp |
R1-2408630 | Discussion for supporting AI/ML based beam management | Samsung |
R1-2408689 | Discussion on Beam management | Rakuten Mobile, Inc |
R1-2408690 | Specification Support for AI/ML for Beam Management | Kyocera Corporation |
R1-2408704 | Discussion on specification support for AIML-based beam management | MediaTek Inc. |
R1-2408749 | AI/ML for Beam Management | Meta |
R1-2408753 | Discussion on AI/ML based beam management | KT Corp. |
R1-2408773 | Discussion on AI/ML for beam management | NTT DOCOMO, INC. |
R1-2408806 | Discussions on AI/ML for beam management | CAICT |
R1-2408823 | Specification support for beam management | KDDI Corporation |
R1-2408837 | Specification support for AI-ML-based beam management | Qualcomm Incorporated |
R1-2408887 | On Associated ID for Beam Management Use Case | NTU |
R1-2408922 | Discussion on Incoming LS on applicable functionality reporting for beam management with UE-sided model | Indian Institute of Tech (M), IIT Kanpur |
R1-2408959 | Specification support for AI/ML beam management | ITL |
R1-2409114 | FL summary #0 for AI/ML in beam management | Moderator (Samsung) |
R1-2409115 | FL summary #1 for AI/ML in beam management | Moderator (Samsung) |
R1-2409116 | FL summary #2 for AI/ML in beam management | Moderator (Samsung) |
R1-2409117 | FL summary #3 for AI/ML in beam management | Moderator (Samsung) |
R1-2409118 | FL summary #4 for AI/ML in beam management | Moderator (Samsung) |
R1-2409305 | FL summary #5 for AI/ML in beam management | Moderator (Samsung) |
TDoc | Title | Source |
---|---|---|
R1-2407649 | AI/ML for Positioning Accuracy Enhancement | Ericsson |
R1-2407654 | Discussion on AI/ML for positioning accuracy enhancement | Huawei, HiSilicon |
R1-2407747 | Specification support for positioning accuracy enhancement | Tejas Network Limited |
R1-2407797 | Discussion on AI/ML-based positioning enhancement | ZTE Corporation, Pengcheng Laboratory |
R1-2407849 | Specification support for positioning accuracy enhancement | vivo |
R1-2407893 | Discussion on specification support for positioning accuracy enhancement | CMCC |
R1-2407951 | Discussion on AI/ML-based positioning accuracy enhancement | Xiaomi |
R1-2407989 | AI/ML based Positioning | |
R1-2408028 | Discussion on AI/ML-based positioning | CATT, CICTCI |
R1-2408104 | Discussion on specification support for AI/ML-based positioning accuracy enhancement | Fujitsu |
R1-2408159 | On specification for AI/ML-based positioning accuracy enhancements | OPPO |
R1-2408214 | Discussion on specification support for AIML based positioning accuracy enhancement | NEC |
R1-2408267 | Discussion on specification support for positioning accuracy enhancement | TCL |
R1-2408290 | Specification support for AI/ML for positioning accuracy enhancement | Intel Corporation |
R1-2408309 | Specification support for positioning accuracy enhancement | Baicells |
R1-2408381 | Discussion on specification support for positioning accuracy enhancement | Ruijie Networks Co. Ltd |
R1-2408385 | AI/ML positioning accuracy enhancement | Fraunhofer IIS, Fraunhofer HHI |
R1-2408391 | Specification support for AI-enabled positioning | NVIDIA |
R1-2408402 | Support for AI/ML for positioning accuracy enhancement | Sony |
R1-2408429 | Specification impacts for AI/ML positioning | Lenovo |
R1-2408453 | Discussion on Specification Support for AI/ML-based positioning | Apple |
R1-2408522 | Discussion on support for AIML positioning | InterDigital, Inc. |
R1-2408545 | AI/ML for Positioning Accuracy Enhancement | Nokia |
R1-2408559 | Discussion on specification support for positioning accuracy enhancement | ETRI |
R1-2408609 | Discussion on specification support for AI/ML based positioning accuracy enhancements | Sharp |
R1-2408631 | Discussion for supporting AI/ML based positioning accuracy enhancement | Samsung |
R1-2408774 | Discussion on AI/ML for positioning accuracy enhancement | NTT DOCOMO, INC. |
R1-2408838 | Specification support for AI-ML-based positioning accuracy enhancement | Qualcomm Incorporated |
R1-2408903 | Design for AI/ML based positioning | MediaTek Korea Inc. |
R1-2408908 | Discussions on specification support for positioning accuracy enhancement for AI/ML | ITL |
R1-2408923 | Discussion on specification support for AI/ML Positioning Accuracy enhancement | CEWiT |
R1-2409028 | Summary #1 of specification support for positioning accuracy enhancement | Moderator (Ericsson) |
R1-2409029 | Summary #2 of specification support for positioning accuracy enhancement | Moderator (Ericsson) |
R1-2409030 | Summary #3 of specification support for positioning accuracy enhancement | Moderator (Ericsson) |
R1-2409031 | Summary #4 of specification support for positioning accuracy enhancement | Moderator (Ericsson) |
R1-2409032 | Summary #5 of specification support for positioning accuracy enhancement | Moderator (Ericsson) |
R1-2409286 | Final summary of specification support for positioning accuracy enhancement | Moderator (Ericsson) |
TDoc | Title | Source |
---|---|---|
R1-2407655 | Discussion on AI/ML for CSI prediction | Huawei, HiSilicon |
R1-2407695 | Discussion on AIML for CSI prediction | Spreadtrum Communications |
R1-2407798 | Discussion on specification support for AI CSI prediction | ZTE Corporation, Sanechips |
R1-2407850 | Study on consistency issue for csi prediction | vivo |
R1-2407894 | Discussion on AI/ML for CSI prediction | CMCC |
R1-2407939 | Discussions on AIML CSI prediction | TCL |
R1-2407952 | Discussion on UE-side AI/ML model based CSI prediction | Xiaomi |
R1-2407990 | AI/ML based CSI Prediction | |
R1-2408029 | Discussion on AI/ML-based CSI prediction | CATT |
R1-2408080 | AI/ML for CSI prediction | Ericsson |
R1-2408105 | Discussion on specification support for CSI prediction | Fujitsu |
R1-2408160 | On specification for AI/ML-based CSI prediction | OPPO |
R1-2408212 | Discussion on specification support for CSI prediction | NEC |
R1-2408247 | AI/ML for CSI prediction | Mavenir |
R1-2408333 | Discussions on CSI prediction | LG Electronics |
R1-2408362 | Discussion on consistency of training / inference for AI/ML-based CSI prediction | Panasonic |
R1-2408392 | Specification support for AI-enabled CSI prediction | NVIDIA |
R1-2408403 | Input quantities for CSI prediction model training, inference and monitoring | Sony |
R1-2408430 | On AI/ML for CSI prediction | Lenovo |
R1-2408436 | On AI/ML-based CSI prediction | InterDigital, Inc. |
R1-2408454 | Discussion on AI based CSI prediction | Apple |
R1-2408546 | AI/ML for CSI Prediction | Nokia |
R1-2408597 | Discussion on Specification support for CSI prediction | Tejas Network Limited |
R1-2408632 | Views on AI/ML based CSI prediction | Samsung |
R1-2408688 | Discussion on CSI feedback enhancement | Rakuten Mobile, Inc |
R1-2408694 | Specification support for CSI prediction | MediaTek Inc. |
R1-2408759 | Discussion on AI/ML for CSI prediction | AT&T |
R1-2408775 | Discussion on AI/ML for CSI prediction | NTT DOCOMO, INC. |
R1-2408839 | Specification support for CSI prediction | Qualcomm Incorporated |
R1-2409144 | Summary #1 of CSI prediction | Moderator (LG Electronics) |
R1-2409145 | Summary #2 of CSI prediction | Moderator (LG Electronics) |
R1-2409146 | Summary #3 of CSI prediction | Moderator (LG Electronics) |
R1-2409236 | Text proposals to capture the outputs of study on CSI prediction | Moderator (LG Electronics) |
TDoc | Title | Source |
---|---|---|
R1-2407617 | Discussion of additional study on AI/ML for NR air interface for CSI compression | FUTUREWEI |
R1-2407656 | Discussion on AI/ML for CSI compression | Huawei, HiSilicon |
R1-2407696 | Discussion on AIML for CSI compression | Spreadtrum Communications, BUPT |
R1-2407748 | CSI compression | Tejas Network Limited |
R1-2407799 | Discussion on study for AI/ML CSI compression | ZTE Corporation, Sanechips |
R1-2407851 | Discussion on CSI compression | vivo |
R1-2407895 | Discussion on AI/ML for CSI compression | CMCC |
R1-2407940 | Discussion on AIML CSI compression | TCL |
R1-2407953 | Views on two-sided AI/ML model based CSI compression | Xiaomi |
R1-2407991 | AI/ML based CSI Compression | |
R1-2408030 | Study on AI/ML-based CSI compression | CATT |
R1-2408079 | AI/ML for CSI compression | Ericsson |
R1-2408084 | Discussion on AI/ML for CSI compression | BJTU |
R1-2408106 | Discussion on CSI compression | Fujitsu |
R1-2408161 | Additional study on AI/ML-based CSI compression | OPPO |
R1-2408213 | Discussion on CSI compression | NEC |
R1-2408291 | AI/ML for CSI compression | Intel Corporation |
R1-2408334 | Study on CSI compression | LG Electronics |
R1-2408363 | Discussion on AI/ML for CSI compression | Panasonic |
R1-2408393 | Additional study on AI-enabled CSI compression | NVIDIA |
R1-2408431 | On AI/ML for CSI compression | Lenovo |
R1-2408437 | On AI/ML-based CSI compression | InterDigital, Inc. |
R1-2408455 | Discussion on AI based CSI compression | Apple |
R1-2408547 | AI/ML for CSI Compression | Nokia |
R1-2408560 | Discussion on AI/ML for CSI compression | ETRI |
R1-2408633 | Views on additional study for AI/ML based CSI compression | Samsung |
R1-2408695 | Additional study on AI/ML for NR air interface - CSI compression | MediaTek Inc. |
R1-2408776 | Discussion on AI/ML for CSI compression | NTT DOCOMO, INC. |
R1-2408807 | Discussions on AI/ML for CSI compression | CAICT |
R1-2408840 | Additional study on CSI compression | Qualcomm Incorporated |
R1-2408924 | Discussion on AI/ML for CSI compression | CEWiT |
R1-2408952 | Discussion on AI/ML for CSI compression | IIT Kanpur |
R1-2409007 | Discussion on AI/ML for CSI compression | Panasonic |
R1-2409156 | Summary#1 of Additional study on AI/ML for NR air interface: CSI compression | Moderator (Qualcomm) |
R1-2409157 | Summary#2 of Additional study on AI/ML for NR air interface: CSI compression | Moderator (Qualcomm) |
R1-2409158 | Summary#3 of Additional study on AI/ML for NR air interface: CSI compression | Moderator (Qualcomm) |
R1-2409159 | Summary#4 of Additional study on AI/ML for NR air interface: CSI compression | Moderator (Qualcomm) |
R1-2409160 | Summary#5 of Additional study on AI/ML for NR air interface: CSI compression | Moderator (Qualcomm) |
R1-2409161 | Final summary of Additional study on AI/ML for NR air interface: CSI compression | Moderator (Qualcomm) |
R1-2409195 | Updated summary of Evaluation Results for AI/ML CSI compression | Moderator (Qualcomm) |
R1-2409285 | Summary#6 of Additional study on AI/ML for NR air interface: CSI compression | Moderator (Qualcomm) |
TDoc | Title | Source |
---|---|---|
R1-2407618 | Discussion on other aspects of AI/ML model and data on AI/ML for NR air-interface | FUTUREWEI |
R1-2407657 | Discussion on other aspects of the additional study for AI/ML | Huawei, HiSilicon |
R1-2407697 | Discussion on other aspects of AI/ML model and data | Spreadtrum Communications |
R1-2407749 | Other aspects of AI/ML model and data | Tejas Network Limited |
R1-2407800 | Discussion on other aspects of AI/ML model and data | ZTE Corporation, Sanechips |
R1-2407852 | Other aspects of AI/ML model and data | vivo |
R1-2407896 | Discussion on other aspects of AI/ML model and data | CMCC |
R1-2407941 | Discussions on other aspects of AlML In NR air interface | TCL |
R1-2407954 | Further study on AI/ML model and data | Xiaomi |
R1-2407992 | AI/ML Model and Data | |
R1-2408031 | Study on AI/ML for other aspects | CATT, CICTCI |
R1-2408107 | Discussion on other aspects of AI/ML model and data | Fujitsu |
R1-2408162 | Additional study on other aspects of AI/ML model and data | OPPO |
R1-2408222 | Discussion on other aspects of AI/ML model and data | NEC |
R1-2408269 | Discussion on other aspects of AI/ML | Ericsson |
R1-2408292 | Other aspects of AI/ML model and data | Intel Corporation |
R1-2408335 | Discussion on other aspects of AI/ML model and data | LG Electronics |
R1-2408394 | Additional study on other aspects of AI model and data | NVIDIA |
R1-2408432 | Discussion on other aspects of AI/ML model and data | Lenovo |
R1-2408438 | On other aspects of AI/ML model and data | InterDigital, Inc. |
R1-2408456 | Discussion on other aspects of AI/ML model and data | Apple |
R1-2408541 | Discussion on other aspects for AI/ML for air interface | Panasonic |
R1-2408548 | Other aspects of AI/ML for two-sided model use case | Nokia |
R1-2408561 | Discussion on other aspects of AI/ML model and data | ETRI |
R1-2408634 | Views on additional study for other aspects of AI/ML model and data | Samsung |
R1-2408750 | Other Aspects of AI/ML Model and Data | Meta |
R1-2408751 | Discussion on other aspects of AI/ML model and data | Sharp |
R1-2408758 | Other Aspects of AI/ML framework | AT&T |
R1-2408777 | Discussion on other aspects of AI/ML model and data | NTT DOCOMO, INC. |
R1-2408841 | Other aspects of AI/ML model and data | Qualcomm Incorporated |
R1-2408885 | Other aspects of AI/ML model and data | Continental Automotive |
R1-2409168 | Summary #1 for other aspects of AI/ML model and data | Moderator (OPPO) |
R1-2409169 | Summary #2 for other aspects of AI/ML model and data | Moderator (OPPO) |
R1-2409170 | Summary #3 for other aspects of AI/ML model and data | Moderator (OPPO) |
R1-2409171 | Summary #4 for other aspects of AI/ML model and data | Moderator (OPPO) |
TDoc | Title | Source |
---|---|---|
R1-2408641 | List of RRC and MAC CE impact for Rel-19 MIMO Ph5 | Samsung, MediaTek, CMCC, Interdigital, OPPO, ZTE |
TDoc | Title | Source |
---|---|---|
R1-2407622 | Enhancements for UE-initiated/event-driven beam management | FUTUREWEI |
R1-2407678 | On UE initiated/event-driven beam management | Huawei, HiSilicon |
R1-2407698 | Discussion on UE-initiated/event-driven beam management | Spreadtrum Communications |
R1-2407773 | Discussion on enhancements for UE-initiated/event-driven beam management | ZTE Corporation, Sanechips |
R1-2407812 | UE-initiated/event-driven beam management | MediaTek Inc. |
R1-2407853 | Remaining issues on UE-initiated/event-driven beam management | vivo |
R1-2407897 | Discussion on enhancements for UE-initiated/event-driven beam management | CMCC |
R1-2407961 | Enhancements for UE-initiated/event-driven beam management | Xiaomi |
R1-2408039 | Enhancement for UE-initiated/event-driven beam management | CATT |
R1-2408083 | Discussion on UE-initiated/event-driven beam management | TCL |
R1-2408108 | Discussion on enhancements for UE-initiated/event-driven beam management | Fujitsu |
R1-2408117 | Enhancements for UE-initiated/event-driven beam management | Transsion Holdings |
R1-2408164 | Discussions on UE-initiated/event-driven beam management | OPPO |
R1-2408187 | Discussion on Rel-19 UE/Event-Driven Beam Management | InterDigital, Inc. |
R1-2408199 | Enhancements for UE-initiated/event-driven beam management | Lenovo |
R1-2408223 | Discussion on enhancements for UE-initiated or event-driven beam management | NEC |
R1-2408230 | Discussion on the UE-initiated/event-driven beam management | HONOR |
R1-2408296 | Enhancements for Event-driven Beam Management | Intel Corporation |
R1-2408317 | Offline summary for Rel-19 MIMO UEIBM (9.2.1) pre-RAN1#118bis | Moderator (ZTE) |
R1-2408318 | Moderator Summary #1 on UE-initiated/event-driven beam management | Moderator (ZTE) |
R1-2408319 | Moderator Summary #2 on UE-initiated/event-driven beam management | Moderator (ZTE) |
R1-2408320 | Moderator Summary #3 on UE-initiated/event-driven beam management | Moderator (ZTE) |
R1-2408336 | UE-initiated beam management | LG Electronics |
R1-2408348 | Enhancements for UE-initiated/event-driven beam management | Sharp |
R1-2408368 | Discussion on enhancements for UE-initiated or event-driven beam management | |
R1-2408382 | Discussion on enhancements for UE-initiated/event-driven beam management | Ruijie Networks Co. Ltd |
R1-2408404 | Enhancements for UE-initiated/event-driven beam management | Sony |
R1-2408457 | Enhancements for UE-initiated beam management | Apple |
R1-2408562 | Enhancements for UE-initiated/event-driven beam management | ETRI |
R1-2408610 | Remaining issues for UE-initiated beam management | Ericsson |
R1-2408635 | Views on Rel-19 UE-initiated/event-driven beam management | Samsung |
R1-2408738 | Enhancements to facilitate UE-initiated/event-driven beam management | Nokia |
R1-2408748 | Enhancements for UE Initiated Beam Management | Meta |
R1-2408778 | Discussion on enhancements for UE-initiated/event-driven beam management | NTT DOCOMO, INC. |
R1-2408827 | Discussion on UE-initiated/event-driven beam management | ITRI |
R1-2408842 | UE-initiated/event-driven beam management | Qualcomm Incorporated |
R1-2408881 | Enhancements for UE-initiated/Event-Driven Beam Management | Panasonic |
R1-2408890 | Discussion on UE initiated beam report | ASUSTeK |
R1-2408911 | Discussions on enhancements for UE-initiated/event-driven beam management | KDDI Corporation |
R1-2408925 | Enhancements for UEiBM | CEWiT |
R1-2408940 | Discussion on enhancements for UE-initiated or event-driven beam management | NICT |
R1-2409212 | Moderator Summary #4 on UE-initiated/event-driven beam management | Moderator (ZTE) |
TDoc | Title | Source |
---|---|---|
R1-2407679 | On 128 CSI-RS ports and UE reporting enhancement | Huawei, HiSilicon |
R1-2407699 | Discussion on CSI enhancements | Spreadtrum Communications |
R1-2407755 | CSI enhancements | Tejas Network Limited |
R1-2407774 | Discussion on CSI enhancements | ZTE Corporation, Sanechips |
R1-2407813 | CSI enhancements | MediaTek Inc. |
R1-2407824 | Discussion on Rel-19 CSI enhancements | New H3C Technologies Co., Ltd. |
R1-2407854 | Remaining issues on Rel-19 CSI enhancements | vivo |
R1-2407898 | Discussion on CSI enhancements | CMCC |
R1-2407962 | Discussion on Rel-19 MIMO CSI enhancements | Xiaomi |
R1-2407993 | CSI Enhancement for NR MIMO | |
R1-2408040 | On Rel-19 MIMO CSI enhancements | CATT |
R1-2408109 | Discussion on Rel-19 CSI enhancements | Fujitsu |
R1-2408165 | CSI enhancements for Rel-19 MIMO | OPPO |
R1-2408188 | Discussion on Rel-19 Enhancements of CSI | InterDigital, Inc. |
R1-2408200 | Discussion on CSI enhancements | Lenovo |
R1-2408210 | Discussion on CSI enhancements | NEC |
R1-2408231 | Discussion on CSI enhancements | HONOR |
R1-2408295 | CSI enhancements for MIMO | Intel Corporation |
R1-2408337 | Discussions on CSI enhancements | LG Electronics |
R1-2408349 | CSI enhancements | Sharp |
R1-2408395 | CSI enhancements for Rel. 19 MIMO | Fraunhofer IIS, Fraunhofer HHI |
R1-2408405 | More views on CSI enhancements | Sony |
R1-2408458 | Views on R19 MIMO CSI enhancement | Apple |
R1-2408496 | Discussion on CSI enhancements | TCL |
R1-2408563 | Discussion on Rel-19 CSI enhancements | ETRI |
R1-2408636 | Moderator summary for OFFLINE discussion on Rel-19 CSI enhancements | Samsung (Moderator) |
R1-2408637 | Moderator summary on Rel-19 CSI enhancements | Samsung (Moderator) |
R1-2408638 | Views on Rel-19 CSI enhancements | Samsung |
R1-2408739 | CSI enhancement for NR MIMO Phase 5 | Nokia |
R1-2408779 | Discussion on CSI enhancements | NTT DOCOMO, INC., NTT CORPORATION |
R1-2408843 | CSI enhancements for >32 ports and UE-assisted CJT | Qualcomm Incorporated |
R1-2408876 | CSI enhancements for large antenna arrays and CJT | Ericsson |
R1-2408926 | CSI Enhancements | CEWiT |
R1-2408948 | Discussion on CSI enhancements for NR MIMO Phase 5 | KDDI Corporation |
R1-2408964 | Discussion on CSI enhancements | NICT |
R1-2409017 | Views on Rel-19 CSI enhancements | Samsung |
R1-2409058 | Moderator Summary#2 on Rel-19 CSI enhancements: Round 2 | Moderator (Samsung) |
R1-2409059 | Moderator Summary#3 on Rel-19 CSI enhancements: Round 3 | Moderator (Samsung) |
R1-2409060 | Moderator Summary#4 on Rel-19 CSI enhancements: Round 4 | Moderator (Samsung) |
R1-2409061 | Moderator Summary for 1st offline on Rel-19 CSI enhancements | Moderator (Samsung) |
R1-2409062 | Moderator Summary for 2nd offline on Rel-19 CSI enhancements | Moderator (Samsung) |
R1-2409063 | Moderator Summary for 3rd offline on Rel-19 CSI enhancements | Moderator (Samsung) |
R1-2409064 | DRAFT LS to RAN2 on RRC and MAC CE impacts for Rel-19 NR MIMO Ph5 | Samsung |
R1-2409065 | LS to RAN2 on RRC and MAC CE impacts for Rel-19 NR MIMO Ph5 | RAN1, Samsung |
TDoc | Title | Source |
---|---|---|
R1-2407680 | Discussion on 3-antenna-port UL transmission | Huawei, HiSilicon |
R1-2407700 | Discussion on 3-antenna-port codebook-based transmissions | Spreadtrum Communications |
R1-2407775 | Discussion on 3-antenna-port codebook-based transmissions | ZTE Corporation, Sanechips |
R1-2407814 | 3-antenna-port UL transmissions | MediaTek Inc. |
R1-2407855 | Remaining issues on 3-antenna-port codebook-based uplink transmissions | vivo |
R1-2407899 | Discussion on support for 3-antenna-port codebook-based transmissions | CMCC |
R1-2407963 | Discussion on the support of 3-antenna-port CB based transmissions | Xiaomi |
R1-2407994 | Uplink 3 Port Codebook based Transmission | |
R1-2408041 | Enhancement for 3-antenna-port UL transmissions | CATT |
R1-2408110 | Discussion on uplink enhancement for UE with 3Tx | Fujitsu |
R1-2408166 | Discussion on 3-antenna-port uplink transmissions | OPPO |
R1-2408189 | Discussion on Rel-19 CB-based UL for 3TX UE | InterDigital, Inc. |
R1-2408191 | FL Summary Support for 3TX CB-based Uplink; First Round | Moderator (InterDigital, Inc.) |
R1-2408192 | FL Summary Support for 3TX CB-based Uplink; Second Round | Moderator (InterDigital, Inc.) |
R1-2408193 | Summary of Discussion on 3TX CB-based Uplink in RAN1#118b | Moderator (InterDigital, Inc.) |
R1-2408201 | Support for 3-antenna-port codebook-based transmissions | Lenovo |
R1-2408211 | Discussion on 3-antenna-port codebook-based transmissions | NEC |
R1-2408293 | Support for 3Tx UL MIMO | Intel Corporation |
R1-2408338 | Discussions on 3-antenna-port UE | LG Electronics |
R1-2408350 | Support for 3-antenna-port transmission | Sharp |
R1-2408459 | Views on R19 MIMO 3Tx transmission | Apple |
R1-2408639 | Views on Rel-19 3-antenna-port codebook-based transmissions | Samsung |
R1-2408740 | On the support for 3-antenna-port codebook-based transmissions | Nokia |
R1-2408768 | Support for 3 Tx UL Transmissions | Ericsson |
R1-2408780 | Discussion on support for 3-antenna-port codebook-based transmissions | NTT DOCOMO, INC. |
R1-2408844 | 3 Tx UL MIMO transmissions | Qualcomm Incorporated |
TDoc | Title | Source |
---|---|---|
R1-2407681 | Enhancements for asymmetric DL sTRP/UL mTRP scenarios | Huawei, HiSilicon |
R1-2407701 | Enhancements for asymmetric DL sTRP/UL mTRP scenarios | Spreadtrum Communications |
R1-2407729 | Discussion on enhancements for asymmetric DL sTRP/UL mTRP scenarios | China Telecom, ZTE |
R1-2407756 | Enhancement for asymmetric DL sTRP/UL mTRP scenarios | Tejas Network Limited |
R1-2407776 | Discussion on enhancements for asymmetric DL sTRP/UL mTRP scenarios | ZTE Corporation, Sanechips, China Telecom |
R1-2407815 | Asymmetric DL sTRP/UL mTRP deployments | MediaTek Inc. |
R1-2407821 | Discussion on asymmetric DL sTRP/UL mTRP scenarios | TCL |
R1-2407856 | Remaining issues on asymmetric DL sTRP/UL mTRP scenarios | vivo |
R1-2407900 | Discussion on enhancement for asymmetric DL sTRP/UL mTRP scenarios | CMCC |
R1-2407964 | Discussion on enhancement for asymmetric DL sTRP/UL mTRP scenarios | Xiaomi |
R1-2408042 | Enhancement for asymmetric DL sTRP/UL mTRP scenarios | CATT |
R1-2408111 | Discussion on UL-only mTRP operation | Fujitsu |
R1-2408118 | Discussion on enhancements for asymmetric DL sTRP/UL mTRP scenarios | Transsion Holdings |
R1-2408167 | Enhancements on asymmetric DL sTRP/UL mTRP scenarios | OPPO |
R1-2408190 | Discussion on Rel-19 Asymmetric mTRP Operation | InterDigital, Inc. |
R1-2408202 | Enhancement for asymmetric DL sTRP/UL mTRP scenarios | Lenovo |
R1-2408224 | Discussion on enhancements for asymmetric DL sTRP and UL mTRP scenarios | NEC |
R1-2408294 | Enhancements for asymmetric DL/UL scenarios | Intel Corporation |
R1-2408339 | Discussions on asymmetric DL sTRP/UL mTRP scenarios | LG Electronics |
R1-2408351 | Enhancement for asymmetric DL sTRP/UL mTRP scenarios | Sharp |
R1-2408369 | Discussion on enhancement for asymmetric DL sTRP and UL mTRP scenarios | |
R1-2408406 | Enhancement for asymmetric DL sTRP/UL mTRP scenarios | Sony |
R1-2408460 | Enhancements for asymmetric DL sTRP/UL mTRP | Apple |
R1-2408564 | Discussion on UL enhancement in asymmetric TRP scenarios | ETRI |
R1-2408584 | Enhancement for asymmetric DL sTRP UL mTRP scenarios | Ericsson |
R1-2408640 | Views on Rel-19 asymmetric DL sTRP/UL mTRP scenarios | Samsung |
R1-2408741 | Enhancement for asymmetric DL sTRP/UL mTRP scenarios | Nokia |
R1-2408781 | Discussion on enhancement for asymmetric DL sTRP/UL mTRP scenarios | NTT DOCOMO, INC. |
R1-2408845 | Enhancement for asymmetric DL sTRP and UL mTRP deployment scenarios | Qualcomm Incorporated |
R1-2408891 | Discussion on asymmetric DL sTRP and UL mTRP | ASUSTeK |
R1-2408995 | Summary #1 on Rel-19 asymmetric DL sTRP/UL mTRP | Moderator (OPPO) |
R1-2408996 | Summary #2 on Rel-19 asymmetric DL sTRP/UL mTRP | Moderator (OPPO) |
R1-2408997 | Summary #3 on Rel-19 asymmetric DL sTRP/UL mTRP | Moderator (OPPO) |
R1-2409254 | Summary #4 on Rel-19 asymmetric DL sTRP/UL mTRP | Moderator (OPPO) |
TDoc | Title | Source |
---|---|---|
R1-2407624 | Discussion for SBFD TX/RX/ measurement procedures | New H3C Technologies Co., Ltd. |
R1-2407631 | Discussion on SBFD TX/RX/measurement procedures | TCL |
R1-2407675 | On subband full duplex design | Huawei, HiSilicon |
R1-2407702 | Discussion on SBFD TX/RX/measurement procedures | Spreadtrum Communications |
R1-2407730 | Discussion on SBFD TX/RX/measurement procedures | China Telecom |
R1-2407752 | Discussion for SBFD TX/RX/ measurement procedures | Tejas Network Limited |
R1-2407807 | Discussion on transmission, reception and measurement procedures for SBFD operation | ZTE Corporation, Sanechips |
R1-2407857 | Discussion on Rel-19 SBFD operation | vivo |
R1-2407901 | Discussion on SBFD TX/RX/measurement procedures | CMCC |
R1-2407926 | Discussion on SBFD TX/RX/measurement procedures | MediaTek Inc |
R1-2407965 | Discussion on reception and transmission procedure for SBFD operation | Xiaomi |
R1-2408043 | Discussion on SBFD TX/RX/measurement procedures | CATT |
R1-2408086 | Discussion on SBFD TX/RX/measurement procedures | LG Electronics |
R1-2408112 | Discussion on SBFD Tx/Rx/measurement procedures | Fujitsu |
R1-2408119 | Discussion on SBFD operation | Transsion Holdings |
R1-2408142 | Discussion on SBFD Tx/Rx/measurement procedures | OPPO |
R1-2408232 | Discussion on SBFD TX-RX-measurement procedures | HONOR |
R1-2408276 | On TX RX and measurement procedures for SBFD operation | InterDigital, Inc. |
R1-2408328 | SBFD Tx/Rx/measurement aspects | Sharp |
R1-2408373 | Discussion on subband non-overlapping full duplex Tx-Rx and measurement operations | NEC |
R1-2408383 | Discussion on SBFD TX/RX/measurement procedures | Ruijie Networks Co. Ltd |
R1-2408407 | SBFD Tx/Rx/Measurement Procedures | Sony |
R1-2408461 | Discussion on SBFD TX/RX/measurement procedures | Apple |
R1-2408525 | SBFD Tx/Rx/measurement procedures | Ericsson |
R1-2408530 | Discussion on SBFD TX/RX/measurement procedures | Panasonic |
R1-2408551 | Views on SBFD TX/RX Measurement Procedures | Lenovo |
R1-2408565 | Discussion on SBFD TX/RX/measurement procedures | ETRI |
R1-2408593 | On SBFD TX/RX/measurement procedures | Nokia, Nokia Shanghai Bell |
R1-2408600 | Discussion on SBFD Tx/Rx/measurement procedures | Fraunhofer HHI, Fraunhofer IIS |
R1-2408642 | SBFD operation and procedures | Samsung |
R1-2408782 | Discussion on SBFD TX/RX/measurement procedures | NTT DOCOMO, INC. |
R1-2408825 | Discussion on SBFD TX/RX/measurement procedures | Kookmin University |
R1-2408828 | Discussion on SBFD TX/RX/measurement procedures | ITRI |
R1-2408846 | SBFD Transmission, Reception and Measurement Procedures | Qualcomm Incorporated |
R1-2408879 | Discussion on SBFD TX/RX/measurement procedures | Google Ireland Limited |
R1-2408898 | Discussion on SBFD TX/RX/measurement procedures | WILUS Inc. |
R1-2408907 | PRG allocation for SBFD | ASUSTeK |
R1-2408927 | Discussion on SBFD TX/RX/ measurement procedures | CEWiT |
R1-2409086 | Summary #1 of SBFD TX/RX/measurement procedures | Moderator (CATT) |
R1-2409087 | Summary #2 of SBFD TX/RX/measurement procedures | Moderator (CATT) |
R1-2409088 | Summary #3 of SBFD TX/RX/measurement procedures | Moderator (CATT) |
TDoc | Title | Source |
---|---|---|
R1-2407625 | Discussion for SBFD random access operation | New H3C Technologies Co., Ltd. |
R1-2407632 | Discussion on SBFD random access operation | TCL |
R1-2407633 | Discussion on SBFD random access operation | TCL |
R1-2407676 | On subband full duplex random access operation | Huawei, HiSilicon |
R1-2407703 | Discussion on SBFD random access operation | Spreadtrum Communications |
R1-2407731 | Discussion on SBFD random access operation | China Telecom |
R1-2407753 | Discussion on SBFD Random Access Operation | Tejas Network Limited |
R1-2407808 | Discussion on SBFD random access operation | ZTE Corporation, Sanechips |
R1-2407858 | Discussion on random access for Rel-19 SBFD | vivo |
R1-2407902 | Discussion on SBFD random access operation | CMCC |
R1-2407927 | Discussion on SBFD Random Access Operation | MediaTek Inc |
R1-2407966 | Discussion on SBFD random access operation | Xiaomi |
R1-2408044 | Discussion on SBFD random access operation | CATT |
R1-2408087 | Discussion on SBFD random access operation | LG Electronics |
R1-2408115 | Discussion on SBFD random access operation | Korea Testing Laboratory |
R1-2408120 | Discussion on SBFD random access operation | Transsion Holdings |
R1-2408143 | Discussion on SBFD random access operation | OPPO |
R1-2408215 | Discussion on random access for SBFD | NEC |
R1-2408277 | Discussion on SBFD random access operation | InterDigital, Inc. |
R1-2408325 | SBFD random access operation | Lenovo |
R1-2408329 | SBFD random access aspects | Sharp |
R1-2408384 | Discussion on SBFD random access operation | Ruijie Networks Co. Ltd |
R1-2408408 | SBFD RACH Operations | Sony |
R1-2408462 | Views on SBFD random access operation | Apple |
R1-2408504 | Discussion on SBFD random access operation | Fujitsu |
R1-2408526 | SBFD random access operation | Ericsson |
R1-2408531 | Discussion on SBFD random access operation | Panasonic |
R1-2408566 | SBFD random access operation | ETRI |
R1-2408587 | On SBFD random access operation | Google Ireland Limited |
R1-2408594 | SBFD random access operation | Nokia, Nokia Shanghai Bell |
R1-2408643 | Random access on SBFD resources | Samsung |
R1-2408752 | Discussion on RO validation for SBFD aware UE | ASUSTeK |
R1-2408754 | Discussion on SBFD Random Access operation | KT Corp. |
R1-2408783 | Discussion on SBFD random access operation | NTT DOCOMO, INC. |
R1-2408826 | Discussion on SBFD random access operation | Kookmin University |
R1-2408829 | Discussion on SBFD random access operation for SBFD aware UEs | ITRI |
R1-2408847 | SBFD Random Access Operation | Qualcomm Incorporated |
R1-2408899 | Discussion on SBFD random access operation | WILUS Inc. |
R1-2408928 | Discussion on SBFD random access operation | CEWiT |
R1-2409046 | Summary#1 on SBFD random access operation | Moderator (CMCC) |
R1-2409047 | Summary#2 on SBFD random access operation | Moderator (CMCC) |
R1-2409048 | Summary#3 on SBFD random access operation | Moderator (CMCC) |
TDoc | Title | Source |
---|---|---|
R1-2407626 | Discussion on CLI handling | New H3C Technologies Co., Ltd. |
R1-2407677 | On cross-link interference handling for subband full duplex | Huawei, HiSilicon |
R1-2407704 | Discussion on CLI handling | Spreadtrum Communications |
R1-2407754 | Discussion on gNB-gNB CLI handling | Tejas Network Limited |
R1-2407809 | Discussion on CLI handling for Rel-19 duplex operation | ZTE Corporation, Sanechips |
R1-2407859 | Discussion on CLI handling for Rel-19 NR duplex | vivo |
R1-2407903 | Discussion on CLI handling | CMCC |
R1-2407928 | Discussion on CLI Handling in SBFD System | MediaTek Inc |
R1-2407967 | Discussion on CLI handling for SBFD operation | Xiaomi |
R1-2408045 | Discussion on CLI handling for NR duplex evolution | CATT |
R1-2408088 | Discussion on CLI handling | LG Electronics |
R1-2408144 | CLI handling in NR duplex operation | OPPO |
R1-2408216 | CLI handling for NR duplex operations | NEC |
R1-2408278 | Discussion on CLI handling for SBFD operation | InterDigital, Inc. |
R1-2408409 | CLI handling for SBFD | Sony |
R1-2408463 | Discussion on CLI handling | Apple |
R1-2408498 | Discussion on CLI handling | Panasonic |
R1-2408527 | SBFD CLI Handling | Ericsson |
R1-2408567 | Discussion on CLI handling for SBFD operation | ETRI |
R1-2408588 | On the gNB-to-gNB CLI and the UE-to-UE CLI handling | Google Ireland Limited |
R1-2408595 | Cross-link interference handling for duplex evolution | Nokia, Nokia Shanghai Bell |
R1-2408644 | Cross-link interference handling for SBFD | Samsung |
R1-2408784 | Discussion on CLI handling | NTT DOCOMO, INC. |
R1-2408848 | Enhancements for CLI handling | Qualcomm Incorporated |
R1-2408884 | Cross-link interference management for duplexing evolution | Lenovo |
R1-2408900 | Discussion on CLI handling for NR duplex operation | WILUS Inc. |
R1-2408929 | Discussion on CLI handling | CEWiT |
R1-2409175 | Summary #1 of CLI handling | Moderator (Huawei) |
R1-2409176 | Summary #2 of CLI handling | Moderator (Huawei) |
R1-2409177 | Summary #3 of CLI handling | Moderator (Huawei) |
TDoc | Title | Source |
---|---|---|
R1-2409167 | Summary#1 for Reply LS on data block sizes for Ambient IoT | Moderator (MediaTek) |
R1-2409204 | Summary#2 for Reply LS on data block sizes for Ambient IoT | Moderator (MediaTek) |
R1-2409223 | Session notes for 9.4 (Study on solutions for Ambient IoT in NR) | Ad-Hoc Chair (Huawei) |
R1-2409249 | [Draft] Reply LS to RAN2 on data block sizes for Ambient IoT | Moderator (MediaTek) |
R1-2409250 | Reply LS to RAN2 on data block sizes for Ambient IoT | RAN1, MediaTek |
TDoc | Title | Source |
---|---|---|
R1-2407608 | Discussion on evaluation assumptions and results for Ambient IoT devices | FUTUREWEI |
R1-2407636 | Evaluation assumptions and results for Ambient IoT | Ericsson |
R1-2407643 | Evaluation assumptions and results for Ambient IoT | Nokia |
R1-2407667 | Evaluation methodology and assumptions for Ambient IoT | Huawei, HiSilicon |
R1-2407705 | Discussion on evaluation assumptions and results for Ambient IoT | Spreadtrum Communications |
R1-2407732 | Discussion on evaluation assumptions and results for Ambient IoT | China Telecom |
R1-2407760 | Discussion on Link Level simulation of A-IoT | Tejas Network Limited |
R1-2407860 | Evaluation methodologies assumptions and results for Ambient IoT | vivo |
R1-2407904 | Discussion on evaluation assumptions and results for Ambient IoT | CMCC |
R1-2407968 | Evaluation assumptions and results for Ambient IoT | Xiaomi |
R1-2408046 | The evaluation methodology and preliminary results of Ambient IoT | CATT |
R1-2408065 | Discussion on Ambient IoT evaluations | ZTE Corporation, Sanechips |
R1-2408145 | Discussion on evaluation assumptions and results for A-IoT | OPPO |
R1-2408233 | Discussion on evaluation assumptions and results for Ambient IoT | HONOR |
R1-2408355 | Analysis for Inventory Completion Time for Multiple A-IoT Devices | Wiliot Ltd. |
R1-2408374 | Discussion on ambient IoT evaluation framework | NEC |
R1-2408464 | On remaining evaluation assumptions and results for AIoT | Apple |
R1-2408598 | Link level simulation for Ambient IoT R2D | Panasonic |
R1-2408645 | Considerations for evaluation assumptions and results | Samsung |
R1-2408670 | Discussion on Ambient IoT evaluation | LG Electronics |
R1-2408699 | Evaluation assumptions and results for A-IoT | MediaTek Inc. |
R1-2408731 | Evaluation results for Ambient IoT | InterDigital, Inc. |
R1-2408785 | Study on evaluation assumptions and results for Ambient IoT | NTT DOCOMO, INC. |
R1-2408849 | Evaluation Assumptions and Results | Qualcomm Incorporated |
R1-2408930 | Discussion on Evaluation assumptions and results | CEWiT |
R1-2408938 | Evaluation assumption and results for AIoT | IIT Kanpur, Indian Institute of Tech (M) |
R1-2408966 | Discussion on the evaluation assumptions for Ambient IoT devices | Lenovo |
R1-2408987 | Ambient IoT evaluations | Sony |
R1-2409006 | Discussion on evaluation assumptions and results for Ambient IoT | CMCC |
R1-2409022 | Discussion on evaluation assumptions and results for Ambient IoT | China Telecom |
R1-2409027 | Considerations for evaluation assumptions and results | Samsung |
R1-2409119 | FL summary #1 for Ambient IoT evaluation | Moderator (CMCC) |
R1-2409120 | FL summary #2 for Ambient IoT evaluation | Moderator (CMCC) |
R1-2409121 | FL summary #3 for Ambient IoT evaluation | Moderator (CMCC) |
R1-2409122 | Draft TP for Ambient IoT evaluation results for TR38.769 – single device latency | Moderator (CMCC) |
R1-2409123 | Draft TP for Ambient IoT evaluation results for TR38.769 – multiple-device inventory completion time | Moderator (CMCC) |
R1-2409124 | Draft TP for Ambient IoT evaluation results for TR38.769 – coverage evaluation | Moderator (CMCC) |
R1-2409125 | Draft TP for Ambient IoT receiver sensitivities for TR38.769 | Moderator (CMCC) |
R1-2409126 | [TP for Annex Z of TR38.769 for receiver sensitivity] | Moderator (CMCC) |
R1-2409127 | [TP for section 7.1.1 of TR38.769 for D1T1 coverage evaluations] | Moderator (CMCC) |
R1-2409128 | [TP for section 7.1.2 of TR38.769 for D2T2 coverage evaluations] | Moderator (CMCC) |
R1-2409129 | [TP for section 7.1.3 and 7.1.4 of TR38.769 for R2D and D2R link performance evaluations] | Moderator (CMCC) |
R1-2409319 | FL summary (final) for Ambient IoT evaluation | Moderator (CMCC) |
TDoc | Title | Source |
---|---|---|
R1-2407609 | Discussion on Rel-19 Ambient IoT device architecture | FUTUREWEI |
R1-2407627 | Discussion on ambient IoT device architectures | TCL |
R1-2407637 | Ambient IoT device architectures | Ericsson |
R1-2407644 | Ambient IoT device architectures | Nokia |
R1-2407668 | Ultra low power device architectures for Ambient IoT | Huawei, HiSilicon |
R1-2407706 | Discussion on Ambient IoT device architectures | Spreadtrum Communications, SGITG |
R1-2407733 | Discussion on Ambient IoT device architectures | China Telecom |
R1-2407761 | Discussion on receiver architecture of A-IoT | Tejas Network Limited |
R1-2407861 | Discussion on Ambient IoT Device architectures | vivo |
R1-2407905 | Discussion on Ambient IoT device architectures | CMCC |
R1-2407969 | Discussion on ambient IoT device architectures | Xiaomi |
R1-2408047 | Study of the Ambient IoT devices architecture | CATT |
R1-2408066 | Discussion on Ambient IoT device architectures | ZTE Corporation, Sanechips |
R1-2408146 | Discussion on device architecture for A-IoT device | OPPO |
R1-2408375 | Device architecture requirements for ambient IoT | NEC |
R1-2408465 | On remaining details of device architecture for AIoT | Apple |
R1-2408646 | Remaining issues for Ambient-IoT device architectures | Samsung |
R1-2408671 | Discussion on Ambient IoT device architectures | LG Electronics |
R1-2408700 | Ambient IoT device architectures | MediaTek Inc. |
R1-2408733 | Device architectures for Ambient IoT | InterDigital, Inc. |
R1-2408786 | Study on device architectures for Ambient IoT | NTT DOCOMO, INC. |
R1-2408850 | Ambient IoT Device Architecture | Qualcomm Incorporated |
R1-2408939 | Views on Architecture of Ambient IoT | IIT Kanpur, Indian Institute of Tech (M) |
R1-2408988 | Ambient IoT device architecture | Sony |
R1-2409066 | RAN1#118-bis FL Summary #1 for 9.4.1.2 Ambient IoT Device Architecture | Moderator (Qualcomm) |
R1-2409067 | RAN1#118-bis FL Summary #2 for 9.4.1.2 Ambient IoT Device Architecture | Moderator (Qualcomm) |
R1-2409068 | RAN1#118-bis FL Summary #3 for 9.4.1.2 Ambient IoT Device Architecture | Moderator (Qualcomm) |
R1-2409069 | RAN1#118-bis FL Summary #4 for 9.4.1.2 Ambient IoT Device Architecture | Moderator (Qualcomm) |
TDoc | Title | Source |
---|---|---|
R1-2407610 | Discussion on physical layer design for Rel-19 Ambient IoT devices | FUTUREWEI |
R1-2407628 | Discussion on general aspects of physical layer design for Ambient IoT | TCL |
R1-2407638 | General aspects of physical layer design for Ambient IoT | Ericsson |
R1-2407645 | General aspects of physical layer design for Ambient IoT | Nokia |
R1-2407669 | On general aspects of physical layer design for Ambient IoT | Huawei, HiSilicon |
R1-2407707 | Discussion on general aspects of physical layer design for Ambient IoT | Spreadtrum Communications |
R1-2407734 | Discussion on general aspects of physical layer design for Ambient IoT | China Telecom |
R1-2407862 | Discussion on General Aspects of Physical Layer Design | vivo |
R1-2407906 | Discussion on general aspects of A-IoT physical layer design | CMCC |
R1-2407970 | Discussion on physical layer design of Ambient IoT | Xiaomi |
R1-2408048 | Discussion on general aspects of physical layer design | CATT |
R1-2408067 | Discussion on general aspects of physical layer design for Ambient IoT | ZTE Corporation, Sanechips |
R1-2408147 | Discussion on general aspects of physical layer design of A-IoT communication | OPPO |
R1-2408206 | Discussion on general aspects of ambient IoT physical layer design | NEC |
R1-2408250 | Discussion on general aspects of physical layer design | Sharp |
R1-2408272 | Discussion on Physical Layer Design for Ambient-IoT | EURECOM |
R1-2408308 | On General Physical Layer Design Considerations for Ambient IoT Applications | Lekha Wireless Solutions |
R1-2408410 | General aspects of Ambient IoT physical layer design | Sony |
R1-2408466 | On remaining general physical layer design aspects for AIoT | Apple |
R1-2408568 | Discussion on general aspects of physical layer design | ETRI |
R1-2408599 | General aspects of physical layer design for Ambient IoT | Panasonic |
R1-2408647 | Considerations for general aspects of Ambient IoT | Samsung |
R1-2408672 | General aspects of Ambient IoT physical layer design | LG Electronics |
R1-2408685 | Discussion on physical layer design for Ambient IoT | Comba |
R1-2408701 | General aspects of physical layer design | MediaTek Inc. |
R1-2408730 | On the general aspects of physical layer design for Ambient IoT | InterDigital, Inc. |
R1-2408765 | Discussion on A-IoT physical layer design | ASUSTeK |
R1-2408787 | Study on general aspects of physical layer design for Ambient IoT | NTT DOCOMO, INC. |
R1-2408851 | General aspects of physical layer design | Qualcomm Incorporated |
R1-2408875 | Discussion on multiple access for D2R | LG Uplus |
R1-2408941 | Discussion on General aspects of physical layer design of AIoT | IIT Kanpur, Indian Institute of Tech (M) |
R1-2408967 | Discussion on the physical layer design aspects for Ambient IoT devices | Lenovo |
R1-2409005 | Discussion on general aspects of physical layer design for Ambient IoT | ZTE Corporation, Sanechips |
R1-2409070 | Feature Lead Summary #1 for 9.4.2.1: “Ambient IoT – General aspects of physical layer design” | Moderator (Huawei) |
R1-2409071 | Feature Lead Summary #2 for 9.4.2.1: “Ambient IoT – General aspects of physical layer design” | Moderator (Huawei) |
R1-2409072 | Feature Lead Summary #3 for 9.4.2.1: “Ambient IoT – General aspects of physical layer design” | Moderator (Huawei) |
R1-2409259 | Feature Lead Summary #4 for 9.4.2.1: “Ambient IoT – General aspects of physical layer design” | Moderator (Huawei) |
R1-2409311 | Feature Lead Summary #5 for 9.4.2.1: “Ambient IoT – General aspects of physical layer design” | Moderator (Huawei) |
TDoc | Title | Source |
---|---|---|
R1-2407611 | Discussion on Frame Structure and Timing Aspects for Ambient IoT | FUTUREWEI |
R1-2407639 | Frame structure and timing aspects for Ambient IoT | Ericsson |
R1-2407646 | Frame structure and timing aspects for Ambient IoT | Nokia |
R1-2407670 | On frame structure and timing aspects of Ambient IoT | Huawei, HiSilicon |
R1-2407708 | Discussion on frame structure and timing aspects for Ambient IoT | Spreadtrum Communications |
R1-2407735 | Discussion on frame structure and timing aspects for Ambient IoT | China Telecom |
R1-2407762 | Resource allocation and frame structure of A-IoT | Tejas Network Limited |
R1-2407818 | Discussion on frame structure and physical layer procedures for Ambient IoT | Lenovo |
R1-2407863 | Discussion on Frame structure, random access, scheduling and timing aspects for Ambient IoT | vivo |
R1-2407907 | Discussion on frame structure and timing aspects for A-IoT | CMCC |
R1-2407971 | Discussion on frame structure and timing aspects for Ambient IoT | Xiaomi |
R1-2408049 | Study of Frame structure and timing aspects for Ambient IoT | CATT |
R1-2408068 | Discussion on frame structure and physical layer procedure for Ambient IoT | ZTE Corporation, Sanechips |
R1-2408113 | Discussion on frame structure and timing aspects | Fujitsu |
R1-2408148 | Discussion on frame structure and timing aspects of A-IoT communication | OPPO |
R1-2408207 | Discussion on frame structure and timing for ambient IoT | NEC |
R1-2408234 | Discussion on frame structure and timing aspects for Ambient IoT | HONOR |
R1-2408251 | Discussion on frame structure and timing aspects | Sharp |
R1-2408264 | Discussion on Frame structure and timing aspects for A-IoT | China Unicom |
R1-2408370 | Discussion on frame structure and timing aspects | |
R1-2408411 | Frame structure and timing aspects for Ambient IoT | Sony |
R1-2408434 | Frame structure and timing aspects of Ambient IoT | InterDigital, Inc. |
R1-2408467 | On remaining frame structure and timing aspects for AIoT | Apple |
R1-2408536 | Discussion on A-IoT Frame Structure and Timing Aspects | Panasonic |
R1-2408569 | Discussion on frame structure and timing aspects | ETRI |
R1-2408596 | Frame Structure and Timing Aspects for Ambient IoT | IIT, Kharagpur |
R1-2408648 | Considerations for frame structure and timing aspects | Samsung |
R1-2408673 | Frame structure and timing aspects for Ambient IoT | LG Electronics |
R1-2408687 | Discussion on frame structre and timing aspects for Ambient IoT | BUPT |
R1-2408702 | Frame structure and timing aspects | MediaTek Inc. |
R1-2408742 | Considerations for frame structure and timing aspects | Semtech Neuchatel SA |
R1-2408763 | Discussion on frame structure and timing aspect | ASUSTeK |
R1-2408788 | Study on frame structure and timing aspects for Ambient IoT | NTT DOCOMO, INC. |
R1-2408852 | Frame structure and timing aspects | Qualcomm Incorporated |
R1-2408901 | Discussion on frame structure and timing aspects for Ambient IoT | WILUS Inc. |
R1-2408920 | Discussion on frame structure and timing aspects for Ambient IoT | TCL |
R1-2408931 | Discussion on Frame structure and timing aspects | CEWiT |
R1-2408942 | Frame structure and timing aspects of AIoT | IIT Kanpur, Indian Institute of Tech (M) |
R1-2408990 | Study on frame structure and timing aspects for Ambient IoT | NTT DOCOMO, INC. |
R1-2408991 | FL summary #1 on frame structure and timing aspects for Rel-19 Ambient IoT | Moderator (vivo) |
R1-2408992 | FL summary #2 on frame structure and timing aspects for Rel-19 Ambient IoT | Moderator (vivo) |
R1-2408993 | FL summary #3 on frame structure and timing aspects for Rel-19 Ambient IoT | Moderator (vivo) |
R1-2409008 | Discussion on Frame structure, random access, scheduling and timing aspects for Ambient IoT | vivo |
R1-2409026 | Discussion on frame structure and physical layer procedures for Ambient IoT | Lenovo |
R1-2409057 | Frame structure and timing aspects | Qualcomm Incorporated |
R1-2409187 | TP on section 6.2 Device (un)availability for TR 38.769 | Moderator (vivo) |
R1-2409244 | Final FL summary on frame structure and timing aspects for Rel-19 Ambient IoT | Moderator (vivo) |
TDoc | Title | Source |
---|---|---|
R1-2407612 | Discussion on D2R and R2D Channel/Signal Aspects for Ambient IoT | FUTUREWEI |
R1-2407629 | Discussion on downlink and uplink channel/signal aspects | TCL |
R1-2407640 | Downlink and uplink channel/signal aspects for Ambient IoT | Ericsson |
R1-2407647 | R2D and D2R channel/signal aspects for Ambient IoT | Nokia |
R1-2407671 | Physical channels and signals for Ambient IoT | Huawei, HiSilicon |
R1-2407709 | Discussion on downlink and uplink channel/signal aspects for Ambient IoT | Spreadtrum Communications |
R1-2407736 | Discussion on downlink and uplink channel/signal aspects for Ambient IoT | China Telecom |
R1-2407763 | Study the downlink and uplink channels of A-IoT | Tejas Network Limited |
R1-2407819 | Discussion on channel/signal aspects for Ambient IoT | Lenovo |
R1-2407864 | Discussion on Downlink and uplink channel/signal aspects | vivo |
R1-2407908 | Discussion on downlink and uplink channel/signal aspects | CMCC |
R1-2407972 | Discussion on downlink and uplink channel and signal aspects for Ambient IoT | Xiaomi |
R1-2408050 | DL and UL Physical Channels/signals design in support of Ambient IoT devices | CATT |
R1-2408069 | Discussion on channel and signal for Ambient IoT | ZTE Corporation, Sanechips |
R1-2408114 | Discussion on downlink and uplink channel/signal aspects | Fujitsu |
R1-2408149 | Discussion on downlink and uplink channel/signal aspects for A-IoT | OPPO |
R1-2408208 | Discussion on downlink and uplink channel for ambient IoT | NEC |
R1-2408252 | Discussion on downlink and uplink channel/signal aspects | Sharp |
R1-2408265 | Discussion on downlink and uplink channel aspects for A-IoT | China Unicom |
R1-2408371 | Discussion on downlink and uplink transmission aspects | |
R1-2408412 | Downlink and uplink channel / signal aspects for Ambient IoT | Sony |
R1-2408435 | Downlink and uplink channels aspects of Ambient IoT | InterDigital, Inc. |
R1-2408468 | On remaining details of physical channels/signals for AIoT | Apple |
R1-2408470 | FL summary#1 on downlink and uplink channel/signal aspects | Moderator (Apple) |
R1-2408471 | FL summary#2 on downlink and uplink channel/signal aspects | Moderator (Apple) |
R1-2408472 | FL summary#3 on downlink and uplink channel/signal aspects | Moderator (Apple) |
R1-2408532 | Considerations on Intermediate UE in A-IoT | Continental Automotive |
R1-2408570 | Discussion on downlink and uplink channel/signal aspects for A-IoT | ETRI |
R1-2408601 | Discussion on downlink and uplink channels and signals for A-IoT | Panasonic |
R1-2408649 | Considerations for downlink and uplink channel/signal aspect | Samsung |
R1-2408674 | Downlink and uplink channel/signal aspects for Ambient IoT | LG Electronics |
R1-2408703 | Downlink and uplink channel/signal aspects | MediaTek Inc. |
R1-2408743 | Considerations for downlink and uplink channel/signal aspects | Semtech Neuchatel SA |
R1-2408764 | Discussion on downlink and uplink channel/signal aspect | ASUSTeK |
R1-2408789 | Study on downlink and uplink channel/signal aspects for Ambient IoT | NTT DOCOMO, INC. |
R1-2408853 | Downlink and uplink channel/signal aspects | Qualcomm Incorporated |
R1-2408932 | Discussion on Downlink and Uplink channel/signal aspects | CEWiT |
R1-2408943 | Discussion on Downlink and Uplink channel signal aspects for AIoT | IIT Kanpur, Indian Institute of Tech (M) |
R1-2409023 | Downlink and uplink channel/signal aspects for Ambient IoT | Ericsson |
R1-2409304 | Final FL summary on downlink and uplink channel/signal aspects | Moderator (Apple) |
TDoc | Title | Source |
---|---|---|
R1-2407613 | Discussion on External Carrier Waveform Characteristics for Rel-19 Ambient IoT devices | FUTUREWEI |
R1-2407630 | Discussion on waveform characteristics of external carrier-wave for Ambient IoT | TCL |
R1-2407641 | Waveform characteristics of carrier wave provided externally to the Ambient IoT device | Ericsson |
R1-2407648 | Waveform characteristics of carrier-wave provided externally to the Ambient IoT device | Nokia |
R1-2407672 | On external carrier wave for backscattering based Ambient IoT device | Huawei, HiSilicon |
R1-2407710 | Discussion on waveform characteristics of external carrier-wave for Ambient IoT | Spreadtrum Communications |
R1-2407737 | Discussion on waveform characteristics of carrier-wave provided externally to the Ambient IoT device | China Telecom |
R1-2407764 | Discussion on CW waveform characteristics of A-IoT | Tejas Network Limited |
R1-2407820 | Discussion on external carrier wave for Ambient IoT | Lenovo |
R1-2407865 | Discussion on CW waveform and interference handling at AIoT UL receiver | vivo |
R1-2407909 | Discussion on waveform characteristics of carrier-wave provided externally to the Ambient IoT device | CMCC |
R1-2407973 | Discussion on waveform characteristics of carrier-wave | Xiaomi |
R1-2408051 | Discussion on the waveform characteristics of carrier-wave for the Ambient IoT device | CATT |
R1-2408070 | Discussion on carrier wave for Ambient IoT | ZTE Corporation, Sanechips |
R1-2408150 | Discussion on Waveform characteristics of carrier-wave provided externally to the A-IoT device | OPPO |
R1-2408209 | Discussion on the waveform of carrier-wave for the Ambient IoT | NEC |
R1-2408266 | Discussion on waveform characteristics of carrier-wave provided externally to the Ambient IoT device | China Unicom |
R1-2408469 | On remaining details of carrier waveform and interference handling for AIoT | Apple |
R1-2408571 | Discussion on carrier-wave for Ambient IoT | ETRI |
R1-2408602 | Discussion on waveform characteristics of carrier-wave for Ambient IoT device | Panasonic |
R1-2408650 | Considerations for Waveform characteristics of carrier-wave | Samsung |
R1-2408675 | Considerations on carrier-wave transmission for Ambient IoT | LG Electronics |
R1-2408732 | Carrier-wave for Ambient IoT | InterDigital, Inc. |
R1-2408790 | Study on waveform characteristics of carrier-wave for Ambient IoT | NTT DOCOMO, INC. |
R1-2408854 | Waveform characteristics of carrier-wave provided externally to the Ambient IoT device | Qualcomm Incorporated |
R1-2408933 | Discussion on Waveform characteristics of carrier-wave provided externally to the Ambient IoT device | CEWiT |
R1-2408989 | Controllable Carrier Wave Characteristics | Sony |
R1-2409149 | FL summary#1 on CW waveform characteristics for A-IoT | Moderator (Spreadtrum Communications) |
R1-2409238 | FL summary#2 on CW waveform characteristics for A-IoT | Moderator (Spreadtrum Communications) |
R1-2409297 | Final FL summary on CW waveform characteristics for A-IoT | Moderator (Spreadtrum Communications) |
TDoc | Title | Source |
---|---|---|
R1-2408816 | Updated workplan for Rel-19 network energy savings WI | Rapporteurs (Ericsson, Apple) |
TDoc | Title | Source |
---|---|---|
R1-2407619 | Discussion of on-demand SSB Scell operation | FUTUREWEI |
R1-2407685 | On-demand SSB SCell operation for eNES | Huawei, HiSilicon |
R1-2407711 | Discussion on on-demand SSB SCell operation | Spreadtrum Communications |
R1-2407738 | Discussion on on-demand SSB operation for SCell | China Telecom |
R1-2407757 | On demand SSB | Tejas Network Limited |
R1-2407792 | On-demand SSB SCell Operation | Nokia, Nokia Shanghai Bell |
R1-2407866 | Discussions on on-demand SSB Scell operation | vivo |
R1-2407910 | Discussion on on-demand SSB SCell operation | CMCC |
R1-2407974 | Discussion on on-demand SSB SCell operation | Xiaomi |
R1-2407995 | On-demand SSB SCell Operation | |
R1-2408052 | Discussion on on-demand SSB SCell operation | CATT |
R1-2408071 | Discussion on on-demand SSB for NES | ZTE Corporation, Sanechips |
R1-2408121 | Discussion on On-Demand SSB SCell operation | Transsion Holdings |
R1-2408132 | Discussion on the enhancement to support on demand SSB SCell operation | OPPO |
R1-2408248 | Discussion of On-demand SSB SCell operation | Mavenir |
R1-2408311 | Discussion on on-demand SSB SCell operation | InterDigital, Inc. |
R1-2408326 | On-demand SSB SCell operation | Lenovo |
R1-2408342 | Discussion on on-demand SSB SCell operation | Panasonic |
R1-2408376 | Discussion on on-demand SSB for SCell operation | NEC |
R1-2408413 | On-demand SSB SCell operation | Sony |
R1-2408473 | On-demand SSB SCell Operation | Apple |
R1-2408503 | Discussion on on-demand SSB SCell operation | Fujitsu |
R1-2408572 | Discussion on On-demand SSB SCell operation | ETRI |
R1-2408651 | On-demand SSB SCell operation | Samsung |
R1-2408676 | On-demand SSB SCell operation | LG Electronics |
R1-2408706 | On-demand SSB SCell operation | MediaTek Inc. |
R1-2408791 | Discussion on on-demand SSB SCell operation | NTT DOCOMO, INC. |
R1-2408817 | On-demand SSB SCell operation | Ericsson |
R1-2408830 | Discussion on on-demand SSB SCell operation | ITRI |
R1-2408855 | On-demand SSB operation for Scell | Qualcomm Incorporated |
R1-2408878 | Discussion on details of on-demand SSB operation on SCell | SHARP Corporation |
R1-2408909 | DCI based signaling for on-demand SSB | ASUSTeK |
R1-2408934 | Discussion on on-demand SSB Scell operation | CEWiT |
R1-2409009 | Discussion on details of on-demand SSB operation on SCell | SHARP |
R1-2409107 | Summary #1 of on-demand SSB for NES | Moderator (LG Electronics) |
R1-2409108 | Summary #2 of on-demand SSB for NES | Moderator (LG Electronics) |
R1-2409109 | Summary #3 of on-demand SSB for NES | Moderator (LG Electronics) |
R1-2409110 | Summary #4 of on-demand SSB for NES | Moderator (LG Electronics) |
R1-2409289 | Summary #5 of on-demand SSB for NES | Moderator (LG Electronics) |
TDoc | Title | Source |
---|---|---|
R1-2407620 | Discussion of on-demand SIB1 for idle/inactive mode UEs | FUTUREWEI |
R1-2407686 | Discussion on on-demand SIB1 for eNES | Huawei, HiSilicon |
R1-2407712 | Discussion on on-demand SIB1 for idle/inactive mode UEs | Spreadtrum Communications |
R1-2407739 | Discussion on on-demand SIB1 for idle/inactive mode UEs | China Telecom |
R1-2407758 | On demand SIB1 | Tejas Network Limited |
R1-2407793 | On-demand SIB1 for Idle/Inactive mode UEs | Nokia, Nokia Shanghai Bell |
R1-2407867 | Discussions on on-demand SIB1 for idle/inactive mode UEs | vivo |
R1-2407911 | Discussion on on-demand SIB1 for UEs in idle/inactive mode | CMCC |
R1-2407975 | Discussion on on-demand SIB1 for idle/inactive mode UEs | Xiaomi |
R1-2407996 | On-demand SIB1 for Idle/Inactive Mode UE | |
R1-2408053 | Discussion on on-demand SIB1 | CATT |
R1-2408072 | Discussion on on-demand SIB1 for NES | ZTE Corporation, Sanechips |
R1-2408122 | Discussion on on-demand SIB1 transmission for idle/inactive mode UEs | Transsion Holdings |
R1-2408133 | Discussion on the enhancement to support on demand SIB1 for idle/inactive mode UE | OPPO |
R1-2408312 | Discussion on on-demand SIB1 for idle/inactive mode UEs | InterDigital, Inc. |
R1-2408321 | Discussion on on-demand SIB1 for idle/inactive mode UEs | KT Corp. |
R1-2408327 | On-demand SIB1 for idle/inactive mode UEs | Lenovo |
R1-2408343 | Discussion on on-demand SIB1 for idle/inactive mode UEs | Panasonic |
R1-2408377 | Discussion on on-demand SIB1 for UEs in idle/inactive mode | NEC |
R1-2408414 | On-demand SIB1 for idle/inactive mode UEs | Sony |
R1-2408474 | On On-demand SIB1 for IDLE/INACTIVE mode UEs | Apple |
R1-2408502 | Discussion on on-demand SIB1 transmission for network energy savings | Fujitsu |
R1-2408573 | On-demand SIB1 for idle/inactive mode UEs | ETRI |
R1-2408582 | On-demand SIB1 for Idle/Inactive mode UEs | III |
R1-2408591 | Views on On-demand SIB1 operation for idle/inactive UEs | Vodafone, Deutsche Telekom |
R1-2408606 | Discussion on on-demand SIB1 transmission for idle UEs | Sharp |
R1-2408652 | On-demand SIB1 for idle/inactive mode UEs | Samsung |
R1-2408677 | On-demand SIB1 for idle/inactive mode UEs | LG Electronics |
R1-2408707 | On-demand SIB1 for idle or inactive mode UEs | MediaTek Inc. |
R1-2408792 | Discussion on on-demand SIB1 for idle/inactive mode UEs | NTT DOCOMO, INC. |
R1-2408808 | Discussion on on-demand SIB1 in idle/inactive mode | CAICT |
R1-2408818 | On-demand SIB1 for UEs in idle/inactive mode for NES | Ericsson |
R1-2408856 | On-demand SIB1 procedure | Qualcomm Incorporated |
R1-2408882 | Discussion on on-demand SIB1 for idle/inactive mode UEs | DENSO CORPORATION |
R1-2408910 | Triggering of on-demand SIB1 | ASUSTeK |
R1-2408935 | Discussion on on-demand SIB1 | CEWiT |
R1-2408951 | On-demand SIB1 for NES | Fraunhofer IIS, Fraunhofer HHI |
R1-2409012 | FL summary 1 for on-demand SIB1 in idle/inactive mode | Moderator (MediaTek) |
R1-2409013 | FL summary 2 for on-demand SIB1 in idle/inactive mode | Moderator (MediaTek) |
R1-2409014 | FL summary 3 for on-demand SIB1 in idle/inactive mode | Moderator (MediaTek) |
R1-2409015 | FL summary 4 for on-demand SIB1 in idle/inactive mode | Moderator (MediaTek) |
R1-2409016 | FL summary 5 for on-demand SIB1 in idle/inactive mode | Moderator (MediaTek) |
TDoc | Title | Source |
---|---|---|
R1-2407621 | Discussion of the adaptation of common signal/channel transmissions | FUTUREWEI |
R1-2407687 | On common channel/signal adaptation for eNES | Huawei, HiSilicon |
R1-2407713 | Discussion on adaptation of common signal/channel transmissions | Spreadtrum Communications |
R1-2407740 | Discussion on common signal/channel adaptation | China Telecom |
R1-2407759 | Adaptation of common signals/channels | Tejas Network Limited |
R1-2407794 | Adaptation of common signal/channel transmissions | Nokia, Nokia Shanghai Bell |
R1-2407868 | Discussions on adaptation of common signal/channel transmissions | vivo |
R1-2407912 | Discussion on adaptation of common signal/channel transmissions | CMCC |
R1-2407976 | Discussion on adaptation of common signal and channel transmissions | Xiaomi |
R1-2407997 | Adaptation of Common Signals | |
R1-2408054 | Discussion on adaptation of common signal/channel transmissions | CATT |
R1-2408073 | Discussion on common signal channel for NES | ZTE Corporation, Sanechips |
R1-2408123 | Discussion on adaptive transmission of common signal or common channel | Transsion Holdings |
R1-2408134 | Discussion on adaptation of common signal/channel transmission | OPPO |
R1-2408235 | Discussion on adaptation of common signal channel transmissions | HONOR |
R1-2408313 | Discussion on adaptation of common signal/channel transmissions | InterDigital, Inc. |
R1-2408352 | Discussion on adaptation of common signal/channel transmission | Panasonic |
R1-2408367 | Adaptation of common signals and channels | Lenovo |
R1-2408378 | Discussion on adaptation of common signal/channel transmissions | NEC |
R1-2408415 | Adaptation of common signal/channel transmissions | Sony |
R1-2408475 | On adaptation of common signal/channel for NES enhancements+B19 | Apple |
R1-2408501 | Discussion on adaptation of common signal / channel transmissions | Fujitsu |
R1-2408574 | Adaptation of common signal/channel transmissions | ETRI |
R1-2408607 | Discussion on adaptation of common signal/channel transmissions | Sharp |
R1-2408653 | Adaptation of common signal/channel transmissions | Samsung |
R1-2408678 | Adaptation of common signal/channel transmissions | LG Electronics |
R1-2408708 | Adaptation of common signal/channel transmissions | MediaTek Inc. |
R1-2408793 | Discussion on adaptation of common signal/channel transmissions | NTT DOCOMO, INC. |
R1-2408819 | Adaptation of common signal/channel transmissions for NES | Ericsson |
R1-2408857 | Adaptation of common channel transmissions | Qualcomm Incorporated |
R1-2408936 | Discussion on adaptation of common signal and channel transmissions | CEWiT |
R1-2408950 | Adaptation of Common Signals and Channels for NES | Fraunhofer IIS, Fraunhofer HHI |
R1-2409150 | Summary#1 of AI 9.5.3 for R19 NES | Moderator (Ericsson) |
R1-2409151 | Summary#2 of AI 9.5.3 for R19 NES | Moderator (Ericsson) |
R1-2409278 | Summary#3 of AI 9.5.3 for R19 NES | Moderator (Ericsson) |
R1-2409279 | Final summary of AI 9.5.3 for R19 NES | Moderator (Ericsson) |
TDoc | Title | Source |
---|---|---|
R1-2409307 | Summary of RAN1 agreements on LP-WUS/WUR for NR | Rapporteur (vivo) |
TDoc | Title | Source |
---|---|---|
R1-2407614 | Discussion on LP-WUS and LP-SS Design | FUTUREWEI |
R1-2407634 | Discussion on LP-WUS and LP-SS Design | TCL |
R1-2407664 | Signal Design of LP-WUS and LP-SS | Huawei, HiSilicon |
R1-2407714 | Discussion on LP-WUS and LP-SS design | Spreadtrum Communications |
R1-2407869 | Discussion on LP-WUS and LP-SS design | vivo |
R1-2407913 | Discussion on LP-WUS and LP-SS design | CMCC |
R1-2407977 | Discussion on LP-WUS and LP-SS design | Xiaomi |
R1-2408055 | Design of LP-WUS and LP-SS | CATT |
R1-2408074 | Discussion on LP-WUS design | ZTE Corporation, Sanechips |
R1-2408129 | Signal design for LP-WUS and LP-SS | OPPO |
R1-2408217 | Discussion on LP-WUS and LP-SS design | NEC |
R1-2408236 | Discussion on LP-WUS and LP-SS design | HONOR |
R1-2408253 | Discussion on LP-WUS and LP-SS design | Sharp |
R1-2408271 | Discussion on LP-WUS and LP-SS Design | EURECOM |
R1-2408280 | Discussion on LP-WUS and LP-SS design framework for Low power WUS | InterDigital, Inc. |
R1-2408344 | Discussion on the LP-WUS and LP-SS design | Panasonic |
R1-2408399 | LP-WUS and LP-SS Design | Everactive |
R1-2408416 | LP-WUS and LP-SS design | Sony |
R1-2408476 | LP-WUS and LP-SS design | Apple |
R1-2408537 | LP-WUS and LP-SS design | Nokia |
R1-2408654 | Discussion on LP-WUS and LP-SS design | Samsung |
R1-2408679 | Discussion on LP-WUS and LP-SS design | LG Electronics |
R1-2408691 | LP-WUS and LP-SS design | MediaTek Inc. |
R1-2408794 | Discussion on LP-WUS and LP-SS design | NTT DOCOMO, INC. |
R1-2408820 | LP-WUS and LP-SS design | Ericsson |
R1-2408858 | LP-WUS and LP-SS design | Qualcomm Incorporated |
R1-2408918 | On LP-WUS and LP-SS design | Nordic Semiconductor ASA |
R1-2408968 | Discussion on LP-WUS and LP-SS design | Lenovo |
R1-2409089 | Summary #1 of discussions on LP-WUS and LP-SS design | Moderator (vivo) |
R1-2409090 | Summary #2 of discussions on LP-WUS and LP-SS design | Moderator (vivo) |
R1-2409091 | Summary #3 of discussions on LP-WUS and LP-SS design | Moderator (vivo) |
R1-2409242 | Summary #4 of discussions on LP-WUS and LP-SS design | Moderator (vivo) |
R1-2409243 | Summary #5 of discussions on LP-WUS and LP-SS design | Moderator (vivo) |
R1-2409308 | Final summary of discussions on LP-WUS and LP-SS design | Moderator (vivo) |
TDoc | Title | Source |
---|---|---|
R1-2407615 | Discussion on LP-WUS Operation in IDLE/INACTIVE Modes | FUTUREWEI |
R1-2407635 | Discussion on LP-WUS Operation in IDLE/INACTIVE modes | TCL |
R1-2407665 | Procedures and functionalities of LP-WUS in IDLE/INACTIVE mode | Huawei, HiSilicon |
R1-2407715 | Discussion on LP-WUS operation in IDLE/INACTIVE modes | Spreadtrum Communications |
R1-2407870 | Discussion on LP-WUS operation in IDLE/INACTIVE modes | vivo |
R1-2407914 | Discussion on LP-WUS operation in IDLE/INACTIVE modes | CMCC |
R1-2407978 | Discussion on LP-WUS operation in Idle/Inactive modes | Xiaomi |
R1-2408056 | System design and procedure of LP-WUS operation for UE in IDLE/Inactive Modes | CATT |
R1-2408075 | Discussion on LP-WUS operation in IDLE/INACTIVE mode | ZTE Corporation, Sanechips |
R1-2408130 | Further consideration on LP-WUS operation in RRC_IDLE/INACTIVE modes | OPPO |
R1-2408218 | Discussion on LP-WUS operation in RRC IDLE/INACTIVE mode | NEC |
R1-2408254 | Discussion on LP-WUS operation in IDLE/INACTIVE modes | Sharp |
R1-2408281 | Discussion on LP-WUS operation in IDLE/INACTIVE modes | InterDigital, Inc. |
R1-2408345 | Discussion on LP-WUS operation in IDLE/INACTIVE modes | Panasonic |
R1-2408417 | LP-WUS operation in IDLE / INACTIVE modes | Sony |
R1-2408477 | LP-WUS operation in IDLE/INACTIVE modes | Apple |
R1-2408479 | Summary #1 on LP-WUS operation in IDLE/INACTIVE mode | Moderator (Apple) |
R1-2408480 | Summary #2 on LP-WUS operation in IDLE/INACTIVE mode | Moderator (Apple) |
R1-2408481 | Summary #3 on LP-WUS operation in IDLE/INACTIVE mode | Moderator (Apple) |
R1-2408500 | Discussion on LP-WUS operation in idle/inactive mode | Fujitsu |
R1-2408538 | LP-WUS operation in IDLE/Inactive mode | Nokia |
R1-2408575 | Discussion on LP-WUS operation in IDLE/INACTIVE modes | ETRI |
R1-2408592 | On LR and MR operating frequencies | Vodafone |
R1-2408655 | Discussion on LP-WUS operation in IDLE/INACTIVE modes | Samsung |
R1-2408680 | Discussion on LP-WUS operation in IDLE/INACTIVE modes | LG Electronics |
R1-2408692 | LP-WUS operation in IDLE/INACTIVE modes | MediaTek Inc. |
R1-2408795 | Discussion on LP-WUS operation in IDLE/INACTIVE modes | NTT DOCOMO, INC. |
R1-2408821 | LP-WUS operation in IDLE and INACTIVE modes | Ericsson |
R1-2408859 | LP-WUR operation in idle and inactive modes | Qualcomm Incorporated |
R1-2408917 | On LP-WUS operation in IDLE/Inactive | Nordic Semiconductor ASA |
R1-2408986 | Discussion on LP-WUS operation in Idle/Inactive modes | Lenovo |
R1-2409239 | Summary #4 on LP-WUS operation in IDLE/INACTIVE mode | Moderator (Apple) |
R1-2409240 | Summary #5 on LP-WUS operation in IDLE/INACTIVE mode | Moderator (Apple) |
R1-2409241 | Summary #6 on LP-WUS operation in IDLE/INACTIVE mode | Moderator (Apple) |
TDoc | Title | Source |
---|---|---|
R1-2407666 | Procedures and functionalities of LP-WUS in CONNECTED mode | Huawei, HiSilicon |
R1-2407716 | Discussion on LP-WUS operation in CONNECTED modes | Spreadtrum Communications |
R1-2407871 | Discussion on LP-WUS operation in CONNECTED modes | vivo |
R1-2407915 | Discussion on LP-WUS operation in CONNECTED mode | CMCC |
R1-2407979 | Discussion on LP-WUS operation in Connected mode | Xiaomi |
R1-2408057 | System design and procedure of LP-WUS operation for UE in CONNECTED Modes | CATT |
R1-2408076 | Discussion on LP-WUS operation in CONNECTED mode | ZTE Corporation, Sanechips |
R1-2408131 | Further consideration on LP-WUS operation in connected mode | OPPO |
R1-2408219 | Discussion on LP-WUS operation in RRC CONNECTED mode | NEC |
R1-2408255 | Discussion on LP-WUS operation in CONNECTED modes | Sharp |
R1-2408282 | Discussion on RRC CONNECTED mode LP-WUS monitoring | InterDigital, Inc. |
R1-2408322 | Discussion on LP-WUS operation in CONNECTED modes | Lenovo |
R1-2408418 | LP-WUS operation in CONNECTED mode | Sony |
R1-2408478 | LP-WUS operation in CONNECTED modes | Apple |
R1-2408495 | Discussion on LP-WUS operation in CONNECTED mode | Panasonic |
R1-2408539 | LP-WUS operation in CONNECTED mode | Nokia |
R1-2408576 | Discussion on LP-WUS operation in CONNECTED modes | ETRI |
R1-2408656 | Discussion on LP-WUS operation in CONNECTED modes | Samsung |
R1-2408681 | Discussion on LP-WUS operation in CONNECTED modes | LG Electronics |
R1-2408693 | LP-WUS operation in CONNECTED modes | MediaTek Inc. |
R1-2408796 | Discussion on LP-WUS operation in CONNECTED mode | NTT DOCOMO, INC. |
R1-2408822 | LP-WUS operation in CONNECTED mode | Ericsson |
R1-2408860 | LP-WUR operation in connected mode | Qualcomm Incorporated |
R1-2408921 | Discussion on LP-WUS procedures in Connected mode | TCL |
R1-2409010 | FL summary #1 on LP-WUS operation in CONNECTED mode | Moderator (NTT DOCOMO) |
R1-2409197 | FL summary #2 on LP-WUS operation in CONNECTED mode | Moderator (NTT DOCOMO) |
R1-2409237 | FL summary #3 on LP-WUS operation in CONNECTED mode | Moderator (NTT DOCOMO) |
R1-2409265 | FL summary #4 on LP-WUS operation in CONNECTED mode | Moderator (NTT DOCOMO) |
R1-2409266 | FL summary #5 on LP-WUS operation in CONNECTED mode | Moderator (NTT DOCOMO) |
TDoc | Title | Source |
---|---|---|
R1-2408097 | Updated work plan on channel modelling for ISAC | Xiaomi, AT&T |
R1-2409224 | Session notes for 9.7 (Study on channel modelling for Integrated Sensing And Communication for NR) | Ad-Hoc Chair (Huawei) |
TDoc | Title | Source |
---|---|---|
R1-2407651 | Deployment scenarios for ISAC channel model | Huawei, HiSilicon |
R1-2407717 | Discussion on ISAC deployment scenarios | Spreadtrum Communications |
R1-2407741 | Discussion on ISAC deployment scenarios | China Telecom |
R1-2407750 | ISAC deployment scenarios | Tejas Network Limited |
R1-2407872 | Views on Rel-19 ISAC deployment scenarios | vivo |
R1-2407916 | Discussion on ISAC deployment scenarios | CMCC, China Southern Power Grid |
R1-2407980 | Deployment scenarios and evaluation assumptions for ISAC channel model | Xiaomi |
R1-2408058 | Discussion on ISAC deployment scenarios | CATT, CICTCI |
R1-2408092 | Discussion on ISAC deployment scenarios and requirements | EURECOM |
R1-2408154 | Discussion on ISAC deployment scenarios | OPPO |
R1-2408240 | Deployment scenarios for ISAC study | KRRI, Hanbat National University |
R1-2408274 | Discussion on ISAC deployment scenarios | TOYOTA InfoTechnology Center |
R1-2408303 | Discussion on ISAC deployment scenarios | LG Electronics |
R1-2408315 | Discussion on ISAC Deployment Scenarios | Nokia, Nokia Shanghai Bell |
R1-2408340 | Discussion on ISAC Deployment Scenarios | Ericsson |
R1-2408386 | Deployment scenarios for integrated sensing and communication with NR | NVIDIA |
R1-2408419 | Considerations on ISAC deployment scenarios | Sony |
R1-2408482 | Discussion on ISAC deployment scenarios | Apple |
R1-2408514 | Discussion on ISAC deployment scenarios | ZTE Corporation, Sanechips |
R1-2408523 | Discussion on ISAC deployment scenarios | InterDigital, Inc. |
R1-2408534 | Discussion on ISAC deployment scenarios | Panasonic |
R1-2408657 | Discussion on ISAC deployment scenarios | Samsung |
R1-2408710 | Discussion on ISAC deployment scenario | MediaTek Inc. |
R1-2408720 | Discussion on ISAC deployment scenarios | Tiami Networks |
R1-2408746 | Discussion on ISAC deployment scenarios | Lenovo |
R1-2408755 | Deployment Scenarios for ISAC Channel Modeling | AT&T, FirstNet |
R1-2408760 | FL Summary #1 on ISAC Deployment Scenarios | Moderator (AT&T) |
R1-2408761 | FL Summary #2 on ISAC Deployment Scenarios | Moderator (AT&T) |
R1-2408762 | FL Summary #3 on ISAC Deployment Scenarios | Moderator (AT&T) |
R1-2408797 | Study on deployment scenarios for ISAC channel modelling | NTT DOCOMO, INC. |
R1-2408809 | Considerations on ISAC deployment scenarios | CAICT |
R1-2408861 | Discussion on ISAC deployment scenarios | Qualcomm Incorporated |
R1-2408904 | Evaluation Parameters for ISAC in Automotive Scenarios | Continental Automotive |
TDoc | Title | Source |
---|---|---|
R1-2407652 | Channel modelling for ISAC | Huawei, HiSilicon |
R1-2407718 | Discussion on ISAC channel modeling | Spreadtrum Communications |
R1-2407742 | Discussion on ISAC channel modelling | China Telecom |
R1-2407751 | ISAC channel modelling | Tejas Network Limited |
R1-2407873 | Views on Rel-19 ISAC channel modelling | vivo, BUPT |
R1-2407917 | Discussion on channel modeling methodology for ISAC | CMCC,BUPT,SEU, PML |
R1-2408059 | Discussion on ISAC channel modelling | CATT, CICTCI |
R1-2408093 | Discussion on ISAC channel modeling | EURECOM |
R1-2408094 | Discussion on ISAC channel model | Xiaomi, BJTU, BUPT |
R1-2408098 | Summary #1 on ISAC channel modelling | Moderator (Xiaomi) |
R1-2408099 | Summary #2 on ISAC channel modelling | Moderator (Xiaomi) |
R1-2408100 | Summary #3 on ISAC channel modelling | Moderator (Xiaomi) |
R1-2408101 | Summary #4 on ISAC channel modelling | Moderator (Xiaomi) |
R1-2408155 | Study on ISAC channel modelling | OPPO |
R1-2408241 | Channel modelling for ISAC study | KRRI, Hanbat National University |
R1-2408263 | ISAC Channel Modeling and Measurement Validation | BUPT, CMCC |
R1-2408275 | Discussion on ISAC channel modelling | TOYOTA InfoTechnology Center |
R1-2408285 | Discussion on ISAC channel modeling | Intel Corporation |
R1-2408304 | Discussion on ISAC channel modelling | LG Electronics |
R1-2408307 | Discussions on ISAC Channel Modelling | Lekha Wireless Solutions |
R1-2408316 | Discussion on ISAC channel modeling | Nokia, Nokia Shanghai Bell |
R1-2408341 | Discussion on ISAC Channel Modelling | Ericsson |
R1-2408387 | Channel modeling for integrated sensing and communication with NR | NVIDIA |
R1-2408420 | Views on Channel Modelling for ISAC | Sony |
R1-2408483 | Discussion on ISAC channel modelling | Apple |
R1-2408515 | Discussion on channel modelling for ISAC | ZTE Corporation, Sanechips |
R1-2408524 | Discussion on ISAC channel modeling | InterDigital, Inc. |
R1-2408658 | Discussion on ISAC channel modelling | Samsung |
R1-2408711 | Discussion on ISAC channel modelling | MediaTek Inc. |
R1-2408721 | Discussion on ISAC Channel Modeling | Tiami Networks |
R1-2408724 | Discussion on ISAC Channel Modeling | NIST |
R1-2408747 | Discussion on Channel Modelling for ISAC | Lenovo |
R1-2408756 | Discussions on ISAC Channel Modeling | AT&T |
R1-2408798 | Discussion on ISAC channel modeling | NTT DOCOMO, INC. |
R1-2408810 | Considerations on ISAC channel modelling | CAICT |
R1-2408862 | Discussion on ISAC channel modelling | Qualcomm Incorporated |
R1-2408883 | Discussion on ISAC Channel Modelling | Panasonic |
R1-2408985 | Discussion on Channel Measurements and Modeling for Integrated Monostatic Sensing and Communication | Southeast University, Purple Mountain Laboratories |
R1-2409011 | Discussion on ISAC Channel Modelling | Ericsson |
R1-2409280 | Summary #5 on ISAC channel modelling | Moderator (Xiaomi) |
TDoc | Title | Source |
---|---|---|
R1-2408998 | Data source descriptions for 7 – 24 GHz SI | Moderator (Intel Corporation) |
R1-2409225 | Session notes for 9.8 (Study on channel modelling enhancements for 7-24GHz for NR) | Ad-Hoc Chair (CMCC) |
TDoc | Title | Source |
---|---|---|
R1-2407683 | Considerations on the 7-24GHz channel model validation | Huawei, HiSilicon |
R1-2407802 | Discussion on validation of channel model | Ericsson |
R1-2407874 | Views on channel model validation of TR38.901 for 7-24GHz | vivo, BUPT |
R1-2407931 | Discussion on the channel model validation | ZTE Corporation, Sanechips |
R1-2408060 | Discussion on channel model validation of TR38.901 for 7-24GHz | CATT |
R1-2408095 | Discussion on channel model validation of TR38.901 for 7-24GHz | BUPT |
R1-2408195 | Discussion on Angle Scaling for MIMO CDL Channel | InterDigital, Inc. |
R1-2408244 | Channel model validation of TR 38.901 for 7-24 GHz | Sharp |
R1-2408270 | Validation of Deterministic Radio Channel Model by 10 GHz Microcell Measurements | Keysight Technologies UK Ltd |
R1-2408283 | Discussion on channel modeling verification for 7-24 GHz | Intel Corporation |
R1-2408388 | Channel model validation of TR 38901 for 7-24 GHz | NVIDIA |
R1-2408421 | Discussion of channel model validation of TR38.901 for 7–24GHz | Sony |
R1-2408484 | On Validation of Channel Model | Apple |
R1-2408589 | Measurements of the angular spreads in a urban and suburban macrocells | Vodafone, Ericsson |
R1-2408659 | Discussion on channel model validation of TR38.901 for 7 - 24 GHz | Samsung |
R1-2408757 | Discussion on Validation of the Channel Model in 38901 | AT&T |
R1-2408799 | Discussion on channel model validation for 7-24 GHz | NTT DOCOMO, INC. |
R1-2408863 | Channel Model Validation of TR38.901 for 7-24 GHz | Qualcomm Incorporated |
R1-2408895 | Discussion on Channel model validation of TR38.901 for 7-24GHz | Nokia |
R1-2408984 | Discussion on channel model validation of 3GPP TR 38.901 for 7-24 GHz | Southeast University, Purple Mountain Laboratories, China Telecom |
R1-2408999 | Summary of issues for Rel-19 7-24 GHz Channel Modeling Validation | Moderator (Intel Corporation) |
R1-2409000 | Summary #1 of discussions for Rel-19 7-24 GHz Channel Modeling Validation | Moderator (Intel Corporation) |
R1-2409001 | Summary #2 of discussions for Rel-19 7-24 GHz Channel Modeling Validation | Moderator (Intel Corporation) |
R1-2409002 | Summary #3 of discussions for Rel-19 7-24 GHz Channel Modeling Validation | Moderator (Intel Corporation) |
R1-2409003 | Summary #4 of discussions for Rel-19 7-24 GHz Channel Modeling Validation | Moderator (Intel Corporation) |
TDoc | Title | Source |
---|---|---|
R1-2407684 | Considerations on the 7-24GHz channel model extension | Huawei, HiSilicon |
R1-2407803 | Discussion on adaptation and extension of channel model | Ericsson |
R1-2407875 | Views on channel model adaptation/extension of TR38.901 for 7-24GHz | vivo, BUPT |
R1-2407932 | Discussion on the channel model adaptation and extension | ZTE Corporation, Sanechips |
R1-2408061 | Discussion on channel model adaptation/extension of TR38.901 for 7-24GHz | CATT |
R1-2408089 | Discussion on channel modelling adaptation/extension for 7-24GHz | LG Electronics |
R1-2408096 | Discussion on modeling near-field propagation and spatial non-stationarity in TR38.901 for 7-24GHz | BUPT, CMCC |
R1-2408156 | Channel model adaptation and extension for 7-24GHz | OPPO |
R1-2408196 | Discussion on Channel Model Extension for FR3 | InterDigital, Inc. |
R1-2408284 | Discussion on channel model adaptation/extension | Intel Corporation |
R1-2408389 | Channel model adaptation of TR 38901 for 7-24 GHz | NVIDIA |
R1-2408422 | Discussion of channel model adaptation/extension of TR38.901 for 7–24GHz | Sony |
R1-2408485 | On Channel Model Adaptation and Extension of TR38.901 for 7-24 GHz | Apple |
R1-2408499 | Discussion on channel model adaptation/extension for 7-24 GHz | Fujitsu |
R1-2408660 | Discussion on channel model adaptation/extension of TR38.901 for 7 - 24 GHz | Samsung |
R1-2408705 | Discussion on channel modelling enhancements for 7-24GHz for NR | MediaTek Inc. |
R1-2408864 | Channel Model Adaptation/Extension of TR38.901 for 7-24GHz | Qualcomm Incorporated |
R1-2408896 | Discussion on Channel model adaptation/extension of TR38.901 for 7-24GHz | Nokia |
R1-2409152 | Summary#1 of channel model adaptation and extension | Moderator (ZTE Corporation) |
R1-2409153 | Summary#2 of channel model adaptation and extension | Moderator (ZTE Corporation) |
R1-2409154 | Summary#3 of channel model adaptation and extension | Moderator (ZTE Corporation) |
R1-2409155 | Summary#4 of channel model adaptation and extension | Moderator (ZTE Corporation) |
TDoc | Title | Source |
---|---|---|
R1-2407658 | Measurements related enhancements for LTM | Huawei, HiSilicon |
R1-2407719 | Discussion on measurements related enhancements for LTM | Spreadtrum Communications |
R1-2407777 | Discussion on measurements related enhancements for LTM | ZTE Corporation, Sanechips |
R1-2407876 | Discussion on measurements related enhancements for LTM | vivo |
R1-2407918 | Discussion on measurements related enhancements for LTM | CMCC |
R1-2407981 | Measurements related enhancements for LTM | Xiaomi |
R1-2408062 | Discussion on measurements related enhancements for LTM | CATT |
R1-2408090 | Discussion on measurements related enhancements for LTM | LG Electronics |
R1-2408168 | Discussions on measurement enhancement for LTM | OPPO |
R1-2408203 | Measurements related enhancements for LTM | Lenovo |
R1-2408305 | Discussion on measurement related enhancements for LTM | Lekha Wireless Solutions |
R1-2408353 | Measurement related enhancements for LTM | Panasonic |
R1-2408356 | FL plan for mobility enhancements in RAN1#118bis | Moderator (Fujitsu) |
R1-2408357 | FL summary 1 of Measurements related enhancements for LTM | Moderator (Fujitsu) |
R1-2408358 | FL summary 2 of Measurements related enhancements for LTM | Moderator (Fujitsu) |
R1-2408359 | FL summary 3 of Measurements related enhancements for LTM | Moderator (Fujitsu) |
R1-2408360 | Final FL summary of Measurements related enhancements for LTM | Moderator (Fujitsu) |
R1-2408372 | Discussion on measurements related enhancements for LTM | |
R1-2408379 | Discussion on measurements related enhancements for LTM | NEC |
R1-2408423 | Measurements related enhancements for LTM | Sony |
R1-2408433 | Measurements related enhancements for LTM | InterDigital, Inc. |
R1-2408486 | Measurements enhancements for LTM | Apple |
R1-2408497 | Measurements enhancements for LTM | TCL |
R1-2408508 | Discussion on measurement related enhancements for LTM | Fujitsu Limited |
R1-2408542 | Discussion on measurements related enhancements for LTM | Sharp |
R1-2408577 | Discussion on measurements related enhancements for LTM | ETRI |
R1-2408605 | Measurement related enhancements for LTM | Ericsson |
R1-2408661 | Views on Rel-19 measurement related enhancements for LTM | Samsung |
R1-2408714 | LTM measurements related enhancements | MediaTek Inc. |
R1-2408722 | Measurement related enhancements for LTM | Nokia |
R1-2408800 | Discussion on measurement related enhancements for LTM | NTT DOCOMO, INC. |
R1-2408865 | Measurements related enhancement for LTM | Qualcomm Incorporated |
R1-2408886 | Discussion on measurements related enhancements for LTM | KDDI Corporation |
R1-2409282 | [draft] LS on the support of semi-persistent CSI-RS resource for LTM candidate cells | Moderator (Fujitsu) |
R1-2409283 | LS on the support of semi-persistent CSI-RS resource for LTM candidate cells | RAN1, Fujitsu |
TDoc | Title | Source |
---|---|---|
R1-2407674 | Discussions on scheduling enhancements considering RRM measurements for XR | Huawei, HiSilicon |
R1-2407720 | Discussion on enabling TX/RX for XR during RRM measurements | Spreadtrum Communications |
R1-2407801 | Enhancements to enable TX/RX for XR during RRM measurements | Fraunhofer IIS, Fraunhofer HHI |
R1-2407877 | Discussion on enabling data transmissions for XR during RRM measurements | vivo |
R1-2407919 | Discussion on enabling TX/RX for XR during RRM measurements | CMCC |
R1-2407955 | Discussion on enabling TX/RX for XR during RRM measurements | Xiaomi |
R1-2408032 | Signaling control of scheduling restriction during measurement gap in support of XR services | CATT |
R1-2408077 | Discussion on measurement gap for XR | ZTE Corporation, Sanechips |
R1-2408091 | Enabling TX/RX for XR during RRM measurements | Lenovo |
R1-2408153 | Enhancements to enable TX/RX for XR during RRM measurements | OPPO |
R1-2408220 | Discussion on enabling TX/RX for XR during RRM measurements | NEC |
R1-2408256 | Enabling TX/RX for XR during RRM measurements | TCL |
R1-2408259 | Enabling TX/RX for XR during RRM measurements | Nokia |
R1-2408314 | Discussion on enabling TX/RX for XR during RRM measurements | InterDigital, Inc. |
R1-2408424 | Views on Enabling TX/RX for XR during RRM measurements | Sony |
R1-2408494 | Discussion on TX/RX for XR during RRM measurements | Apple (UK) Limited |
R1-2408535 | Discussion on Enabling TX/RX for XR During RRM Measurements | Meta |
R1-2408583 | On enabling Tx Rx for XR during RRM measurements | Google Ireland Limited |
R1-2408603 | Discussion on enabling TX/RX for XR during RRM measurements | Panasonic |
R1-2408662 | Discussion on enabling TX/RX for XR during RRM measurements | Samsung |
R1-2408682 | Discussion on XR during RRM measurements | LG Electronics |
R1-2408715 | Enabling TX RX for XR during RRM measurements | MediaTek Inc. |
R1-2408801 | Discussion on Enaling TX/RX for XR during RRM | NTT DOCOMO, INC. |
R1-2408866 | Enabling Tx/Rx for XR during RRM measurements | Qualcomm Incorporated |
R1-2408892 | Enabling TX/RX for XR traffic during RRM measurement gaps | Ericsson |
R1-2409104 | Moderator summary #1 - Enabling TX/RX for XR during RRM measurements | Moderator (Nokia) |
R1-2409105 | Moderator summary #2 - Enabling TX/RX for XR during RRM measurements | Moderator (Nokia) |
R1-2409106 | Moderator summary #3 - Enabling TX/RX for XR during RRM measurements | Moderator (Nokia) |
R1-2409306 | Moderator summary #4 - Enabling TX/RX for XR during RRM measurements | Moderator (Nokia) |
TDoc | Title | Source |
---|---|---|
R1-2407771 | Work plan for Rel-19 NR_NTN_Ph3 | THALES, CATT |
R1-2409226 | Session notes for 9.11 (Non-Terrestrial Networks for NR Phase 3 and Internet of Things Phase 3) | Ad-Hoc Chair (Huawei) |
R1-2409255 | IRIS² - The New EU Programme Providing Secure Communications Via Satellites | ESA |
R1-2409256 | Moderator’s summary on the discussion of common TA in a regenerative payload scenario | Moderator (CMCC) |
R1-2409257 | Draft Reply LS on common TA values in the regenerative payload scenario | CMCC |
R1-2409258 | Reply LS on common TA in a regenerative payload scenario | RAN1, CMCC |
TDoc | Title | Source |
---|---|---|
R1-2407660 | Discussion on downlink coverage enhancements for NR NTN | Huawei, HiSilicon |
R1-2407721 | Discussion on NR-NTN downlink coverage enhancement | Spreadtrum Communications |
R1-2407743 | Discussion on downlink coverage enhancements for NR NTN | China Telecom |
R1-2407765 | Discussions on downlink coverage enhancement for NR NTN | Fraunhofer IIS, Fraunhofer HHI |
R1-2407766 | NR NTN Downlink coverage enhancements | THALES |
R1-2407767 | FL Summary #1: NR-NTN downlink coverage enhancements | THALES |
R1-2407768 | FL Summary #2: NR-NTN downlink coverage enhancements | THALES |
R1-2407769 | FL Summary #3: NR-NTN downlink coverage enhancements | THALES |
R1-2407770 | FL Summary #4: NR-NTN downlink coverage enhancements | THALES |
R1-2407816 | Discussion on DL coverage enhancements for NR-NTN | NICT |
R1-2407878 | Discussion on NR-NTN downlink coverage enhancement | vivo |
R1-2407920 | Discussion on NR-NTN DL coverage enhancement | CMCC |
R1-2407933 | Discussion on DL coverage enhancement for NR NTN | ZTE Corporation, Sanechips |
R1-2407956 | Discussion on NR-NTN downlink coverage enhancement | Xiaomi |
R1-2408033 | Further consideration on downlink coverage enhancement for NR NTN | CATT |
R1-2408135 | Discussion on NR-NTN downlink coverage enhancement | OPPO |
R1-2408227 | NR-NTN downlink coverage enhancement | NEC |
R1-2408237 | Discussion on NR-NTN downlink coverage enhancement | HONOR |
R1-2408257 | Discussion on NR-NTN downlink coverage enhancement | TCL |
R1-2408298 | Discussion on NR-NTN downlink coverage enhancement | LG Electronics |
R1-2408310 | NR-NTN downlink coverage enhancement | Baicells |
R1-2408323 | Discussion on downlink coverage enhancement for NR NTN | Lenovo |
R1-2408361 | NR-NTN Downlink Coverage Enhancement | Panasonic |
R1-2408426 | On NR-NTN downlink coverage enhancement | Ericsson |
R1-2408487 | Discussion on NR-NTN Downlink Coverage Enhancement | Apple |
R1-2408506 | Discussion on downlink coverage enhancements | Fujitsu |
R1-2408528 | NR-NTN downlink coverage enhancement with beam groups | Sharp |
R1-2408552 | NR-NTN downlink coverage enhancement | InterDigital, Inc. |
R1-2408578 | Discussion on NR-NTN downlink coverage enhancement | ETRI |
R1-2408663 | Discussion on downlink coverage enhancement for NR-NTN | Samsung |
R1-2408684 | Discussion on downlink coverage enhancements for NR NTN | CCU |
R1-2408716 | NR-NTN downlink coverage enhancement | MediaTek Inc. |
R1-2408727 | Further discussion on downlink coverage enhancements for NR over NTN | Nokia, Nokia Shanghai Bell |
R1-2408802 | Discussion on DL coverage enhancement for NR-NTN | NTT DOCOMO, INC. |
R1-2408824 | Discussion on NR-NTN DL coverage enhancement | KT Corp. |
R1-2408867 | Downlink coverage enhancement for NR NTN | Qualcomm Incorporated |
R1-2408880 | Downlink Coverage Enhancement for NR NTN | Google Ireland Limited |
R1-2408894 | Discussion on downlink coverage enhancement for NR-NTN | CSCN |
R1-2408937 | Downlink Coverage Enhancements for NR NTN | CEWiT |
R1-2408945 | Operator views on DL Coverage Enhancements for NR NTN | Inmarsat, Viasat |
R1-2408949 | Discussion on NTN System Level Downlink Coverage Enhancement | EchoStar, Eutelsat Group, Thales, Terrestar |
R1-2409004 | Operator views on DL Coverage Enhancements for NR NTN | Inmarsat, Viasat |
R1-2409037 | Discussion on DL coverage enhancement for NR-NTN | NTT DOCOMO, INC. |
R1-2409288 | Draft Reply LS on DL coverage enhancements | Moderator (THALES) |
TDoc | Title | Source |
---|---|---|
R1-2407661 | Discussion on HD-FDD RedCap UEs and eRedCap UEs for FR1-NTN | Huawei, HiSilicon |
R1-2407722 | Discussion on support of RedCap and eRedCap UEs with NR NTN operating in FR1-NTN bands | Spreadtrum Communications |
R1-2407744 | Discussion on Support of RedCap and eRedCap UEs with NR NTN operating in FR1-NTN bands | China Telecom |
R1-2407879 | Discussion on support of RedCap and eRedCap UEs with NR-NTN | vivo |
R1-2407921 | Discussion on the collision issues of HD-FDD Redcap UE in FR1-NTN | CMCC |
R1-2407934 | Discussion on support of RedCap/eRedCap UEs for NR NTN | ZTE Corporation, Sanechips |
R1-2407957 | Discussion on the support of Redcap and eRedcap UEs in NR NTN | Xiaomi |
R1-2408034 | Discussion on the enhancement of RedCap and eRedCap UEs In NTN | CATT |
R1-2408136 | Discussion on supporting of RedCap and eRedCap UEs with NR NTN operating in FR1-NTN bands | OPPO |
R1-2408238 | Discussion on support of RedCap and eRedCap UEs in NR NTN | HONOR |
R1-2408258 | Discussion on HD-FDD Redcap UEs and eRedcap UEs for FR1-NTN | TCL |
R1-2408299 | Discussion on support of (e)RedCap UEs with NR-NTN operating in FR1-NTN bands | LG Electronics |
R1-2408488 | Discussion on support of RedCap UEs with NR NTN operation | Apple |
R1-2408553 | Discussion on half-duplex RedCap issues for NTN FR1 operation | InterDigital, Inc. |
R1-2408579 | Discussion on HD UEs with NR NTN | ETRI |
R1-2408664 | Discussion on support of RedCap and eRedCap UEs with NR NTN operating in FR1-NTN bands | Samsung |
R1-2408717 | Support of RedCap and eRedCap UEs with NR NTN operating in FR1-NTN bands | MediaTek Inc. |
R1-2408728 | Additional considerations on (e)RedCap operation in NR over NTN | Nokia, Nokia Shanghai Bell |
R1-2408734 | On HD-FDD Redcap UEs for NTN | Ericsson |
R1-2408803 | Discussion on support of RedCap and eRedCap UEs in FR1-NTN | NTT DOCOMO, INC. |
R1-2408811 | Discussion on support of RedCap/eRedCap UEs in NTN | CAICT |
R1-2408868 | Support of Redcap and eRedcap UEs in NR NTN | Qualcomm Incorporated |
R1-2409101 | Summary #1 for Support of RedCap and eRedCap UEs with NR NTN operating in FR1-NTN bands | Moderator (CATT) |
R1-2409102 | Summary #2 for Support of RedCap and eRedCap UEs with NR NTN operating in FR1-NTN bands | Moderator (CATT) |
R1-2409103 | Summary #3 for Support of RedCap and eRedCap UEs with NR NTN operating in FR1-NTN bands | Moderator (CATT) |
R1-2409295 | Final Summary for Support of RedCap and eRedCap UEs with NR NTN operating in FR1-NTN bands | Moderator (CATT) |
TDoc | Title | Source |
---|---|---|
R1-2407662 | Discussion on uplink capacity/throughput enhancement for FR1-NTN | Huawei, HiSilicon |
R1-2407723 | Discussion on NR-NTN uplink capacity/throughput enhancement | Spreadtrum Communications, SGITG |
R1-2407745 | Discussion on NR-NTN uplink enhancement | China Telecom |
R1-2407817 | Discussion on NR-NTN uplink capacity/throughput enhancement | NICT |
R1-2407880 | Discussion on NR-NTN uplink capacity enhancement | vivo |
R1-2407922 | Discussion on the NR-NTN uplink capacity/throughput enhancements | CMCC |
R1-2407935 | Discussion on UL capacity enhancement for NR NTN | ZTE Corporation, Sanechips |
R1-2407958 | Discussion on NR-NTN PUSCH capacity enhancement | Xiaomi |
R1-2408035 | Discussion on UL capacity enhancement for NR NTN | CATT |
R1-2408137 | Discussion on NR-NTN uplink capacity/throughput enhancement | OPPO |
R1-2408228 | NR-NTN uplink capacity/throughput enhancement | NEC |
R1-2408239 | Discussion on NR-NTN UL capacity/throughput enhancement | HONOR |
R1-2408242 | Discussion on the NR-NTN uplink capacity/throughput enhancements | TCL |
R1-2408300 | Discussion on NR-NTN uplink capacity/throughput enhancement | LG Electronics |
R1-2408330 | NR-NTN uplink capacity enhancement | Sharp |
R1-2408489 | Discussion on NR-NTN Uplink Capacity Enhancement | Apple |
R1-2408505 | Discussion on uplink capacity/cell throughput enhancement for FR1-NTN | Fujitsu |
R1-2408540 | Uplink capacity/throughput enhancement for NR-NTN | Panasonic |
R1-2408543 | Discussion on the NR-NTN uplink capacity/throughput enhancements | Lenovo |
R1-2408554 | NR-NTN uplink capacity/throughput enhancement | InterDigital, Inc. |
R1-2408580 | Discussion on NR-NTN uplink capacity/throughput enhancement | ETRI |
R1-2408665 | Discussion on uplink capacity/throughput enhancement for NR-NTN | Samsung |
R1-2408686 | On uplink capacity/cell throughput enhancement for NR NTN | Ericsson |
R1-2408718 | NR-NTN uplink capacity and throughput enhancements | MediaTek Inc. |
R1-2408729 | Further discussion on uplink capacity enhancements for NR over NTN | Nokia, Nokia Shanghai Bell |
R1-2408804 | Discussion on NR-NTN uplink capacity/throughput enhancement | NTT DOCOMO, INC. |
R1-2408869 | NR-NTN uplink capacity / throughput enhancement | Qualcomm Incorporated |
R1-2408946 | Operator views on UL Capacity Enhancements for NR NTN | Inmarsat, Viasat |
R1-2408965 | Views on NR-NTN PUSCH capacity enhancement | Mitsubishi Electric RCE |
R1-2409018 | Feature lead summary #1 of AI 9.11.3 on NR-NTN uplink capacity and throughput enhancements | Moderator (MediaTek) |
R1-2409019 | Feature lead summary #2 of AI 9.11.3 on NR-NTN uplink capacity and throughput enhancements | Moderator (MediaTek) |
R1-2409020 | Feature lead summary #3 of AI 9.11.3 on NR-NTN uplink capacity and throughput enhancements | Moderator (MediaTek) |
R1-2409092 | Discussion on uplink capacity/throughput enhancement for FR1-NTN | Huawei, HiSilicon |
TDoc | Title | Source |
---|---|---|
R1-2407663 | Discussion on UL capacity enhancements for IoT NTN | Huawei, HiSilicon |
R1-2407724 | Discussion on IoT-NTN uplink capacity/throughput enhancement | Spreadtrum Communications |
R1-2407881 | Discussion on IoT-NTN uplink capacity enhancement | vivo |
R1-2407923 | Discussion on the IoT -NTN uplink capacity/throughput enhancements | CMCC |
R1-2407936 | Discussion on UL capacity enhancement for IoT NTN | ZTE Corporation, Sanechips |
R1-2407959 | Discussion on IoT-NTN uplink capacity enhancement | Xiaomi |
R1-2408036 | Discussion on UL capacity enhancement for IoT NTN | CATT |
R1-2408138 | Discussion on IoT-NTN uplink capacity/throughput enhancement | OPPO |
R1-2408229 | IoT-NTN uplink capacity/throughput enhancement | NEC |
R1-2408243 | Discussion on the IoT-NTN uplink capacity/throughput enhancements | TCL |
R1-2408301 | Discussion on IoT-NTN uplink capacity/throughput enhancement | LG Electronics |
R1-2408324 | Discussion on uplink capacity enhancement for IoT NTN | Lenovo |
R1-2408346 | IoT-NTN uplink capacity enhancement | Nokia, Nokia Shanghai Bell |
R1-2408425 | On IoT-NTN uplink capacity enhancements | Sony |
R1-2408490 | Discussion on IoT-NTN Uplink Capacity Enhancement | Apple |
R1-2408529 | IoT NTN OCC methods for NPUSCH and NPRACH | Sharp |
R1-2408555 | IoT-NTN uplink capacity/throughput enhancement | InterDigital, Inc. |
R1-2408581 | Discussion on uplink capacity/throughput enhancement for IoT NTN | ETRI |
R1-2408666 | Discussion on uplink capacity/throughput enhancement for IoT-NTN | Samsung |
R1-2408719 | IoT-NTN uplink capacity and throughput enhancement | MediaTek Inc. |
R1-2408735 | On uplink capacity enhancements for IoT-NTN | Ericsson |
R1-2408870 | IOT-NTN uplink capacity/throughput enhancement | Qualcomm Incorporated |
R1-2408877 | IoT-NTN uplink capacity/throughput enhancement | Nordic Semiconductor ASA |
R1-2408944 | Operator views on UL Capacity Enhancements for IoT NTN | Inmarsat, Viasat |
R1-2409192 | FL Summary #1 for IoT-NTN | Moderator (Sony) |
R1-2409193 | FL Summary #2 for IoT-NTN | Moderator (Sony) |
R1-2409309 | Final FL Summary for IoT-NTN | Moderator (Sony) |
TDoc | Title | Source |
---|---|---|
R1-2407689 | Discussion on IoT-NTN TDD mode | Huawei, HiSilicon |
R1-2407725 | Discussion on IoT-NTN TDD mode | Spreadtrum Communications |
R1-2407772 | Discussion on IoT-NTN TDD mode | THALES |
R1-2407882 | Discussion on IoT-NTN TDD mode | vivo |
R1-2407924 | Discussion on the new NB-IoT NTN TDD mode | CMCC |
R1-2407937 | Discussion on the IoT-NTN TDD mode | ZTE Corporation, Sanechips |
R1-2407960 | Discussion on IoT-NTN TDD mode | Xiaomi |
R1-2408037 | Considerations on IoT-NTN TDD mode | CATT |
R1-2408078 | Discussion on introduction of IoT-NTN TDD mode | SageRAN |
R1-2408139 | Discussion on IoT-NTN TDD mode | OPPO |
R1-2408273 | WP for Introduction of IoT-NTN TDD mode WI | Iridium Satellite LLC |
R1-2408302 | Discussion on IoT-NTN TDD mode | LG Electronics |
R1-2408347 | Discussion on IoT-NTN TDD mode | Nokia, Nokia Shanghai Bell |
R1-2408400 | Analysis - loT-NTN TDD mode DL sync | Iridium Satellite LLC |
R1-2408491 | Discussion on IoT-NTN TDD mode | Apple |
R1-2408667 | Discussion on IoT-NTN TDD mode | Samsung |
R1-2408736 | On TDD mode for IoT-NTN | Ericsson |
R1-2408871 | IOT-NTN TDD mode | Qualcomm Incorporated |
R1-2408874 | Discussion on introduction of IoT-NTN TDD mode | SageRAN |
R1-2408919 | On R19 TDD IoT-NTN | Nordic Semiconductor ASA |
R1-2409038 | Feature lead summary#1 on IoT-NTN TDD mode | Moderator (Qualcomm Incorporated) |
R1-2409039 | Feature lead summary#2 on IoT-NTN TDD mode | Moderator (Qualcomm Incorporated) |
R1-2409274 | Feature lead summary#3 on IoT-NTN TDD mode | Moderator (Qualcomm Incorporated) |
TDoc | Title | Source |
---|---|---|
R1-2408261 | Work plan for Rel-19 Multi-carrier enhancements | Lenovo |
R1-2409227 | Session notes for 9.12 (Multi-Carrier Enhancements for NR Phase 2) | Ad-Hoc Chair (CMCC) |
TDoc | Title | Source |
---|---|---|
R1-2407688 | Discussion on Rel-19 Multi-carrier enhancements | Huawei, HiSilicon |
R1-2407726 | Discussion on multi-cell PUSCH/PDSCH scheduling with a single DCI | Spreadtrum Communications |
R1-2407810 | Discussion on multi-cell PUSCH/PDSCH scheduling with a single DCI | ZTE Corporation, Sanechips |
R1-2407883 | Discussion on enhancement of multi-cell PUSCH/PDSCH scheduling with a single DCI | vivo |
R1-2407925 | Discussion on multi-cell PUSCH/PDSCH scheduling with a single DCI | CMCC |
R1-2408038 | Discussion on multi-cell PUSCH/PDSCH scheduling with a single DCI | CATT |
R1-2408157 | Discussion of multi-cell scheduling with a single DCI | OPPO |
R1-2408260 | On Rel-19 Multi-carrier enhancements for NR Phase 2 | Nokia |
R1-2408262 | Discussion on multi-cell scheduling with a single DCI | Lenovo |
R1-2408364 | Discussion on multi-carrier enhancements for NR Phase 2 | Panasonic |
R1-2408492 | On multi-cell PUSCH/PDSCH scheduling with single DCI | Apple |
R1-2408668 | Enhancements for multi-cell PUSCH/PDSCH scheduling | Samsung |
R1-2408669 | Discussion on Multi-cell PUSCH/PDSCH scheduling with a single DCI | TCL |
R1-2408683 | Discussion on single DCI based multi-cell scheduling for Rel-19 | LG Electronics |
R1-2408713 | Multi-Carrier enhancements initial views | MediaTek Inc. |
R1-2408805 | Discussion on multi-cell PUSCH/PDSCH scheduling with a single DCI | NTT DOCOMO, INC. |
R1-2408872 | Multi-cell PUSCH/PDSCH scheduling with a single DCI | Qualcomm Incorporated |
R1-2408893 | Multi-cell PxSCH scheduling with a single DCI | Ericsson |
R1-2409162 | Feature lead summary#1 on multi-cell scheduling with a single DCI | Moderator (Lenovo) |
R1-2409163 | Feature lead summary#2 on multi-cell scheduling with a single DCI | Moderator (Lenovo) |
R1-2409164 | Feature lead summary#3 on multi-cell scheduling with a single DCI | Moderator (Lenovo) |
R1-2409165 | Feature lead summary#4 on multi-cell scheduling with a single DCI | Moderator (Lenovo) |
R1-2409166 | Feature lead summary#5 on multi-cell scheduling with a single DCI | Moderator (Lenovo) |
TDoc | Title | Source |
---|---|---|
R1-2407811 | On Rel-19 TEI proposals | ZTE Corporation, Sanechips |
R1-2407884 | Rel-19 TEI proposals | vivo |
R1-2408177 | Enhancement of positioning SRS beam configuration | Huawei, HiSilicon, China Unicom, ZTE, Sanechips |
R1-2408366 | Link adaptation TEI-19 | Ericsson |
R1-2408493 | Rel-19 TEI proposal on remaining ambiguities with SRS carrier switching | Apple |
R1-2408590 | CSI Acquisition Improvement for Type-II codebook | Orange, ZTE, BT |
R1-2408873 | Rel-19 TEI proposals | Qualcomm Incorporated |
R1-2408958 | Proposals for TEI19 | Nokia |
R1-2409075 | CSI Acquisition Improvement for Type-II codebook | Orange, ZTE, BT |
R1-2409094 | FL Summary #1 on Rel-19 TEIs | Moderator (NTT DOCOMO) |
R1-2409210 | FL Summary #2 on Rel-19 TEIs | Moderator (NTT DOCOMO) |
R1-2409228 | Session notes for 9.13 (TEI19) | Ad-Hoc Chair (CMCC) |
R1-2409296 | FL Summary #3 on Rel-19 TEIs | Moderator (NTT DOCOMO) |
TDoc | Title | Source |
---|---|---|
R1-2409234 | Patrick BD in Hefei | RAN1 |