TDoc | Title | Source |
---|---|---|
R1-2409340 | Draft Agenda of RAN1#119 meeting | RAN1 Chair |
R1-2409342 | RAN1#119 Meeting Timelines, Scope, Process | RAN1 Chair, ETSI MCC |
TDoc | Title | Source |
---|---|---|
R1-2409341 | Report of RAN1#118bis meeting | ETSI MCC |
TDoc | Title | Source |
---|---|---|
R1-2409343 | LS on OCC for CB-msg3 NPUSCH | RAN2, vivo |
R1-2409344 | LS on Additional Measurements for SL-TDOA and SL-TOA | RAN2, Qualcomm |
R1-2409345 | LS to RAN1 on CBR range | RAN2, CATT |
R1-2409346 | LS on UE capabilities for inter-frequency L1 measurements for LTM | RAN2, Huawei |
R1-2409347 | LS on carrierBandwidth configuration for less-than-5MHz carriers | RAN2, Huawei |
R1-2409348 | Reply LS on synchronization source change at the transmitting anchor UE in SL positioning | RAN2, Ericsson |
R1-2409349 | Reply LS on Early TA acquisition for the inter-DU scenario | RAN2, Google |
R1-2409350 | LS on SSB relation in On-demand SSB and SSB adaptation on Scell | RAN4, Ericsson |
R1-2409351 | Reply LS to RAN1 on UL synchronization for contention based Msg3 transmission without Msg1/Msg2 | RAN4, ZTE Corporation |
R1-2409352 | LS on the scenarios of UE-to-UE CLI measurement report in SBFD operation | RAN4, Apple |
R1-2409353 | LS on UE RF issues for Rel-19 MIMO enhancement | RAN4, Huawei |
R1-2409354 | LS on SSB adaptation | RAN4, Apple |
R1-2409355 | Reply LS on common TA in a regenerative payload scenario | RAN4, CMCC |
R1-2409356 | LS on AI/ML Model transfer/delivery to UE | SA5, NEC |
R1-2409357 | Reply LS on AIML Data Collection | SA5, Nokia, ZTE |
R1-2409383 | Draft reply LS to RAN4 on UE RF issues for Rel-19 MIMO enhancement | ZTE Corporation, Sanechips |
R1-2409400 | Discussion on LS to RAN1 on CBR range | Huawei, HiSilicon |
R1-2409433 | Discussion on RAN4 LS on SSB relation in NES | Ericsson |
R1-2409478 | Discussion and reply LS on applicable functionality reporting for beam management UE-sided model | ZTE Corporation, Sanechips |
R1-2409493 | Discussion on RAN4 LS on the scenarios of UE-to-UE CLI measurement report in SBFD operation | CMCC |
R1-2409494 | Discussion on LS on applicable functionality reporting for beam management UE-sided model | CMCC |
R1-2409495 | Discussion on LS on SSB relation in on-demand SSB and SSB adaptation on SCell | CMCC |
R1-2409496 | Discussion on LS on UE RF issues for Rel-19 MIMO enhancement | CMCC |
R1-2409497 | Draft reply LS on UE RF issues for Rel-19 MIMO enhancement | CMCC |
R1-2409498 | Discussion on LS on OCC for CB-msg3 NPUSCH | CMCC |
R1-2409537 | Draft reply LS on the scenarios of UE-to-UE CLI measurement report in SBFD operation | ZTE Corporation, Sanechips |
R1-2409548 | LS reply on SSB relation in On-demand SSB and SSB adaptation | ZTE Corporation, Sanechips |
R1-2409549 | Discussion on LS on SSB relation in On-demand SSB and SSB adaptation | ZTE Corporation, Sanechips |
R1-2409570 | Draft reply LS on UE RF issues for Rel-19 MIMO enhancement | Samsung |
R1-2409571 | Draft reply LS on SSB relation in on-demand SSB and SSB adaptation on Scell | Samsung |
R1-2409572 | Draft reply RAN2 LS on OCC for CB-msg3 NPUSCH | Samsung |
R1-2409622 | Discussion on LS on OCC for CB-msg3 NPUSCH | Spreadtrum, UNISOC |
R1-2409623 | Discussion on LS on the scenarios of UE-to-UE CLI measurement report in SBFD operation | Spreadtrum, UNISOC |
R1-2409656 | Draft LS Reply on UE RF issues for Rel-19 MIMO enhancement | vivo |
R1-2409657 | Discussion on the scenarios of UE-to-UE CLI measurement report in SBFD operation | vivo |
R1-2409658 | Draft reply LS on the scenarios of UE-to-UE CLI measurement report in SBFD operation | vivo |
R1-2409659 | Draft reply LS on applicable functionality reporting for beam management UE-sided model | vivo |
R1-2409660 | Discussion on LS on applicable functionality reporting for beam management UE-sided model | vivo |
R1-2409661 | Draft reply LS on OCC for CB-msg3 NPUSCH | vivo |
R1-2409662 | Discussion on LS on OCC for CB-msg3 NPUSCH | vivo |
R1-2409663 | Draft reply LS on additional Measurements for SL-TDOA and SL-TOA | vivo |
R1-2409664 | Draft reply LS on SSB relation in On-demand SSB and SSB adaptation on Scell | vivo |
R1-2409723 | Discussion on LS on OCC for CB-msg3 NPUSCH | ZTE Corporation, Sanechips |
R1-2409770 | Discussion on RAN4 LS on UE RF issues for Rel-19 MIMO enhancement | Ericsson |
R1-2409785 | Draft Reply LS to RAN2 on OCC for CB-msg3 NPUSCH | Apple |
R1-2409786 | Discussion on RAN2 LS on applicable functionality reporting for beam management UE-sided model | Apple |
R1-2409830 | Discussion on LS on OCC for CB-msg3 NPUSCH | LG Electronics |
R1-2409850 | Discussion on LS from RAN2 on OCC for CB-msg3 NPUSCH | Nokia, Nokia Shanghai Bell |
R1-2409859 | Discussion on RAN2 LS on applicable functionality reporting for beam management UE-sided model | NEC |
R1-2409869 | Discussion on RAN2 LS on OCC for CB-msg3 NPUSCH | NEC |
R1-2409876 | Discussion on RAN4 LS on UE RF issues for Rel-19 MIMO enhancement | Xiaomi |
R1-2409911 | Discussion on reply LS on applicable functionality reporting for beam management | CATT |
R1-2409912 | Discussion on RAN4 LS on UE RF issues for Rel-19 MIMO enhancement | CATT |
R1-2409913 | Draft reply LS on the scenarios of UE-to-UE CLI measurement report in SBFD operation | CATT |
R1-2409914 | Discussion on additional measurements for SL-TDOA and SL-TOA | CATT, CICTCI |
R1-2409915 | Draft reply LS on additional measurements for SL-TDOA and SL-TOA | CATT, CICTCI |
R1-2409916 | Discussion on CBR range | CATT, CICTCI |
R1-2409917 | Draft reply LS on CBR range | CATT, CICTCI |
R1-2409918 | Discussion on Reply LS for SSB relation in On-demand SSB and SSB adaptation on Scell | CATT |
R1-2409924 | Discussion on UE capabilities for inter-frequency L1 measurements for LTM | CATT |
R1-2409974 | Draft Reply LS on UE RF issues for Rel-19 MIMO enhancement | Lenovo |
R1-2409983 | Discussion on LS reply on OCC for CB-msg3 NPUSCH | CATT |
R1-2410023 | Draft LS reply on UE RF issues for Rel-19 MIMO | Nokia |
R1-2410038 | Discussion on LS on SSB relation in on-demand SSB and SSB adaptation on SCell | Nokia, Nokia Shanghai Bell |
R1-2410039 | Draft reply LS on SSB relation in on-demand SSB and SSB adaptation on Scell | Nokia, Nokia Shanghai Bell |
R1-2410067 | Discussion on LS about Additional Measurements for SL-TDOA and SL-TOA | OPPO |
R1-2410068 | Draft reply LS to RAN2 on Additional Measurements for SL-TDOA and SL-TOA | OPPO |
R1-2410069 | Discussion on LS about CBR range | OPPO |
R1-2410070 | Draft reply LS to RAN2 on CBR range | OPPO |
R1-2410077 | Discussion on SSB relation in On-demand SSB and SSB adaptation operation | OPPO |
R1-2410078 | Draft reply LS on SSB relation in On-demand SSB and SSB adaptation operation | OPPO |
R1-2410084 | Discussion on OCC for CB-msg3 NPUSCH | OPPO |
R1-2410085 | Draft reply LS on OCC for CB-msg3 NPUSCH | OPPO |
R1-2410089 | Discussion of RAN4 LS on UE-to-UE CLI scenario | OPPO |
R1-2410106 | Discussion on LS on applicable functionality reporting for beam management UE-sided model | OPPO |
R1-2410107 | Draft reply on LS on applicable functionality reporting for beam management UE-sided model | OPPO |
R1-2410113 | Discussion on LS on UE RF issues for Rel-19 MIMO enhancement | OPPO |
R1-2410114 | Draft reply LS on UE RF issues for Rel-19 MIMO enhancement | OPPO |
R1-2410143 | Discussion on LS from RAN4 on the scenarios of UE-to-UE CLI measurement report in SBFD operation | Ericsson |
R1-2410144 | Draft Reply LS on Additional Measurements for SL-TDOA and SL-TOA | Intel Corporation |
R1-2410145 | Draft Reply LS on on CBR range for SL Positioning | Intel Corporation |
R1-2410146 | Draft Reply LS on UE RF issues for Rel-19 MIMO enhancement | |
R1-2410147 | Draft Reply LS on SSB relation in On-demand SSB and SSB adaptation on Scell | |
R1-2410283 | Discussion of SA5 LS on AI/ML Model Transfer/Delivery to UE | Ericsson |
R1-2410284 | Discussion on RAN4 LS on SSB relation in On-demand SSB and SSB adaptation on Scell | LG Electronics |
R1-2410308 | Discussion LS on carrier bandwidth configuration for LessThan5MHzFR1 | Ericsson |
R1-2410309 | Discussion LS on OCC for CB-msg3 NPUSCH | Ericsson |
R1-2410326 | Discussion on the LS reply to RAN2 on functionality in AI/ML | Huawei, HiSilicon |
R1-2410327 | Discussion on LS to RAN1 on additional measurements in SL positioning | Huawei, HiSilicon |
R1-2410328 | Discussion on the reply of LS on OCC for CB-msg3 NPUSCH | Huawei, HiSilicon |
R1-2410329 | Draft reply LS on OCC for CB-msg3 NPUSCH | Huawei, HiSilicon |
R1-2410331 | Draft reply LS on carrierBandwidth configuration for less-than-5MHz carriers | Huawei, HiSilicon |
R1-2410349 | Discussion on LS on SSB relation in On-demand SSB and SSB adaptation on SCell | Fujitsu Limited |
R1-2410355 | Discussion of RAN2 LS on applicable functionality reporting for beam management UE-sided model | Ericsson |
R1-2410374 | Discussion on applicable functionality reporting for beam management UE-sided model | NTT DOCOMO, INC. |
R1-2410449 | Discussion on additional measurements for SL-TDOA and SL-TOA | ZTE Corporation, Sanechips |
R1-2410450 | Draft reply LS on additional measurements for SL-TDOA and SL-TOA | ZTE Corporation, Sanechips |
R1-2410451 | Discussion on CBR range for SL positioning | ZTE Corporation, Sanechips |
R1-2410452 | Draft reply LS on CBR range for SL positioning | ZTE Corporation, Sanechips |
R1-2410457 | Discussion on the carrierBandwidth configuration for less-than-5MHz carriers | Qualcomm Incorporated |
R1-2410458 | Discussion on RAN 4 LS on UE RF issues for Rel-19 MIMO enhancement | Qualcomm Incorporated |
R1-2410459 | Discussion on OCC for CB-msg3 NPUSCH | Qualcomm Incorporated |
R1-2410460 | Draft Reply LS on the scenarios of UE-to-UE CLI measurement report in SBFD operation | Qualcomm Incorporated |
R1-2410461 | Draft Reply for the LS on Additional Measurements for SL-TDOA and SL-TOA | Qualcomm Incorporated |
R1-2410462 | Draft reply for the LS to RAN1 on CBR range | Qualcomm Incorporated |
R1-2410463 | Discussion for LS reply on applicable functionality reporting | Qualcomm Incorporated |
R1-2410507 | Discussion on reply LS on OCC for CB-msg3 NPUSCH in NB-IoT NTN | MediaTek Inc. |
R1-2410541 | Draft reply LS on SSB relation in On-demand SSB and SSB adaptation on Scell | CATT |
R1-2410566 | Discussion on RAN2 LS on UE capabilities for inter-frequency L1 measurements for LTM | Ericsson |
R1-2410605 | Discussion on carrierBandwidth configuration for less-than-5MHz carriers | Huawei, HiSilicon |
R1-2410609 | Discussion on RAN4 LS on SSB relation in On-demand SSB and SSB adaptation on SCell | Huawei, HiSilicon |
R1-2410610 | Discussion on UE RF issues for Rel-19 MIMO enhancement | Huawei, HiSilicon |
R1-2410611 | Discussion on RAN4 LS on the scenarios of UE-to-UE CLI measurement report in SBFD operation | Huawei, HiSilicon |
R1-2410613 | Discussion on LS on Additional Measurements for SL-TDOA and SL-TOA | Ericsson |
R1-2410614 | Discussion on LS to RAN1 on CBR range | Ericsson |
R1-2410615 | Draft reply LS Additional Measurements for SL-TDOA and SL-TOA | Ericsson |
R1-2410616 | Draft reply LS on LS to RAN1 on CBR range | Ericsson |
R1-2410923 | LS of RAN4 input on Ambient-IoT to TR 38.769 | RAN4, CMCC |
R1-2410928 | LS on RAN3 outcome of Ambient IoT study | RAN3, Huawei |
R1-2410930 | LS on RAN2 outcome of Ambient IoT study | RAN2, Huawei |
TDoc | Title | Source |
---|---|---|
R1-2409368 | Discussion on PDSCH reception scheduled by CORESET not following the unified TCI state | MediaTek Inc. |
R1-2409369 | Draft CR on PDSCH reception scheduled by CORESET not following the unified TCI state | MediaTek. Inc, NTT DOCOMO. INC, Ericsson, Huawei, Hisilicon |
R1-2409385 | Discussion on determining spatial filter provided by UL TCI state in TS38.214 | ZTE Corporation, Sanechips |
R1-2409386 | Draft CR on determining spatial filter provided by UL TCI state in TS38.214 | ZTE Corporation, Sanechips, Google, Samsung, Spreadtrum Communications |
R1-2409573 | Discussion on TCI state determination for PDSCH reception scheduled by CORESET not following the indicated unified TCI state | Samsung |
R1-2409574 | Draft CR on TCI state determination for PDSCH reception scheduled by CORESET not following the indicated unified TCI state | Samsung |
R1-2409575 | Draft CR on candidate beams configuration for beam failure recovery | Samsung |
R1-2409624 | Discussion on PDCCH candidate larger AL than the REGs in CORESET | Spreadtrum, UNISOC |
R1-2409707 | Draft CR on correction on preamble sequence mapping for NTN | vivo |
R1-2409919 | Discussion on UE capability for SRS antenna switching | CATT |
R1-2409968 | Discussion on PDSCH reception scheduled by CORESET not following the unified TCI state | vivo |
R1-2410120 | Discussion on QCL assumption for PDSCH scheduled by PDCCH in CORESET not following unified TCI | ZTE Corporation, Sanechips |
R1-2410121 | Discussion on UL TX spatial filter for PUSCH in Rel-17 unified TCI | ZTE Corporation, Sanechips |
R1-2410530 | Clarification on SSSG timer reset after UE finished DCI-triggered BWP switch | MediaTek Inc. |
R1-2410601 | Disscusion on skipping uplink transmission in case of BWP switching | Huawei, HiSilicon |
R1-2410602 | Correction on skipping uplink transmission in case of BWP switching | Huawei, HiSilicon |
R1-2410603 | Correction on the configuration of multi-DCI multi-TRP | Huawei, HiSilicon |
R1-2410604 | Correction on parameters for maximum number of layers in 38.212 | Huawei, HiSilicon |
R1-2410606 | Discussion on p0-nominal | Huawei, HiSilicon |
R1-2410607 | Draft CR for p0-nominal | Huawei, HiSilicon |
R1-2410608 | Correction on SCell dormancy indication case 2 in case of BWP switching | Huawei, HiSilicon |
R1-2410620 | Soft buffer size determination for 1024QAM rank restricted UE | Nokia |
R1-2410652 | Summary on PDSCH reception scheduled by CORESET not following the unified TCI state | Moderator (MediaTek Inc.) |
R1-2410682 | Moderator summary 1 of SSSG timer reset after UE finished DCI-triggered BWP switch | Moderator (MediaTek) |
R1-2410683 | Moderator summary 2 of SSSG timer reset after UE finished DCI-triggered BWP switch | Moderator (MediaTek) |
R1-2410685 | Summary for discussion on SCell dormancy indication case 2 | Moderator (Huawei) |
R1-2410686 | Summary of determining spatial filter provided by UL TCI state in TS38.214 | Moderator (ZTE) |
R1-2410688 | Summary on discussion on correction on preamble sequence mapping | Moderator (vivo) |
R1-2410695 | Summary on UL Tx spatial filter for PUSCH transmission in R17 UTCI | Moderator (ZTE) |
R1-2410726 | Summary on UE capability of SRS antenna switching | Moderator (CATT) |
R1-2410740 | Moderator’s summary for PDCCH with larger AL | Moderator (Spreadtrum) |
R1-2410750 | FL summary on Correction on parameters for maximum number of layers in 38.212 | Moderator (Huawei) |
R1-2410766 | Draft Final CR on PDSCH reception scheduled by CORESET not following the unified TCI state | Moderator (MediaTek Inc.) |
R1-2410770 | Summary#2 for discussion on SCell dormancy indication case 2 | Moderator (Huawei) |
R1-2410795 | Summary#2 of determining spatial filter provided by UL TCI state in TS38.214 | Moderator (ZTE) |
R1-2410798 | Summary#2 on UE capability of SRS antenna switching | Moderator (CATT) |
R1-2410800 | Summary on discussion for mDCI mTRP PDSCH | Moderator (Huawei) |
R1-2410810 | CR on PDSCH reception scheduled by CORESET not following the unified TCI state | Moderator (MediaTek. Inc), ZTE Corporation, Sanechips, Samsung, Ericsson, NTT DOCOMO, OPPO, Google |
R1-2410814 | CR on PDSCH reception scheduled by CORESET not following the unified TCI state | Moderator (MediaTek. Inc), ZTE Corporation, Sanechips, Samsung, Ericsson, NTT DOCOMO, OPPO, Google |
R1-2410824 | Summary#1 of discussion on power control for 2-step RACH | Moderator (Huawei) |
R1-2410829 | Summary#2 of discussion on power control for 2-step RACH | Moderator (Huawei) |
R1-2410831 | Summary of discussion on skipping uplink transmission in case of BWP switching | Moderator (Huawei) |
R1-2410839 | Session notes for 7 (Pre-Rel-18 NR maintenance) | Ad-Hoc Chair (CMCC) |
R1-2410871 | Moderator summary 3 of SSSG timer reset after UE finished DCI-triggered BWP switch | Moderator (MediaTek) |
R1-2410932 | Alignment of parameter names | Ericsson |
R1-2410933 | Alignment of parameter names | Ericsson |
R1-2410935 | Rel-17 editorial corrections for TS 38.213 | Samsung |
R1-2410936 | Rel-17 editorial corrections for TS 38.213 (mirrored to Rel-18) | Samsung |
TDoc | Title | Source |
---|---|---|
R1-2410931 | Rel-18 editorial corrections for TS 38.212 | Huawei |
R1-2410934 | Alignment of parameter names | Ericsson |
R1-2410937 | Rel-18 editorial corrections for TS 38.213 | Samsung |
R1-2410938 | Rel-18 higher-layers parameter name corrections for TS 38.214 | Nokia |
TDoc | Title | Source |
---|---|---|
R1-2409384 | Draft CR on implicit BFD-RS determination for S-DCI based MTRP in TS 38.213 | ZTE Corporation, Sanechips |
R1-2409387 | Discussion on precoding and number of layers indication for Type-1 CG-PUSCH in UL 8-Tx | ZTE Corporation, Sanechips |
R1-2409466 | FL Summary on Maintenance of 8TX | Moderator (InterDigital, Inc.) |
R1-2409576 | Moderator summary on maintenance issues for Rel-18 CSI enhancements | Samsung (Moderator) |
R1-2409577 | Draft CR on applying apply-IndicatedTCIState to PDCCH repetition | Samsung |
R1-2409578 | Draft CR on cell-specific beam resetting for MDCI MTRP under eUTCI | Samsung |
R1-2409580 | Discussion on the time period determination for multiple PRACH transmission | Samsung |
R1-2409665 | Draft CR on a bandwidth part indicator by a DCI format 0_3/1_3 | vivo |
R1-2409666 | Discussion on active semi-persistent SRS resource configuration and transmission of SRS | vivo |
R1-2409667 | Draft CR on active semi-persistent SRS resource configuration and transmission of SRS | vivo |
R1-2409705 | Discussion on E-UTRAN measurement in IoT NTN | vivo |
R1-2409706 | Discussion on NG-RAN measurement in NTN | vivo |
R1-2409708 | Draft CR on correction on support of open loop timing advance calculation for ATG | vivo |
R1-2409920 | Correction on TPMI determination for UL transmissions in 38.214 | CATT |
R1-2409921 | Correction on SRS for DL CSI acquisition in 38.214 | CATT |
R1-2409922 | Draft CR on Type-3 HARQ-ACK codebook triggered by DCI format 1_3 | CATT |
R1-2409923 | Discussion on last DCI determination of DCI format 1_3 for HARQ-ACK codebook | CATT |
R1-2409984 | Draft CR on last DCI determination of DCI format 1_3 for HARQ-ACK codebook | CATT |
R1-2410122 | Draft CR on correction of parameter name for early UL sync in TS 38.213 | ZTE Corporation, Sanechips |
R1-2410123 | Draft CR on correction of parameter name for early UL sync in TS 38.211 | ZTE Corporation, Sanechips |
R1-2410148 | Discussion on Precoder and Number of Layers Indication for 8Tx CG-PUSCH | |
R1-2410190 | Draft CR on Type-1 and Type-2 HARQ-ACK codebook | ZTE Corporation, Sanechips |
R1-2410242 | Draft CR on LTM PRACH and serving cell UL transmission in a same band | MediaTek Inc. |
R1-2410243 | Draft CR on LTM TA command application time | MediaTek Inc. |
R1-2410256 | Draft CR on RRC parameter alignment of cellDTX DRX indication in TS38.212 | ETRI |
R1-2410375 | Draft CR on usage of the 2nd starting symbol | NTT DOCOMO, INC. |
R1-2410440 | Draft CR on clarification of activation and deactivation time for cell DRX and DTX | Ericsson |
R1-2410453 | Discussion on active semi-persistent SRS resource | ZTE Corporation, Sanechips |
R1-2410454 | Corrections on positioning in 38.214 | ZTE Corporation, Sanechips |
R1-2410455 | Draft CR on timeline of BW aggregation SRS for positioning | ZTE Corporation, Sanechips |
R1-2410456 | Correction on the application condition of two candidate starting symbols in TS 38.213 | ZTE Corporation, Sanechips |
R1-2410464 | Clarifications for 2 TB SPS PDSCH | Qualcomm Incorporated |
R1-2410542 | Correction on handling collision of SSB and RA occasion for LTM | |
R1-2410565 | Draft CR for 38.213 on LTM power control | Ericsson |
R1-2410596 | Draft CR on the prioritization of SL-PRS | Huawei, HiSilicon |
R1-2410597 | Maintenance of Rel-18 Multicarrier Enhancements | Huawei, HiSilicon |
R1-2410598 | Corrections on bit-width determination of Type-1B DCI field for multi-cell scheduling | Huawei, HiSilicon |
R1-2410599 | Corrections to SSB-RO association for LTM in TS38.213 | Huawei, HiSilicon |
R1-2410600 | Corrections to PRACH transmission for LTM in TS38.211 | Huawei, HiSilicon |
R1-2410612 | Corrections on determination of DCI format 0_3 for unpaired spectrum operation | Huawei, HiSilicon |
R1-2410617 | Draft CR for correction to semi-persistent configuration of UL SRS in 38.214 | Ericsson |
R1-2410618 | Discussion on correction to semi-persistent configuration of UL SRS in 38.214 | Ericsson |
R1-2410621 | Clarification on DCI field value of Type 1-B DCI fields in DCI format 0_3/1_3 in case of a DCI field size of 0 in TS 38.212 | Nokia |
R1-2410622 | Ambiguity in field sizes of DCI format 0_3 of a scheduled cell that is dormant. | Nokia |
R1-2410623 | Draft CR on Type-3 HARQ-ACK codebook triggered by DCI format 1_3 | Nokia |
R1-2410625 | Discussion on STxMP with DMRS Bundling | Ericsson |
R1-2410670 | Summary of NR Rel-18 Maintenance Discussion on STxMP with DMRS Bundling | Moderator (Ericsson) |
R1-2410684 | On DCI field value of Type 1-B in DCI format 0_3/1_3 | Moderator (Huawei) |
R1-2410689 | Moderator summary#1 on NR-RAN measurement in NTN | Moderator (vivo) |
R1-2410690 | Summary#1 on discussion on correction on open loop timing advance calculation for ATG | Moderator (vivo) |
R1-2410691 | Moderator summary#1 on E-UTRAN measurement in IoT NTN | Moderator (vivo) |
R1-2410696 | Summary on correction of parameter name for early UL sync in TS 38.213 | Moderator (ZTE) |
R1-2410697 | Summary on correction of parameter name for early UL sync in TS 38.211 | Moderator (ZTE) |
R1-2410698 | Moderator summary on implicit BFD-RS determination for S-DCI based MTRP | Moderator (ZTE) |
R1-2410705 | [119-R18-Maintenance] DCI format 0_3 field size determination | Moderator (Nokia) |
R1-2410706 | Summary of discussion of reply LS on CBR Range | Moderator (CATT) |
R1-2410707 | Draft Reply LS on CBR Range | Moderator (CATT) |
R1-2410708 | Reply LS on CBR Range | RAN1, CATT |
R1-2410709 | FL summary #1 on clarifications for 2 TB SPS-PDSCH and CG-PUSCH | Moderator (Qualcomm Incorporated) |
R1-2410727 | Summary on SRS antenna switching on 8Tx | Moderator (CATT) |
R1-2410728 | Summary on STxMP TPMI determination | Moderator (CATT) |
R1-2410738 | Summary on Precoder Indication for 8Tx CG-PUSCH | Moderator (Google) |
R1-2410743 | Summary on LTM PRACH and serving cell UL transmission | Moderator (MediaTek) |
R1-2410744 | Summary on LTM TA command application time | Moderator (MediaTek) |
R1-2410745 | Summary of discussion for R1-2410375 | Moderator (NTT DOCOMO, INC.) |
R1-2410746 | FLS#1 on 2 candidate starting symbols in TS 38.213 | Moderator (ZTE) |
R1-2410749 | Discussion summary of corrections to LTM power control | Moderator (Ericsson) |
R1-2410759 | Moderator summary on handling collision of SSB and RA occasion for LTM | Moderator (Google) |
R1-2410760 | Summary#1 of Type-3 HARQ-ACK codebook triggered by DCI format 1_3 | Moderator (CATT) |
R1-2410761 | Summary#1 of last DCI determination of DCI format 1_3 for HARQ-ACK codebook | Moderator (CATT) |
R1-2410771 | Discussion summary of Corrections to PRACH transmission for LTM in TS38.211 | Moderator (Huawei) |
R1-2410772 | Discussion summary of Corrections to SSB-RO association for LTM in TS38.213 | Moderator (Huawei) |
R1-2410774 | Summary of the discussion on Type-1 and Type-2 HARQ-ACK codebook | Moderator (ZTE) |
R1-2410783 | FLS#2 on 2 candidate starting symbols in TS 38.213 | Moderator (ZTE) |
R1-2410787 | Summary#1 on semi-persistent configuration of UL SRS and transmission of SRS | Moderator (vivo) |
R1-2410791 | Moderator summary#2 on NR-RAN measurement in NTN | Moderator (vivo) |
R1-2410792 | Summary#2 on discussion on correction on open loop timing advance calculation for ATG | Moderator (vivo) |
R1-2410793 | Moderator summary#2 on E-UTRAN measurement in IoT NTN | Moderator (vivo) |
R1-2410794 | Correction to reference point for NG-RAN measurement for UL SRS-RSRP and UL SRS-RSRPP | Moderator (vivo) |
R1-2410796 | Feature Lead summary on discussion for prioritization of SL-PRS | Moderator (Huawei) |
R1-2410797 | Correction on the support of open loop timing advance calculation for ATG | Moderators (Huawei, vivo), HiSilicon, Samsung, Ericsson |
R1-2410799 | Summary#2 on STxMP TPMI determination | Moderator (CATT) |
R1-2410801 | Summary on timeline of BW aggregation SRS for positioning | Moderator (ZTE) |
R1-2410802 | Moderator summary on cell specific beam resetting for MDCI MTRP under eUTCI | Moderator (Samsung) |
R1-2410803 | Moderator summary on supporting PDCCH repetition under eUTCI | Moderator (Samsung) |
R1-2410805 | Summary#2 on Precoder Indication for 8Tx CG-PUSCH | Moderator (Google) |
R1-2410809 | Clarification on DCI field value of Type 1-B DCI fields in DCI format 0_3/1_3 in case of a DCI field size of 0 in TS 38.212 | Moderator (Huawei), Nokia |
R1-2410811 | Summary#2 on LTM PRACH and serving cell UL transmission | Moderator (MediaTek) |
R1-2410812 | Summary#2 on LTM TA command application time | Moderator (MediaTek) |
R1-2410815 | Summary on Corrections for positioning in 38.214 | Moderator (ZTE) |
R1-2410816 | Moderator summary 2 on handling collision of SSB and RA occasion for LTM | Moderator (Google) |
R1-2410822 | Summary#2 of Type-3 HARQ-ACK codebook triggered by DCI format 1_3 | Moderator (CATT) |
R1-2410823 | Summary#2 of last DCI determination of DCI format 1_3 for HARQ-ACK codebook | Moderator (CATT) |
R1-2410833 | Moderator summary on supporting PDCCH repetition under eUTCI round3 | Moderator (Samsung) |
R1-2410834 | Summary #3 on Precoder Indication for 8Tx CG-PUSCH | Moderator (Google) |
R1-2410835 | Draft CR on Precoder Indication for 8Tx CG-PUSCH | Moderator (Google) |
R1-2410836 | LS on Precoder Indication for 8-Port CG-PUSCH | RAN1, Google |
R1-2410840 | Session notes for 8.1 (Maintenance on Rel-18 work items - Coverage enhancements ) | Ad-Hoc Chair (CMCC) |
R1-2410841 | Session notes for 8.1 (Maintenance on Rel-18 work items - Mobility Enhancement) | Ad-Hoc Chair (CMCC) |
R1-2410842 | Session notes for 8.1 (Maintenance on Rel-18 work items – Multi-Carrier) | Ad-Hoc Chair (CMCC) |
R1-2410843 | Session notes for 8.1 (Maintenance on Rel-18 work items - IoT NTN/NR NTN, Sidelink, Positioning Enhancements) | Ad-Hoc Chair (Huawei) |
R1-2410851 | Summary#2 of NR Rel-18 Maintenance Discussion on STxMP with DMRS Bundling | Moderator (Ericsson) |
R1-2410852 | Summary#3 on STxMP TPMI determination | Moderator (CATT) |
R1-2410853 | Correction on TPMI determination for UL transmissions in 38.214 | Moderator (CATT), New H3C, Ericsson, ZTE, OPPO |
R1-2410856 | Summary#2 of discussion for R1-2410375 | Moderator (NTT DOCOMO, INC.) |
R1-2410857 | Draft CR on transmission attempt from the 2nd starting symbol | Moderator (NTT DOCOMO, INC.), OPPO, Huawei, HiSilicon |
R1-2410858 | CR on transmission attempt from the 2nd starting symbol | Moderator (NTT DOCOMO, INC.), OPPO, Huawei, HiSilicon |
R1-2410860 | Summary#3 of NR Rel-18 Maintenance Discussion on STxMP with DMRS Bundling | Moderator (Ericsson) |
R1-2410864 | CR on active semi-persistent SRS resource configuration and transmission of SRS | Moderator (vivo), Ericsson, Intel |
R1-2410865 | CR on active semi-persistent SRS resource configuration | Moderator (vivo), Ericsson, Intel |
R1-2410867 | Summary#2 On DCI field value of Type 1-B in DCI format 0_3/1_3 | Moderator (Huawei) |
R1-2410868 | Ambiguity in field sizes of DCI format 0_3 of a scheduled cell that is dormant. | Moderator (Nokia), Nokia, Huawei, HiSilicon, Samsung |
R1-2410869 | CR on timeline of BW aggregation SRS for positioning | Moderator (ZTE), ZTE Corporation, Sanechips |
R1-2410873 | Summary #4 on Precoder Indication for 8Tx CG-PUSCH | Moderator (Google) |
R1-2410876 | Draft CR on Precoder Indication for 8Tx CG-PUSCH | Moderator (Google) |
R1-2410877 | Final summary of NR Rel-18 Maintenance Discussion on STxMP with DMRS Bundling | Moderator (Ericsson) |
R1-2410878 | Corrections to SSB-RO association for LTM | Huawei, HiSilicon, Nokia, Google, Samsung, Fujitsu, Ericsson, NTT DOCOMO, ZTE |
R1-2410879 | Corrections to PRACH transmission for LTM | Huawei, HiSilicon, Nokia, Google, Samsung, Fujitsu, Ericsson, NTT DOCOMO, ZTE |
R1-2410882 | CR on Precoder Indication for 8 port CG-PUSCH | Moderator (Google), Google, ZTE, Sanechips, Ericsson, Nokia, Nokia Shanghai Bell, Huawei, HiSilicon, Samsung |
R1-2410896 | Summary#2 of last DCI determination of DCI format 1_3 for HARQ-ACK codebook | Moderator (CATT) |
R1-2410897 | Draft CR on Type-3 HARQ-ACK codebook triggered by DCI format 1_3 | Moderator (CATT), Nokia |
R1-2410901 | Draft LS on collision between SSB and RA occasion for LTM | |
R1-2410902 | Summary#3 on LTM PRACH and serving cell UL transmission | Moderator (MediaTek) |
R1-2410903 | Summary#3 on LTM TA command application time | Moderator (MediaTek) |
R1-2410904 | Draft CR on LTM TA command application time | Moderator (MediaTek) |
R1-2410911 | LS on collision between SSB and RA occasion for LTM | RAN1, Google |
R1-2410916 | LS on condition of applying both indicated TCI states for PDCCH reception | RAN1, Samsung |
R1-2410918 | Final summary on LTM PRACH and serving cell UL transmission | Moderator (MediaTek) |
R1-2410919 | Final summary on LTM TA command application time | Moderator (MediaTek) |
R1-2410920 | CR on LTM TA command application time | Moderator (MediaTek), NTT Docomo, ZTE, Nokia |
R1-2410924 | [Draft] LS on condition of applying both indicated TCI states for PDCCH reception | Samsung |
TDoc | Title | Source |
---|---|---|
R1-2409392 | Rel-18 UE Features | Huawei, HiSilicon |
R1-2409579 | UE features for Rel-18 work items | Samsung |
R1-2410340 | Rel-18 UE Features | Ericsson |
R1-2410465 | UE features for Rel-18 | Qualcomm Incorporated |
R1-2410661 | Summary of discussion on Rel-18 NR UE features | Moderator (NTT DOCOMO, INC.) |
R1-2410662 | Summary#2 of discussion on Rel-18 NR UE features | Moderator (NTT DOCOMO, INC.) |
R1-2410663 | Session Notes of AI 8.2 | Ad-Hoc Chair (NTT DOCOMO, INC.) |
R1-2410664 | Draft LS on updated Rel-18 RAN1 UE features lists for NR after RAN1#119 | Moderators (AT&T, NTT DOCOMO, INC.) |
R1-2410665 | LS on updated Rel-18 RAN1 UE features lists for NR after RAN1#120 | RAN1, AT&T, NTT DOCOMO, INC. |
R1-2410666 | Updated RAN1 UE features list for Rel-18 NR after RAN1 #119 | Moderators (AT&T, NTT DOCOMO, INC.) |
R1-2410900 | Summary#3 of discussion on Rel-18 NR UE features | Moderator (NTT DOCOMO, INC.) |
TDoc | Title | Source |
---|---|---|
R1-2410844 | Session notes for 9.1 (AI/ML for NR Air Interface) | Ad-Hoc Chair (CMCC) |
TDoc | Title | Source |
---|---|---|
R1-2409395 | Discussion on AI/ML for beam management | Huawei, HiSilicon |
R1-2409447 | Discussion on AI/ML for Beam Management | Quectel |
R1-2409455 | Discussion on AI/ML for beam management | InterDigital, Inc. |
R1-2409479 | Discussion on AI/ML-based beam management | ZTE Corporation, Sanechips |
R1-2409499 | Discussion on specification support for beam management | CMCC |
R1-2409569 | Specification Support for AI/ML for Beam Management | Kyocera |
R1-2409581 | Discussion for supporting AI/ML based beam management | Samsung |
R1-2409625 | Discussion on AIML for beam management | Spreadtrum, UNISOC |
R1-2409668 | Specification support for beam management | vivo |
R1-2409741 | Specification support for beam management | Intel Corporation |
R1-2409749 | Specification support for beam management | Tejas Networks Limited |
R1-2409780 | Specification support for AI-enabled beam management | NVIDIA |
R1-2409787 | Discussion on AI/ML beam management | Apple |
R1-2409840 | Discussion on specification support for beam management | Ruijie Networks Co. Ltd |
R1-2409855 | Discussion on specification support for beam management | NEC |
R1-2409877 | Discussion on AI/ML for beam management | Xiaomi |
R1-2409925 | Specification support for AI/ML-based beam management | CATT, CBN |
R1-2409957 | Discussion on specification support for beam management | Panasonic |
R1-2409960 | Discussion on specification support for AI/ML beam management | Transsion Holdings |
R1-2409985 | AI/ML for Beam Management | Nokia |
R1-2409994 | Discussion on AI/ML for beam management | China Telecom |
R1-2410018 | AI/ML specification support for beam management | Lenovo |
R1-2410029 | Discussion on specification support for AI/ML-based beam management | FUTUREWEI |
R1-2410048 | Discussion on specification support on AI/ML for beam management | Fujitsu |
R1-2410101 | On specification for AI/ML-based beam management | OPPO |
R1-2410149 | AI/ML based Beam Management | |
R1-2410174 | Discussion on AI/ML for beam management | HONOR |
R1-2410185 | FL plan for mobility enhancements in RAN1#119 | Moderator (Fujitsu) |
R1-2410193 | Discussions on AI/ML for beam management | LG Electronics |
R1-2410204 | Discussion on AIML beam management | TCL |
R1-2410216 | Discussion on specification support for beam management | Sony |
R1-2410255 | Specification support for beam management | Fraunhofer HHI, Fraunhofer IIS |
R1-2410257 | Discussion on specification support for beam management | ETRI |
R1-2410344 | Discussion on AI/ML based beam management | KT Corp. |
R1-2410347 | AI/ML for Beam Management | Meta |
R1-2410354 | AI/ML for beam management | Ericsson |
R1-2410359 | Discussions on specification support for beam management | Sharp |
R1-2410367 | Discussions on AI/ML for beam management | CAICT |
R1-2410373 | Discussion on Specification Support of AI/ML for Beam Management | Indian Institute of Tech (M), IIT Kanpur |
R1-2410376 | Discussion on AI/ML for beam management | NTT DOCOMO, INC. |
R1-2410466 | Specification support for AI-ML-based beam management | Qualcomm Incorporated |
R1-2410504 | Specification support for beam management | KDDI Corporation |
R1-2410519 | Discussion on specification support for AIML-based beam management | MediaTek Inc. |
R1-2410547 | Specification support for AI/ML beam management | ITL |
R1-2410587 | On Associated ID for Beam Management Use Case | NTU |
R1-2410733 | FL summary #0 for AI/ML in beam management | Moderator (Samsung) |
R1-2410734 | FL summary #1 for AI/ML in beam management | Moderator (Samsung) |
R1-2410735 | FL summary #2 for AI/ML in beam management | Moderator (Samsung) |
R1-2410736 | FL summary #3 for AI/ML in beam management | Moderator (Samsung) |
R1-2410737 | FL summary #4 for AI/ML in beam management | Moderator (Samsung) |
R1-2410892 | FL summary #5 for AI/ML in beam management | Moderator (Samsung) |
R1-2410893 | [DRAFT] Reply LS on applicable functionality reporting for beam management UE-sided model | Samsung |
R1-2410898 | Reply LS on applicable functionality reporting for beam management UE-sided model | RAN1, Samsung |
TDoc | Title | Source |
---|---|---|
R1-2409396 | Discussion on AI/ML for positioning accuracy enhancement | Huawei, HiSilicon |
R1-2409443 | AI/ML for Positioning Accuracy Enhancement | Ericsson |
R1-2409480 | Discussion on AI/ML-based positioning enhancement | ZTE Corporation, Pengcheng Laboratory |
R1-2409500 | Discussion on specification support for positioning accuracy enhancement | CMCC |
R1-2409543 | Discussion on AI/ML for positioning accuracy enhancement | New H3C Technologies Co., Ltd. |
R1-2409582 | Discussion for supporting AI/ML based positioning accuracy enhancement | Samsung |
R1-2409669 | Specification support for positioning accuracy enhancement | vivo |
R1-2409742 | Specification support for positioning accuracy enhancement | Intel Corporation |
R1-2409750 | Specification support for positioning accuracy enhancement | Tejas Networks Limited |
R1-2409781 | Specification support for AI-enabled positioning | NVIDIA |
R1-2409788 | Discussion on Specification Support for AI/ML-based positioning | Apple |
R1-2409841 | Discussion on specification support for positioning accuracy enhancement | Ruijie Networks Co. Ltd |
R1-2409845 | Discussion on support for AIML positioning | InterDigital, Inc. |
R1-2409852 | Discussion on specification support for AIML based positioning accuracy enhancement | NEC |
R1-2409878 | Discussion on AI/ML-based positioning accuracy enhancement | Xiaomi |
R1-2409926 | Specification support for AI/ML-based positioning | CATT, CICTCI |
R1-2409986 | AI/ML for Positioning Accuracy Enhancement | Nokia |
R1-2410019 | Specification impacts for AI/ML positioning | Lenovo |
R1-2410049 | Discussion on specification support for AIML-based positioning accuracy enhancement | Fujitsu |
R1-2410102 | On specification for AI/ML-based positioning accuracy enhancements | OPPO |
R1-2410150 | AI/ML based Positioning | |
R1-2410205 | AI/ML positioning accuracy enhancement | Fraunhofer IIS, Fraunhofer HHI |
R1-2410215 | Discussion on specification support for positioning accuracy enhancement | TCL |
R1-2410217 | Support for AI/ML for positioning accuracy enhancement | Sony |
R1-2410258 | Discussion on specification support for positioning accuracy enhancement | ETRI |
R1-2410360 | Discussion on specification support for AI/ML based positioning accuracy enhancements | Sharp |
R1-2410377 | Discussion on AI/ML for positioning accuracy enhancement | NTT DOCOMO, INC. |
R1-2410414 | Discussion on specification support for AI-ML based positioning accuracy enhancement | Baicells |
R1-2410424 | Specification Support of AI/ML for Positioning Accuracy Enhancement | Indian Institute of Tech (M), IIT Kanpur |
R1-2410467 | Specification support for AI-ML-based positioning accuracy enhancement | Qualcomm Incorporated |
R1-2410531 | Design for AI/ML based positioning | MediaTek Korea Inc. |
R1-2410571 | Discussion on specification support for AI/ML Positioning Accuracy enhancement | CEWiT |
R1-2410588 | Discussions on specification support for positioning accuracy enhancement for AI/ML | ITL |
R1-2410714 | Summary #1 of specification support for positioning accuracy enhancement | Moderator (Ericsson) |
R1-2410715 | Summary #2 of specification support for positioning accuracy enhancement | Moderator (Ericsson) |
R1-2410716 | Summary #3 of specification support for positioning accuracy enhancement | Moderator (Ericsson) |
R1-2410717 | Summary #4 of specification support for positioning accuracy enhancement | Moderator (Ericsson) |
R1-2410718 | Summary #5 of specification support for positioning accuracy enhancement | Moderator (Ericsson) |
R1-2410921 | Final summary of specification support for positioning accuracy enhancement | Moderator (Ericsson) |
TDoc | Title | Source |
---|---|---|
R1-2409397 | Discussion on AI/ML for CSI prediction | Huawei, HiSilicon |
R1-2409449 | AI/ML for CSI prediction | Ericsson |
R1-2409481 | Discussion on specification support for AI CSI prediction | ZTE Corporation, Sanechips |
R1-2409501 | Discussion on AI/ML for CSI prediction | CMCC |
R1-2409583 | Views on AI/ML based CSI prediction | Samsung |
R1-2409626 | Discussion on AIML for CSI prediction | Spreadtrum, UNISOC |
R1-2409670 | Study on consistency issue for CSI prediction | vivo |
R1-2409751 | Discussion on study for AI/ML CSI prediction | Tejas Networks Limited |
R1-2409782 | Specification support for AI-enabled CSI prediction | NVIDIA |
R1-2409789 | Discussion on AI/ML-based CSI prediction | Apple |
R1-2409853 | Discussion on specification support for CSI prediction | NEC |
R1-2409879 | Discussion on AI/ML model based CSI prediction | Xiaomi |
R1-2409927 | Specification support for AI/ML-based CSI prediction | CATT |
R1-2409987 | AI/ML for CSI Prediction | Nokia |
R1-2409995 | Discussion on AI/ML for CSI prediction | China Telecom |
R1-2410020 | On AI/ML for CSI prediction | Lenovo |
R1-2410042 | On AI/ML-based CSI prediction | InterDigital, Inc. |
R1-2410050 | Discussion on specification support for CSI prediction | Fujitsu |
R1-2410103 | On specification for AI/ML-based CSI prediction | OPPO |
R1-2410151 | AI/ML based CSI Prediction | |
R1-2410194 | Discussions on CSI prediction | LG Electronics |
R1-2410218 | Further views on consistency issues in CSI prediction | Sony |
R1-2410248 | Discussion on consistency of training / inference for AI/ML-based CSI prediction | Panasonic |
R1-2410259 | Discussion on specification support for CSI prediction | ETRI |
R1-2410336 | Discussion on AI/ML for CSI prediction | AT&T |
R1-2410378 | Discussion on AI/ML for CSI prediction | NTT DOCOMO, INC. |
R1-2410468 | Specification support for CSI prediction | Qualcomm Incorporated |
R1-2410537 | AI/ML - Specification support for CSI Prediction | MediaTek Inc. |
R1-2410564 | AI/ML for CSI prediction | Mavenir |
R1-2410654 | Discussion on AI/ML for CSI prediction | Huawei, HiSilicon |
R1-2410673 | Study on consistency issue for CSI prediction | vivo |
R1-2410817 | Summary #1 of CSI prediction | Moderator (LG Electronics) |
R1-2410818 | Summary #2 of CSI prediction | Moderator (LG Electronics) |
R1-2410899 | Summary #3 of CSI prediction | Moderator (LG Electronics) |
TDoc | Title | Source |
---|---|---|
R1-2409398 | Discussion on AI/ML for CSI compression | Huawei, HiSilicon |
R1-2409450 | AI/ML for CSI compression | Ericsson |
R1-2409482 | Discussion on study for AI/ML CSI compression | ZTE Corporation, Sanechips |
R1-2409502 | Discussion on AI/ML for CSI compression | CMCC |
R1-2409584 | Views on additional study for AI/ML based CSI compression | Samsung |
R1-2409627 | Discussion on AIML for CSI compression | Spreadtrum, UNISOC |
R1-2409671 | Discussion on CSI compression | vivo |
R1-2409743 | AI/ML for CSI compression | Intel Corporation |
R1-2409752 | Discussion on AI/ML for CSI Compression | Tejas Networks Limited |
R1-2409783 | Additional study on AI-enabled CSI compression | NVIDIA |
R1-2409790 | Discussion on AI based CSI compression | Apple |
R1-2409854 | Discussion on CSI compression | NEC |
R1-2409880 | Views on AI/ML model based CSI compression | Xiaomi |
R1-2409928 | Additional study on AI/ML-based CSI compression | CATT |
R1-2409988 | AI/ML for CSI Compression | Nokia |
R1-2410021 | On AI/ML for CSI compression | Lenovo |
R1-2410030 | Discussion of CSI compression on AI/ML for NR air interface | FUTUREWEI |
R1-2410043 | On AI/ML-based CSI compression | InterDigital, Inc. |
R1-2410051 | Discussion on CSI compression with AI/ML | Fujitsu |
R1-2410104 | Additional study on AI/ML-based CSI compression | OPPO |
R1-2410152 | AI/ML based CSI Compression | |
R1-2410195 | Study on CSI compression | LG Electronics |
R1-2410201 | Discussion on AI/ML for CSI compression | KAIST |
R1-2410202 | Discussion on AIML CSI compression | TCL |
R1-2410249 | Discussion on AI/ML for CSI compression | Panasonic |
R1-2410260 | Discussion on AI/ML for CSI compression | ETRI |
R1-2410379 | Discussion on AI/ML for CSI compression | NTT DOCOMO, INC. |
R1-2410425 | Discussion and evaluation results on AI/ML for CSI Compression | Indian Institute of Tech (M), IIT Kanpur |
R1-2410469 | Additional study on CSI compression | Qualcomm Incorporated |
R1-2410508 | Additional study on AI/ML for NR air interface - CSI compression | MediaTek Inc. |
R1-2410572 | Discussion on AI/ML for CSI compression | CEWiT |
R1-2410589 | Discussion an AI/ML based CSI Compression | IIT Kanpur, Indian Institute of Tech (M) |
R1-2410719 | Summary#1 of Additional study on AI/ML for NR air interface: CSI compression | Moderator (Qualcomm) |
R1-2410720 | Summary#2 of Additional study on AI/ML for NR air interface: CSI compression | Moderator (Qualcomm) |
R1-2410721 | Summary#3 of Additional study on AI/ML for NR air interface: CSI compression | Moderator (Qualcomm) |
R1-2410722 | Summary#4 of Additional study on AI/ML for NR air interface: CSI compression | Moderator (Qualcomm) |
R1-2410723 | Summary#5 of Additional study on AI/ML for NR air interface: CSI compression | Moderator (Qualcomm) |
R1-2410724 | Final summary of Additional study on AI/ML for NR air interface: CSI compression | Moderator (Qualcomm) |
R1-2410725 | Updated summary of Evaluation Results for AI/ML CSI compression | Moderator (Qualcomm) |
R1-2410915 | [Draft] LS on signalling feasibility of dataset and parameter sharing | Qualcomm |
R1-2410922 | LS on signalling feasibility of dataset and parameter sharing | RAN1, Qualcomm |
TDoc | Title | Source |
---|---|---|
R1-2409399 | Discussion on other aspects of the additional study for AI/ML | Huawei, HiSilicon |
R1-2409483 | Discussion on other aspects of AI/ML model and data | ZTE Corporation, Sanechips |
R1-2409503 | Discussion on other aspects of AI/ML model and data | CMCC |
R1-2409585 | Views on additional study for other aspects of AI/ML model and data | Samsung |
R1-2409628 | Discussion on other aspects of AI/ML model and data | Spreadtrum, UNISOC |
R1-2409672 | Other aspects of AI/ML model and data | vivo |
R1-2409731 | Discussion on other aspects of AI/ML | Ericsson |
R1-2409744 | Other aspects of AI/ML model and data | Intel Corporation |
R1-2409753 | Discussion on Other aspects of AI/ML model and data | Tejas Networks Limited |
R1-2409784 | Additional study on other aspects of AI model and data | NVIDIA |
R1-2409791 | Discussion on other aspects of AI/ML model and data | Apple |
R1-2409856 | Discussion on other aspects of AI/ML model and data | NEC |
R1-2409881 | Further study on AI/ML model and data | Xiaomi |
R1-2409929 | Additional study on AI/ML for other aspects | CATT, CICTCI |
R1-2409989 | Other aspects of AI/ML for two-sided model | Nokia |
R1-2409996 | Discussion on other aspects of AI ML model and data | China Telecom |
R1-2410022 | Discussion on other aspects of AI/ML model and data | Lenovo |
R1-2410031 | Discussion on other aspects of AI/ML model and data on AI/ML for NR air-interface | FUTUREWEI |
R1-2410044 | On other aspects of AI/ML model and data | InterDigital, Inc. |
R1-2410052 | Discussion on other aspects of AI/ML model and data | Fujitsu |
R1-2410105 | Additional study on other aspects of AI/ML model and data | OPPO |
R1-2410153 | AI/ML Model and Data | |
R1-2410173 | Discussion on other aspects for AI/ML for air interface | Panasonic |
R1-2410192 | Other aspects of AI/ML model and data | Continental Automotive |
R1-2410196 | Discussion on other aspects of AI/ML model and data | LG Electronics |
R1-2410203 | Discussions on other aspects of AlML In NR air interface | TCL |
R1-2410261 | Discussion on other aspects of AI/ML model and data | ETRI |
R1-2410335 | Other Aspects of AI/ML framework | AT&T |
R1-2410380 | Discussion on other aspects of AI/ML model and data | NTT DOCOMO, INC. |
R1-2410426 | Discussion on other aspects of AI/ML model and data | Sharp |
R1-2410470 | Other aspects of AI/ML model and data | Qualcomm Incorporated |
R1-2410775 | Summary #1 for other aspects of AI/ML model and data | Moderator (OPPO) |
R1-2410776 | Summary #2 for other aspects of AI/ML model and data | Moderator (OPPO) |
R1-2410777 | Summary #3 for other aspects of AI/ML model and data | Moderator (OPPO) |
R1-2410778 | Summary #4 for other aspects of AI/ML model and data | Moderator (OPPO) |
TDoc | Title | Source |
---|---|---|
R1-2409592 | List of RRC and MAC CE impact for Rel-19 MIMO Ph5 | Samsung (Moderator) |
R1-2410757 | DRAFT LS to RAN2 on RRC and MAC CE impacts for Rel-19 NR MIMO Ph5 | Moderator (Samsung) |
R1-2410758 | LS to RAN2 on RRC and MAC CE impacts for Rel-19 NR MIMO Ph5 | RAN1, Samsung |
TDoc | Title | Source |
---|---|---|
R1-2409370 | Enhancements for UE-initiated/event-driven beam management | MediaTek Inc. |
R1-2409377 | Discussion on enhancements for UE-initiated/event-driven beam management | ZTE Corporation, Sanechips |
R1-2409427 | On UE initiated/event-driven beam management | Huawei, HiSilicon |
R1-2409459 | Further Details on Rel-19 UE/Event-Driven Beam Management | InterDigital, Inc. |
R1-2409504 | Discussion on enhancements for UE-initiated/event-driven beam management | CMCC |
R1-2409563 | Remaining issues for UE-initiated beam management | Ericsson |
R1-2409586 | Views on Rel-19 UE-initiated/event-driven beam management | Samsung |
R1-2409629 | Discussion on UE-initiated/event-driven beam management | Spreadtrum, UNISOC |
R1-2409673 | Remaining issues on UE-initiated/event-driven beam management | vivo |
R1-2409710 | Discussion on UE-initiated/event-driven beam management | TCL |
R1-2409748 | Enhancements for Event-driven Beam Management | Intel Corporation |
R1-2409792 | Enhancements for UE-initiated beam management | Apple |
R1-2409842 | Discussion on enhancements for UE-initiated/event-driven beam management | Ruijie Networks Co. Ltd |
R1-2409857 | Discussion on enhancements for UE-initiated or event-driven beam management | NEC |
R1-2409888 | Discussion on enhancements for UE-initiated/event-driven beam management | Xiaomi |
R1-2409933 | Views on Rel-19 UE-initiated/event-driven beam management | CATT |
R1-2409961 | Enhancements for UE-initiated/event-driven beam management | Transsion Holdings |
R1-2409969 | Enhancements for UE-initiated/event-driven beam management | Lenovo |
R1-2410035 | Enhancements for UE-initiated/event-driven beam management | FUTUREWEI |
R1-2410053 | Discussion on enhancements for UE-initiated/event-driven beam management | Fujitsu |
R1-2410108 | Discussions on UE-initiated/event-driven beam management | OPPO |
R1-2410116 | Offline summary for Rel-19 MIMO UEIBM (9.2.1) pre-RAN1#119 | Moderator (ZTE) |
R1-2410117 | Moderator Summary #1 on UE-initiated/event-driven beam management | Moderator (ZTE) |
R1-2410118 | Moderator Summary #2 on UE-initiated/event-driven beam management | Moderator (ZTE) |
R1-2410119 | Moderator Summary #3 on UE-initiated/event-driven beam management | Moderator (ZTE) |
R1-2410164 | Discussion on enhancements for UE-initiated or event-driven beam management | |
R1-2410171 | Discussion on enhancements for UE-initiated/event-driven beam management | Hyundai Motor Company |
R1-2410175 | Discussion on the UE-initiated/event-driven beam management | HONOR |
R1-2410197 | UE-initiated beam management | LG Electronics |
R1-2410219 | Enhancements for UE-initiated/event-driven beam management | Sony |
R1-2410262 | Enhancements for UE-initiated/event-driven beam management | ETRI |
R1-2410315 | Enhancements to facilitate UE-initiated/event-driven beam management | Nokia |
R1-2410346 | Enhancements for UE Initiated Beam Management | Meta |
R1-2410381 | Discussion on enhancements for UE-initiated/event-driven beam management | NTT DOCOMO, INC. |
R1-2410427 | Discussion on UE-initiated/event-driven beam management | ITRI |
R1-2410435 | Enhancements for UE-initiated/event-driven beam management | Sharp |
R1-2410471 | UE-initiated/event-driven beam management | Qualcomm Incorporated |
R1-2410533 | Enhancements for UE-initiated/Event-Driven Beam Management | Panasonic |
R1-2410538 | Discussion on UE initiated beam report | ASUSTeK |
R1-2410540 | Discussions on enhancements for UE-initiated/event-driven beam management | KDDI Corporation |
R1-2410573 | Enhancements for UEiBM | CEWiT |
R1-2410585 | Discussion on enhancements for UE-initiated/event-driven beam management | NICT |
R1-2410872 | Moderator Summary #4 on UE-initiated/event-driven beam management | Moderator (ZTE) |
R1-2410913 | [DRAFT] LS to RAN4 on event-instance evaluation periodicity for UE-initiated/event-driven beam management | Moderator (ZTE) |
R1-2410914 | LS to RAN4 on event-instance evaluation periodicity for UE-initiated/event-driven beam management | RAN1, ZTE |
TDoc | Title | Source |
---|---|---|
R1-2409371 | CSI enhancements | MediaTek Inc. |
R1-2409378 | Discussion on CSI enhancements | ZTE Corporation, Sanechips |
R1-2409428 | On 128 CSI-RS ports and UE reporting enhancement | Huawei, HiSilicon |
R1-2409432 | CSI enhancements for Rel. 19 MIMO | Fraunhofer IIS, Fraunhofer HHI |
R1-2409460 | Further Details on Rel-19 Enhancements of CSI | InterDigital, Inc. |
R1-2409505 | Discussion on CSI enhancements | CMCC |
R1-2409587 | Moderator summary for OFFLINE discussion on Rel-19 CSI enhancements | Samsung (Moderator) |
R1-2409588 | Moderator summary on Rel-19 CSI enhancements | Samsung (Moderator) |
R1-2409589 | Views on Rel-19 CSI enhancements | Samsung |
R1-2409630 | Discussion on CSI enhancements | Spreadtrum, UNISOC |
R1-2409674 | Remaining issues on Rel-19 CSI enhancements | vivo |
R1-2409747 | CSI enhancements for MIMO | Intel Corporation |
R1-2409761 | CSI enhancements | Tejas Networks Limited |
R1-2409793 | Views on R19 MIMO CSI enhancement | Apple |
R1-2409851 | Discussion on CSI enhancements | NEC |
R1-2409889 | Further discussion on Rel-19 MIMO CSI enhancements | Xiaomi |
R1-2409934 | Views on NR MIMO CSI enhancements Phase 5 | CATT |
R1-2409970 | Discussion on CSI enhancements | Lenovo |
R1-2410040 | CSI enhancements | TCL |
R1-2410054 | Discussion on Rel-19 CSI enhancements | Fujitsu |
R1-2410109 | CSI enhancements for Rel-19 MIMO | OPPO |
R1-2410154 | CSI Enhancement for NR MIMO | |
R1-2410176 | Discussion on CSI enhancements | HONOR |
R1-2410220 | Further views on CSI enhancements | Sony |
R1-2410303 | Discussion on Open Issues of CSI Enhancement | Rakuten Mobile, Inc |
R1-2410316 | CSI enhancement for NR MIMO Phase 5 | Nokia |
R1-2410353 | Remaining issues on CSI enhancements for large antenna arrays and CJT | Ericsson |
R1-2410382 | Discussion on CSI enhancements | NTT DOCOMO, INC., NTT CORPORATION |
R1-2410436 | CSI enhancements | Sharp |
R1-2410472 | CSI enhancements for >32 ports and UE-assisted CJT | Qualcomm Incorporated |
R1-2410549 | Discussion on CSI enhancements for NR MIMO Phase 5 | KDDI Corporation |
R1-2410586 | Discussion on CSI enhancements | NICT |
R1-2410657 | Views on NR MIMO CSI enhancements Phase 5 | CATT |
R1-2410667 | CSI enhancement for NR MIMO Phase 5 | Nokia |
R1-2410751 | Moderator Summary#2 on Rel-19 CSI enhancements: Round 2 | Moderator (Samsung) |
R1-2410752 | Moderator Summary#3 on Rel-19 CSI enhancements: Round 3 | Moderator (Samsung) |
R1-2410753 | Moderator Summary#4 on Rel-19 CSI enhancements: Round 4 | Moderator (Samsung) |
R1-2410754 | Moderator Summary for 1st offline on Rel-19 CSI enhancements | Moderator (Samsung) |
R1-2410755 | Moderator Summary for 2nd offline on Rel-19 CSI enhancements | Moderator (Samsung) |
R1-2410756 | Moderator Summary for 3rd offline on Rel-19 CSI enhancements | Moderator (Samsung) |
TDoc | Title | Source |
---|---|---|
R1-2409372 | Enhancements for 3-antenna-port transmissions | MediaTek Inc. |
R1-2409379 | Discussion on 3-antenna-port codebook-based transmissions | ZTE Corporation, Sanechips |
R1-2409429 | Discussion on 3-antenna-port UL transmission | Huawei, HiSilicon |
R1-2409461 | Further Details on Rel-19 CB-based UL for 3TX UE | InterDigital, Inc. |
R1-2409463 | FL Summary Support for 3TX CB-based Uplink; First Round | Moderator (InterDigital, Inc.) |
R1-2409464 | FL Summary Support for 3TX CB-based Uplink; Second Round | Moderator (InterDigital, Inc.) |
R1-2409465 | Summary of Discussion on 3TX CB-based Uplink in RAN1#119 | Moderator (InterDigital, Inc.) |
R1-2409506 | Discussion on support for 3-antenna-port codebook-based transmissions | CMCC |
R1-2409590 | Views on Rel-19 3-antenna-port codebook-based transmissions | Samsung |
R1-2409675 | Remaining issues on 3-antenna-port codebook-based uplink transmissions | vivo |
R1-2409745 | Support for 3Tx UL MIMO | Intel Corporation |
R1-2409794 | Remaining issues on R19 MIMO 3Tx transmission | Apple |
R1-2409890 | Discussion on the support of 3-antenna-port CB based transmissions | Xiaomi |
R1-2409935 | Views on 3-antenna-port uplink transmissions | CATT |
R1-2409971 | Support for 3-antenna-port codebook-based transmissions | Lenovo |
R1-2410055 | Discussion on uplink enhancement for UE with 3Tx | Fujitsu |
R1-2410110 | Discussion on 3-antenna-port uplink transmissions | OPPO |
R1-2410155 | Uplink 3 Port Codebook based Transmission | |
R1-2410317 | On the support for 3-antenna-port codebook-based transmissions | Nokia |
R1-2410341 | Remaining issues for 3 Tx UL transmissions | Ericsson |
R1-2410383 | Discussion on support for 3-antenna-port codebook-based transmissions | NTT DOCOMO, INC. |
R1-2410437 | Support for 3-antenna-port transmission | Sharp |
R1-2410762 | Draft Reply to RAN4 LS on UE RF issues for Rel-19 MIMO Enhancement | InterDigital, OPPO |
R1-2410870 | Reply to RAN4 LS on UE RF issues for Rel-19 MIMO Enhancement | RAN1, InterDigital, OPPO |
TDoc | Title | Source |
---|---|---|
R1-2409373 | Enhancement for asymmetric DL sTRP/UL mTRP scenarios | MediaTek Inc. |
R1-2409380 | Discussion on enhancements for asymmetric DL sTRP/UL mTRP scenarios | ZTE Corporation, Sanechips, China Telecom |
R1-2409430 | Enhancements for asymmetric DL sTRP/UL mTRP scenarios | Huawei, HiSilicon |
R1-2409462 | Further Details on Rel-19 Asymmetric mTRP Operation | InterDigital, Inc. |
R1-2409507 | Discussion on enhancement for asymmetric DL sTRP/UL mTRP scenarios | CMCC |
R1-2409591 | Views on Rel-19 asymmetric DL sTRP/UL mTRP scenarios | Samsung |
R1-2409631 | Enhancements for asymmetric DL sTRP/UL mTRP scenarios | Spreadtrum, UNISOC |
R1-2409676 | Remaining issues on asymmetric DL sTRP/UL mTRP scenarios | vivo |
R1-2409709 | Discussion on asymmetric DL sTRP/UL mTRP scenarios | TCL |
R1-2409746 | Enhancements for asymmetric DL/UL scenarios | Intel Corporation |
R1-2409762 | Enhancement for asymmetric DL sTRP/UL mTRP scenarios | Tejas Networks Limited |
R1-2409769 | Enhancement for asymmetric DL sTRP UL mTRP scenarios | Ericsson |
R1-2409795 | Enhancements for asymmetric DL sTRP/UL mTRP | Apple |
R1-2409858 | Discussion on enhancements for asymmetric DL sTRP and UL mTRP scenarios | NEC |
R1-2409891 | Discussion on enhancement for asymmetric DL sTRP/UL mTRP scenarios | Xiaomi |
R1-2409936 | Views on Rel-19 asymmetric DL sTRP/UL mTRP scenarios | CATT |
R1-2409962 | Discussion on enhancements for asymmetric DL sTRP/UL mTRP scenarios | Transsion Holdings |
R1-2409972 | Enhancement for asymmetric DL sTRP/UL mTRP scenarios | Lenovo |
R1-2409997 | Discussion on enhancements for asymmetric DL sTRP/UL mTRP scenarios | China Telecom, ZTE |
R1-2410056 | Discussion on UL-only mTRP operation | Fujitsu |
R1-2410111 | Enhancements on asymmetric DL sTRP/UL mTRP scenarios | OPPO |
R1-2410165 | Discussion on enhancement for asymmetric DL sTRP and UL mTRP scenarios | |
R1-2410198 | Discussions on asymmetric DL sTRP/UL mTRP scenarios | LG Electronics |
R1-2410221 | Enhancement for asymmetric DL sTRP/UL mTRP scenarios | Sony |
R1-2410263 | Discussion on DL single TRP and UL mTRP operation | ETRI |
R1-2410318 | Enhancement for asymmetric DL sTRP/UL mTRP scenarios | Nokia |
R1-2410384 | Discussion on enhancement for asymmetric DL sTRP/UL mTRP scenarios | NTT DOCOMO, INC. |
R1-2410438 | Enhancement for asymmetric DL sTRP/UL mTRP scenarios | Sharp |
R1-2410473 | Enhancement for asymmetric DL sTRP and UL mTRP deployment scenarios | Qualcomm Incorporated |
R1-2410534 | Enhancement for Asymmetric DL sTRP/UL mTRP Scenarios | Panasonic |
R1-2410539 | Discussion on asymmetric DL sTRP and UL mTRP | ASUSTeK |
R1-2410649 | Summary #1 on Rel-19 asymmetric DL sTRP/UL mTRP | Moderator (OPPO) |
R1-2410650 | Summary #2 on Rel-19 asymmetric DL sTRP/UL mTRP | Moderator (OPPO) |
R1-2410651 | Summary #3 on Rel-19 asymmetric DL sTRP/UL mTRP | Moderator (OPPO) |
TDoc | Title | Source |
---|---|---|
R1-2410889 | LS on impact on transmit signal quality/MPR requirement | RAN1, Huawei |
R1-2410890 | Reply LS on the scenarios of UE-to-UE CLI measurement report in SBFD operation | RAN1, Huawei |
TDoc | Title | Source |
---|---|---|
R1-2409374 | Discussion for SBFD TX/RX/ measurement procedures | New H3C Technologies Co., Ltd. |
R1-2409410 | On subband full duplex design | Huawei, HiSilicon |
R1-2409452 | Discussion on SBFD TX/RX/measurement procedures | MediaTek Inc. |
R1-2409474 | Discussion on SBFD TX/RX/measurement procedures | TCL |
R1-2409488 | Discussion on SBFD TX/RX/measurement procedures | LG Electronics |
R1-2409508 | Discussion on SBFD TX/RX/measurement procedures | CMCC |
R1-2409538 | Discussion on transmission, reception and measurement procedures for SBFD operation | ZTE Corporation, Sanechips |
R1-2409566 | Discussion on SBFD TX_RX_measurement procedures | InterDigital, Inc. |
R1-2409593 | SBFD operation and procedures | Samsung |
R1-2409632 | Discussion on SBFD TX/RX/measurement procedures | Spreadtrum, UNISOC |
R1-2409677 | Discussion on Rel-19 SBFD operation | vivo |
R1-2409763 | Discussion for SBFD TX/RX/ measurement procedures | Tejas Networks Limited |
R1-2409796 | Discussion on SBFD TX/RX/measurement procedures | Apple |
R1-2409843 | Discussion on SBFD TX/RX/measurement procedures | Ruijie Networks Co. Ltd |
R1-2409892 | Discussion on reception and transmission procedure for SBFD operation | Xiaomi |
R1-2409937 | Discussion on SBFD TX/RX/measurement procedures | CATT |
R1-2409963 | Discussion on SBFD operation | Transsion Holdings |
R1-2409998 | Discussion on SBFD TX/RX/measurement procedures | China Telecom |
R1-2410045 | Discussion on SBFD TX/RX/measurement procedures | Panasonic |
R1-2410057 | Discussion on SBFD Tx/Rx/measurement procedures | Fujitsu |
R1-2410086 | Discussion on SBFD Tx/Rx/measurement procedures | OPPO |
R1-2410137 | On SBFD TX/RX/measurement procedures | Nokia, Nokia Shanghai Bell |
R1-2410140 | SBFD TX/RX/measurement procedures | Ericsson |
R1-2410177 | Discussion on SBFD TX/RX/measurement procedures | HONOR |
R1-2410191 | Views on SBFD TX/RX Measurement Procedures | Lenovo |
R1-2410206 | Discussion on subband non-overlapping full duplex Tx-Rx and measurement operations | NEC |
R1-2410222 | SBFD Procedures | Sony |
R1-2410241 | Discussion on SBFD Tx/Rx/measurement procedures | Fraunhofer HHI, Fraunhofer IIS |
R1-2410264 | Discussion on SBFD TX/RX/measurement procedures | ETRI |
R1-2410385 | Discussion on SBFD TX/RX/measurement procedures | NTT DOCOMO, INC. |
R1-2410410 | SBFD Tx/Rx/measurement aspects | Sharp |
R1-2410428 | Discussion on SBFD TX/RX/measurement procedures | ITRI |
R1-2410474 | SBFD Transmission, Reception and Measurement Procedures | Qualcomm Incorporated |
R1-2410545 | Discussion on SBFD TX/RX/measurement procedures | Google Ireland Limited |
R1-2410548 | Partial PRG handling for SBFD | ASUSTeK |
R1-2410558 | Discussion on SBFD TX/RX/measurement procedures | WILUS Inc. |
R1-2410574 | Discussion on SBFD TX/RX/ measurement procedures | CEWiT |
R1-2410692 | Summary #1 of SBFD TX/RX/measurement procedures | Moderator (CATT) |
R1-2410693 | Summary #2 of SBFD TX/RX/measurement procedures | Moderator (CATT) |
R1-2410694 | Summary #3 of SBFD TX/RX/measurement procedures | Moderator (CATT) |
TDoc | Title | Source |
---|---|---|
R1-2409375 | Discussion for SBFD random access operation | New H3C Technologies Co., Ltd. |
R1-2409411 | On subband full duplex random access operation | Huawei, HiSilicon |
R1-2409453 | Discussion on SBFD Random Access Operation | MediaTek Inc. |
R1-2409475 | Discussion on SBFD random access operation | TCL |
R1-2409489 | Discussion on SBFD random access operation | LG Electronics |
R1-2409509 | Discussion on SBFD random access operation | CMCC |
R1-2409539 | Discussion on SBFD random access operation | ZTE Corporation, Sanechips |
R1-2409567 | On SBFD random access operation | InterDigital, Inc. |
R1-2409594 | Random access on SBFD resources | Samsung |
R1-2409633 | Discussion on SBFD random access operation | Spreadtrum, UNISOC |
R1-2409678 | Discussion on random access for Rel-19 SBFD | vivo |
R1-2409764 | Discussion on SBFD Random Access Operation | Tejas Networks Limited |
R1-2409797 | Views on SBFD random access operation | Apple |
R1-2409844 | Discussion on SBFD random access operation | Ruijie Networks Co. Ltd |
R1-2409873 | Discussion on random access for SBFD | NEC |
R1-2409893 | Discussion on SBFD random access operation | Xiaomi |
R1-2409910 | Discussion on SBFD random access operation | Korea Testing Laboratory |
R1-2409938 | Discussion on SBFD random access operation | CATT |
R1-2409964 | Discussion on SBFD random access operation | Transsion Holdings |
R1-2409999 | Discussion on SBFD random access operation | China Telecom |
R1-2410046 | Discussion on SBFD random access operation | Panasonic |
R1-2410058 | Discussion on SBFD random access operation | Fujitsu |
R1-2410087 | Discussion on SBFD random access operation | OPPO |
R1-2410138 | SBFD random access operation | Nokia, Nokia Shanghai Bell |
R1-2410141 | SBFD Random access operation | Ericsson |
R1-2410172 | Discussion on SBFD random access operation | Hyundai Motor Company |
R1-2410223 | SBFD RACH Operations | Sony |
R1-2410251 | SBFD random access operation | Lenovo |
R1-2410265 | SBFD random access operation | ETRI |
R1-2410324 | On SBFD random access operation | Google Ireland Limited |
R1-2410345 | Discussion on SBFD Random Access operation | KT Corp. |
R1-2410386 | Discussion on SBFD random access operation | NTT DOCOMO, INC. |
R1-2410412 | SBFD random access aspects | Sharp |
R1-2410429 | Discussion on SBFD random access operation for SBFD aware UEs | ITRI |
R1-2410475 | SBFD Random Access Operation | Qualcomm Incorporated |
R1-2410544 | Discussion on SBFD random access operation | ASUSTEK COMPUTER (SHANGHAI) |
R1-2410559 | Discussion on SBFD random access operation | WILUS Inc. |
R1-2410575 | Discussion on SBFD random access operation | CEWiT |
R1-2410674 | Summary#1 on SBFD random access operation | Moderator (CMCC) |
R1-2410675 | Summary#2 on SBFD random access operation | Moderator (CMCC) |
R1-2410676 | Summary#3 on SBFD random access operation | Moderator (CMCC) |
TDoc | Title | Source |
---|---|---|
R1-2409376 | Discussion on CLI handling | New H3C Technologies Co., Ltd. |
R1-2409412 | On cross-link interference handling for subband full duplex | Huawei, HiSilicon |
R1-2409454 | Discussion on CLI Handling in SBFD System | MediaTek Inc. |
R1-2409490 | Discussion on CLI handling | LG Electronics |
R1-2409510 | Discussion on CLI handling | CMCC |
R1-2409540 | Discussion on CLI handling for Rel-19 duplex operation | ZTE Corporation, Sanechips |
R1-2409568 | On CLI handling for SBFD operation | InterDigital, Inc. |
R1-2409595 | Cross-link interference handling for SBFD | Samsung |
R1-2409634 | Discussion on CLI handling | Spreadtrum, UNISOC |
R1-2409679 | Discussion on CLI handling for Rel-19 NR duplex | vivo |
R1-2409765 | Discussion on gNB-gNB CLI handling | Tejas Networks Limited |
R1-2409798 | Discussion on CLI handling | Apple |
R1-2409874 | CLI handling for NR duplex operations | NEC |
R1-2409894 | Discussion on CLI handling for SBFD operation | Xiaomi |
R1-2409939 | Discussion on CLI handling for NR duplex evolution | CATT |
R1-2410047 | Discussion on CLI handling | Panasonic |
R1-2410088 | CLI handling in NR duplex operation | OPPO |
R1-2410139 | Cross-link interference handling for duplex evolution | Nokia, Nokia Shanghai Bell |
R1-2410142 | CLI handling | Ericsson |
R1-2410224 | SBFD CLI Handling | Sony |
R1-2410266 | Discussion on CLI handling for SBFD operation | ETRI |
R1-2410325 | On the gNB-to-gNB CLI and the UE-to-UE CLI handling | Google Ireland Limited |
R1-2410387 | Discussion on CLI handling | NTT DOCOMO, INC. |
R1-2410433 | Views on uplink resource muting | SHARP Corporation |
R1-2410476 | Enhancements for CLI handling | Qualcomm Incorporated |
R1-2410576 | Discussion on CLI handling | CEWiT |
R1-2410788 | Summary #1 of CLI handling | Moderator (Huawei) |
R1-2410789 | Summary #2 of CLI handling | Moderator (Huawei) |
R1-2410790 | Summary #3 of CLI handling | Moderator (Huawei) |
TDoc | Title | Source |
---|---|---|
R1-2409993 | TR 38.769 v1.1.0 “Study on Solutions for Ambient IoT (Internet of Things)” | Huawei (TR editor) |
R1-2410330 | TP for Conclusions in TR 38.769 | Huawei, HiSilicon |
R1-2410703 | Feature Lead Summary #1 for 9.4: “Ambient IoT – TR Conclusions” | Moderator (Huawei) |
R1-2410704 | Feature Lead Summary #2 for 9.4: “Ambient IoT – TR Conclusions” | Moderator (Huawei) |
R1-2410845 | Session notes for 9.4 (Study on solutions for Ambient IoT in NR) | Ad-Hoc Chair (Huawei) |
R1-2410929 | TR 38.769 v2.0.0 “Study on Solutions for Ambient IoT (Internet of Things)” | Huawei (TR editor) |
TDoc | Title | Source |
---|---|---|
R1-2409362 | Evaluation assumptions and results for Ambient IoT | Nokia |
R1-2409390 | Evaluation assumptions and results for Ambient IoT | Ericsson |
R1-2409416 | Evaluation methodology and assumptions for Ambient IoT | Huawei, HiSilicon |
R1-2409511 | Discussion on evaluation assumptions and results for Ambient IoT | CMCC |
R1-2409550 | Discussion on Ambient IoT evaluations | ZTE Corporation, Sanechips |
R1-2409596 | Considerations for evaluation assumptions and results | Samsung |
R1-2409635 | Discussion on evaluation assumptions and results for Ambient IoT | Spreadtrum, UNISOC |
R1-2409680 | Evaluation methodologies assumptions and results for Ambient IoT | vivo |
R1-2409757 | Discussion on Link Level simulation of A-IoT | Tejas Networks Limited |
R1-2409799 | On remaining evaluation assumptions and results for AIoT | Apple |
R1-2409895 | Evaluation assumptions and results for Ambient IoT | Xiaomi |
R1-2409940 | The evaluation methodology and preliminary results of Ambient IoT | CATT |
R1-2410000 | Discussion on evaluation assumptions and results for Ambient IoT | China Telecom |
R1-2410024 | Discussion on evaluation assumptions and results for Ambient IoT devices | FUTUREWEI |
R1-2410090 | Discussion on evaluation assumptions and results for A-IoT | OPPO |
R1-2410178 | Discussion on evaluation assumptions and results for Ambient IoT | HONOR |
R1-2410207 | Discussion on ambient IoT evaluation framework | NEC |
R1-2410285 | Discussion on Ambient IoT evaluation | LG Electronics |
R1-2410312 | Evaluation results for Ambient IoT | InterDigital, Inc. |
R1-2410351 | Link level simulation for Ambient IoT R2D | Panasonic |
R1-2410388 | Study on evaluation assumptions and results for Ambient IoT | NTT DOCOMO, INC. |
R1-2410422 | Discussion on evaluation assumptions and results for Ambient IoT | Indian Institute of Tech (M) |
R1-2410477 | Evaluation Assumptions and Results | Qualcomm Incorporated |
R1-2410513 | Evaluation assumptions and results for A-IoT | MediaTek Inc. |
R1-2410551 | Discussion on the evaluation assumptions for Ambient IoT devices | Lenovo |
R1-2410577 | Discussion on Evaluation assumptions and results | CEWiT |
R1-2410590 | Evaluation assumption and results for AIoT | IIT Kanpur, Indian Institute of Tech (M) |
R1-2410629 | Discussion on Ambient IoT evaluations | ZTE Corporation, Sanechips |
R1-2410630 | Considerations for evaluation assumptions and results | Samsung |
R1-2410637 | FL summary #1 for Ambient IoT evaluation | Moderator (CMCC) |
R1-2410638 | FL summary #2 for Ambient IoT evaluation | Moderator (CMCC) |
R1-2410639 | FL summary #3 for Ambient IoT evaluation | Moderator (CMCC) |
R1-2410658 | Discussion on Evaluation assumptions and results | CEWiT |
R1-2410825 | TP for Annex Z of TR38.769 for receiver sensitivity | Moderator (CMCC) |
R1-2410826 | TP for Clause 7.1.1-7.1.4 of TR38.769 for coverage results | Moderator (CMCC) |
R1-2410827 | TP for Clause 7.2.1 of TR38.769 for single device latency | Moderator (CMCC) |
R1-2410828 | TP for Clause 7.2.2 of TR38.769 for multi-device inventory completion time | Moderator (CMCC) |
R1-2410854 | TP for Annex Z of TR38.769 for receiver sensitivity | Moderator (CMCC) |
R1-2410855 | TP for Clause 7.1.1-7.1.4 of TR38.769 for coverage results | Moderator (CMCC) |
R1-2410875 | TP for coverage results spreadsheet for TR38.769 | Moderator (CMCC) |
TDoc | Title | Source |
---|---|---|
R1-2409358 | Discussion on ambient IoT device architectures | TCL |
R1-2409363 | Ambient IoT device architectures | Nokia |
R1-2409391 | Ambient IoT device architectures | Ericsson |
R1-2409417 | Ultra low power device architectures for Ambient IoT | Huawei, HiSilicon |
R1-2409512 | Discussion on Ambient IoT device architectures | CMCC |
R1-2409551 | Discussion on Ambient IoT device architectures | ZTE Corporation, Sanechips |
R1-2409597 | Remaining issues for Ambient-IoT device architectures | Samsung |
R1-2409636 | Discussion on Ambient IoT device architectures | Spreadtrum, UNISOC, SGITG |
R1-2409681 | Discussion on Ambient IoT Device architectures | vivo |
R1-2409758 | Discussion on receiver architecture of A-IoT | Tejas Networks Limited |
R1-2409800 | On remaining details of device architecture for AIoT | Apple |
R1-2409896 | Discussion on Ambient IoT device architectures | Xiaomi |
R1-2409941 | Study of the Ambient IoT devices architecture | CATT |
R1-2410025 | On remaining open issues in Rel-19 Ambient IoT device architecture | FUTUREWEI |
R1-2410091 | Discussion on device architecture for A-IoT device | OPPO |
R1-2410208 | Device architecture requirements for ambient IoT | NEC |
R1-2410286 | Discussion on Ambient IoT device architectures | LG Electronics |
R1-2410313 | Device architectures for Ambient IoT | InterDigital, Inc. |
R1-2410389 | Study on device architectures for Ambient IoT | NTT DOCOMO, INC. |
R1-2410423 | Discussion on Ambient IoT Device Architectures | Indian Institute of Tech (M), IIT Kanpur |
R1-2410478 | Ambient IoT Device Architecture | Qualcomm Incorporated |
R1-2410502 | Analysis for CFO calibration for device 2b | Wiliot Ltd. |
R1-2410514 | Ambient IoT device architectures | MediaTek Inc. |
R1-2410710 | FL Summary #1 for 9.4.1.2 Ambient IoT Device Architecture | Moderator (Qualcomm) |
R1-2410711 | FL Summary #2 for 9.4.1.2 Ambient IoT Device Architecture | Moderator (Qualcomm) |
R1-2410712 | FL Summary #3 for 9.4.1.2 Ambient IoT Device Architecture | Moderator (Qualcomm) |
R1-2410713 | FL Summary #4 for 9.4.1.2 Ambient IoT Device Architecture | Moderator (Qualcomm) |
TDoc | Title | Source |
---|---|---|
R1-2409359 | Discussion on general aspects of physical layer design for Ambient IoT | TCL |
R1-2409364 | General aspects of physical layer design for Ambient IoT | Nokia |
R1-2409388 | General aspects of physical layer design for Ambient IoT | Ericsson |
R1-2409418 | On general aspects of physical layer design for Ambient IoT | Huawei, HiSilicon |
R1-2409513 | Discussion on general aspects of A-IoT physical layer design | CMCC |
R1-2409535 | Discussion on Physical Layer Design for Ambient-IoT | EURECOM |
R1-2409552 | Discussion on general aspects of physical layer design for Ambient IoT | ZTE Corporation, Sanechips |
R1-2409598 | Considerations for general aspects of Ambient IoT | Samsung |
R1-2409637 | Discussion on general aspects of physical layer design for Ambient IoT | Spreadtrum, UNISOC |
R1-2409682 | Discussion on General Aspects of Physical Layer Design | vivo |
R1-2409801 | On remaining general physical layer design aspects for AIoT | Apple |
R1-2409864 | Discussion on general aspects of ambient IoT physical layer design | NEC |
R1-2409897 | Discussion on physical layer design of Ambient IoT | Xiaomi |
R1-2409942 | Discussion on general aspects of physical layer design | CATT |
R1-2409976 | On General Physical Layer Design Considerations for Ambient IoT Applications | Lekha Wireless Solutions |
R1-2410001 | Discussion on general aspects of physical layer design for Ambient IoT | China Telecom |
R1-2410026 | On remaining open issues in Rel-19 Ambient IoT physical layer design | FUTUREWEI |
R1-2410059 | Discussions on FEC/repetition in R2D and D2R | Fujitsu |
R1-2410092 | Discussion on general aspects of physical layer design of A-IoT communication | OPPO |
R1-2410225 | Physical layer design of Ambient IoT | Sony |
R1-2410267 | Discussion on general aspects of physical layer design | ETRI |
R1-2410287 | General aspects of Ambient IoT physical layer design | LG Electronics |
R1-2410311 | Discussion on physical layer design for Ambient IoT | InterDigital, Inc. |
R1-2410352 | General aspects of physical layer design for Ambient IoT | Panasonic |
R1-2410372 | Discussion on A-IoT physical layer design | ASUSTeK |
R1-2410390 | Study on general aspects of physical layer design for Ambient IoT | NTT DOCOMO, INC. |
R1-2410416 | Discussion on general aspects of physical layer design | Sharp |
R1-2410479 | General aspects of physical layer design | Qualcomm Incorporated |
R1-2410515 | General aspects of physical layer design | MediaTek Inc. |
R1-2410552 | Discussion on the physical layer design aspects for Ambient IoT devices | Lenovo |
R1-2410591 | Discussion on General aspects of physical layer design of AIoT | IIT Kanpur, Indian Institute of Tech (M) |
R1-2410700 | Feature Lead Summary #1 for 9.4.2.1: “Ambient IoT – General aspects of physical layer design” | Moderator (Huawei) |
R1-2410701 | Feature Lead Summary #2 for 9.4.2.1: “Ambient IoT – General aspects of physical layer design” | Moderator (Huawei) |
R1-2410702 | Feature Lead Summary #3 for 9.4.2.1: “Ambient IoT – General aspects of physical layer design” | Moderator (Huawei) |
TDoc | Title | Source |
---|---|---|
R1-2409365 | Frame structure and timing aspects for Ambient IoT | Nokia |
R1-2409389 | Frame structure and timing aspects for Ambient IoT | Ericsson |
R1-2409419 | On frame structure and timing aspects of Ambient IoT | Huawei, HiSilicon, CBN, China Broadnet |
R1-2409485 | Discussion on frame structure and physical layer procedures for Ambient IoT | Lenovo |
R1-2409514 | Discussion on frame structure and timing aspects for A-IoT | CMCC |
R1-2409553 | Discussion on frame structure and physical layer procedure for Ambient IoT | ZTE Corporation, Sanechips |
R1-2409599 | Considerations for frame structure and timing aspects | Samsung |
R1-2409638 | Discussion on frame structure and timing aspects for Ambient IoT | Spreadtrum, UNISOC |
R1-2409683 | Discussion on Frame structure, random access, scheduling and timing aspects for Ambient IoT | vivo |
R1-2409733 | Discussion on frame structure and timing aspects | InterDigital, Inc. |
R1-2409759 | Resource allocation and frame structure of A-IoT | Tejas Networks Limited |
R1-2409802 | On remaining frame structure and timing aspects for AIoT | Apple |
R1-2409865 | Discussion on frame structure and timing for ambient IoT | NEC |
R1-2409898 | Discussion on frame structure and timing aspects for Ambient IoT | Xiaomi |
R1-2409943 | Study of Frame structure and timing aspects for Ambient IoT | CATT |
R1-2410002 | Discussion on frame structure and timing aspects for Ambient IoT | China Telecom |
R1-2410027 | Frame Structure and Timing Aspects for Ambient IoT | FUTUREWEI |
R1-2410060 | Discussion on frame structure and timing aspects | Fujitsu |
R1-2410063 | Discussion on A-IoT Frame Structure and Timing Aspects | Panasonic |
R1-2410093 | Discussion on frame structure and timing aspects of A-IoT communication | OPPO |
R1-2410166 | Discussion on frame structure and timing aspects | |
R1-2410179 | Discussion on frame structure and timing aspects for Ambient IoT | HONOR |
R1-2410226 | Frame structure and timing aspects of Ambient IoT | Sony |
R1-2410268 | Discussion on frame structure and timing aspects | ETRI |
R1-2410288 | Frame structure and timing aspects for Ambient IoT | LG Electronics |
R1-2410356 | Discussion on frame structure and timing aspects for Ambient IoT | TCL |
R1-2410391 | Study on frame structure and timing aspects for Ambient IoT | NTT DOCOMO, INC. |
R1-2410409 | Discussion on frame structure and timing aspect | ASUSTeK |
R1-2410417 | Discussion on frame structure and timing aspects | Sharp |
R1-2410480 | Frame structure and timing aspects | Qualcomm Incorporated |
R1-2410516 | Frame structure and timing aspects | MediaTek Inc. |
R1-2410560 | Discussion on frame structure and timing aspects for Ambient IoT | WILUS Inc. |
R1-2410578 | Discussion on Frame structure and timing aspects | CEWiT |
R1-2410592 | Frame structure and timing aspects of AIoT | IIT Kanpur, Indian Institute of Tech (M) |
R1-2410643 | FL summary #1 on frame structure and timing aspects for Rel-19 Ambient IoT | Moderator (vivo) |
R1-2410644 | FL summary #2 on frame structure and timing aspects for Rel-19 Ambient IoT | Moderator (vivo) |
R1-2410645 | FL summary #3 on frame structure and timing aspects for Rel-19 Ambient IoT | Moderator (vivo) |
R1-2410647 | Discussion on frame structure and timing aspects for Ambient IoT | China Telecom |
R1-2410653 | TP updates on section 6.2 Device (un)availability for TR 38.769 | Moderator (vivo) |
R1-2410866 | Final FL summary on frame structure and timing aspects for Rel-19 Ambient IoT | Moderator (vivo) |
TDoc | Title | Source |
---|---|---|
R1-2409360 | Discussion on downlink and uplink channel/signal aspects for Ambient IoT | TCL |
R1-2409366 | R2D and D2R channel/signal aspects for Ambient IoT | Nokia |
R1-2409420 | Physical channels and signals for Ambient IoT | Huawei, HiSilicon, CBN, China Broadnet |
R1-2409486 | Discussion on channel/signal aspects for Ambient IoT | Lenovo |
R1-2409515 | Discussion on downlink and uplink channel/signal aspects | CMCC |
R1-2409554 | Discussion on channel and signal for Ambient IoT | ZTE Corporation, Sanechips |
R1-2409600 | Considerations for downlink and uplink channel/signal aspect | Samsung |
R1-2409639 | Discussion on downlink and uplink channel/signal aspects for Ambient IoT | Spreadtrum, UNISOC |
R1-2409684 | Discussion on Downlink and uplink channel/signal aspects | vivo |
R1-2409734 | Discussion on downlink and uplink channel/signal aspects | InterDigital, Inc. |
R1-2409760 | Study the downlink and uplink signal aspects of A-IoT | Tejas Networks Limited |
R1-2409803 | On remaining details of physical channels/signals for AIoT | Apple |
R1-2409805 | FL summary#1 on downlink and uplink channel/signal aspects | Apple |
R1-2409806 | FL summary#2 on downlink and uplink channel/signal aspects | Apple |
R1-2409807 | FL summary#3 on downlink and uplink channel/signal aspects | Apple |
R1-2409866 | Discussion on downlink and uplink channel for ambient IoT | NEC |
R1-2409899 | Discussion on downlink and uplink channel and signal aspects for Ambient IoT | Xiaomi |
R1-2409944 | DL and UL Physical Channels/signals design in support of Ambient IoT devices | CATT |
R1-2410003 | Discussion on downlink and uplink channel/signal aspects for Ambient IoT | China Telecom |
R1-2410028 | D2R and R2D Channel/Signal Aspects for Ambient IoT | FUTUREWEI |
R1-2410061 | Discussion on downlink and uplink channel/signal aspects | Fujitsu |
R1-2410094 | Discussion on downlink and uplink channel/signal aspects for A-IoT | OPPO |
R1-2410127 | Downlink and uplink channel/signal aspects for Ambient IoT | Ericsson |
R1-2410167 | Discussion on downlink and uplink transmission aspects | |
R1-2410199 | Discussion on downlink and uplink channels and signals for A-IoT | Panasonic |
R1-2410227 | Downlink and uplink channel aspects of Ambient IoT | Sony |
R1-2410269 | Discussion on downlink and uplink channel/signal aspects for A-IoT | ETRI |
R1-2410289 | Downlink and uplink channel/signal aspects for Ambient IoT | LG Electronics |
R1-2410392 | Study on downlink and uplink channel/signal aspects for Ambient IoT | NTT DOCOMO, INC. |
R1-2410411 | Discussion on downlink and uplink channel/signal aspect | ASUSTeK |
R1-2410418 | Discussion on downlink and uplink channel/signal aspects | Sharp |
R1-2410439 | Considerations for downlink and uplink channel/signal aspects | Semtech Neuchatel SA |
R1-2410481 | Downlink and uplink channel/signal aspects | Qualcomm Incorporated |
R1-2410517 | Downlink and uplink channel/signal aspects | MediaTek Inc. |
R1-2410579 | Discussion on Downlink and Uplink channel/signal aspects | CEWiT |
R1-2410593 | Discussion on Downlink and uplink channel/signal aspects | IIT Kanpur, Indian Institute of Tech (M) |
TDoc | Title | Source |
---|---|---|
R1-2409361 | Discussion on waveform characteristics of external carrier-wave for Ambient IoT | TCL |
R1-2409367 | Waveform characteristics of carrier-wave provided externally to the Ambient IoT device | Nokia |
R1-2409421 | On external carrier wave for backscattering based Ambient IoT device | Huawei, HiSilicon |
R1-2409487 | Discussion on external carrier wave for Ambient IoT | Lenovo |
R1-2409516 | Discussion on waveform characteristics of carrier-wave provided externally to the Ambient IoT device | CMCC |
R1-2409555 | Discussion on carrier wave for Ambient IoT | ZTE Corporation, Sanechips |
R1-2409601 | Considerations for Waveform characteristics of carrier-wave | Samsung |
R1-2409640 | Discussion on waveform characteristics of external carrier-wave for Ambient IoT | Spreadtrum, UNISOC |
R1-2409685 | Discussion on CW waveform and interference handling at AIoT UL receiver | vivo |
R1-2409804 | On remaining details of carrier waveform and interference handling for AIoT | Apple |
R1-2409867 | Discussion on the waveform of carrier-wave for the Ambient IoT | NEC |
R1-2409900 | Discussion on waveform characteristics of carrier-wave | Xiaomi |
R1-2409945 | Discussion on the waveform characteristics of carrier-wave for the Ambient IoT device | CATT |
R1-2410095 | Discussion on Waveform characteristics of carrier-wave provided externally to the A-IoT device | OPPO |
R1-2410128 | Waveform characteristics of carrier wave provided externally to the Ambient IoT device | Ericsson |
R1-2410270 | Discussion on carrier-wave for Ambient IoT | ETRI |
R1-2410290 | Considerations on carrier-wave transmission for Ambient IoT | LG Electronics |
R1-2410314 | Carrier-wave for Ambient IoT | InterDigital, Inc. |
R1-2410393 | Study on waveform characteristics of carrier-wave for Ambient IoT | NTT DOCOMO, INC. |
R1-2410482 | Waveform characteristics of carrier-wave provided externally to the Ambient IoT device | Qualcomm Incorporated |
R1-2410518 | Waveform characteristics of carrier-wave provided externally to the Ambient IoT device | MediaTek Inc. |
R1-2410580 | Discussion on Waveform characteristics of carrier-wave provided externally to the Ambient IoT device | CEWiT |
R1-2410773 | FL summary#1 on CW waveform characteristics for A-IoT | Moderator (Spreadtrum) |
R1-2410927 | Final FL summary on CW waveform characteristics for A-IoT | Moderator (Spreadtrum) |
TDoc | Title | Source |
---|---|---|
R1-2410886 | Draft reply LS on SSB relation in On-demand SSB and SSB adaptation on Scell | Moderator (Ericsson) |
R1-2410917 | Reply LS on SSB relation in On-demand SSB and SSB adaptation on Scell | RAN1, Ericsson |
TDoc | Title | Source |
---|---|---|
R1-2409413 | On-demand SSB SCell operation for eNES | Huawei, HiSilicon |
R1-2409448 | Discussion on on-demand SSB SCell operation | Quectel |
R1-2409469 | On-demand SSB Scell operation | Quectel |
R1-2409517 | Discussion on on-demand SSB SCell operation | CMCC |
R1-2409544 | Discussion on on-demand SSB SCell operation | Panasonic |
R1-2409556 | Discussion on on-demand SSB for NES | ZTE Corporation, Sanechips |
R1-2409602 | On-demand SSB SCell operation | Samsung |
R1-2409641 | Discussion on on-demand SSB SCell operation | Spreadtrum, UNISOC |
R1-2409686 | Discussions on on-demand SSB Scell operation | vivo |
R1-2409712 | On-demand SSB SCell Operation | Nokia, Nokia Shanghai Bell |
R1-2409735 | Discussion on on-demand SSB SCell operation | Intel Corporation |
R1-2409754 | On demand SSB | Tejas Networks Limited |
R1-2409772 | Discussion on on-demand SSB SCell operation | InterDigital, Inc. |
R1-2409808 | On-demand SSB SCell Operation | Apple |
R1-2409901 | Discussion on on-demand SSB SCell operation | Xiaomi |
R1-2409946 | Discussion on on-demand SSB SCell operation | CATT |
R1-2409965 | Discussion on On-Demand SSB SCell operation | Transsion Holdings |
R1-2410004 | Discussion on on-demand SSB operation for SCell | China Telecom |
R1-2410032 | Discussion of on-demand SSB Scell operation | FUTUREWEI |
R1-2410062 | Discussion on on-demand SSB SCell operation | Fujitsu |
R1-2410074 | Discussion on the enhancement to support on-demand SSB SCell operation | OPPO |
R1-2410156 | On-demand SSB SCell Operation | |
R1-2410209 | Discussion on on-demand SSB for SCell operation | NEC |
R1-2410228 | On-demand SSB SCell operation | Sony |
R1-2410252 | On-demand SSB SCell operation | Lenovo |
R1-2410271 | Discussion on On-demand SSB SCell operation | ETRI |
R1-2410291 | On-demand SSB SCell operation | LG Electronics |
R1-2410394 | Discussion on on-demand SSB SCell operation | NTT DOCOMO, INC. |
R1-2410430 | Discussion on on-demand SSB SCell operation | ITRI |
R1-2410441 | On-demand SSB SCell operation | Ericsson |
R1-2410483 | On-demand SSB operation for Scell | Qualcomm Incorporated |
R1-2410505 | Discussion on details of on-demand SSB operation on SCell | Sharp |
R1-2410521 | On-demand SSB SCell operation | MediaTek Inc. |
R1-2410550 | DCI based signaling for on-demand SSB | ASUSTeK |
R1-2410563 | Discussion of On-demand SSB SCell operation | Mavenir |
R1-2410581 | Discussion on on-demand SSB Scell operation | CEWiT |
R1-2410779 | Summary #1 of on-demand SSB for NES | Moderator (LG Electronics) |
R1-2410780 | Summary #2 of on-demand SSB for NES | Moderator (LG Electronics) |
R1-2410781 | Summary #3 of on-demand SSB for NES | Moderator (LG Electronics) |
R1-2410782 | Summary #4 of on-demand SSB for NES | Moderator (LG Electronics) |
R1-2410912 | Summary #5 of on-demand SSB for NES | Moderator (LG Electronics) |
TDoc | Title | Source |
---|---|---|
R1-2409414 | Discussion on on-demand SIB1 for eNES | Huawei, HiSilicon |
R1-2409518 | Discussion on on-demand SIB1 for UEs in idle/inactive mode | CMCC |
R1-2409545 | Discussion on on-demand SIB1 for idle/inactive mode UEs | Panasonic |
R1-2409557 | Discussion on on-demand SIB1 for NES | ZTE Corporation, Sanechips |
R1-2409603 | On-demand SIB1 for idle/inactive mode UEs | Samsung |
R1-2409642 | Discussion on on-demand SIB1 for idle/inactive mode UEs | Spreadtrum, UNISOC |
R1-2409687 | Discussions on on-demand SIB1 for idle/inactive mode UEs | vivo |
R1-2409711 | Discussion on on-demand SIB1 for idle/inactive mode UEs | KT Corp. |
R1-2409713 | On-demand SIB1 for Idle/Inactive mode UEs | Nokia, Nokia Shanghai Bell |
R1-2409736 | Discussion on-demand SIB1 for idle/inactive mode UEs | Intel Corporation |
R1-2409755 | On demand SIB1 | Tejas Networks Limited |
R1-2409773 | Discussion on on-demand SIB1 for idle/inactive mode UEs | InterDigital, Inc. |
R1-2409809 | On On-demand SIB1 for IDLE/INACTIVE mode UEs | Apple |
R1-2409902 | Discussion on on-demand SIB1 for idle/inactive mode UEs | Xiaomi |
R1-2409947 | Discussion on on-demand SIB1 | CATT |
R1-2409966 | Discussion on on-demand SIB1 transmission for idle/inactive mode UEs | Transsion Holdings |
R1-2410033 | Discussion of on-demand SIB1 for idle/inactive mode UEs | FUTUREWEI |
R1-2410075 | Discussion on the enhancement to support on demand SIB1 for idle/inactive mode UE | OPPO |
R1-2410132 | Discussion on on-demand SIB1 transmission for network energy savings | Fujitsu |
R1-2410157 | On-demand SIB1 for Idle/Inactive Mode UE | |
R1-2410210 | Discussion on on-demand SIB1 for UEs in idle/inactive mode | NEC |
R1-2410229 | On-demand SIB1 for idle/inactive mode UEs | Sony |
R1-2410253 | On-demand SIB1 for idle/inactive mode UEs | Lenovo |
R1-2410272 | On-demand SIB1 for idle/inactive mode UEs | ETRI |
R1-2410292 | On-demand SIB1 for idle/inactive mode UEs | LG Electronics |
R1-2410301 | Views on On-demand SIB1 operation for idle/inactive UEs | Vodafone, Deutsche Telekom |
R1-2410350 | Discussion on on-demand SIB1 for idle/inactive mode UEs | DENSO CORPORATION |
R1-2410361 | Discussion on on-demand SIB1 transmission for idle UEs | Sharp |
R1-2410368 | Discussion on on-demand SIB1 in idle/inactive mode | CAICT |
R1-2410395 | Discussion on on-demand SIB1 for idle/inactive mode UEs | NTT DOCOMO, INC. |
R1-2410431 | Discussion on details of on-demand SSB operation on Scell | Sharp |
R1-2410442 | On-demand SIB1 for UEs in idle/inactive mode for NES | Ericsson |
R1-2410484 | On-demand SIB1 procedure | Qualcomm Incorporated |
R1-2410522 | On-demand SIB1 for idle or inactive mode UEs | MediaTek Inc. |
R1-2410561 | On-demand SIB1 for NES | Fraunhofer IIS, Fraunhofer HHI |
R1-2410582 | Discussion on on-demand SIB1 | CEWiT |
R1-2410677 | FL summary 1 for on-demand SIB1 in idle/inactive mode | Moderator (MediaTek) |
R1-2410678 | FL summary 2 for on-demand SIB1 in idle/inactive mode | Moderator (MediaTek) |
R1-2410679 | FL summary 3 for on-demand SIB1 in idle/inactive mode | Moderator (MediaTek) |
R1-2410680 | FL summary 4 for on-demand SIB1 in idle/inactive mode | Moderator (MediaTek) |
R1-2410681 | FL summary 5 for on-demand SIB1 in idle/inactive mode | Moderator (MediaTek) |
TDoc | Title | Source |
---|---|---|
R1-2409415 | On common channel/signal adaptation for eNES | Huawei, HiSilicon |
R1-2409470 | Adaptation of common signal/channel transmissions | Quectel |
R1-2409519 | Discussion on adaptation of common signal/channel transmissions | CMCC |
R1-2409558 | Discussion on common signal/channel for NES | ZTE Corporation, Sanechips |
R1-2409604 | Adaptation of common signal/channel transmissions | Samsung |
R1-2409643 | Discussion on adaptation of common signal/channel transmissions | Spreadtrum, UNISOC |
R1-2409688 | Discussions on adaptation of common signal/channel transmissions | vivo |
R1-2409714 | Adaptation of common signal/channel transmissions | Nokia, Nokia Shanghai Bell |
R1-2409737 | Discussion on adaptation of common signal/channel transmission | Intel Corporation |
R1-2409756 | Adaptation of common signals/channels | Tejas Networks Limited |
R1-2409774 | Discussion on adaptation of common signal/channel transmissions | InterDigital, Inc. |
R1-2409810 | On adaptation of common signal/channel for NES enhancements | Apple |
R1-2409903 | Discussion on adaptation of common signal and channel transmissions | Xiaomi |
R1-2409948 | Discussion on adaptation of common signal/channel transmissions | CATT |
R1-2409967 | Discussion on adaptive transmission of common signal or common channel | Transsion Holdings |
R1-2410005 | Discussion on common signal/channel adaptation | China Telecom |
R1-2410034 | Discussion of the adaptation of common signal/channel transmissions | FUTUREWEI |
R1-2410076 | Discussion on adaptation of common signal/channel transmission | OPPO |
R1-2410134 | Discussion on adaptation of common signal / channel transmissions | Fujitsu |
R1-2410158 | Adaptation of Common Signals | |
R1-2410180 | Discussion on adaptation of common signal channel transmissions | HONOR |
R1-2410211 | Discussion on adaptation of common signal/channel transmissions | NEC |
R1-2410230 | Adaptation of common signal/channel transmissions | Sony |
R1-2410247 | Discussion on adaptation of common signal/channel transmission | Panasonic |
R1-2410273 | Adaptation of common signal/channel transmissions | ETRI |
R1-2410293 | Adaptation of common signal/channel transmissions | LG Electronics |
R1-2410302 | Adaptation of common signals and channels | Lenovo |
R1-2410362 | Discussion on adaptation of common signal/channel transmissions | Sharp |
R1-2410396 | Discussion on adaptation of common signal/channel transmissions | NTT DOCOMO, INC. |
R1-2410443 | Adaptation of common signal/channel transmissions for NES | Ericsson |
R1-2410485 | Adaptation of common channel transmissions | Qualcomm Incorporated |
R1-2410523 | Adaptation of common signal/channel transmissions | MediaTek Inc. |
R1-2410583 | Discussion on adaptation of common signal and channel transmissions | CEWiT |
R1-2410784 | Summary#1 of AI 9.5.3 for R19 NES | Moderator (Ericsson) |
R1-2410785 | Summary#2 of AI 9.5.3 for R19 NES | Moderator (Ericsson) |
R1-2410786 | Summary#3 of AI 9.5.3 for R19 NES | Moderator (Ericsson) |
R1-2410887 | Summary#4 of AI 9.5.3 for R19 NES | Moderator (Ericsson) |
R1-2410888 | Final summary of AI 9.5.3 for R19 NES | Moderator (Ericsson) |
TDoc | Title | Source |
---|---|---|
R1-2410885 | Summary of RAN1 agreements on LP-WUS/WUR for NR | Rapporteur (vivo) |
TDoc | Title | Source |
---|---|---|
R1-2409423 | Signal Design of LP-WUS and LP-SS | Huawei, HiSilicon |
R1-2409444 | LP-WUS and LP-SS design | Nokia |
R1-2409456 | Discussion on LP-WUS and LP-SS design for low power WUS | InterDigital, Inc. |
R1-2409476 | Discussion on LP-WUS and LP-SS Design | TCL |
R1-2409520 | Discussion on LP-WUS and LP-SS design | CMCC |
R1-2409534 | Discussion on LP-WUS and LP-SS Design | EURECOM |
R1-2409546 | Discussion on the LP-WUS and LP-SS design | Panasonic |
R1-2409559 | Discussion on LP-WUS design | ZTE Corporation, Sanechips |
R1-2409605 | Discussion on LP-WUS and LP-SS design | Samsung |
R1-2409644 | Discussion on LP-WUS and LP-SS design | Spreadtrum, UNISOC |
R1-2409689 | Discussion on LP-WUS and LP-SS design | vivo |
R1-2409811 | LP-WUS and LP-SS design | Apple |
R1-2409860 | Discussion on LP-WUS and LP-SS design | NEC |
R1-2409904 | Discussion on LP-WUS and LP-SS design | Xiaomi |
R1-2409949 | Design of LP-WUS and LP-SS | CATT |
R1-2410036 | Discussion on LP-WUS and LP-SS Design | FUTUREWEI |
R1-2410071 | Signal design for LP-WUS and LP-SS | OPPO |
R1-2410135 | Discussion on LP-WUS and LP-SS design | Fujitsu |
R1-2410181 | Discussion on LP-WUS and LP-SS design | HONOR |
R1-2410231 | LP-WUS and LP-SS design | Sony |
R1-2410294 | Discussion on LP-WUS and LP-SS design | LG Electronics |
R1-2410310 | LP-SS Code Sets and Comparison | Everactive |
R1-2410397 | Discussion on LP-WUS and LP-SS design | NTT DOCOMO, INC. |
R1-2410419 | Discussion on LP-WUS and LP-SS design | Sharp |
R1-2410444 | LP-WUS and LP-SS design | Ericsson |
R1-2410486 | LP-WUS and LP-SS design | Qualcomm Incorporated |
R1-2410510 | LP-WUS and LP-SS design | MediaTek Inc. |
R1-2410556 | Discussion on LP-WUS and LP-SS design | Lenovo |
R1-2410569 | On LP-WUS and LP-SS design | Nordic Semiconductor ASA |
R1-2410646 | Signal design for LP-WUS and LP-SS | OPPO |
R1-2410747 | Summary #1 of discussions on LP-WUS and LP-SS design | Moderator (vivo) |
R1-2410748 | Summary #2 of discussions on LP-WUS and LP-SS design | Moderator (vivo) |
R1-2410837 | Summary #3 of discussions on LP-WUS and LP-SS design | Moderator (vivo) |
R1-2410838 | Summary #4 of discussions on LP-WUS and LP-SS design | Moderator (vivo) |
R1-2410883 | Summary #5 of discussions on LP-WUS and LP-SS design | Moderator (vivo) |
R1-2410884 | Final summary of discussions on LP-WUS and LP-SS design | Moderator (vivo) |
R1-2410925 | Template for collecting LP-SS binary sequence results | Moderator (vivo) |
R1-2410939 | Collection of LP-SS binary sequences | Moderator (vivo) |
TDoc | Title | Source |
---|---|---|
R1-2409424 | Procedures and functionalities of LP-WUS in IDLE/INACTIVE mode | Huawei, HiSilicon |
R1-2409445 | LP-WUS operation in IDLE/Inactive mode | Nokia |
R1-2409457 | Discussion on LP-WUS operation in IDLE/INACTIVE modes | InterDigital, Inc. |
R1-2409477 | Discussion on LP-WUS Operation in IDLE/INACTIVE modes | TCL |
R1-2409521 | Discussion on LP-WUS operation in IDLE/INACTIVE modes | CMCC |
R1-2409547 | Discussion on LP-WUS operation in IDLE/INACTIVE modes | Panasonic |
R1-2409560 | Discussion on LP-WUS operation in IDLE/INACTIVE mode | ZTE Corporation, Sanechips |
R1-2409606 | Discussion on LP-WUS operation in IDLE/INACTIVE modes | Samsung |
R1-2409645 | Discussion on LP-WUS operation in IDLE/INACTIVE modes | Spreadtrum, UNISOC |
R1-2409690 | Discussion on LP-WUS operation in IDLE/INACTIVE modes | vivo |
R1-2409812 | LP-WUS operation in IDLE/INACTIVE modes | Apple |
R1-2409814 | Summary #1 on LP-WUS operation in IDLE/INACTIVE mode | Moderator (Apple) |
R1-2409815 | Summary #2 on LP-WUS operation in IDLE/INACTIVE mode | Moderator (Apple) |
R1-2409816 | Summary #3 on LP-WUS operation in IDLE/INACTIVE mode | Moderator (Apple) |
R1-2409861 | Discussion on LP-WUS operation in RRC IDLE/INACTIVE mode | NEC |
R1-2409905 | Discussion on LP-WUS operation in Idle/Inactive modes | Xiaomi |
R1-2409950 | System design and procedure of LP-WUS operation for UE in IDLE/Inactive Modes | CATT |
R1-2410037 | Discussion on LP-WUS Operation in IDLE/INACTIVE Modes | FUTUREWEI |
R1-2410072 | Further consideration on LP-WUS operation in RRC_IDLE/INACTIVE modes | OPPO |
R1-2410232 | LP-WUS operation in IDLE / INACTIVE modes | Sony |
R1-2410274 | Discussion on LP-WUS operation in IDLE/INACTIVE modes | ETRI |
R1-2410295 | Discussion on LP-WUS operation in IDLE/INACTIVE modes | LG Electronics |
R1-2410300 | On LR and MR operating frequencies | Vodafone, Deutsche Telekom |
R1-2410398 | Discussion on LP-WUS operation in IDLE/INACTIVE modes | NTT DOCOMO, INC. |
R1-2410420 | Discussion on LP-WUS operation in IDLE/INACTIVE modes | Sharp |
R1-2410445 | LP-WUS operation in IDLE and INACTIVE modes | Ericsson |
R1-2410487 | LP-WUR operation in idle and inactive modes | Qualcomm Incorporated |
R1-2410511 | LP-WUS operation in IDLE/INACTIVE modes | MediaTek Inc. |
R1-2410557 | Discussion on LP-WUS operation in Idle/Inactive modes | Lenovo |
R1-2410568 | On LP-WUS operation in IDLE/Inactive | Nordic Semiconductor ASA |
R1-2410861 | Summary #4 on LP-WUS operation in IDLE/INACTIVE mode | Moderator (Apple) |
R1-2410862 | Summary #5 on LP-WUS operation in IDLE/INACTIVE mode | Moderator (Apple) |
R1-2410863 | Summary #6 on LP-WUS operation in IDLE/INACTIVE mode | Moderator (Apple) |
TDoc | Title | Source |
---|---|---|
R1-2409425 | Procedures and functionalities of LP-WUS in CONNECTED mode | Huawei, HiSilicon |
R1-2409446 | LP-WUS operation in CONNECTED mode | Nokia |
R1-2409458 | Discussion on RRC CONNECTED mode LP-WUS monitoring | InterDigital, Inc. |
R1-2409522 | Discussion on LP-WUS operation in CONNECTED mode | CMCC |
R1-2409561 | Discussion on LP-WUS operation in CONNECTED mode | ZTE Corporation, Sanechips |
R1-2409607 | Discussion on LP-WUS operation in CONNECTED modes | Samsung |
R1-2409646 | Discussion on LP-WUS operation in CONNECTED modes | Spreadtrum, UNISOC |
R1-2409691 | Discussion on LP-WUS operation in CONNECTED modes | vivo |
R1-2409813 | LP-WUS operation in CONNECTED modes | Apple |
R1-2409862 | Discussion on LP-WUS operation in RRC CONNECTED mode | NEC |
R1-2409875 | Discussion on LP-WUS operation in CONNECTED mode | Panasonic |
R1-2409906 | Discussion on LP-WUS operation in Connected mode | Xiaomi |
R1-2409951 | System design and procedure of LP-WUS operation for UE in CONNECTED Modes | CATT |
R1-2410073 | Further consideration on LP-WUS operation in connected mode | OPPO |
R1-2410233 | LP-WUS operation in CONNECTED mode | Sony |
R1-2410275 | Discussion on LP-WUS operation in CONNECTED modes | ETRI |
R1-2410296 | Discussion on LP-WUS operation in CONNECTED modes | LG Electronics |
R1-2410358 | Discussion on LP-WUS procedures in Connected mode | TCL |
R1-2410363 | Discussion on LP-WUS operation in CONNECTED modes | Lenovo |
R1-2410399 | Discussion on LP-WUS operation in CONNECTED mode | NTT DOCOMO, INC. |
R1-2410421 | Discussion on LP-WUS operation in CONNECTED modes | Sharp |
R1-2410446 | LP-WUS operation in CONNECTED mode | Ericsson |
R1-2410488 | LP-WUR operation in connected mode | Qualcomm Incorporated |
R1-2410512 | LP-WUS operation in CONNECTED modes | MediaTek Inc. |
R1-2410699 | FL summary #1 on LP-WUS operation in CONNECTED mode | Moderator (NTT DOCOMO) |
R1-2410804 | FL summary #2 on LP-WUS operation in CONNECTED mode | Moderator (NTT DOCOMO) |
R1-2410859 | FL summary #3 on LP-WUS operation in CONNECTED mode | Moderator (NTT DOCOMO) |
R1-2410906 | FL summary #4 on LP-WUS operation in CONNECTED mode | Moderator (NTT DOCOMO) |
R1-2410907 | FL summary #5 on LP-WUS operation in CONNECTED mode | Moderator (NTT DOCOMO) |
R1-2410908 | Draft LS on LP-WUS operation in CONNECTED modes | Moderator (NTT DOCOMO) |
R1-2410909 | LS on LP-WUS operation in CONNECTED mode | RAN1, NTT DOCOMO |
TDoc | Title | Source |
---|---|---|
R1-2410846 | Session notes for 9.7 (Study on channel modelling for Integrated Sensing And Communication for NR) | Ad-Hoc Chair (Huawei) |
TDoc | Title | Source |
---|---|---|
R1-2409393 | Deployment scenarios for ISAC channel model | Huawei, HiSilicon |
R1-2409471 | Discussion on ISAC deployment scenarios and requirements | EURECOM |
R1-2409523 | Discussion on ISAC deployment scenarios | CMCC, China Southern Power Grid |
R1-2409608 | Discussion on ISAC deployment scenarios | Samsung |
R1-2409692 | Views on Rel-19 ISAC deployment scenarios | vivo |
R1-2409717 | Discussion on ISAC deployment scenarios | TOYOTA InfoTechnology Center |
R1-2409766 | Discussion on ISAC Deployment Scenarios | Nokia, Nokia Shanghai Bell |
R1-2409776 | Deployment scenarios for integrated sensing and communication with NR | NVIDIA |
R1-2409817 | Discussion on ISAC deployment scenarios | Apple |
R1-2409836 | Discussion on ISAC deployment scenarios | LG Electronics |
R1-2409846 | Discussion on ISAC deployment scenarios | InterDigital, Inc. |
R1-2409907 | Deployment scenarios and evaluation assumptions for ISAC channel model | Xiaomi |
R1-2409952 | Discussion on ISAC deployment scenarios | CATT, CICTCI |
R1-2410006 | Discussion on ISAC deployment scenarios | China Telecom |
R1-2410097 | Discussion on ISAC deployment scenarios | OPPO |
R1-2410125 | Discussion on ISAC Deployment Scenarios | Ericsson |
R1-2410162 | ISAC deployment scenarios | Tejas Networks Limited |
R1-2410234 | Considerations on ISAC deployment scenarios | Sony |
R1-2410322 | Discussion on ISAC deployment scenarios | Lenovo |
R1-2410332 | ISAC channel model calibration and scenario parameters | AT&T, FirstNet |
R1-2410337 | FL Summary #1 on ISAC Deployment Scenarios | Moderator (AT&T) |
R1-2410338 | FL Summary #2 on ISAC Deployment Scenarios | Moderator (AT&T) |
R1-2410339 | FL Summary #3 on ISAC Deployment Scenarios | Moderator (AT&T) |
R1-2410369 | Considerations on ISCA deployment scenarios | CAICT |
R1-2410400 | Study on deployment scenarios for ISAC channel modelling | NTT DOCOMO, INC. |
R1-2410447 | Discussion on ISAC deployment scenarios | ZTE Corporation, Sanechips |
R1-2410489 | Discussion on ISAC deployment scenarios | Qualcomm Incorporated |
R1-2410524 | Discussion on ISAC deployment scenario | MediaTek Inc. |
R1-2410626 | Discussion on ISAC deployment scenarios | Tiami Networks |
R1-2410627 | Discussion on ISAC channel modeling | Tiami Networks |
TDoc | Title | Source |
---|---|---|
R1-2409394 | Channel modelling for ISAC | Huawei, HiSilicon |
R1-2409472 | Discussion on ISAC channel modeling | EURECOM |
R1-2409524 | Discussion on channel modeling methodology for ISAC | CMCC,BUPT,SEU, PML |
R1-2409609 | Discussion on ISAC channel modelling | Samsung |
R1-2409647 | Discussion on ISAC channel modeling | Spreadtrum, UNISOC |
R1-2409693 | Views on Rel-19 ISAC channel modelling | vivo, BUPT |
R1-2409718 | Discussion on ISAC channel modelling | TOYOTA InfoTechnology Center |
R1-2409740 | Discussion on ISAC channel modeling | Intel Corporation |
R1-2409767 | Discussion on ISAC channel modeling | Nokia, Nokia Shanghai Bell |
R1-2409777 | Channel modeling for integrated sensing and communication with NR | NVIDIA |
R1-2409818 | Discussion on ISAC channel modelling | Apple |
R1-2409837 | Discussion on ISAC channel modelling | LG Electronics |
R1-2409847 | Discussion on ISAC channel modeling | InterDigital, Inc. |
R1-2409908 | Discussion on ISAC channel model | Xiaomi, BJTU, BUPT |
R1-2409953 | Discussion on ISAC channel modelling | CATT, CICTCI |
R1-2409977 | Discussions on ISAC Channel Modelling | Lekha Wireless Solutions |
R1-2409992 | ISAC Channel Modeling and Measurement Validation | BUPT, CMCC, VIVO |
R1-2410007 | Discussion on ISAC channel modelling | China Telecom |
R1-2410011 | Summary #1 on ISAC channel modelling | Moderator (Xiaomi) |
R1-2410012 | Summary #2 on ISAC channel modelling | Moderator (Xiaomi) |
R1-2410013 | Summary #3 on ISAC channel modelling | Moderator (Xiaomi) |
R1-2410014 | Summary #4 on ISAC channel modelling | Moderator (Xiaomi) |
R1-2410098 | Study on ISAC channel modelling | OPPO |
R1-2410126 | Discussion on ISAC Channel Modelling | Ericsson |
R1-2410136 | Discussion on ISAC channel modeling | NIST |
R1-2410163 | ISAC channel modelling | Tejas Networks Limited |
R1-2410235 | Views on Channel Modelling for ISAC | Sony |
R1-2410321 | Discussion on Channel Modelling for ISAC | Lenovo |
R1-2410333 | Discussions on ISAC Channel Modeling | AT&T |
R1-2410370 | Considerations on ISAC channel modelling | CAICT |
R1-2410401 | Discussion on ISAC channel modeling | NTT DOCOMO, INC. |
R1-2410448 | Discussion on channel modelling for ISAC | ZTE Corporation, Sanechips |
R1-2410490 | Discussion on ISAC channel modelling | Qualcomm Incorporated |
R1-2410525 | Discussion on ISAC channel modelling | MediaTek Inc. |
R1-2410648 | Discussion on channel modelling for ISAC | ZTE Corporation, Sanechips |
R1-2410659 | ISAC Channel Modeling and Measurement Validation | BUPT, CMCC, VIVO |
R1-2410660 | Discussion on ISAC channel modelling | Qualcomm Incorporated |
R1-2410668 | Discussion on ISAC channel model | Xiaomi, BJTU, BUPT |
R1-2410671 | Discussion on ISAC channel modeling | Intel Corporation |
R1-2410739 | Discussion on ISAC channel modelling | Apple |
R1-2410832 | Discussion on ISAC channel modeling | Intel Corporation |
TDoc | Title | Source |
---|---|---|
R1-2410170 | Draft CR/TP to incorporate the agreement for Rel-19 7-24GHz Channel model | ZTE Corporation,Intel Corporation |
R1-2410631 | Data source descriptions for 7 – 24 GHz SI | Moderator (Intel Corporation) |
R1-2410847 | Session notes for 9.8 (Study on channel modelling enhancements for 7-24GHz for NR) | Ad-Hoc Chair (CMCC) |
TDoc | Title | Source |
---|---|---|
R1-2409402 | Considerations on the 7-24GHz channel model validation | Huawei, HiSilicon |
R1-2409441 | Discussion on validation of channel model | Ericsson |
R1-2409467 | Further Discussion on Angle Scaling for MIMO CDL Channel | InterDigital, Inc. |
R1-2409610 | Discussion on channel model validation of TR38.901 for 7 - 24 GHz | Samsung |
R1-2409694 | Views on channel model validation of TR38.901 for 7-24GHz | vivo, BUPT |
R1-2409724 | Discussion on the channel model validation | ZTE Corporation, Sanechips |
R1-2409738 | Discussion on channel modeling verification for 7-24 GHz | Intel Corporation |
R1-2409778 | Channel model validation of TR 38901 for 7-24 GHz | NVIDIA |
R1-2409819 | Validation of Channel Model | Apple |
R1-2409954 | Discussion on channel model validation for 7-24GHz | CATT |
R1-2410015 | Channel model validation for 7-24 GHz | Lenovo |
R1-2410213 | Discussion on channel model validation of TR38.901 for 7-24GHz | BUPT |
R1-2410236 | Further Discussion of channel model validation of TR38.901 for 7–24GHz | Sony |
R1-2410254 | Instantaneous directional channel measurements and parameter estimation at 14 GHz | ROHDE & SCHWARZ |
R1-2410299 | Measurements of the angular spreads in a urban and suburban macrocells | Vodafone, Ericsson |
R1-2410319 | Channel model validation of TR38.901 for 7-24 GHz | Sharp, Nokia |
R1-2410334 | Discussion on Validation of the Channel Model in 38901 | AT&T |
R1-2410402 | Discussion on channel model validation for 7-24 GHz | NTT DOCOMO, INC. |
R1-2410491 | Channel Model Validation of TR38.901 for 7-24 GHz | Qualcomm Incorporated |
R1-2410594 | Discussion on Channel model validation of TR38.901 for 7-24GHz | Nokia |
R1-2410632 | Summary of issues for Rel-19 7-24 GHz Channel Modeling Validation | Moderator (Intel Corporation) |
R1-2410633 | Summary #1 of discussions for Rel-19 7-24 GHz Channel Modeling Validation | Moderator (Intel Corporation) |
R1-2410634 | Summary #2 of discussions for Rel-19 7-24 GHz Channel Modeling Validation | Moderator (Intel Corporation) |
R1-2410635 | Summary #3 of discussions for Rel-19 7-24 GHz Channel Modeling Validation | Moderator (Intel Corporation) |
R1-2410636 | Summary #4 of discussions for Rel-19 7-24 GHz Channel Modeling Validation | Moderator (Intel Corporation) |
R1-2410655 | Discussion on Validation of the Channel Model in 38901 | AT&T |
R1-2410910 | Summary #5 of discussions for Rel-19 7-24 GHz Channel Modeling Validation | Moderator (Intel Corporation) |
TDoc | Title | Source |
---|---|---|
R1-2409403 | Considerations on the 7-24GHz channel model extension | Huawei, HiSilicon |
R1-2409442 | Discussion on adaptation and extension of channel model | Ericsson |
R1-2409468 | Further Discussion on Channel Model Extension for FR3 | InterDigital, Inc. |
R1-2409491 | Discussion on channel modelling adaptation/extension for 7-24GHz | LG Electronics |
R1-2409611 | Discussion on channel model adaptation/extension of TR38.901 for 7 - 24 GHz | Samsung |
R1-2409695 | Views on channel model adaptation/extension of TR38.901 for 7-24GHz | vivo, BUPT |
R1-2409725 | Discussion on the channel model adaptation and extension | ZTE Corporation, Sanechips |
R1-2409739 | Discussion on channel model adaptation/extension | Intel Corporation |
R1-2409779 | Channel model adaptation of TR 38901 for 7-24 GHz | NVIDIA |
R1-2409821 | Channel Model Adaptation and Extension of TR38.901 for 7-24 GHz | Apple |
R1-2409955 | Discussion on channel model adaptation/extension for 7-24GHz | CATT |
R1-2410016 | Channel model extension for 7-24 GHz | Lenovo |
R1-2410099 | Channel model adaptation and extension for 7-24GHz | OPPO |
R1-2410131 | Discussion on channel model adaptation/extension for 7-24 GHz | Fujitsu |
R1-2410214 | Discussion on modeling near-field propagation and spatial non-stationarity in TR38.901 for 7-24GHz | BUPT, CMCC |
R1-2410237 | Further discussion of channel model adaptation/extension of TR38.901 for 7–24GHz | Sony |
R1-2410320 | Views on channel modelling adaptation/extension for 7-24GHz | Sharp, NYU WIRELESS |
R1-2410492 | Channel Model Adaptation/Extension of TR38.901 for 7-24GHz | Qualcomm Incorporated |
R1-2410520 | Discussion on channel modelling enhancements for 7-24GHz for NR | MediaTek Inc. |
R1-2410595 | Discussion on Channel model adaptation/extension of TR38.901 for 7-24GHz | Nokia |
R1-2410628 | Channel model adaptation/extension of TR38.901 for 7-24 GHz | CEWiT |
R1-2410656 | Discussion on channel model adaptation/extension | Intel Corporation |
R1-2410767 | Summary#1 of channel model adaptation and extension | Moderator (ZTE Corporation) |
R1-2410768 | Summary#2 of channel model adaptation and extension | Moderator (ZTE Corporation) |
R1-2410769 | Summary#3 of channel model adaptation and extension | Moderator (ZTE Corporation) |
R1-2410880 | Summary#4 of channel model adaptation and extension | Moderator (ZTE Corporation) |
R1-2410881 | Summary#5 of channel model adaptation and extension | Moderator (ZTE Corporation) |
TDoc | Title | Source |
---|---|---|
R1-2409381 | Discussion on measurements related enhancements for LTM | ZTE Corporation, Sanechips |
R1-2409422 | Measurements related enhancements for LTM | Huawei, HiSilicon |
R1-2409492 | Discussion on measurements related enhancements for LTM | LG Electronics |
R1-2409525 | Discussion on measurements related enhancements for LTM | CMCC |
R1-2409612 | Views on Rel-19 measurement related enhancements for LTM | Samsung |
R1-2409648 | Discussion on measurements related enhancements for LTM | Spreadtrum, UNISOC |
R1-2409696 | Discussion on measurements related enhancements for LTM | vivo |
R1-2409771 | Measurement related enhancements for LTM | Nokia |
R1-2409820 | Measurement related enhancements for LTM | Apple |
R1-2409909 | Discussion on measurements related enhancements for LTM | Xiaomi |
R1-2409956 | Discussion on measurements related enhancements for LTM | CATT |
R1-2409973 | Measurements related enhancements for LTM | Lenovo |
R1-2409975 | Measurement related enhancements for LTM | Ericsson |
R1-2409991 | Discussion on measurement related enhancements for LTM | Lekha Wireless Solutions |
R1-2410017 | Measurements related enhancements for LTM | InterDigital, Inc. |
R1-2410041 | Measurements enhancements for LTM | TCL |
R1-2410115 | Discussions on measurement enhancement for LTM | OPPO |
R1-2410124 | Discussion on measurement related enhancements for LTM | Fujitsu Limited |
R1-2410133 | Discussion on measurement related enhancements for LTM | Fujitsu |
R1-2410168 | Discussion on measurements related enhancements for LTM | |
R1-2410186 | FL summary 1 of Measurements related enhancements for LTM | Moderator (Fujitsu) |
R1-2410187 | FL summary 2 of Measurements related enhancements for LTM | Moderator (Fujitsu) |
R1-2410188 | FL summary 3 of Measurements related enhancements for LTM | Moderator (Fujitsu) |
R1-2410189 | Final FL summary of Measurements related enhancements for LTM | Moderator (Fujitsu) |
R1-2410212 | Discussion on measurements related enhancements for LTM | NEC |
R1-2410238 | Measurements related enhancements for LTM | Sony |
R1-2410244 | LTM measurements related enhancements | MediaTek Inc. |
R1-2410276 | Measurements related enhancements for LTM | ETRI |
R1-2410348 | Measurement Enhancements for LTM | Meta |
R1-2410403 | Discussion on measurement related enhancements for LTM | NTT DOCOMO, INC. |
R1-2410432 | Discussion on measurements related enhancements for LTM | KDDI Corporation |
R1-2410493 | Measurements related enhancement for LTM | Qualcomm Incorporated |
R1-2410543 | Discussion on measurements related enhancements for LTM | Sharp |
TDoc | Title | Source |
---|---|---|
R1-2409426 | Discussions on scheduling enhancements considering RRM measurements for XR | Huawei, HiSilicon |
R1-2409526 | Discussion on enabling TX/RX for XR during RRM measurements | CMCC |
R1-2409536 | Enhancements to enable TX/RX for XR during RRM measurements | Fraunhofer IIS, Fraunhofer HHI |
R1-2409562 | Discussion on measurement gap for XR | ZTE Corporation, Sanechips |
R1-2409613 | Remaining topics on enabling TX/RX during RRM measurements for XR | Samsung |
R1-2409649 | Discussion on enabling TXRX for XR during RRM measurements | Spreadtrum, UNISOC |
R1-2409697 | Discussion on enabling data transmissions for XR during RRM measurements | vivo |
R1-2409715 | Enabling TX/RX for XR during RRM measurements | Nokia |
R1-2409732 | Enabling TX/RX for XR during RRM measurements | Lenovo |
R1-2409775 | Discussion on enabling TX/RX for XR during RRM measurements | InterDigital, Inc. |
R1-2409822 | Enhancements for XR | Apple |
R1-2409863 | Discussion on enabling TX/RX for XR during RRM measurements | NEC |
R1-2409882 | Discussion on enabling TX/RX for XR during RRM measurements | Xiaomi |
R1-2409930 | Signaling control of scheduling restriction during measurement gap in support of XR services | CATT |
R1-2410096 | Enhancements to enable TX/RX for XR during RRM measurements | OPPO |
R1-2410159 | Discussion on Enabling TX/RX for XR During RRM Measurements | Meta |
R1-2410200 | Discussion on enabling TX/RX for XR during RRM measurements | Panasonic |
R1-2410239 | On Enabling TX/RX for XR during RRM measurements | Sony |
R1-2410245 | Enabling TX RX for XR during RRM measurements | MediaTek Inc. |
R1-2410297 | Discussion on XR during RRM measurements | LG Electronics |
R1-2410323 | On enabling Tx/Rx for XR during RRM measurements | Google Ireland Limited |
R1-2410404 | Discussion on enabling TX/RX for XR during RRM | NTT DOCOMO, INC. |
R1-2410494 | Enabling Tx/Rx for XR during RRM measurements | Qualcomm Incorporated |
R1-2410535 | Enabling TX/RX for XR traffic during RRM measurement gaps | Ericsson |
R1-2410741 | Moderator summary #1 - Enabling TX/RX for XR during RRM measurements | Moderator (Nokia) |
R1-2410742 | Moderator summary #2 - Enabling TX/RX for XR during RRM measurements | Moderator (Nokia) |
TDoc | Title | Source |
---|---|---|
R1-2409439 | Work plan for Rel-19 NR_NTN_Ph3 | THALES, CATT |
R1-2409564 | Work plan for WID: introduction of IoT-NTN TDD mode | Iridium Satellite LLC |
R1-2410848 | Session notes for 9.11 (Non-Terrestrial Networks for NR Phase 3 and Internet of Things Phase 3) | Ad-Hoc Chair (Huawei) |
R1-2410894 | Draft Reply LS on OCC for CB-msg3 NPUSCH | Moderator (Sony) |
R1-2410895 | Reply LS on OCC for CB-msg3 NPUSCH | RAN1, Sony |
TDoc | Title | Source |
---|---|---|
R1-2409405 | Discussion on downlink coverage enhancements for NR NTN | Huawei, HiSilicon |
R1-2409434 | NR NTN Downlink coverage enhancements | THALES |
R1-2409435 | FL Summary #1: NR-NTN downlink coverage enhancements | THALES |
R1-2409436 | FL Summary #2: NR-NTN downlink coverage enhancements | THALES |
R1-2409437 | FL Summary #3: NR-NTN downlink coverage enhancements | THALES |
R1-2409438 | FL Summary #4: NR-NTN downlink coverage enhancements | THALES |
R1-2409451 | Discussions on downlink coverage enhancement for NR NTN | Fraunhofer IIS, Fraunhofer HHI |
R1-2409473 | Discussion on NTN System Level Downlink Coverage Enhancement | EchoStar, Thales, Terrestar, Eutelsat |
R1-2409527 | Discussion on NR-NTN DL coverage enhancement | CMCC |
R1-2409614 | Discussion on downlink coverage enhancement for NR-NTN | Samsung |
R1-2409650 | Discussion on NR-NTN downlink coverage enhancement | Spreadtrum, UNISOC |
R1-2409698 | Discussion on NR-NTN downlink coverage enhancement | vivo |
R1-2409719 | NR-NTN downlink coverage enhancement | InterDigital, Inc. |
R1-2409726 | Discussion on DL coverage enhancement for NR NTN | ZTE Corporation, Sanechips |
R1-2409823 | On NR-NTN Downlink Coverage Enhancement | Apple |
R1-2409831 | Discussion on NR-NTN downlink coverage enhancement | LG Electronics |
R1-2409870 | NR-NTN downlink coverage enhancement | NEC |
R1-2409883 | Discussion on NR-NTN downlink coverage enhancement | Xiaomi |
R1-2409958 | Discussion on DL coverage enhancements for NR-NTN | NICT |
R1-2409978 | Further consideration on downlink coverage enhancement for NR NTN | CATT |
R1-2410064 | Discussion on NR-NTN downlink coverage enhancement | TCL |
R1-2410079 | Discussion on NR-NTN downlink coverage enhancement | OPPO |
R1-2410129 | Discussion on downlink coverage enhancements | Fujitsu |
R1-2410160 | NR-NTN downlink coverage enhancement techniques | Sharp |
R1-2410169 | On NR-NTN downlink coverage enhancement | Ericsson |
R1-2410182 | Discussion on NR-NTN downlink coverage enhancement | HONOR |
R1-2410277 | Discussion on NR-NTN downlink coverage enhancement | ETRI |
R1-2410282 | NR-NTN Downlink Coverage Enhancement | Panasonic |
R1-2410364 | Discussion on downlink coverage enhancement for NR NTN | Lenovo |
R1-2410405 | Discussion on DL coverage enhancement for NR-NTN | NTT DOCOMO, INC. |
R1-2410415 | Discussion on downlink coverage enhancement for NR NTN | Baicells |
R1-2410495 | Downlink coverage enhancement for NR NTN | Qualcomm Incorporated |
R1-2410526 | NR-NTN downlink coverage enhancement | MediaTek Inc. |
R1-2410546 | Downlink Coverage Enhancement for NR NTN | Google Ireland Limited |
R1-2410553 | Further discussion on downlink coverage enhancements for NR over NTN | Nokia, Nokia Shanghai Bell |
R1-2410567 | Discussion on NR-NTN DL coverage enhancement | KT Corp. |
R1-2410584 | Discussion on Downlink Coverage Enhancements for NR NTN | CEWiT |
R1-2410619 | Operator views on DL Coverage Enhancements for NR NTN | Inmarsat, Viasat |
TDoc | Title | Source |
---|---|---|
R1-2409406 | Discussion on HD-FDD RedCap UEs and eRedCap UEs for FR1-NTN | Huawei, HiSilicon |
R1-2409528 | Discussion on the collision issues of HD-FDD Redcap UE in FR1-NTN | CMCC |
R1-2409615 | Discussion on support of RedCap and eRedCap UEs with NR NTN operating in FR1-NTN bands | Samsung |
R1-2409651 | Discussion on support of RedCap and eRedCap UEs with NR NTN operating in FR1-NTN bands | Spreadtrum, UNISOC |
R1-2409699 | Discussion on support of RedCap and eRedCap UEs with NR-NTN | vivo |
R1-2409720 | Discussion on half-duplex RedCap issues for NTN FR1 operation | InterDigital, Inc. |
R1-2409727 | Discussion on support of RedCap/eRedCap UEs for NR NTN | ZTE Corporation, Sanechips |
R1-2409824 | Discussion on support of RedCap UEs with NR NTN operation | Apple |
R1-2409832 | Discussion on support of (e)RedCap UEs with NR-NTN operating in FR1-NTN bands | LG Electronics |
R1-2409884 | Discussion on the support of Redcap and eRedcap UEs in NR NTN | Xiaomi |
R1-2409979 | Discussion on the enhancement of RedCap and eRedCap UEs In NTN | CATT |
R1-2410008 | Discussion on Support of RedCap and eRedCap UEs with NR NTN operating in FR1-NTN bands | China Telecom |
R1-2410065 | Discussion on HD-FDD Redcap UEs and eRedcap UEs for FR1-NTN | TCL |
R1-2410080 | Discussion on supporting of RedCap and eRedCap UEs with NR NTN operating in FR1-NTN bands | OPPO |
R1-2410183 | Discussion on support of (e)RedCap UEs in NR NTN | HONOR |
R1-2410278 | Discussion on HD UEs with NR NTN | ETRI |
R1-2410305 | On HD-FDD Redcap UEs for NTN | Ericsson |
R1-2410371 | Discussion on support of RedCap/eRedCap UEs in NTN | CAICT |
R1-2410406 | Discussion on support of RedCap and eRedCap UEs in FR1-NTN | NTT DOCOMO, INC. |
R1-2410434 | Views on the support of (e)RedCap UEs with NR NTN | SHARP Corporation |
R1-2410496 | Support of Redcap and eRedcap UEs in NR NTN | Qualcomm Incorporated |
R1-2410527 | Support of RedCap and eRedCap UEs with NR NTN operating in FR1-NTN bands | MediaTek Inc. |
R1-2410532 | Support of RedCap and eRedCap UEs in NR NTN | Nordic Semiconductor ASA |
R1-2410554 | Additional considerations on (e)RedCap operation in NR over NTN | Nokia, Nokia Shanghai Bell |
R1-2410806 | Summary #1 for 9.11.2 Support of RedCap and eRedCap UEs with NR NTN operating in FR1-NTN bands | Moderator (CATT) |
R1-2410807 | Summary #2 for 9.11.2 Support of RedCap and eRedCap UEs with NR NTN operating in FR1-NTN bands | Moderator (CATT) |
R1-2410808 | Summary #3 for 9.11.2 Support of RedCap and eRedCap UEs with NR NTN operating in FR1-NTN bands | Moderator (CATT) |
TDoc | Title | Source |
---|---|---|
R1-2409407 | Discussion on uplink capacity/throughput enhancement for FR1-NTN | Huawei, HiSilicon |
R1-2409529 | Discussion on the NR-NTN uplink capacity/throughput enhancements | CMCC |
R1-2409616 | Discussion on uplink capacity/throughput enhancement for NR-NTN | Samsung |
R1-2409652 | Discussion on NR-NTN uplink capacity/throughput enhancement | Spreadtrum, UNISOC, SGITG |
R1-2409700 | Discussion on NR-NTN uplink capacity enhancement | vivo |
R1-2409721 | NR-NTN uplink capacity/throughput enhancement | InterDigital, Inc. |
R1-2409728 | Discussion on UL capacity enhancement for NR NTN | ZTE Corporation, Sanechips |
R1-2409825 | On NR-NTN Uplink Capacity Enhancement | Apple |
R1-2409833 | Discussion on NR-NTN uplink capacity/throughput enhancement | LG Electronics |
R1-2409838 | Discussion on the NR-NTN uplink capacity/throughput enhancements | TCL |
R1-2409871 | NR-NTN uplink capacity/throughput enhancement | NEC |
R1-2409885 | Discussion on NR-NTN PUSCH capacity enhancement | Xiaomi |
R1-2409959 | Discussion on NR-NTN uplink capacity/throughput enhancement | NICT |
R1-2409980 | Discussion on UL capacity enhancement for NR NTN | CATT |
R1-2410009 | Discussion on NR-NTN uplink enhancement | China Telecom |
R1-2410081 | Discussion on NR-NTN uplink capacity/throughput enhancement | OPPO |
R1-2410130 | Discussion on uplink capacity/cell throughput enhancement for FR1-NTN | Fujitsu |
R1-2410184 | Discussion on NR-NTN UL capacity & throughput enhancement | HONOR |
R1-2410279 | Discussion on NR-NTN uplink capacity/throughput enhancement | ETRI |
R1-2410304 | Discussion on NR-NTN Uplink Capacity/Throughput Enhancement | Lenovo |
R1-2410343 | Views on KPIs for uplink capacity enhancement for NR NTN | ViaSat Satellite Holdings Ltd |
R1-2410357 | Uplink capacity/throughput enhancement for NR-NTN | Panasonic |
R1-2410407 | Discussion on NR-NTN uplink capacity/throughput enhancement | NTT DOCOMO, INC. |
R1-2410413 | NR-NTN uplink capacity enhancement | Sharp |
R1-2410497 | NR-NTN uplink capacity / throughput enhancement | Qualcomm Incorporated |
R1-2410528 | NR-NTN uplink capacity and throughput enhancements | MediaTek Inc. |
R1-2410555 | Further discussion on uplink capacity enhancements for NR over NTN | Nokia, Nokia Shanghai Bell |
R1-2410562 | On uplink capacity/cell throughput enhancement for NR NTN | Ericsson |
R1-2410640 | Feature lead summary #1 of AI 9.11.3 on NR-NTN uplink capacity and throughput enhancements | Moderator (MediaTek) |
R1-2410641 | Feature lead summary #2 of AI 9.11.3 on NR-NTN uplink capacity and throughput enhancements | Moderator (MediaTek) |
R1-2410642 | Feature lead summary #3 of AI 9.11.3 on NR-NTN uplink capacity and throughput enhancements | Moderator (MediaTek) |
R1-2410669 | Discussion on NR-NTN uplink capacity/throughput enhancement | NTT DOCOMO, INC. |
TDoc | Title | Source |
---|---|---|
R1-2409408 | Discussion on UL capacity enhancements for IoT NTN | Huawei, HiSilicon |
R1-2409530 | Discussion on the IoT -NTN uplink capacity/throughput enhancements | CMCC |
R1-2409617 | Discussion on uplink capacity/throughput enhancement for IoT-NTN | Samsung |
R1-2409653 | Discussion on IoT-NTN uplink capacity/throughput enhancement | Spreadtrum, UNISOC |
R1-2409701 | Discussion on IoT-NTN uplink capacity enhancement | vivo |
R1-2409722 | IoT-NTN uplink capacity/throughput enhancement | InterDigital, Inc. |
R1-2409729 | Discussion on UL capacity enhancement for IoT NTN | ZTE Corporation, Sanechips |
R1-2409826 | Discussion on IoT-NTN Uplink Capacity Enhancement | Apple |
R1-2409834 | Discussion on IoT-NTN uplink capacity/throughput enhancement | LG Electronics |
R1-2409839 | Discussion on the IoT-NTN uplink capacity/throughput enhancements | TCL |
R1-2409848 | IoT-NTN uplink capacity enhancement | Nokia, Nokia Shanghai Bell |
R1-2409872 | IoT-NTN uplink capacity/throughput enhancement | NEC |
R1-2409886 | Discussion on IoT-NTN uplink capacity enhancement | Xiaomi |
R1-2409981 | Discussion on UL capacity enhancement for IoT NTN | CATT |
R1-2410082 | Discussion on IoT-NTN uplink capacity/throughput enhancement | OPPO |
R1-2410161 | IoT NTN OCC methods and signaling for NPUSCH and NPRACH | Sharp |
R1-2410240 | On IoT-NTN uplink capacity enhancements | Sony |
R1-2410280 | Discussion on uplink capacity/throughput enhancement for IoT NTN | ETRI |
R1-2410306 | On uplink capacity enhancements for IoT-NTN | Ericsson |
R1-2410365 | Discussion on uplink capacity enhancement for IoT NTN | Lenovo |
R1-2410498 | IOT-NTN uplink capacity/throughput enhancement | Qualcomm Incorporated |
R1-2410503 | Operator views on KPIs for uplink capacity enhancement for IOT- NTN | ViaSat Satellite Holdings Ltd |
R1-2410506 | IoT-NTN uplink capacity/throughput enhancement | Nordic Semiconductor ASA |
R1-2410529 | IoT-NTN uplink capacity and throughput enhancement | MediaTek Inc. |
R1-2410763 | FL Summary #1 for IoT-NTN | Moderator (Sony) |
R1-2410764 | FL Summary #2 for IoT-NTN | Moderator (Sony) |
R1-2410765 | Final FL Summary for IoT-NTN | Moderator (Sony) |
TDoc | Title | Source |
---|---|---|
R1-2409409 | Discussion on IoT-NTN TDD mode | Huawei, HiSilicon |
R1-2409440 | Discussion on IoT-NTN TDD mode | THALES |
R1-2409531 | Discussion on the new NB-IoT NTN TDD mode | CMCC |
R1-2409565 | Analysis - loT-NTN TDD mode DL synchronization and SIB scheduling | Iridium Satellite LLC |
R1-2409618 | Discussion on IoT-NTN TDD mode | Samsung |
R1-2409654 | Discussion on IoT-NTN TDD mode | Spreadtrum, UNISOC |
R1-2409702 | Discussion on IoT-NTN TDD mode | vivo |
R1-2409730 | Discussion on the IoT-NTN TDD mode | ZTE Corporation, Sanechips |
R1-2409827 | Discussion on IoT-NTN TDD mode | Apple |
R1-2409835 | Discussion on IoT-NTN TDD mode | LG Electronics |
R1-2409849 | Discussion on IoT-NTN TDD mode | Nokia, Nokia Shanghai Bell |
R1-2409887 | Discussion on IoT-NTN TDD mode | Xiaomi |
R1-2409982 | Evaluation on IoT-NTN TDD mode | CATT |
R1-2410083 | Discussion on IoT-NTN TDD mode | OPPO |
R1-2410307 | On TDD mode for IoT-NTN | Ericsson |
R1-2410366 | Discussion on IoT-NTN TDD mode | Lenovo |
R1-2410499 | IOT-NTN TDD mode | Qualcomm Incorporated |
R1-2410570 | On R19 TDD IoT-NTN | Nordic Semiconductor ASA |
R1-2410672 | Discussion on IoT-NTN TDD mode | vivo |
R1-2410687 | Feature lead summary #1 on IoT-NTN TDD mode | Moderator (Qualcomm Incorporated) |
R1-2410874 | Feature lead summary #2 on IoT-NTN TDD mode | Moderator (Qualcomm Incorporated) |
TDoc | Title | Source |
---|---|---|
R1-2410849 | Session notes for 9.12 (Multi-Carrier Enhancements for NR Phase 2) | Ad-Hoc Chair (CMCC) |
TDoc | Title | Source |
---|---|---|
R1-2409404 | Discussion on Rel-19 Multi-carrier enhancements | Huawei, HiSilicon |
R1-2409484 | Discussion on multi-cell scheduling with a single DCI | Lenovo |
R1-2409532 | Discussion on multi-cell PUSCH/PDSCH scheduling with a single DCI | CMCC |
R1-2409541 | Discussion on multi-cell PUSCH/PDSCH scheduling with a single DCI | ZTE Corporation, Sanechips |
R1-2409619 | Enhancements for multi-cell PUSCH/PDSCH scheduling | Samsung |
R1-2409655 | Discussion on multi-cell PUSCH/PDSCH scheduling with a single DCI | Spreadtrum, UNISOC |
R1-2409703 | Discussion on enhancement of multi-cell PUSCH/PDSCH scheduling with a single DCI | vivo |
R1-2409716 | On Rel-19 Multi-carrier enhancements for NR Phase 2 | Nokia |
R1-2409828 | On multi-cell PUSCH/PDSCH scheduling with single DCI | Apple |
R1-2409868 | Discussion on multi-cell scheduling with a single DCI | NEC |
R1-2409931 | Discussion on multi-cell PUSCH/PDSCH scheduling with a single DCI | CATT |
R1-2410010 | Discussion on multi-carrier enhancements for NR phase 2 | China Telecom |
R1-2410066 | Discussion on Multi-cell PUSCH/PDSCH scheduling with a single DCI | TCL |
R1-2410100 | Discussion of multi-cell scheduling with a single DCI | OPPO |
R1-2410250 | Discussion on multi-carrier enhancements for NR Phase 2 | Panasonic |
R1-2410281 | Discussion on multi-cell PUSCH/PDSCH scheduling with a single DCI | ETRI |
R1-2410298 | Discussion on single DCI based multi-cell scheduling for Rel-19 | LG Electronics |
R1-2410408 | Discussion on multi-cell PUSCH/PDSCH scheduling with a single DCI | NTT DOCOMO, INC. |
R1-2410500 | Multi-cell PUSCH/PDSCH scheduling with a single DCI | Qualcomm Incorporated |
R1-2410509 | Multi-cell PUSCH/PDSCH scheduling with a single DCI | MediaTek Inc. |
R1-2410536 | Multi-cell PxSCH scheduling with a single DCI | Ericsson |
R1-2410729 | Feature lead summary#1 on multi-cell scheduling with a single DCI | Moderator (Lenovo) |
R1-2410730 | Feature lead summary#2 on multi-cell scheduling with a single DCI | Moderator (Lenovo) |
R1-2410731 | Feature lead summary#3 on multi-cell scheduling with a single DCI | Moderator (Lenovo) |
R1-2410732 | Feature lead summary#4 on multi-cell scheduling with a single DCI | Moderator (Lenovo) |
R1-2410905 | Feature lead summary#5 on multi-cell scheduling with a single DCI | Moderator (Lenovo) |
TDoc | Title | Source |
---|---|---|
R1-2409401 | Enhancement of SRS beamforming for FR2 positioning | Huawei, HiSilicon, China Unicom, ZTE, Sanechips, CATT |
R1-2409542 | On Rel-19 TEI proposals | ZTE Corporation, Sanechips |
R1-2409990 | TEI-19 proposal on link adaptation enhancement | Ericsson |
R1-2410246 | CSI Acquisition Improvement for Type-II codebook | Orange, ZTE, BT |
R1-2410624 | TEI19: Counting of active NZP-CSI-RS resources | Nokia, Apple, Ericsson, MediaTek, NTT DOCOMO, Spreadtrum |
R1-2410813 | FL Summary #1 on Rel-19 TEIs | Moderator (NTT DOCOMO, INC.) |
R1-2410830 | FL Summary #2 on Rel-19 TEIs | Moderator (NTT DOCOMO, INC.) |
R1-2410850 | Session notes for 9.13 (TEI19) | Ad-Hoc Chair (CMCC) |
R1-2410891 | FL Summary #3 on Rel-19 TEIs | Moderator (NTT DOCOMO, INC.) |
TDoc | Title | Source |
---|---|---|
R1-2409382 | Discussion on UE features for NR MIMO Phase 5 | ZTE Corporation, Sanechips |
R1-2409431 | UE features for NR MIMO Phase 5 | Huawei, HiSilicon |
R1-2409533 | Discussion on \tUE features for NR MIMO Phase 5 | CMCC |
R1-2409620 | UE features for NR MIMO Phase 5 | Samsung |
R1-2409621 | Initial list of UE features for Rel-19 MIMO Ph5 | Samsung (Moderator) |
R1-2409704 | Discussion on Rel-19 MIMO UE features | vivo |
R1-2409768 | Initial views on UE features NR MIMO Phase 5 WI | Nokia |
R1-2409829 | Views on UE features for NR MIMO Phase 5 | Apple |
R1-2409932 | On UE features for NR MIMO Phase 5 | CATT |
R1-2410112 | UE features for NR MIMO Phase 5 | OPPO |
R1-2410342 | UE features for NR MIMO Phase 5 | Ericsson |
R1-2410501 | UE features for NR MIMO phase 5 | Qualcomm Incorporated |
R1-2410819 | Summary of UE features for NR MIMO Phase 5 | Moderator (AT&T) |
R1-2410820 | Session Notes of AI 9.14.2 | Ad-Hoc Chair (AT&T) |
R1-2410821 | Initial RAN1 UE features list for Rel-19 NR MIMO Phase 5 | Moderators (AT&T, NTT DOCOMO, INC.) |
TDoc | Title | Source |
---|---|---|
R1-2410926 | Tribute to Mark Harrison | Ericsson |