TDoc | Title | Source |
---|---|---|
R1-2500001 | Draft Agenda of RAN1#120 meeting | RAN1 Chair |
R1-2500004 | RAN1#120 Meeting Timelines, Scope, Process | RAN1 Chair, ETSI MCC |
R1-2500138 | Draft Agenda of RAN1#120 meeting | RAN1 Chair |
TDoc | Title | Source |
---|---|---|
R1-2500002 | Highlights from RAN#106 | RAN1 Chair |
TDoc | Title | Source |
---|---|---|
R1-2500003 | Report of RAN1#119 meeting | ETSI MCC |
TDoc | Title | Source |
---|---|---|
R1-2500005 | Reply LS to R2-2407921/ R1-2407559 | RAN2, Vodafone |
R1-2500006 | LS on soft satellite switch with re-sync | RAN2, Huawei |
R1-2500007 | LS response on waveform determination for PUSCH scheduled by fallbackRAR UL grant and MsgA PUSCH | RAN2, CATT |
R1-2500008 | Reply LS on the time period for R18 preamble repetition | RAN2, Huawei |
R1-2500009 | LS on PWS support in RRC_CONNECTED for NB-IoT NTN | RAN2, InterDigital |
R1-2500010 | LS on LTM UE capabilities for cross-band operation | RAN2, Qualcomm |
R1-2500011 | RAN2 agreements on Inter-CU LTM and Conditional LTM | RAN2, Lenovo |
R1-2500012 | LS on UL 8Tx | RAN2, Samsung |
R1-2500013 | LS on differentiation of sDCI mTRP, mDCI mTRP and sTRP | RAN2, CATT |
R1-2500014 | LS on co-existence of SL-CA and SL PRS transmission/reception for Dedicated SL-PRS resource pool | RAN2, vivo |
R1-2500015 | Reply LS to SA5 on AIML data collection | RAN2, Nokia |
R1-2500016 | Reply LS to SA2 on AIML data collection | RAN2, InterDigital |
R1-2500017 | LS on inter-gNB RACH-less HO in NTN | RAN2, Nokia |
R1-2500018 | LS on Ku band numerology | RAN4, Eutelsat |
R1-2500019 | LS on CSI-RS measurement with SBFD operation | RAN4, MediaTek |
R1-2500020 | Reply LS on timeline for On-demand SSB operation on SCell | RAN4, Ericsson |
R1-2500021 | Response LS on gaps/restrictions that are caused by RRM measurements | RAN4, Qualcomm |
R1-2500022 | Reply LS on carrierBandwidth configuration for less-than-5MHz carriers | RAN4, ZTE Corporation |
R1-2500023 | Reply LS to RAN1 and RAN2 on FR2-NTN inclusion to specifications | RAN4, vivo |
R1-2500024 | LS on AdditionalSpectrumEmission in NR SL Pre-configuration | RAN4, LG Electronics |
R1-2500025 | LS on simultaneous operation between GNSS and NR NTN | RAN4, Huawei |
R1-2500026 | LS on UE capability for FDD-FDD inter-band CA simultaneous Rx/Tx | RAN4, CATT |
R1-2500027 | Reply LS for LS on the support of semi-persistent CSI-RS resource for LTM candidate cells | RAN3, CATT |
R1-2500028 | Reply LS on RAN3 vs RAN2 Basketball Match | RAN3, ZTE |
R1-2500029 | Reply on AIML data collection | SA5, Nokia |
R1-2500030 | Reply LS on AIML data collection | SA5, Samsung |
R1-2500031 | Reply LS on AIML data collection | SA2, InterDigital |
R1-2500032 | LS on SSB position restrictions for less-than-5MHz Scells | RAN4, Qualcomm |
R1-2500142 | Draft reply LS on CSI-RS measurement with SBFD operation | ZTE Corporation, Sanechips |
R1-2500158 | Draft reply LS on CSI-RS measurement with SBFD operation | Spreadtrum, UNISOC |
R1-2500190 | Draft reply LS on CSI-RS measurement with SBFD operation | CATT |
R1-2500191 | Discussion on co-existence of SL-CA and SL PRS transmission/reception in dedicated SL-PRS resource pool | CATT, CICTCI |
R1-2500192 | Draft reply LS on co-existence of SL-CA and SL PRS transmission/reception in dedicated SL-PRS resource pool | CATT, CICTCI |
R1-2500193 | Discussion on LS on differentiation of sDCI mTRP, mDCI mTRP and sTRP | CATT |
R1-2500194 | Draft reply LS on differentiation of sDCI mTRP, mDCI mTRP and sTRP | CATT |
R1-2500195 | Discussion on LS from RAN2 on UL 8Tx | CATT |
R1-2500196 | Draft reply LS on UL 8Tx | CATT |
R1-2500197 | Draft reply LS on LTM UE capabilities for cross-band operation | CATT |
R1-2500247 | Draft reply LS to RAN2 on LTM UE capabilities for cross-band operation | ZTE Corporation, Sanechips |
R1-2500248 | Draft reply LS to RAN2 on UL 8Tx | ZTE Corporation, Sanechips |
R1-2500272 | Discussion on RAN4 LS on CSI-RS measurement with SBFD operation | CMCC |
R1-2500273 | Discussion on the LS on soft satellite switch with re-sync | CMCC |
R1-2500320 | Draft reply LS on LTM UE capabilities for cross-band operation | vivo |
R1-2500321 | Draft reply LS on UL 8Tx | vivo |
R1-2500322 | Draft reply LS on differentiation of sDCI mTRP, mDCI mTRP and sTRP | vivo |
R1-2500323 | Draft reply LS on CSI-RS measurement with SBFD operation | vivo |
R1-2500324 | Draft reply LS on soft satellite switch with resync | vivo |
R1-2500325 | Draft reply LS on Ku band numerology | vivo |
R1-2500326 | Draft reply LS on PWS support in RRC_CONNECTED | vivo |
R1-2500327 | Draft reply LS on co-existence of SL-CA and SL PRS transmission/reception in Dedicated SL-PRS resource pool | vivo |
R1-2500328 | Discussion on time period determination for PRACH repetition | vivo |
R1-2500378 | Discussion on the LS on soft satellite switch with re-sync | ZTE Corporation, Sanechips |
R1-2500379 | Discussion on the LS on PWS support in RRC_CONNECTED for NB-IoT NTN | ZTE Corporation, Sanechips |
R1-2500387 | Draft reply LS on Ku band numerology | THALES |
R1-2500388 | LS on LMF-based AI/ML Positioning for Case 2b | SA2, vivo |
R1-2500389 | LS on LMF-based AI/ML Positioning for case 3b | SA2, Ericsson |
R1-2500412 | Draft Reply LS on co-existence of SL-CA and SL PRS transmission/reception in Dedicated SL-PRS resource pool | Intel Corporation |
R1-2500416 | Discussion on LS on LTM UE capabilities for cross-band operation | Nokia |
R1-2500428 | Discussion on LS on UL 8Tx | OPPO |
R1-2500429 | Discussions on LS on differentiation of sDCI mTRP, mDCI mTRP and sTRP | OPPO |
R1-2500431 | Discussion on LS on LTM UE capabilities for cross-band operation | OPPO |
R1-2500433 | Discussion on LS about co-existence of SL-CA and SL PRS transmission/reception in Dedicated SL-PRS resource pool | OPPO |
R1-2500434 | Draft reply LS to RAN2 on co-existence of SL-CA and SL PRS transmission/reception in Dedicated SL-PRS resource pool | OPPO |
R1-2500435 | Discussion on soft satellite switch with re-sync | OPPO |
R1-2500436 | Draft reply LS on soft satellite switch with re-sync | OPPO |
R1-2500448 | Discussion on PWS support in RRC_CONNECTED for NB-IoT NTN | OPPO |
R1-2500449 | Draft reply LS on PWS support in RRC_CONNECTED for NB-IoT NTN | OPPO |
R1-2500458 | Discussion on RAN4 LS for CSI-RS measurement with SBFD operation | OPPO |
R1-2500510 | Discussion on LS from RAN2 on PWS reception in RRC_CONNECTED | Nokia, Nokia Shanghai Bell |
R1-2500538 | Draft reply LS to RAN2 on differentiation of sDCI mTRP, mDCI mTRP and sTRP | ZTE Corporation, Sanechips |
R1-2500540 | Discussion of RAN2 LS on 8Tx UL Transmission | Ericsson |
R1-2500564 | Draft Reply LS on UL 8Tx | |
R1-2500571 | Discussion on reply LS on LMF-based AI/ML Positioning for Case 2b | CATT,CICTCI |
R1-2500572 | Draft reply LS on LMF-based AI/ML Positioning for Case 3b | CATT, CICTCI |
R1-2500578 | Draft reply LS on co-existence of SL-CA and SL PRS | ZTE Corporation, Sanechips |
R1-2500589 | Draft reply to LS on CSI-RS based measurements for SBFD | NEC |
R1-2500599 | Discussion on RAN2 LS on differentiation of sDCI mTRP, mDCI mTRP and sTRP | NEC |
R1-2500613 | Draft LS reply on LMF-based positioning for case 2b | NEC |
R1-2500614 | Draft LS reply on LMF-based positioning for case 3b | NEC |
R1-2500616 | Discussion on LS on LMF-based AI/ML Positioning for case 3b | OPPO |
R1-2500617 | Discussion on LS on LMF-based AI/ML Positioning for Case 2b | OPPO |
R1-2500618 | [Draft] Reply LS on LMF-based AI/ML Positioning for Case 2b | ZTE Corporation, Sanechips |
R1-2500619 | [Draft] Reply LS on LMF-based AI/ML Positioning for Case 3b | ZTE Corporation, Sanechips |
R1-2500634 | Discussion on SA2 LSs on LMF-based Positioning for Cases 2b and 3b | Lenovo |
R1-2500668 | Discussion on RAN4 LS on CSI-RS measurement with SBFD operation | MediaTek Inc. |
R1-2500675 | Discussion LS on Ku band numerology | Ericsson |
R1-2500676 | Discussion LS on PWS for NB-IoT in RRC connected | Ericsson |
R1-2500695 | Draft reply LS on LMF-based AI/ML Positioning for Case 2b | vivo |
R1-2500696 | Draft reply LS on LMF-based AI/ML Positioning for Case 3b | vivo |
R1-2500704 | Draft Reply LS on LTM UE capabilities for cross-band operation | Lenovo |
R1-2500705 | Draft Reply LS on UL 8Tx | Lenovo |
R1-2500706 | Draft Reply LS on differentiation of sDCI mTRP, mDCI mTRP and sTRP | Lenovo |
R1-2500708 | Discussion for SA2 LS on LMF-based AI/ML Positioning for Case 2b | InterDigital, Inc. |
R1-2500709 | Draft reply LS on CSI-RS measurement with SBFD operation | Xiaomi |
R1-2500745 | Discussion for SA2 LS on LMF-based AI/ML Positioning for Case 3b | InterDigital, Inc. |
R1-2500752 | Discussion on RAN4 LS on CSI-RS measurement with SBFD operation | Ericsson |
R1-2500753 | [Draft] Reply LS on CSI-RS measurement with SBFD operation | Ericsson |
R1-2500758 | Discussion on LS reply on PWS support in RRC_CONNECTED for NB-IoT NTN | CATT |
R1-2500759 | Discussion on LS reply on Ku band numerology | CATT |
R1-2500760 | Discussion on RAN2 LS on Soft Satellite Switch with Re-sync | Apple |
R1-2500761 | Draft Reply LS to RAN2 on Soft Satellite Switch with Re-sync | Apple |
R1-2500762 | Draft Reply LS to RAN4 on Ku Band Numerology | Apple |
R1-2500763 | Draft reply LS on differentiation of sDCI mTRP, mDCI mTRP and sTRP | Apple |
R1-2500764 | Draft reply LS on LTM UE capabilities for cross-band operation | Apple |
R1-2500819 | Discussion on the time period determination for multiple PRACH transmission | Samsung |
R1-2500820 | Discussion on RAN2 LS about co-existence of SL-CA and SL PRS transmission/reception in dedicated SL-PRS resource pool | Samsung |
R1-2500821 | Discussion on LS on CSI-RS measurement with SBFD operation | Samsung |
R1-2500822 | Draft reply LS on LTM UE capabilities for cross-band operation | Samsung |
R1-2500823 | Discussion on RAN4 LS about Ku band numerology | Samsung |
R1-2500824 | Discussion on RAN2 LS about PWS support in RRC_CONNECTED for NB-IoT NTN | Samsung |
R1-2500825 | Discussion on RAN2 LS about soft satellite switch with re-sync | Samsung |
R1-2500826 | Draft reply LS on UL 8Tx | Samsung |
R1-2500827 | Draft reply LS on differentiation of sDCI mTRP, mDCI mTRP and sTRP | Samsung |
R1-2500895 | Draft LS reply on differentiation of sDCI mTRP, mDCI mTRP and sTRP | Nokia |
R1-2500948 | Discussion on RAN4 LS on timeline for On-demand SSB operation on SCell | LG Electronics |
R1-2500975 | Discussion on RAN4 Reply LS on Timeline for On-demand SSB Operation on Scell | Nokia, Nokia Shanghai Bell |
R1-2500986 | Draft Reply LS on Ku band numerology | Eutelsat Group |
R1-2500990 | Discussion on RAN2 LS on soft satellite switch with re-sync | Ericsson |
R1-2500996 | Discussion of LS response related to soft satellite switch with re-sync | Nokia |
R1-2500997 | Discussion of LS response related to Ku band numerology | Nokia |
R1-2501006 | Discussion on RAN4 LS on CSI-RS measurement with SBFD | Nokia, Nokia Shanghai Bell |
R1-2501038 | Discussion on reply LS on soft satellite switch with re-sync | MediaTek Inc. |
R1-2501047 | Draft Reply for the LS on PWS support in RRC_CONNECTED for NB-IoT NTN | InterDigital, Inc. |
R1-2501054 | Discussion on reply to LS on Ku band numerology | Sharp |
R1-2501063 | Discussion on RAN2 LS on LTM UE capabilities for cross-band operation | Huawei, HiSilicon |
R1-2501064 | Discussion on PWS support in RRC_CONNECTED for NB-IoT NTN | Huawei, HiSilicon |
R1-2501066 | Discussion on the time period for R18 preamble repetition | Huawei, HiSilicon |
R1-2501068 | Discussion on the possibility to mix FR1 numerology and FR2 numerology for Ku band | Huawei, HiSilicon |
R1-2501069 | Discussion on coexistence of SL CA and SL PRS in dedicated RP | Huawei, HiSilicon |
R1-2501070 | Discussion on soft satellite switch with re-sync | Huawei, HiSilicon |
R1-2501102 | Discussion on time period determination for PRACH transmission with preamble repetitions | China Telecom |
R1-2501136 | Draft reply to RAN4 LS on CSI-RS measurement with SBFD operation | Qualcomm Incorporated |
R1-2501137 | Discussion on response to RAN2 LS on UL 8Tx | Qualcomm Incorporated |
R1-2501138 | Discussion on response to RAN2 LS on PWS support in RRC_CONNECTED for NB-IoT NTN | Qualcomm Incorporated |
R1-2501139 | Discussion on RAN2 LS on soft satellite switch with re-synch | Qualcomm Incorporated |
R1-2501140 | Discussion on RAN2 LS on LTM UE capabilities for cross-band operation | Qualcomm Incorporated |
R1-2501187 | Discussion on LS reply for UL 8Tx | NTT DOCOMO, INC. |
R1-2501188 | Discussion on LS on CSI-RS measurement with SBFD operation | NTT DOCOMO, INC. |
R1-2501239 | Discussion on LS to RAN1 on UL 8Tx | ASUSTeK |
R1-2501246 | Discussion on RAN2 LS on LTM UE capabilities for cross-band operation | Ericsson |
R1-2501265 | Discussion on time period for Rel-18 preamble repetition | ZTE Corporation, Sanechips |
R1-2501282 | Discussion on LS on differentiation of sDCI mTRP, mDCI mTRP and sTRP | Ericsson |
R1-2501300 | Discussion on LS on co-existence of SL-CA and SL PRS transmission/reception in Dedicated SL-PRS resource pool | Ericsson |
R1-2501301 | Draft reply LS on co-existence of SL-CA and SL PRS transmission/reception in Dedicated SL-PRS resource pool | Ericsson |
R1-2501302 | Discussion for SA2 LS on LMF-based AI/ML Positioning for Case 2b | Ericsson |
R1-2501303 | Discussion for SA2 LS on LMF-based AI/ML Positioning for Case 3b | Ericsson |
R1-2501304 | Draft reply LS on LMF-based AI/ML Positioning for Case 2b | Ericsson |
R1-2501305 | Draft reply LS on LMF-based AI/ML Positioning for Case 3b | Ericsson |
R1-2501306 | Draft LS reply on LMF-based AI/ML Positioning for Case 2b | Nokia |
R1-2501308 | Draft LS reply on LMF-based AI/ML Positioning for Case 3b | Nokia |
R1-2501316 | Draft reply LS on PWS support in RRC_CONNECTED for NB-IoT NTN | Huawei, HiSilicon |
R1-2501324 | Draft reply LS on soft satellite switch with re-sync | Huawei, HiSilicon |
R1-2501327 | Discussion on UL 8Tx | Huawei, HiSilicon |
R1-2501329 | Discussion on RAN4 LS on CSI-RS measurement with SBFD operation | Huawei, HiSilicon |
R1-2501330 | Discussion on the LS reply to SA2 on AI/ML Positioning of Case 2b | Huawei, HiSilicon |
R1-2501331 | Discussion on the LS reply to SA2 on AI/ML Positioning of Case 3b | Huawei, HiSilicon |
R1-2501332 | Discussion on differentiation of sDCI mTRP, mDCI mTRP and sTRP | Huawei, HiSilicon |
R1-2501342 | Discussion on RAN4 LS response on skipping RRM measurement gaps/restrictions | Ericsson |
R1-2501352 | Discussion of RAN2 LS on co-existence of SL-CA and SL PRS transmission/reception for Dedicated SL-PRS resource pool | Nokia |
R1-2501370 | Availability of Group Reports from ETSI ISAC ISG on use cases and channel models | ETSI ISG ISAC, Mitsubishi, ZTE |
R1-2501569 | Reply LS on the STx2P UE Features | RAN2, ZTE |
TDoc | Title | Source |
---|---|---|
R1-2501012 | Draft Rel-15 eMTC parameter correction for flexible starting PRB | ZTE Corporation, Sanechips |
TDoc | Title | Source |
---|---|---|
R1-2500143 | Draft CR on DCI size alignment for UL grant | ZTE Corporation, Sanechips |
R1-2500329 | Draft CR on QCL assumption of AP CSI-RS | vivo |
R1-2500330 | Draft mirror CR on QCL assumption of AP CSI-RS (Rel-18 mirror) | vivo |
R1-2500594 | Draft CR on PTRS in TS 38.211 | NEC |
R1-2500757 | Draft CR to 38.214 for alignment of parameter name pusch-FrequencyHoppingInterval | Ericsson |
R1-2500765 | UCI multiplexing procedure within BWP switch delay | Apple |
R1-2501035 | On DCI 1_0/0_0 monitoring with Rel-17 SSSG switching | MediaTek Inc. |
R1-2501036 | On SSSG reset with RRC reconfiguration | MediaTek Inc. |
R1-2501037 | On R17 SSSG reset with BWP switch triggered by RA procedure | MediaTek Inc. |
R1-2501067 | Discussion on p0-nominal | Huawei, HiSilicon |
R1-2501141 | Clarification on UL skipping with SSSG switch and PDCCH skipping | Qualcomm Incorporated |
R1-2501266 | Soft buffer size determination for 1024QAM rank restricted UE | Nokia |
R1-2501267 | Initialization of PRACH preamble generation for restricted set type B | Nokia |
R1-2501268 | Correction to slot aggregation configuration with multi-PUSCH | Nokia |
R1-2501320 | Draft CRs for p0-nominal | Huawei, HiSilicon |
R1-2501321 | Discussion on skipping uplink transmission in case of BWP switching | Huawei, HiSilicon |
R1-2501322 | Correction on skipping uplink transmission in case of BWP switching | Huawei, HiSilicon |
R1-2501326 | Discussion on Type0-PDCCH CSS set monitoring | Huawei, HiSilicon |
R1-2501383 | Moderator summary 1 of SSSG switching on R17 UE power saving | Moderator (MediaTek) |
R1-2501384 | Moderator summary 2 of SSSG switching on R17 UE power saving | Moderator (MediaTek) |
R1-2501434 | Summary on CR on PTRS in TS 38.211 | Moderator (NEC) |
R1-2501488 | FL summary of DCI size alignment for UL grant | Moderator (ZTE) |
R1-2501491 | Summary of discussion on QCL assumption | Moderator (vivo) |
R1-2501510 | Summary #1 of discussion on skipping uplink transmission in case of BWP switching | Moderator (Huawei) |
R1-2501513 | [120-Pre-R18-NR] Summary for soft buffer for 1024QAM | Moderator (Nokia) |
R1-2501514 | [120-Pre-R18-NR] Summary for slot aggregation configuration with multi-PUSCH | Moderator (Nokia) |
R1-2501515 | FL summary #1 of UCI multiplexing procedure within BWP switch delay | Moderator (Apple) |
R1-2501516 | Moderator summary on discussion of p0-nominal | Moderator (Huawei) |
R1-2501526 | Draft LS on Slot aggregation configuration with multi-PUSCH | Moderator (Nokia) |
R1-2501527 | Draft CR on Slot aggregation configuration with multi-PUSCH | Moderator (Nokia) |
R1-2501565 | Summary #2 of discussion on skipping uplink transmission in case of BWP switching | Moderator (Huawei) |
R1-2501566 | Summary #3 of discussion on skipping uplink transmission in case of BWP switching | Moderator (Huawei) |
R1-2501567 | [120-Pre-R18-NR] Summary#2 for soft buffer for 1024QAM | Moderator (Nokia) |
R1-2501568 | Correction on LBRM TBS determination for UE indicating 1024QAM rank restricted capability | Moderator (Nokia) |
R1-2501579 | Slot aggregation configuration with multi-PUSCH | Moderator (Nokia), Ericsson |
R1-2501580 | Slot aggregation configuration with multi-PUSCH | Moderator (Nokia), Ericsson |
R1-2501581 | Correction on LBRM TBS determination for UE indicating 1024QAM rank restricted capability | Moderator (Nokia), Ericsson, xiaomi |
R1-2501582 | Correction on LBRM TBS determination for UE indicating 1024QAM rank restricted capability | Moderator (Nokia), Ericsson, xiaomi |
R1-2501593 | LS on Slot aggregation configuration with multi-PUSCH | RAN1, Nokia |
R1-2501652 | Rel-17 editorial corrections for TS 38.214 | Nokia |
R1-2501653 | Rel-17 editorial corrections for TS 38.214 (mirrored to Rel-18) | Nokia |
TDoc | Title | Source |
---|---|---|
R1-2501648 | Alignment of parameter names | Ericsson |
R1-2501649 | Rel-18 editorial corrections for TS 38.213 | Samsung |
R1-2501650 | Rel-18 editorial corrections for TS 38.212 | Huawei |
R1-2501651 | Rel-18 editorial corrections for TS 38.214 | Nokia |
TDoc | Title | Source |
---|---|---|
R1-2500198 | Discussion on the usage of two candidate starting symbols | CATT, CICTCI |
R1-2500199 | Draft CR on PSCCH DMRS sequence generation in a dedicated SL PRS resource pool | CATT, CICTCI |
R1-2500200 | Discussion on missing RRC parameter for PRACH transmission in 2TA enhancement | CATT |
R1-2500331 | Draft CR on time period determination for PRACH repetition | vivo |
R1-2500332 | Discussion on L1-RSRP reporting for unmeasured LTM L1-RSRP resources | vivo |
R1-2500333 | Draft CR on L1-RSRP reporting for unmeasured LTM L1-RSRP resources | vivo |
R1-2500334 | Draft CR on the PRACH retransmission indicator field included in the PDCCH order | vivo |
R1-2500335 | Correction on transition time of UL BWP change triggered by DCI format 0_1 scheduling multiple PUSCHs | vivo |
R1-2500336 | Discussion on E-UTRAN measurement in IoT-NTN | vivo |
R1-2500430 | Draft CR on RRC parameters for uplink multi-panel transmission | OPPO |
R1-2500432 | Discussion on maintenance of 2 candidate starting symbols in SL-U | OPPO |
R1-2500511 | Discussion on E-UTRAN measurement in IoT NTN | Nokia, Nokia Shanghai Bell |
R1-2500535 | Draft CR on the formula of further enhanced further enhanced Type II port selection codebook for CJT | ZTE Corporation, Sanechips |
R1-2500536 | Draft CR on transmission power reduction for STxMP in TS 38.213 | ZTE Corporation, Sanechips |
R1-2500537 | Discussion on transmission power reduction for STxMP in TS 38.213 | ZTE Corporation, Sanechips |
R1-2500543 | Draft CR on PMI prediction during cell DTX | |
R1-2500544 | Discussion on PMI prediction during cell DTX | |
R1-2500580 | Draft CR on power control of PSFCH in TS 38.213 | ZTE Corporation, Sanechips |
R1-2500581 | Draft CR on the application condition of two candidate starting symbols in TS 38.213 | ZTE Corporation, Sanechips |
R1-2500585 | Draft CR on RRC parameter alignment in TS 38.213 | NEC |
R1-2500586 | Draft CR on RRC parameter alignment in TS 38.214 | NEC |
R1-2500595 | Draft CR on TAG for sidelink resource allocation mode 1 in TS 38.214 | NEC |
R1-2500596 | Draft CR on CSI parameters in TS38.214 | NEC |
R1-2500597 | Draft CR on priority formula for predicted CSI in TS38.214 | NEC |
R1-2500813 | Draft CR on RRC parameter alignment of Rel-18 MIMO enhancements in TS 38.214 | ZTE Corporation, Sanechips |
R1-2500814 | Discussion on misalignment of aperiodic CSI reporting configuration in TS 38.214 and TS 38.331 for LTM | ZTE Corporation, Sanechips |
R1-2500828 | Correction on the zero padding description for CSI part 1 | Samsung |
R1-2500829 | Discussion on the zero padding for CSI part 1 | Samsung |
R1-2500830 | Discussion on two candidate starting symbols for sidelink unlicensed | Samsung |
R1-2500831 | Draft CR on timeline for STxMP | Samsung |
R1-2500832 | Draft CR on Rel-18 Type-II codebook refinement for high/medium velocities and the TRS-based TDCP reporting | Samsung |
R1-2500941 | Correction on downlink DM-RS resource mapping | Nokia |
R1-2501065 | Maintenance of Rel-18 Multicarrier Enhancements | Huawei, HiSilicon |
R1-2501189 | Draft CR on Rel.18 DMRS ports indication by DCI format 0_3/1_3/4_2 | NTT DOCOMO, INC., Huawei, HiSilicon |
R1-2501225 | Enhancement of CDM DMRS port allocation combinations for enhanced uplink and downlink performance | Tejas Network Limited |
R1-2501234 | Correction on RACH-less handover for NTN | ASUSTeK |
R1-2501243 | Draft CR on RRC name alignment of Rel-18 MIMO enhancement in TS 38.213 | ZTE Corporation, Sanechips |
R1-2501314 | Draft CR on LTM PRACH and serving cell UL transmission in a same band | MediaTek, Apple, NTT DOCOMO, Ericsson, Nokia, ZTE, Huawei, Vivo, Google |
R1-2501317 | Corrections on determination of DCI format 0_3 for unpaired spectrum operation | Huawei, HiSilicon, Nokia |
R1-2501318 | Correction on SCell dormancy indication case 2 for DCI format 1_3 | Huawei, HiSilicon |
R1-2501319 | Draft CR on the time period for R18 preamble repetition | Huawei, HiSilicon |
R1-2501328 | Correction on notation of number of TRPs for CJT codebooks | Huawei, HiSilicon |
R1-2501346 | Discussion on Rel.18 DMRS ports indication by DCI format 0_3/1_3/4_2 | Huawei, HiSilicon |
R1-2501419 | Summary on Rel.18 DMRS ports indication by DCI format 0_3/1_3/4_2 | Moderator (NTT DOCOMO) |
R1-2501421 | Summary of discussion on E-UTRAN measurement in IoT NTN | Moderator (vivo) |
R1-2501422 | Summary on RRC parameter for PRACH transmission in 2TA | Moderator (CATT) |
R1-2501423 | Summary#1 of discussion on the time period for R18 preamble repetition | Moderator (Huawei) |
R1-2501438 | FLS#1 on 2 candidate starting symbols in TS 38.213 | Moderator (ZTE) |
R1-2501439 | FLS#1 on power control of PSFCH in TS 38.213 | Moderator (ZTE) |
R1-2501444 | Summary of discussion on the timeline issue for STxMP | Moderator (Samsung) |
R1-2501445 | Moderator summary of RRC parameter alignment in TS 38.213 | Moderator (NEC) |
R1-2501446 | Moderator summary of RRC parameter alignment in TS 38.214 | Moderator (NEC) |
R1-2501447 | Summary on Draft CR on TAG for sidelink resource allocation mode 1 in TS 38.214 | Moderator (NEC) |
R1-2501448 | Summary#1 on LS of co-existence of SL-CA and SL PRS transmission/reception in dedicated SL-PRS resource pool | Moderator (vivo) |
R1-2501449 | [Draft] Reply LS on co-existence of SL-CA and SL PRS transmission/reception in Dedicated SL-PRS resource pool | Moderator (vivo) |
R1-2501450 | Summary on LTM PRACH and serving cell UL transmission | Moderator (MediaTek) |
R1-2501454 | Draft Final CR on the zero padding for CSI part 1 on NES | Moderator (Samsung) |
R1-2501461 | Draft CR on RRC parameter alignment of Rel-18 MIMO enhancements in TS 38.214 | Moderator (ZTE Corporation), Sanechips |
R1-2501462 | Summary of discussion on transmission power reduction for STxMP in TS 38.213 | Moderator (ZTE Corporation) |
R1-2501463 | Summary#1 of PSCCH DMRS sequence generation in a dedicated SL PRS resource pool | Moderator (CATT) |
R1-2501476 | Summary#2 on RRC parameter for PRACH transmission in 2TA | Moderator (CATT) |
R1-2501477 | Summary on LS on differentiation of sDCI mTRP, mDCI mTRP and sTRP | Moderator (CATT) |
R1-2501478 | LS on RRC parameter for PRACH transmission in 2TA | RAN1, CATT |
R1-2501479 | Reply LS on co-existence of SL-CA and SL PRS transmission/reception in Dedicated SL-PRS resource pool | RAN1, vivo |
R1-2501480 | Draft CR on Rel-18 Type-II codebook refinement for high/medium velocities and the TRS-based TDCP reporting | Samsung |
R1-2501486 | Summary#2 of discussion on E-UTRAN measurement in IoT NTN | Moderator (vivo) |
R1-2501489 | Summary #2 of discussion on the timeline issue for STxMP | Moderator (Samsung) |
R1-2501490 | Summary of reply LS on 8Tx | Moderator (Samsung) |
R1-2501492 | Summary of discussion on PRACH retransmission indicator field included in the PDCCH order | Moderator (vivo) |
R1-2501497 | Summary on PMI prediction during cell DTX | Moderator (Google) |
R1-2501498 | Summary#2 on Draft CR on TAG for sidelink resource allocation mode 1 in TS 38.214 | Moderator (NEC) |
R1-2501501 | Correction on transition time of UL BWP change triggered by DCI format 0_1 scheduling multiple PUSCHs | vivo, ASUSTeK |
R1-2501502 | CR on PSCCH DMRS sequence generation in a dedicated SL PRS resource pool | Moderator (CATT), CATT, CICTCI |
R1-2501503 | CR on power control of PSFCH in TS 38.213 | Moderator (ZTE), ZTE Corporation, Sanechips, Samsung, vivo, OPPO |
R1-2501504 | Draft CR on the PRACH retransmission indicator field included in the PDCCH order | Moderator (vivo), Nokia |
R1-2501505 | Summary of discussion on the LS reply of soft-satellite switching with re-sync | Moderator (Huawei) |
R1-2501506 | Draft reply LS on soft satellite switch with re-sync | Moderator (Huawei) |
R1-2501507 | Summary of RACH-less HO for NTN | Moderator (ASUSTeK) |
R1-2501511 | Draft LS on measurement quantities for IoT NTN | Moderator (vivo) |
R1-2501512 | LS on measurement quantities for IoT NTN | RAN1, vivo |
R1-2501532 | Corrections on determination of DCI format 0_3 in case of dormancy | Huawei, HiSilicon |
R1-2501533 | Draft CR on the time period for R18 preamble repetition | Moderator (Huawei), vivo, ZTE |
R1-2501538 | Summary#2 on LS on differentiation of sDCI mTRP and sTRP | Moderator (CATT) |
R1-2501540 | LS on RRC parameter for PRACH transmission in 2TA | RAN1, CATT |
R1-2501541 | Summary#2 of discussion on the LS reply of soft-satellite switching with re-sync | Moderator (Huawei) |
R1-2501542 | Session notes for 8.1 (Maintenance on Rel-18 work items - Coverage enhancements ) | Ad-Hoc Chair (CMCC) |
R1-2501543 | Session notes for 8.1 (Maintenance on Rel-18 work items - Mobility Enhancement) | Ad-Hoc Chair (CMCC) |
R1-2501544 | Session notes for 8.1 (Maintenance on Rel-18 work items – Multi-Carrier) | Ad-Hoc Chair (CMCC) |
R1-2501545 | Session notes for 8.1 Maintenance on Rel-18 work items – Positioning, Sidelink, IoT NTN, NR NTN, NR extension to 71 GHz | Ad-Hoc Chair (Huawei) |
R1-2501554 | Correction on determination of DCI format 0_3 for unpaired spectrum operation | Huawei, HiSilicon |
R1-2501557 | Summary#2 on Rel.18 DMRS ports indication by DCI format 0_3/1_3/4_2 | Moderator (NTT DOCOMO) |
R1-2501558 | Draft CR on LTM PRACH and serving cell UL transmission in a same band | Moderator (MediaTek) |
R1-2501559 | Correction on the zero padding for CSI part 1 on NES | Moderator (Samsung) |
R1-2501563 | Summary#2 of reply LS on 8Tx | Moderator (Samsung) |
R1-2501564 | CR on timeline for STxMP | Moderator (Samsung), ZTE, Huawei, HiSilicon |
R1-2501572 | Corrections on determination of DCI format 0_3 in case of dormancy | Huawei, HiSilicon, Ericsson, Fujitsu, Nokia, Samsung, ZTE |
R1-2501575 | CR on LTM PRACH and serving cell UL transmission in a same band | Moderator (MediaTek), Apple, NTT DOCOMO, Ericsson, Nokia, ZTE, Huawei, Vivo, Google, Fujitsu, Samsung |
R1-2501578 | Final summary on LTM PRACH and serving cell UL transmission | Moderator (MediaTek) |
R1-2501596 | Correction on RACH-less handover for NTN | Moderator (ASUSTeK), Huawei, Hisilicon |
R1-2501597 | Summary#2 of discussion on transmission power reduction for STxMP in TS 38.213 | Moderator (ZTE Corporation) |
R1-2501606 | Reply LS on soft satellite switch with re-sync | RAN1, Huawei |
R1-2501611 | Reply LS on differentiation of sDCI mTRP, mDCI mTRP and sTRP | RAN1, CATT |
R1-2501618 | [Draft] Reply LS on UL 8Tx | Moderator (Samsung) |
R1-2501636 | Reply LS on UL 8Tx | RAN1, Samsung |
R1-2501637 | CR on the PRACH retransmission indicator field included in the PDCCH order | Moderator (vivo), Nokia |
TDoc | Title | Source |
---|---|---|
R1-2500833 | UE features for Rel-18 work items | Samsung |
R1-2501142 | UE features for Rel-18 | Qualcomm Incorporated |
R1-2501325 | Rel-18 UE Features | Huawei, HiSilicon |
R1-2501385 | Summary of discussion on Rel-18 NR UE features | Moderator (NTT DOCOMO, INC.) |
R1-2501386 | Summary#2 of discussion on Rel-18 NR UE features | Moderator (NTT DOCOMO, INC.) |
R1-2501387 | Session Notes of AI 8.2 | Ad-Hoc Chair (NTT DOCOMO, INC.) |
R1-2501388 | Updated RAN1 UE features list for Rel-18 NR after RAN1#120 | Moderators (AT&T, NTT DOCOMO, INC.) |
R1-2501389 | Draft LS on Rel-18 RAN1 UE features lists for NR after RAN1#120 | Moderators (AT&T, NTT DOCOMO, INC.) |
R1-2501390 | LS on Rel-18 RAN1 UE features lists for NR after RAN1#120 | RAN1, AT&T, NTT DOCOMO, INC. |
R1-2501631 | Summary#3 of discussion on Rel-18 NR UE features | Moderator (NTT DOCOMO, INC.) |
TDoc | Title | Source |
---|---|---|
R1-2501642 | Email discussion summary on Rel-19 higher layers parameters list Post RAN1#120 | Moderator (Ericsson) |
R1-2501643 | DRAFT LS on Rel-19 higher layers parameters list Post RAN1#120 | Moderator (Ericsson) |
R1-2501644 | LS on Rel-19 higher layers parameters list Post RAN1#120 | RAN1, Ericsson |
R1-2501645 | Consolidated Rel-19 higher layers parameters list Post RAN1#120 | Moderator (Ericsson) |
R1-2501646 | Collection of Rel-19 higher layers parameters list Post RAN1#120 | Moderator (Ericsson) |
R1-2501656 | Introduction of NR MIMO Phase5 | Ericsson |
R1-2501657 | Editor’s summary on draft CR 38.211 for NR_MIMO_Ph5 | Ericsson |
R1-2501658 | Introduction of Rel-19 NR MIMO Phase 5 | Huawei |
R1-2501659 | Summary of email discussion [Post-120-Rel19-38.212-NR_MIMO_Ph5] | Moderator (Huawei) |
R1-2501660 | Introduction of Rel-19 XR enhancements for NR | Huawei |
R1-2501661 | Introduction of NR MIMO Phase5 | Samsung |
R1-2501662 | Summary of email discussions [120-R19-38.213-NR_MIMO_Ph5] | Samsung |
R1-2501663 | Introduction of XR (eXtended Reality) for NR Phase 3 | Samsung |
R1-2501664 | Summary of email discussions [120-R19-38.213-NR_XR_Ph3] | Samsung |
R1-2501665 | Introduction of 3Tx UL enhancements for NR MIMO Phase 5 | Nokia |
R1-2501666 | Summary of the discussion concerning the 3Tx draft CR for Release 19 | Nokia |
R1-2501667 | Introduction of CSI enhancements for NR MIMO Phase 5 | Nokia |
R1-2501668 | Summary of the discussion concerning the CSI draft CR for Release 19 | Nokia |
R1-2501669 | Introduction of UE-initiated/event-driven beam management | Nokia |
R1-2501670 | Summary of the discussion concerning the UEIBM draft CR for Release 19 | Nokia |
R1-2501671 | Introduction of specification for XR Enhancements for NR Phase3 | Nokia |
R1-2501672 | Summary of the discussion concerning the XR Ph3 draft CR for Release 19 | Nokia |
R1-2501673 | Introduction of Rel-19 MIMO evolution for TS38.215 | Intel Corporation |
R1-2501674 | Editor’s summary on draft CR 38.215 for NR_MIMO_Ph5 | Intel Corporation |
TDoc | Title | Source |
---|---|---|
R1-2501143 | Rapporteur view on higher layer signalling of Rel-19 AI-ML for NR air interface | Qualcomm Incorporated |
R1-2501546 | Session notes for 9.1 (AI/ML for NR Air Interface) | Ad-Hoc Chair (CMCC) |
TDoc | Title | Source |
---|---|---|
R1-2500050 | Discussion on specification support for AI/ML-based beam management | FUTUREWEI |
R1-2500066 | Discussion on AI/ML-based beam management | ZTE Corporation, Sanechips |
R1-2500089 | Discussion on AI/ML for beam management | Huawei, HiSilicon |
R1-2500159 | Discussion on AIML for beam management | Spreadtrum, UNISOC |
R1-2500201 | Discussion on AI/ML-based beam management | CATT |
R1-2500254 | Discussion on AI/ML for beam management | China Telecom |
R1-2500274 | Discussion on specification support for beam management | CMCC |
R1-2500337 | Specification support for beam management | vivo |
R1-2500390 | Specification Support for AI/ML for Beam Management | Kyocera |
R1-2500391 | AI/ML for beam management | Ericsson |
R1-2500404 | Specification support for beam management | Tejas Networks Limited |
R1-2500465 | On specification for AI/ML-based beam management | OPPO |
R1-2500512 | Discussion on AI/ML for beam management | Ofinno |
R1-2500529 | Discussion on AI/ML for beam management | InterDigital, Inc. |
R1-2500545 | AI/ML based Beam Management | |
R1-2500555 | Discussion on AIML beam management | TCL |
R1-2500560 | Discussion on specification support for beam management | Panasonic |
R1-2500565 | Discussions on AI/ML for beam management | LG Electronics |
R1-2500590 | Discussion on specification support for beam management | NEC |
R1-2500635 | AI/ML specification support for beam management | Lenovo |
R1-2500642 | Discussion on Specification Support for Beam Management | Sony |
R1-2500669 | Discussion on specification support for beam management | Ruijie Networks Co. Ltd |
R1-2500686 | Specification support for AI-enabled beam management | NVIDIA |
R1-2500710 | Discussion on AI/ML for beam management | Xiaomi |
R1-2500766 | Enhancements for AI/ML enabled beam management | Apple |
R1-2500834 | Discussion for supporting AI/ML based beam management | Samsung |
R1-2500877 | Specification support for beam management | KDDI Corporation |
R1-2500900 | Discussion on specification support for beam management | ETRI |
R1-2500925 | Discussion on specification support on AI/ML for beam management | Fujitsu |
R1-2500962 | Discussion on specification support for AI/ML beam management | Transsion Holdings |
R1-2500970 | AI/ML for Beam Management | Nokia |
R1-2501013 | Discussion on specification support for AIML-based beam management | MediaTek Inc. |
R1-2501085 | AI/ML for Beam Management | Meta |
R1-2501103 | Specification support for beam management | Intel Corporation |
R1-2501104 | Discussion on AI/ML for beam management | HONOR |
R1-2501130 | Discussions on specification support for beam management | Sharp |
R1-2501144 | Specification support for AI-ML-based beam management | Qualcomm Incorporated |
R1-2501190 | Discussion on AI/ML for beam management | NTT DOCOMO, INC. |
R1-2501226 | Discussion on AI/ML based beam management | KT Corp. |
R1-2501235 | Discussion on AIML based beam management | ASUSTeK |
R1-2501262 | Discussions on AI/ML for beam management | CAICT |
R1-2501270 | Specification support for beam management | Fraunhofer HHI, Fraunhofer IIS |
R1-2501333 | Specification support for AI/ML beam management | ITL |
R1-2501440 | FL summary #1 for AI/ML in beam management | Moderator (Samsung) |
R1-2501441 | FL summary #2 for AI/ML in beam management | Moderator (Samsung) |
R1-2501442 | FL summary #3 for AI/ML in beam management | Moderator (Samsung) |
R1-2501443 | FL summary #4 for AI/ML in beam management | Moderator (Samsung) |
R1-2501594 | FL summary #5 for AI/ML in beam management | Moderator (Samsung) |
R1-2501595 | FL summary #6 for AI/ML in beam management | Moderator (Samsung) |
TDoc | Title | Source |
---|---|---|
R1-2500060 | AI/ML for Positioning Accuracy Enhancement | Ericsson |
R1-2500067 | Discussion on AI/ML-based positioning enhancement | ZTE Corporation, Pengcheng Laboratory |
R1-2500090 | Discussion on AI/ML for positioning accuracy enhancement | Huawei, HiSilicon |
R1-2500202 | Discussion on AI/ML-based positioning | CATT, CICTCI |
R1-2500275 | Discussion on specification support for positioning accuracy enhancement | CMCC |
R1-2500338 | Specification support for positioning accuracy enhancement | vivo |
R1-2500405 | Specification support for positioning accuracy enhancement | Tejas Networks Limited |
R1-2500466 | On specification for AI/ML-based positioning accuracy enhancements | OPPO |
R1-2500518 | Discussion on specification support for AI-ML based positioning accuracy enhancement | Baicells |
R1-2500546 | AI/ML based Positioning | |
R1-2500556 | Discussion on AIML positioning | TCL |
R1-2500606 | Discussion on specification support for AIML based positioning accuracy enhancement | NEC |
R1-2500636 | Specification impacts for AI/ML positioning | Lenovo |
R1-2500643 | Specification support for AI/ML for positioning accuracy enhancement | Sony |
R1-2500670 | Discussion on specification support for positioning accuracy enhancement | Ruijie Networks Co. Ltd |
R1-2500687 | Specification support for AI-enabled positioning | NVIDIA |
R1-2500711 | Discussion on AI/ML-based positioning accuracy enhancement | Xiaomi |
R1-2500746 | Discussion on support for AIML positioning | InterDigital, Inc. |
R1-2500767 | Discussion on Specification Support for AI/ML-based positioning | Apple |
R1-2500835 | Discussion for supporting AI/ML based positioning accuracy enhancement | Samsung |
R1-2500901 | Discussion on specification support for positioning accuracy enhancement | ETRI |
R1-2500926 | Discussion on specification support for AIML-based positioning accuracy enhancement | Fujitsu |
R1-2500971 | AI/ML for Positioning Accuracy Enhancement | Nokia |
R1-2500991 | AI/ML positioning accuracy enhancement | Fraunhofer IIS, Fraunhofer HHI |
R1-2501131 | Discussion on specification support for AI/ML based positioning accuracy enhancements | Sharp |
R1-2501145 | Specification support for AI-ML-based positioning accuracy enhancement | Qualcomm Incorporated |
R1-2501191 | Discussion on AI/ML for positioning accuracy enhancement | NTT DOCOMO, INC. |
R1-2501247 | Discussion on Specification Support of AI/ML for Positioning Accuracy Enhancement | Indian Institute of Tech (M) |
R1-2501259 | Design for AI/ML based positioning | MediaTek Korea Inc. |
R1-2501273 | Discussion on specification support for AI/ML Positioning Accuracy enhancement | CEWiT |
R1-2501283 | Discussions on specification support for positioning accuracy enhancement for AI/ML | ITL |
R1-2501410 | Summary #1 of specification support for positioning accuracy enhancement | Moderator (Ericsson) |
R1-2501411 | Summary #2 of specification support for positioning accuracy enhancement | Moderator (Ericsson) |
R1-2501412 | Summary #3 of specification support for positioning accuracy enhancement | Moderator (Ericsson) |
R1-2501413 | Summary #4 of specification support for positioning accuracy enhancement | Moderator (Ericsson) |
R1-2501414 | Summary #5 of specification support for positioning accuracy enhancement | Moderator (Ericsson) |
R1-2501521 | Summary#1 on reply LS to SA2 on LMF-based AI/ML Positioning for case 2b and 3b | Moderator (vivo) |
R1-2501522 | Draft reply LS on LMF-based AI/ML Positioning for Case 2b | vivo, Ericsson |
R1-2501523 | Reply LS on LMF-based AI/ML Positioning for Case 2b | RAN1, vivo |
R1-2501524 | [DRAFT] reply LS on LMF-based AI/ML Positioning for Case 3b | Ericsson, vivo |
R1-2501525 | Reply LS on LMF-based AI/ML Positioning for Case 3b | RAN1, Ericsson |
R1-2501627 | [DRAFT] LS on AI/ML Positioning Case 3b | Moderator (Ericsson) |
R1-2501628 | LS on AI/ML Positioning Case 3b | RAN1, Ericsson |
R1-2501629 | Final summary specification support for positioning accuracy enhancement | Moderator (Ericsson) |
R1-2501639 | [DRAFT] LS on AI/ML Positioning Case 3b | Moderator (Ericsson) |
TDoc | Title | Source |
---|---|---|
R1-2500057 | AI/ML for CSI prediction | Ericsson |
R1-2500068 | Discussion on specification support for AI CSI prediction | ZTE Corporation, Sanechips |
R1-2500091 | Discussion on AI/ML for CSI prediction | Huawei, HiSilicon |
R1-2500160 | Discussion on AIML for CSI prediction | Spreadtrum, UNISOC |
R1-2500203 | Discussion on AI/ML-based CSI prediction | CATT |
R1-2500276 | Discussion on AI/ML for CSI prediction | CMCC |
R1-2500319 | Discussion on CSI Prediction | TCL |
R1-2500339 | Specification support for CSI prediction | vivo |
R1-2500406 | Specification support for CSI Prediction | Tejas Networks Limited |
R1-2500467 | On specification for AI/ML-based CSI prediction | OPPO |
R1-2500533 | On AI/ML-based CSI prediction | InterDigital, Inc. |
R1-2500547 | AI/ML based CSI Prediction | |
R1-2500557 | Discussion on AIML CSI prediction | TCL |
R1-2500566 | Discussions on CSI prediction | LG Electronics |
R1-2500600 | Discussion on specification support for CSI prediction | NEC |
R1-2500637 | Specification support for CSI prediction | Lenovo |
R1-2500644 | Specification Support for AI/ML CSI prediction | Sony |
R1-2500688 | Specification support for AI-enabled CSI prediction | NVIDIA |
R1-2500712 | Discussion on AI/ML model based CSI prediction | Xiaomi |
R1-2500768 | Discussion on AI/ML based CSI prediction | Apple |
R1-2500816 | Discussion on AI/ML-based CSI prediction | Panasonic |
R1-2500836 | Views on AI/ML based CSI prediction | Samsung |
R1-2500902 | Discussion on specification support for CSI prediction | ETRI |
R1-2500927 | Discussion on specification support for CSI prediction | Fujitsu |
R1-2500972 | AI/ML for CSI Prediction | Nokia |
R1-2501014 | AI/ML - Specification support for CSI Prediction | MediaTek Inc. |
R1-2501080 | Discussion on AI/ML for CSI prediction | AT&T |
R1-2501132 | Discussion on specification support for AI/ML based CSI prediction | Sharp |
R1-2501146 | Specification support for CSI prediction | Qualcomm Incorporated |
R1-2501192 | Discussion on AI/ML for CSI prediction | NTT DOCOMO, INC. |
R1-2501528 | Summary #1 of CSI prediction | Moderator (LG Electronics) |
R1-2501529 | Summary #2 of CSI prediction | Moderator (LG Electronics) |
R1-2501530 | Summary #3 of CSI prediction | Moderator (LG Electronics) |
R1-2501610 | Summary #4 of CSI prediction | Moderator (LG Electronics) |
R1-2501626 | Summary #5 of CSI prediction | Moderator (LG Electronics) |
TDoc | Title | Source |
---|---|---|
R1-2500051 | Discussion of CSI compression on AI/ML for NR air interface | FUTUREWEI |
R1-2500058 | AI/ML for CSI compression | Ericsson |
R1-2500069 | Discussion on study for AI/ML CSI compression | ZTE Corporation, Sanechips |
R1-2500151 | Discussion on AI/ML for CSI compression | Huawei, HiSilicon |
R1-2500161 | Discussion on AIML for CSI compression | Spreadtrum, UNISOC |
R1-2500204 | Further study on AI/ML-based CSI compression | CATT |
R1-2500277 | Discussion on AI/ML for CSI compression | CMCC |
R1-2500340 | Discussion on CSI compression | vivo |
R1-2500407 | Discussion on AI/ML for CSI Compression | Tejas Networks Limited |
R1-2500468 | Additional study on AI/ML-based CSI compression | OPPO |
R1-2500534 | On AI/ML-based CSI compression | InterDigital, Inc. |
R1-2500548 | AI/ML based CSI Compression | |
R1-2500558 | Discussion on AIML CSI compression | TCL |
R1-2500567 | Study on CSI compression | LG Electronics |
R1-2500601 | Discussion CSI compression | NEC |
R1-2500638 | On AI/ML for CSI compression | Lenovo |
R1-2500689 | Additional study on AI-enabled CSI compression | NVIDIA |
R1-2500713 | Views on two-side AI/ML model based CSI compression | Xiaomi |
R1-2500769 | Discussion on AI based CSI compression | Apple |
R1-2500817 | Discussion on AI/ML for CSI compression | Panasonic |
R1-2500837 | Views on additional study for AI/ML based CSI compression | Samsung |
R1-2500903 | Discussion on AI/ML for CSI compression | ETRI |
R1-2500928 | Discussion on CSI compression with AI/ML | Fujitsu |
R1-2500973 | AI/ML for CSI Compression | Nokia |
R1-2501015 | Additional study on AI/ML for NR air interface - CSI compression | MediaTek Inc. |
R1-2501119 | AI/ML for CSI feedback enhancement | Mavenir |
R1-2501147 | Additional study on CSI compression | Qualcomm Incorporated |
R1-2501193 | Discussion on AI/ML for CSI compression | NTT DOCOMO, INC. |
R1-2501274 | Discussion on AI/ML for CSI compression | CEWiT |
R1-2501350 | Discussion on two-sided AI/ML model based CSI compression | IIT Kanpur |
R1-2501354 | Discussion on two-sided AI/ML model based CSI compression | IIT Kanpur |
R1-2501468 | Summary#1 of Additional study on AI/ML for NR air interface: CSI compression | Moderator (Qualcomm) |
R1-2501469 | Summary#2 of Additional study on AI/ML for NR air interface: CSI compression | Moderator (Qualcomm) |
R1-2501470 | Summary#3 of Additional study on AI/ML for NR air interface: CSI compression | Moderator (Qualcomm) |
R1-2501471 | Summary#4 of Additional study on AI/ML for NR air interface: CSI compression | Moderator (Qualcomm) |
R1-2501472 | Summary#5 of Additional study on AI/ML for NR air interface: CSI compression | Moderator (Qualcomm) |
R1-2501473 | Summary#6 of Additional study on AI/ML for NR air interface: CSI compression | Moderator (Qualcomm) |
R1-2501474 | Final summary of Additional study on AI/ML for NR air interface: CSI compression | Moderator (Qualcomm) |
R1-2501475 | Updated summary of Evaluation Results for AI/ML CSI compression | Moderator (Qualcomm) |
TDoc | Title | Source |
---|---|---|
R1-2500052 | Discussion on other aspects of AI/ML model and data on AI/ML for NR air-interface | FUTUREWEI |
R1-2500070 | Discussion on other aspects of AI/ML model and data | ZTE Corporation, Sanechips |
R1-2500152 | Discussion on other aspects of the additional study for AI/ML | Huawei, HiSilicon |
R1-2500162 | Discussion on other aspects of AI/ML model and data | Spreadtrum, UNISOC |
R1-2500205 | Further study on AI/ML for other aspects | CATT, CICTCI |
R1-2500255 | Discussion on other aspects of AI ML model and data | China Telecom |
R1-2500278 | Discussion on other aspects of AI/ML model and data | CMCC |
R1-2500341 | Other aspects of AI/ML model and data | vivo |
R1-2500392 | Discussion on other aspects of AI/ML | Ericsson |
R1-2500408 | Other aspects of AI/ML Model and Data | Tejas Networks Limited |
R1-2500469 | Additional study on other aspects of AI/ML model and data | OPPO |
R1-2500549 | AI/ML Model and Data | |
R1-2500559 | Discussions on other aspects of AlML In NR air interface | TCL |
R1-2500568 | Discussion on other aspects of AI/ML model and data | LG Electronics |
R1-2500591 | Discussion on other aspects of AI/ML model and data | NEC |
R1-2500639 | Discussion on other aspects of AI/ML model and data | Lenovo |
R1-2500690 | Additional study on other aspects of AI model and data | NVIDIA |
R1-2500714 | Further study on AI/ML model and data | Xiaomi |
R1-2500770 | Discussion on other aspects of AI/ML models and data | Apple |
R1-2500815 | Discussion on the terminology alignment TR in SA | Panasonic |
R1-2500838 | Views on additional study for other aspects of AI/ML model and data | Samsung |
R1-2500904 | Discussion on other aspects of AI/ML model and data | ETRI |
R1-2500929 | Discussion on other aspects of AI/ML model and data | Fujitsu |
R1-2500974 | Other aspects of AI/ML for two-sided model | Nokia |
R1-2500976 | Discussion on other aspects of AI/ML model and data | Continental Automotive |
R1-2501079 | Other Aspects of AI/ML framework | AT&T |
R1-2501148 | Other aspects of AI/ML model and data | Qualcomm Incorporated |
R1-2501194 | Discussion on other aspects of AI/ML model and data | NTT DOCOMO, INC. |
R1-2501403 | Summary #1 for other aspects of AI/ML model and data | Moderator (OPPO) |
R1-2501404 | Summary #2 for other aspects of AI/ML model and data | Moderator (OPPO) |
R1-2501405 | Summary #3 for other aspects of AI/ML model and data | Moderator (OPPO) |
R1-2501406 | Summary #4 for other aspects of AI/ML model and data | Moderator (OPPO) |
TDoc | Title | Source |
---|---|---|
R1-2500844 | List of RRC impact for Rel-19 MIMO Ph5 | Moderator (Samsung) |
R1-2500845 | Draft LS to RAN2 on MAC impact for Rel-19 MIMO Ph5 | Samsung, MediaTek |
R1-2500846 | LS to RAN2 on MAC impact for Rel-19 MIMO Ph5 | RAN1, Samsung |
TDoc | Title | Source |
---|---|---|
R1-2500056 | Enhancements for UE-initiated/event-driven beam management | FUTUREWEI |
R1-2500097 | On UE initiated/event-driven beam management | Huawei, HiSilicon |
R1-2500104 | Enhancements for UE-initiated/event-driven beam management | MediaTek Inc. |
R1-2500115 | Remaining Details on Rel-19 UE/Event-Driven Beam Management | InterDigital, Inc. |
R1-2500163 | Discussion on UE-initiated/event-driven beam management | Spreadtrum, UNISOC |
R1-2500217 | Views on enhancement for Rel-19 UE-initiated/event-driven beam management | CATT |
R1-2500240 | Discussion on UE-initiated/event-driven beam management | TCL |
R1-2500241 | Discussion on enhancements for UE-initiated/event-driven beam management | ZTE Corporation, Sanechips |
R1-2500279 | Discussion on enhancements for UE-initiated/event-driven beam management | CMCC |
R1-2500342 | Remaining issues on UE-initiated/event-driven beam management | vivo |
R1-2500377 | Discussions on UE-initiated/event-driven beam management | China Telecom Corporation Ltd. |
R1-2500470 | Discussions on UE-initiated/event-driven beam management | OPPO |
R1-2500513 | On UE-initiated/event-driven beam management | Ofinno |
R1-2500569 | UE-initiated beam management | LG Electronics |
R1-2500592 | Discussion on enhancements for UE-initiated or event-driven beam management | NEC |
R1-2500645 | Enhancements for UE-initiated/event-driven beam management | Sony |
R1-2500671 | Discussion on enhancements for UE-initiated/event-driven beam management | Ruijie Networks Co. Ltd |
R1-2500699 | Enhancements for UE-initiated/event-driven beam management | Lenovo |
R1-2500725 | Discussion on enhancements for UE-initiated/event-driven beam management | Xiaomi |
R1-2500771 | Remaining issues for UE-initiated beam management | Apple |
R1-2500839 | Views on Rel-19 UE-initiated/event-driven beam management | Samsung |
R1-2500896 | Enhancements to facilitate UE-initiated/event-driven beam management | Nokia |
R1-2500905 | Enhancements for UE-initiated/event-driven beam management | ETRI |
R1-2500930 | Discussion on enhancements for UE-initiated/event-driven beam management | Fujitsu |
R1-2500942 | Offline summary for Rel-19 MIMO UEIBM (9.2.1) pre-RAN1#120 | Moderator (ZTE) |
R1-2500943 | Moderator Summary #1 on UE-initiated/event-driven beam management | Moderator (ZTE) |
R1-2500944 | Moderator Summary #2 on UE-initiated/event-driven beam management | Moderator (ZTE) |
R1-2500945 | Moderator Summary #3 on UE-initiated/event-driven beam management | Moderator (ZTE) |
R1-2500963 | Enhancements for UE-initiated/event-driven beam management | Transsion Holdings |
R1-2500977 | Enhancements for UE-initiated/Event-Driven Beam Management | Panasonic |
R1-2501084 | Enhancements for UE Initiated Beam Management | Meta |
R1-2501087 | Discussion on enhancements for UE-initiated/event-driven beam management | Hyundai Motor Company |
R1-2501105 | Discussion on the UE-initiated/event-driven beam management | HONOR |
R1-2501127 | Enhancements for UE-initiated/event-driven beam management | Sharp |
R1-2501149 | UE-initiated/event-driven beam management | Qualcomm Incorporated |
R1-2501195 | Discussion on enhancements for UE-initiated/event-driven beam management | NTT DOCOMO, INC. |
R1-2501230 | Discussion on UE-initiated/event-driven beam management | ITRI |
R1-2501236 | Discussion on UE initiated beam report | ASUSTeK |
R1-2501245 | Remaining issues for UE-initiated beam management | Ericsson |
R1-2501264 | Enhancements for UE-initiated/event-driven beam management | KT Corp. |
R1-2501309 | Discussion on enhancements for UE-initiated/event-driven beam management | NICT |
R1-2501334 | Discussion on enhancements for UE-initiated or event-driven beam management | |
R1-2501341 | Discussions on enhancements for UE-initiated/event-driven beam management | KDDI Corporation |
R1-2501556 | Moderator Summary #4 on UE-initiated/event-driven beam management | Moderator (ZTE) |
TDoc | Title | Source |
---|---|---|
R1-2500098 | On 128 CSI-RS ports and UE reporting enhancement | Huawei, HiSilicon |
R1-2500105 | CSI enhancements | MediaTek Inc. |
R1-2500116 | Remaining Details on Rel-19 Enhancements of CSI | InterDigital, Inc. |
R1-2500164 | Discussion on CSI enhancements | Spreadtrum, UNISOC |
R1-2500218 | Discussion on CSI enhancements for NR MIMO Phase 5 | CATT |
R1-2500242 | Discussion on CSI enhancements | ZTE Corporation, Sanechips |
R1-2500280 | Discussion on CSI enhancements | CMCC |
R1-2500317 | CSI enhancements | TCL |
R1-2500343 | Remaining issues on Rel-19 CSI enhancements | vivo |
R1-2500471 | CSI enhancements for Rel-19 MIMO | OPPO |
R1-2500484 | Discussion on Rel-19 CSI Enhancements | Tejas Network Limited |
R1-2500485 | CSI enhancements for Rel. 19 MIMO | Fraunhofer IIS, Fraunhofer HHI |
R1-2500550 | CSI Enhancement for NR MIMO | |
R1-2500598 | Discussion on CSI enhancements | NEC |
R1-2500646 | Discussion of CSI enhancements | Sony |
R1-2500700 | Discussion on CSI enhancements | Lenovo |
R1-2500726 | Further discussion on Rel-19 MIMO CSI enhancements | Xiaomi |
R1-2500772 | Views on R19 MIMO CSI enhancement | Apple |
R1-2500840 | Moderator Summary#1 on Rel-19 CSI enhancements: Round 1 | Moderator (Samsung) |
R1-2500841 | Views on Rel-19 CSI enhancements | Samsung |
R1-2500897 | CSI enhancement for NR MIMO Phase 5 | Nokia |
R1-2500906 | Discussion on CSI enhancements for NR MIMO Phase 5 | ETRI |
R1-2500931 | Remaining issues on Rel-19 CSI enhancements | Fujitsu |
R1-2501073 | Discussion on Open Issues of CSI Enhancement | Rakuten Mobile, Inc |
R1-2501106 | Discussion on CSI enhancements | HONOR |
R1-2501128 | CSI enhancements | Sharp |
R1-2501150 | CSI enhancements for >32 ports and UE-assisted CJT | Qualcomm Incorporated |
R1-2501196 | Discussion on CSI enhancements | NTT DOCOMO, INC., NTT CORPORATION |
R1-2501272 | Remaining issues on CSI enhancements for large antenna arrays and CJT | Ericsson |
R1-2501297 | Discussion on CSI enhancements for NR MIMO Phase 5 | KDDI Corporation |
R1-2501307 | Discussion on CSI enhancements | NICT |
R1-2501361 | Moderator Summary#2 on Rel-19 CSI enhancements: Round 2 | Moderator (Samsung) |
R1-2501362 | Moderator Summary for 1st offline on Rel-19 CSI enhancements | Moderator (Samsung) |
R1-2501571 | Moderator Summary#3 on Rel-19 CSI enhancements: Round 3 | Moderator (Samsung) |
TDoc | Title | Source |
---|---|---|
R1-2500099 | Discussion on 3-antenna-port UL transmission | Huawei, HiSilicon |
R1-2500106 | 3-antenna-port UL transmissions | MediaTek Inc. |
R1-2500117 | Remaining Details on Rel-19 CB-based UL for 3TX UE | InterDigital, Inc. |
R1-2500119 | FL Summary Support for 3TX CB-based Uplink; First Round | Moderator (InterDigital, Inc.) |
R1-2500120 | FL Summary Support for 3TX CB-based Uplink; Second Round | Moderator (InterDigital, Inc.) |
R1-2500121 | Summary of Discussion on 3TX CB-based Uplink in RAN1#120 | Moderator (InterDigital, Inc.) |
R1-2500219 | Views on 3Tx uplink transmissions | CATT |
R1-2500243 | Discussion on 3-antenna-port codebook-based transmissions | ZTE Corporation, Sanechips |
R1-2500281 | Discussion on support for 3-antenna-port codebook-based transmissions | CMCC |
R1-2500344 | Remaining issues on 3-antenna-port codebook-based uplink transmissions | vivo |
R1-2500472 | Discussion on 3-antenna-port uplink transmissions | OPPO |
R1-2500539 | Remaining issues for 3 Tx UL transmissions | Ericsson |
R1-2500551 | Uplink 3 Port Codebook based Transmission | |
R1-2500701 | Support for 3-antenna-port codebook-based transmissions | Lenovo |
R1-2500727 | Discussion on the support of 3-antenna-port CB based transmissions | Xiaomi |
R1-2500773 | Remaining issues on R19 MIMO 3Tx transmission | Apple |
R1-2500842 | Views on Rel-19 3-antenna-port codebook-based transmissions | Samsung |
R1-2500879 | Discussions on 3-antenna-port codebook-based UL transmission | China Telecom Corporation Ltd. |
R1-2500898 | On the support for 3-antenna-port codebook-based transmissions | Nokia |
R1-2500932 | Discussion on uplink enhancement for UE with 3Tx | Fujitsu |
R1-2501129 | Support for 3-antenna-port transmission | Sharp |
R1-2501151 | Remaining issues for 3Tx CB based PUSCH | Qualcomm Incorporated |
R1-2501197 | Discussion on support for 3-antenna-port codebook-based transmissions | NTT DOCOMO, INC. |
TDoc | Title | Source |
---|---|---|
R1-2500100 | Enhancements for asymmetric DL sTRP/UL mTRP scenarios | Huawei, HiSilicon |
R1-2500107 | Enhancement for asymmetric DL sTRP/UL mTRP scenarios | MediaTek Inc. |
R1-2500118 | Remaining Details on Rel-19 Asymmetric mTRP Operation | InterDigital, Inc. |
R1-2500165 | Enhancements for asymmetric DL sTRP/UL mTRP scenarios | Spreadtrum, UNISOC |
R1-2500220 | Discussion on enhancement for asymmetric DL sTRP/UL mTRP scenarios | CATT |
R1-2500239 | Discussion on asymmetric DL sTRP/UL mTRP scenarios | TCL |
R1-2500244 | Discussion on enhancements for asymmetric DL sTRP/UL mTRP scenarios | ZTE Corporation, Sanechips, China Telecom |
R1-2500256 | Discussion on enhancements for asymmetric DL sTRP/UL mTRP scenarios | China Telecom, ZTE |
R1-2500282 | Discussion on enhancement for asymmetric DL sTRP/UL mTRP scenarios | CMCC |
R1-2500345 | Remaining issues on asymmetric DL sTRP/UL mTRP scenarios | vivo |
R1-2500473 | Enhancements on asymmetric DL sTRP/UL mTRP scenarios | OPPO |
R1-2500495 | Remaining issues on asymmetric DL sTRP UL mTRP scenarios | Ericsson |
R1-2500498 | Enhancement for asymmetric DL sTRP UL mTRP | Tejas Network Limited |
R1-2500514 | Enhancements on asymmetric DL STRP/UL MTRP scenarios | Ofinno |
R1-2500570 | Discussions on asymmetric DL sTRP/UL mTRP scenarios | LG Electronics |
R1-2500593 | Discussion on enhancements for asymmetric DL sTRP and UL mTRP scenarios | NEC |
R1-2500647 | Enhancement for asymmetric DL sTRP/UL mTRP scenarios | Sony |
R1-2500702 | Enhancement for asymmetric DL sTRP/UL mTRP scenarios | Lenovo |
R1-2500728 | Discussion on enhancement for asymmetric DL sTRP/UL mTRP scenarios | Xiaomi |
R1-2500774 | Enhancements for asymmetric DL sTRP/UL mTRP | Apple |
R1-2500843 | Views on Rel-19 asymmetric DL sTRP/UL mTRP scenarios | Samsung |
R1-2500899 | Enhancement for asymmetric DL sTRP/UL mTRP scenarios | Nokia |
R1-2500907 | Discussion on UL mTRP and DL single TRP operation | ETRI |
R1-2500933 | Discussion on UL-only mTRP operation | Fujitsu |
R1-2500964 | Discussion on enhancements for asymmetric DL sTRP/UL mTRP scenarios | Transsion Holdings |
R1-2500978 | Enhancement for Asymmetric DL sTRP/UL mTRP Scenarios | Panasonic |
R1-2501121 | Enhancement for asymmetric DL sTRP/UL mTRP scenarios | Sharp |
R1-2501152 | Enhancement for asymmetric DL sTRP and UL mTRP deployment scenarios | Qualcomm Incorporated |
R1-2501198 | Discussion on enhancement for asymmetric DL sTRP/UL mTRP scenarios | NTT DOCOMO, INC. |
R1-2501237 | Discussion on asymmetric DL sTRP and UL mTRP | ASUSTeK |
R1-2501335 | Discussion on enhancement for asymmetric DL sTRP and UL mTRP scenarios | |
R1-2501358 | Summary #1 on Rel-19 asymmetric DL sTRP/UL mTRP | Moderator (OPPO) |
R1-2501359 | Summary #2 on Rel-19 asymmetric DL sTRP/UL mTRP | Moderator (OPPO) |
R1-2501360 | Summary #3 on Rel-19 asymmetric DL sTRP/UL mTRP | Moderator (OPPO) |
TDoc | Title | Source |
---|---|---|
R1-2500157 | Higher layer parameters for Rel-19 SBFD | Huawei, HiSilicon |
R1-2501536 | Summary of Discussion on LS on CSI-RS measurement with SBFD operation | Moderator (MediaTek) |
R1-2501537 | Draft Reply LS on CSI-RS measurement with SBFD operation | Moderator (MediaTek) |
R1-2501560 | Reply LS on CSI-RS measurement with SBFD operation | RAN1, MediaTek |
TDoc | Title | Source |
---|---|---|
R1-2500061 | Discussion on SBFD TX/RX/measurement procedures | TCL |
R1-2500093 | On subband full duplex design | Huawei, HiSilicon |
R1-2500144 | Discussion on transmission, reception and measurement procedures for SBFD operation | ZTE Corporation, Sanechips |
R1-2500166 | Discussion on SBFD TX/RX/measurement procedures | Spreadtrum, UNISOC |
R1-2500221 | Discussion on SBFD TX/RX/measurement procedures | CATT |
R1-2500249 | Discussion on SBFD TX/RX/measurement procedures | LG Electronics |
R1-2500257 | Discussion on SBFD TX/RX/measurement procedures | China Telecom |
R1-2500283 | Discussion on SBFD TX/RX/measurement procedures | CMCC |
R1-2500314 | Discussion on SBFD TX/RX/measurement procedures | MediaTek Inc. |
R1-2500346 | Discussion on Rel-19 SBFD operation | vivo |
R1-2500401 | Discussion for SBFD TX/RX/ measurement procedures | Tejas Networks Limited |
R1-2500454 | Discussion on SBFD Tx/Rx/measurement procedures | OPPO |
R1-2500500 | Discussion on SBFD Tx/Rx/measurement procedures | Fraunhofer HHI, Fraunhofer IIS |
R1-2500515 | Discussion on SBFD TX/RX/measurement procedures | Ofinno |
R1-2500520 | Views on SBFD TX_RX_measurement procedures | InterDigital, Inc. |
R1-2500620 | Discussion on subband non-overlapping full duplex Tx-Rx and measurement operations | NEC |
R1-2500648 | SBFD procedures | Sony |
R1-2500697 | Discussion on SBFD TX/RX/measurement procedures | Panasonic |
R1-2500729 | Discussion on reception and transmission procedure for SBFD operation | Xiaomi |
R1-2500749 | SBFD TX/RX/measurement procedures | Ericsson |
R1-2500775 | Discussion on SBFD TX/RX/measurement procedures | Apple |
R1-2500847 | SBFD operation and procedures | Samsung |
R1-2500880 | Discussion on SBFD TX/RX/ measurement procedures | CEWiT |
R1-2500908 | Discussion on SBFD TX/RX/measurement procedures | ETRI |
R1-2500934 | Discussion on SBFD Tx/Rx/measurement procedures | Fujitsu |
R1-2500965 | Discussion on SBFD operation | Transsion Holdings |
R1-2500988 | Discussion on SBFD TX/RX/measurement procedures | Kookmin University |
R1-2501003 | On SBFD TX/RX/measurement procedures | Nokia, Nokia Shanghai Bell |
R1-2501010 | Views on SBFD TX/RX Measurement Procedures | Lenovo |
R1-2501052 | SBFD Tx/Rx/measurement procedures | Charter Communications, Inc |
R1-2501055 | SBFD Tx/Rx/measurement aspects | Sharp |
R1-2501088 | Discussion on SBFD TX/RX/measurement procedures | Hyundai Motor Company |
R1-2501107 | Discussion on SBFD TX/RX/measurement procedures | HONOR |
R1-2501153 | SBFD Transmission, Reception and Measurement Procedures | Qualcomm Incorporated |
R1-2501199 | Discussion on SBFD TX/RX/measurement procedures | NTT DOCOMO, INC. |
R1-2501228 | Discussion on SBFD TX/RX/measurement procedures | Google Korea LLC |
R1-2501231 | Discussion on SBFD TX/RX/measurement procedures | ITRI |
R1-2501240 | Partial PRG handling for SBFD | ASUSTeK |
R1-2501285 | Discussion on SBFD TX/RX/measurement procedures | WILUS Inc. |
R1-2501338 | Summary #1 of SBFD TX/RX/measurement procedures | Moderator (Xiaomi) |
R1-2501339 | Summary #2 of SBFD TX/RX/measurement procedures | Moderator (Xiaomi) |
R1-2501340 | Summary #3 of SBFD TX/RX/measurement procedures | Moderator (Xiaomi) |
TDoc | Title | Source |
---|---|---|
R1-2500062 | Discussion on SBFD random access operation | TCL |
R1-2500094 | On subband full duplex random access operation | Huawei, HiSilicon |
R1-2500145 | Discussion on SBFD random access operation | ZTE Corporation, Sanechips |
R1-2500167 | Discussion on SBFD random access operation | Spreadtrum, UNISOC |
R1-2500222 | Discussion on SBFD random access operation | CATT |
R1-2500250 | Discussion on SBFD random access operation | LG Electronics |
R1-2500258 | Discussion on SBFD random access operation | China Telecom |
R1-2500284 | Discussion on SBFD random access operation | CMCC |
R1-2500315 | Discussion on SBFD Random Access Operation | MediaTek Inc. |
R1-2500347 | Discussion on random access for Rel-19 SBFD | vivo |
R1-2500402 | Discussion on SBFD Random Access Operation | Tejas Networks Limited |
R1-2500455 | Discussion on SBFD random access operation | OPPO |
R1-2500516 | Discussion on SBFD for random-access procedure | Ofinno |
R1-2500521 | Discussion on SBFD random access operation | InterDigital, Inc. |
R1-2500587 | Discussion on random access for SBFD | NEC |
R1-2500649 | SBFD RACH operations | Sony |
R1-2500698 | Discussion on SBFD random access operation | Panasonic |
R1-2500730 | Discussion on SBFD random access operation | Xiaomi |
R1-2500750 | SBFD Random access operation | Ericsson |
R1-2500776 | Views on SBFD random access operation | Apple |
R1-2500848 | Random access on SBFD resources | Samsung |
R1-2500881 | Discussion on SBFD random access operation | CEWiT |
R1-2500883 | SBFD random access operation | Lenovo |
R1-2500909 | SBFD random access operation | ETRI |
R1-2500935 | Discussion on SBFD random access operation | Fujitsu |
R1-2500966 | Discussion on SBFD random access operation | Transsion Holdings |
R1-2500989 | Discussion on SBFD random access operation | Kookmin University |
R1-2501004 | SBFD random access operation | Nokia, Nokia Shanghai Bell |
R1-2501056 | SBFD random access aspects | Sharp |
R1-2501154 | SBFD Random Access Operation | Qualcomm Incorporated |
R1-2501200 | Discussion on SBFD random access operation | NTT DOCOMO, INC. |
R1-2501227 | Discussion on SBFD Random Access operation | KT Corp. |
R1-2501232 | Discussion on SBFD random access operation for SBFD aware UEs | ITRI |
R1-2501286 | Discussion on SBFD random access operation | WILUS Inc. |
R1-2501291 | On SBFD random access operation | Google Ireland Limited |
R1-2501415 | Summary#1 on SBFD random access operation | Moderator (CMCC) |
R1-2501416 | Summary#2 on SBFD random access operation | Moderator (CMCC) |
R1-2501417 | Summary#3 on SBFD random access operation | Moderator (CMCC) |
TDoc | Title | Source |
---|---|---|
R1-2500095 | On cross-link interference handling for subband full duplex | Huawei, HiSilicon |
R1-2500146 | Discussion on CLI handling for Rel-19 duplex operation | ZTE Corporation, Sanechips |
R1-2500168 | Discussion on CLI handling | Spreadtrum, UNISOC |
R1-2500223 | Discussion on CLI handling for NR duplex evolution | CATT |
R1-2500251 | Discussion on CLI handling | LG Electronics |
R1-2500285 | Discussion on CLI handling | CMCC |
R1-2500316 | Discussion on CLI Handling in SBFD system | MediaTek Inc. |
R1-2500348 | Discussion on CLI handling for Rel-19 NR duplex | vivo |
R1-2500403 | Discussion on gNB-gNB CLI handling | Tejas Networks Limited |
R1-2500456 | CLI handling in NR duplex operation | OPPO |
R1-2500522 | Discussion on CLI handling for SBFD operation | InterDigital, Inc. |
R1-2500588 | CLI handling for NR duplex operations | NEC |
R1-2500650 | SBFD CLI handling | Sony |
R1-2500707 | Discussion on CLI handling | Panasonic |
R1-2500731 | Discussion on CLI handling for SBFD operation | Xiaomi |
R1-2500751 | CLI handling | Ericsson |
R1-2500777 | Discussion on CLI handling | Apple |
R1-2500849 | Cross-link interference handling for SBFD | Samsung |
R1-2500882 | Discussion on CLI handling | CEWiT |
R1-2500910 | Discussion on CLI handling for SBFD operation | ETRI |
R1-2501005 | Cross-link interference handling for duplex evolution | Nokia, Nokia Shanghai Bell |
R1-2501061 | Cross-link interference (CLI) handling | Sharp |
R1-2501155 | Enhancements for CLI handling | Qualcomm Incorporated |
R1-2501201 | Discussion on CLI handling | NTT DOCOMO, INC. |
R1-2501292 | On the gNB-to-gNB CLI and the UE-to-UE CLI handling | Google Ireland Limited |
R1-2501353 | Discussion on CLI handling for Rel-19 NR duplex | vivo |
R1-2501455 | Summary #1 of CLI handling | Moderator (Huawei) |
R1-2501456 | Summary #2 of CLI handling | Moderator (Huawei) |
R1-2501457 | Summary #3 of CLI handling | Moderator (Huawei) |
R1-2501458 | Summary #1 of discussion on RRC parameters for 9.3.3 | Moderator (Huawei) |
R1-2501459 | Summary #2 of discussion on RRC parameters for 9.3.3 | Moderator (Huawei) |
R1-2501460 | Summary #3 of discussion on RRC parameters for 9.3.3 | Moderator (Huawei) |
R1-2501619 | [Draft] LS on L1 based UE-to-UE CLI measurement and reporting | Moderator (Huawei) |
R1-2501620 | LS on L1 based UE-to-UE CLI measurement and reporting | RAN1, Huawei |
TDoc | Title | Source |
---|---|---|
R1-2500286 | Ambient IoT Work Item work plan | CMCC, Huawei, T-Mobile USA |
R1-2501547 | Session notes for 9.4 (Study on solutions for Ambient IoT in NR) | Ad-Hoc Chair (Huawei) |
TDoc | Title | Source |
---|---|---|
R1-2500033 | Modulation aspects for Ambient IoT | Ericsson |
R1-2500044 | Discussion on modulation aspects for A-IoT physical channel | FUTUREWEI |
R1-2500124 | Discussion on Ambient IoT modulation | ZTE Corporation, Sanechips |
R1-2500153 | Physical channels design on modulation | Huawei, HiSilicon |
R1-2500169 | Discussion on modulation aspects of physical channels design for Ambient IoT | Spreadtrum, UNISOC |
R1-2500224 | Ambient IoT physical channel design and modulation | CATT |
R1-2500259 | Discussion on physical channels design about modulation aspects for Ambient IoT | China Telecom |
R1-2500287 | Discussion on modulation aspects of physical channel design | CMCC |
R1-2500349 | Discussion on Modulation Aspects of Physical Channels Design | vivo |
R1-2500394 | AIoT Physical channels design - modulation aspects | Nokia |
R1-2500424 | Discussion on modulation aspects for Ambient IoT physical design | TCL |
R1-2500450 | Discussion on modulation aspects of A-IoT | OPPO |
R1-2500479 | Discussion on modulation aspects for A-IoT physical channel | Tejas Network Limited |
R1-2500497 | Discussion on Physical Channel Modulation Aspects for Ambient-IoT | EURECOM |
R1-2500583 | A-IoT Modulation Aspects | Panasonic |
R1-2500610 | Discussion on modulation aspects of ambient IoT | NEC |
R1-2500651 | Modulation aspects for Ambient IoT | Sony |
R1-2500732 | Discussion on modulation aspects for Ambient IoT | Xiaomi |
R1-2500778 | On modulation aspects for Ambient IoT | Apple |
R1-2500850 | Views on Physical channels design – modulation aspects | Samsung |
R1-2500936 | Modulation for R2D and D2R | Fujitsu |
R1-2500947 | Discussion on D2R modulation schemes for A-IoT | IIT Kharagpur |
R1-2500949 | A-IoT PHY layer design - waveform and modulation aspects | LG Electronics |
R1-2501016 | A-IoT - PHY modulation aspects | MediaTek Inc. |
R1-2501071 | Discussion on modulation aspects for Ambient IoT physical channel design | Lenovo |
R1-2501092 | Discussion on modulation aspects | Sharp |
R1-2501108 | Discussion on Physical channels design for Ambient IoT-modulation aspects | HONOR |
R1-2501117 | Modulation aspects of physical channel design for Ambient IoT | InterDigital, Inc. |
R1-2501156 | Physical channels design – modulation aspects | Qualcomm Incorporated |
R1-2501202 | Discussion on modulation aspects of physical channel design for Ambient IoT | NTT DOCOMO, INC. |
R1-2501287 | Discussion on modulation aspects of physical channels design for Ambient IoT | WILUS Inc. |
R1-2501310 | Discussion on modulation related aspects of AIoT | IIT Kanpur |
R1-2501351 | Discussion on Physical channels design for Ambient IoT | Indian Institute of Tech (M) |
R1-2501372 | Discussion on Ambient IoT modulation | ZTE Corporation, Sanechips |
R1-2501407 | FL summary #1 for Ambient IoT: “9.4.1 Physical channels design – modulation aspects | Moderator (Huawei) |
R1-2501408 | FL summary #2 for Ambient IoT: “9.4.1 Physical channels design – modulation aspects | Moderator (Huawei) |
R1-2501409 | FL summary #3 for Ambient IoT: “9.4.1 Physical channels design – modulation aspects | Moderator (Huawei) |
R1-2501623 | Final summary for Ambient IoT: “9.4.1 Physical channels design – modulation aspects | Moderator (Huawei) |
TDoc | Title | Source |
---|---|---|
R1-2500034 | Coding aspects for Ambient IoT | Ericsson |
R1-2500045 | Discussion on coding aspects for A-IoT physical channel | FUTUREWEI |
R1-2500125 | Discussion on Ambient IoTcoding | ZTE Corporation, Sanechips |
R1-2500154 | Physical channel design on channel coding | Huawei, HiSilicon |
R1-2500170 | Discussion on line coding, FEC, CRC, repetition aspects for Ambient IoT | Spreadtrum, UNISOC |
R1-2500225 | Ambient IoT channel coding and small frequency shift | CATT |
R1-2500260 | Discussion on physical channels design about line coding, FEC, CRC, repetition aspects for Ambient IoT | China Telecom |
R1-2500288 | Discussion on coding aspects of physical channel design | CMCC |
R1-2500350 | Discussion on line coding, FEC, CRC and repetition for A-IoT | vivo |
R1-2500395 | AIoT Physical channels design - line coding, FEC, CRC, repetition aspects | Nokia |
R1-2500425 | Discussion on other aspects for Ambient IoT physical design | TCL |
R1-2500451 | Discussion on physical channels design for A-IoT | OPPO |
R1-2500487 | Discussion on Physical Channel Designs for A-IoT | Panasonic |
R1-2500611 | Physical layer design – line coding, FEC, CRC, repetition aspects | NEC |
R1-2500733 | Discussion on line coding, FEC, CRC and repetition aspects for Ambient IoT | Xiaomi |
R1-2500779 | On coding aspects for Ambient IoT | Apple |
R1-2500851 | Views on Physical channels design – line coding, FEC, CRC, repetition aspects | Samsung |
R1-2500894 | Discussion on general aspects of physical layer design of A-IoT | IIT, Kharagpur |
R1-2500937 | Discussion on coding aspects | Fujitsu |
R1-2500950 | A-IoT PHY layer design - line coding, FEC, CRC and repetition aspects | LG Electronics |
R1-2501017 | A-IoT - PHY line coding, FEC, CRC, repetition aspects | MediaTek Inc. |
R1-2501072 | Discussion on the Ambient IoT physical layer design aspects for Line coding, FEC, CRC, Repetition | Lenovo |
R1-2501093 | Discussion on coding aspects | Sharp |
R1-2501109 | Discussion on Physical channels design for Ambient IoT-other aspects | HONOR |
R1-2501118 | Coding aspects of physical channel design for Ambient IoT | InterDigital, Inc. |
R1-2501124 | Discussion on A-IoT Physical channels design | ASUSTeK |
R1-2501157 | Physical channels design – line coding, FEC, CRC, repetition aspects | Qualcomm Incorporated |
R1-2501203 | Discussion on coding and CRC aspects of physical channel design for Ambient IoT | NTT DOCOMO, INC. |
R1-2501269 | Coding aspects for Ambient IoT | ITL |
R1-2501311 | Discussion on other aspects of Phy design for AIoT | IIT Kanpur |
R1-2501373 | Discussion on Ambient IoT coding | ZTE Corporation, Sanechips |
R1-2501435 | Summary #1 for coding aspects of physical channel design | Moderator (CMCC) |
R1-2501436 | Summary #2 for coding aspects of physical channel design | Moderator (CMCC) |
R1-2501437 | Summary #3 for coding aspects of physical channel design | Moderator (CMCC) |
R1-2501591 | Summary #4 for coding aspects of physical channel design | Moderator (CMCC) |
R1-2501592 | Summary #5 for coding aspects of physical channel design | Moderator (CMCC) |
R1-2501634 | Summary #6 for coding aspects of physical channel design (eom) | Moderator (CMCC) |
TDoc | Title | Source |
---|---|---|
R1-2500035 | Timing acquisition and synchronization for Ambient IoT | Ericsson |
R1-2500046 | Discussion on timing acquisition and synchronization aspects for A-IoT | FUTUREWEI |
R1-2500126 | Discussion on Ambient IoT signals | ZTE Corporation, Sanechips |
R1-2500140 | Discussion on timing acquisition and synchronization for Ambient IoT | Lenovo |
R1-2500155 | Physical signals design | Huawei, HiSilicon |
R1-2500171 | Discussion on timing acquisition and synchronization for Ambient IoT | Spreadtrum, UNISOC |
R1-2500226 | Ambient IoT Timing and synchronization | CATT |
R1-2500261 | Discussion on timing acquisition and synchronization for Ambient IoT | China Telecom |
R1-2500289 | Discussion on timing acquisition and synchronization | CMCC |
R1-2500351 | Discussion on Timing acquisition and synchronization for AIoT | vivo |
R1-2500396 | AIoT Timing acquisition and synchronization | Nokia |
R1-2500426 | Discussion on timing acquisition and synchronization functionalities for Ambient IoT | TCL |
R1-2500452 | Discussion on timing acquisition and synchronization for A-IoT | OPPO |
R1-2500480 | Discussion on timing acquisition and synchronization aspects | Tejas Network Limited |
R1-2500493 | Discussion on timing acquisition and synchronization | InterDigital, Inc. |
R1-2500584 | A-IoT Timing acquisition and synchronization | Panasonic |
R1-2500625 | Discussion on timing acquisition and synchronization | NEC |
R1-2500652 | Timing acquisition and synchronisation for Ambient IoT | Sony |
R1-2500734 | Discussion on timing acquisition and synchronization for Ambient IoT | Xiaomi |
R1-2500780 | On timing acquisition & synchronization aspects for Ambient IoT | Apple |
R1-2500782 | FL Summary#1 on timing acquisition & synchronization for Ambient IoT | Moderator (Apple) |
R1-2500783 | FL Summary#2 on timing acquisition & synchronization for Ambient IoT | Moderator (Apple) |
R1-2500784 | FL Summary#3 on timing acquisition & synchronization for Ambient IoT | Moderator (Apple) |
R1-2500852 | Views on timing acquisition and synchronization | Samsung |
R1-2500911 | Discussion on timing acquisition and synchronization | ETRI |
R1-2500938 | Discussion on timing acquisition and synchronization | Fujitsu |
R1-2500951 | Timing acquisition and synchronization for A-IoT | LG Electronics |
R1-2501018 | A-IoT - Timing acquisition and synchronization | MediaTek Inc. |
R1-2501094 | Discussion on timing acquisition and synchronization | Sharp |
R1-2501110 | Discussion on timing acquisition and synchronization | HONOR |
R1-2501125 | Discussion on end timing acquisition | ASUSTeK |
R1-2501158 | Timing acquisition and synchronization | Qualcomm Incorporated |
R1-2501204 | Discussion on timing acquisition and synchronization for Ambient IoT | NTT DOCOMO, INC. |
R1-2501275 | Discussion on timing acquisition and synchronization aspects for Ambient IoT | CEWiT |
R1-2501312 | Discussion on timing and synchronization aspects for AIoT | IIT Kanpur |
R1-2501365 | Discussion on timing acquisition and synchronization | HONOR |
R1-2501616 | FL Summary#4 on timing acquisition & synchronization for Ambient IoT | Moderator (Apple) |
R1-2501617 | Final summary on timing acquisition & synchronization for Ambient IoT | Moderator (Apple) |
TDoc | Title | Source |
---|---|---|
R1-2500036 | Other aspects for Ambient IoT | Ericsson |
R1-2500047 | Discussion on multiple access, scheduling and timing aspects for A-IoT | FUTUREWEI |
R1-2500127 | Discussion on Ambient IoT multiple access and timing | ZTE Corporation, Sanechips |
R1-2500141 | Discussion on multiple access, scheduling and timing aspects for Ambient IoT | Lenovo |
R1-2500156 | Multiplexing, scheduling, and other physical-layer procedures | Huawei, HiSilicon |
R1-2500172 | Discussion on other aspects for Ambient IoT | Spreadtrum, UNISOC |
R1-2500227 | Ambient IoT frame structure, system control and resource allocation | CATT |
R1-2500262 | Discussion on other aspects for Ambient IoT | China Telecom |
R1-2500290 | Discussion on access, scheduling and timing relationships | CMCC |
R1-2500352 | Discussion on other aspects for Rel-19 Ambient IoT | vivo |
R1-2500397 | AIoT Other aspects incl. multiplexing/multiple access, scheduling information, and timing relationships | Nokia |
R1-2500453 | Discussions on other aspects of A-IoT communication | OPPO |
R1-2500481 | Discussion on multiple access, scheduling and timing aspects for A-IoT | Tejas Network Limited |
R1-2500488 | Discussion on other aspects of A-IoT | Panasonic |
R1-2500494 | Discussion on other aspects including multiplexing/multiple access, scheduling information, and timing relationships | InterDigital, Inc. |
R1-2500517 | Views on other aspects for AIoT | Ofinno |
R1-2500563 | Discussion on multiple access, scheduling and timing for Ambient IoT | Lekha Wireless Solutions |
R1-2500612 | Discussion on control and other aspects of ambient IoT | NEC |
R1-2500653 | Multiplexing, multiple access and timing relationships for Ambient IoT | Sony |
R1-2500735 | Discussion on other aspects for Ambient IoT | Xiaomi |
R1-2500781 | On multiple Access, scheduling and control for Ambient IoT | Apple |
R1-2500853 | Views on aspects including multiplexing/multiple access, scheduling information, and timing relationships | Samsung |
R1-2500912 | Discussion on other aspects of Ambient IoT | ETRI |
R1-2500939 | Discussion on other aspects for Ambient IoT | Fujitsu |
R1-2500952 | Other aspects for A-IoT | LG Electronics |
R1-2501019 | A-IoT - Other aspects | MediaTek Inc. |
R1-2501095 | Discussion on other aspects | Sharp |
R1-2501111 | Discuss on L1 control information and L1 procedural aspects | HONOR |
R1-2501126 | Discussion on control information and procedural aspects | ASUSTeK |
R1-2501159 | Discussion on other aspects for Rel-19 Ambient IoT | Qualcomm Incorporated |
R1-2501205 | Discussion on other aspects for Ambient IoT | NTT DOCOMO, INC. |
R1-2501276 | Discussion on multiple access, scheduling and timing aspects for Ambient IoT | CEWiT |
R1-2501288 | Discussion on multiplexing/multiple access and timing relationships for Ambient IoT | WILUS Inc. |
R1-2501298 | Discussion on multiple access, scheduling information and timing relationships for Ambient IoT | TCL |
R1-2501313 | Discussion on other aspects of AIoT | IIT Kanpur |
R1-2501336 | Discussion on multiplexing, multiple access, scheduling information, and timing relationships | |
R1-2501347 | Discussion on aspects for Ambient IoT | Sequans Communications |
R1-2501355 | FL summary #1 on other aspects for Rel-19 Ambient IoT | Moderator (vivo) |
R1-2501356 | FL summary #2 on other aspects for Rel-19 Ambient IoT | Moderator (vivo) |
R1-2501357 | FL summary #3 on other aspects for Rel-19 Ambient IoT | Moderator (vivo) |
R1-2501625 | Final FL summary on other aspects for Rel-19 Ambient IoT | Moderator (vivo) |
TDoc | Title | Source |
---|---|---|
R1-2501248 | List of RAN1 agreements for R19 NES WI until RAN1#119 | Rapporteur (Ericsson) |
R1-2501249 | Initial list of RRC parameters for R19 NES WI | Rapporteur (Ericsson) |
R1-2501647 | Updated list of RAN1 agreements for Rel-19 NES WI | Rapporteur (Ericsson) |
TDoc | Title | Source |
---|---|---|
R1-2500053 | Discussion of on-demand SSB Scell operation | FUTUREWEI |
R1-2500077 | On-demand SSB SCell operation for eNES | Huawei, HiSilicon |
R1-2500128 | Discussion on on-demand SSB for NES | ZTE Corporation, Sanechips |
R1-2500173 | Discussion on on-demand SSB SCell operation | Spreadtrum, UNISOC |
R1-2500228 | Discussion on on-demand SSB SCell operation | CATT |
R1-2500263 | Discussion on on-demand SSB operation for SCell | China Telecom |
R1-2500291 | Discussion on on-demand SSB SCell operation | CMCC |
R1-2500353 | Discussion on on-demand SSB Scell operation | vivo |
R1-2500400 | On demand SSB for connected UEs | Tejas Networks Limited |
R1-2500440 | Discussion on the enhancement to support on demand SSB SCell operation | OPPO |
R1-2500476 | On-demand SSB SCell Operation | Nokia, Nokia Shanghai Bell |
R1-2500489 | Discussion on on-demand SSB SCell operation | Panasonic |
R1-2500525 | Discussion on on-demand SSB SCell operation | InterDigital, Inc. |
R1-2500552 | On-demand SSB SCell Operation | |
R1-2500621 | Discussion on on-demand SSB for SCell operation | NEC |
R1-2500682 | Discussion on On-demand SSB SCell operation | KT Corp. |
R1-2500736 | Discussion on on-demand SSB SCell operation | Xiaomi |
R1-2500785 | On-demand SSB SCell Operation | Apple |
R1-2500854 | On-demand SSB SCell operation | Samsung |
R1-2500884 | On-demand SSB SCell operation | Lenovo |
R1-2500913 | Discussion on On-demand SSB SCell operation | ETRI |
R1-2500940 | Discussion on on-demand SSB SCell operation | Fujitsu |
R1-2500953 | On-demand SSB SCell operation | LG Electronics |
R1-2500967 | Discussion on On-Demand SSB SCell operation | Transsion Holdings |
R1-2501020 | On-demand SSB SCell operation | MediaTek Inc. |
R1-2501123 | Discussion of On-demand SSB SCell operation | Mavenir |
R1-2501160 | On-demand SSB operation for Scell | Qualcomm Incorporated |
R1-2501186 | Discussion on remaining details of on-demand SSB operation on SCell | Sharp |
R1-2501206 | Discussion on on-demand SSB SCell operation | NTT DOCOMO, INC. |
R1-2501233 | Discussion on on-demand SSB SCell operation | ITRI |
R1-2501238 | Discussion on on-demand SSB Scell operation for NES | TCL |
R1-2501241 | DCI based signaling for on-demand SSB | ASUSTeK |
R1-2501242 | DCI based signaling for on-demand SSB | ASUSTeK |
R1-2501251 | On-demand SSB SCell operation | Ericsson |
R1-2501277 | Discussion on on-demand SSB Scell operation | CEWiT |
R1-2501493 | Summary #1 of on-demand SSB for NES | Moderator (LG Electronics) |
R1-2501494 | Summary #2 of on-demand SSB for NES | Moderator (LG Electronics) |
R1-2501495 | Summary #3 of on-demand SSB for NES | Moderator (LG Electronics) |
R1-2501496 | Summary #4 of on-demand SSB for NES | Moderator (LG Electronics) |
R1-2501632 | Draft LS on time location of on-demand SSB for Scell | LG Electronics |
R1-2501633 | LS on time location of on-demand SSB for Scell | RAN1, LG Electronics |
R1-2501635 | Summary #5 of on-demand SSB for NES | Moderator (LG Electronics) |
TDoc | Title | Source |
---|---|---|
R1-2500054 | Discussion of on-demand SIB1 for idle/inactive mode UEs | FUTUREWEI |
R1-2500078 | Discussion on on-demand SIB1 for eNES | Huawei, HiSilicon |
R1-2500129 | Discussion on on-demand SIB1 for NES | ZTE Corporation, Sanechips |
R1-2500174 | Discussion on on-demand SIB1 for idle/inactive mode UEs | Spreadtrum, UNISOC |
R1-2500229 | Discussion on on-demand SIB1 | CATT |
R1-2500264 | Discussion on on-demand SIB1 for idle/inactive mode UEs | China Telecom |
R1-2500292 | Discussion on on-demand SIB1 for UEs in idle/inactive mode | CMCC |
R1-2500354 | Discussion on on-demand SIB1 for idle/inactive mode UEs | vivo |
R1-2500398 | On demand SIB1 for idle/inactive UEs | Tejas Networks Limited |
R1-2500441 | Discussion on the enhancement to support on demand SIB1 for idle/inactive mode UE | OPPO |
R1-2500477 | On-demand SIB1 for Idle/Inactive mode UEs | Nokia, Nokia Shanghai Bell |
R1-2500490 | Discussion on on-demand SIB1 for idle/inactive mode UEs | Panasonic |
R1-2500526 | Discussion on on-demand SIB1 for idle/inactive mode UEs | InterDigital, Inc. |
R1-2500553 | On-demand SIB1 for Idle/Inactive Mode UE | |
R1-2500622 | Discussion on on-demand SIB1 for UEs in idle/inactive mode | NEC |
R1-2500629 | Discussion on on-demand SIB1 transmission for network energy savings | Fujitsu |
R1-2500654 | On-demand SIB1 for idle/inactive mode UEs | Sony |
R1-2500737 | Discussion on on-demand SIB1 for idle/inactive mode UEs | Xiaomi |
R1-2500786 | On On-demand SIB1 for IDLE/INACTIVE mode UEs | Apple |
R1-2500855 | On-demand SIB1 for idle/inactive mode UEs | Samsung |
R1-2500885 | On-demand SIB1 for idle/inactive mode UEs | Lenovo |
R1-2500914 | On-demand SIB1 for idle/inactive mode UEs | ETRI |
R1-2500954 | On-demand SIB1 for idle/inactive mode UEs | LG Electronics |
R1-2500968 | Discussion on on-demand SIB1 transmission for idle/inactive mode UEs | Transsion Holdings |
R1-2501021 | On-demand SIB1 for idle or inactive mode UEs | MediaTek Inc. |
R1-2501049 | Views on On-demand SIB1 for idle-inactive UEs | Vodafone |
R1-2501089 | Discussion on on-demand SIB1 for idle/inactive mode UEs | DENSO CORPORATION |
R1-2501133 | Discussion on on-demand SIB1 transmission for idle UEs | Sharp |
R1-2501161 | On-demand SIB1 procedure | Qualcomm Incorporated |
R1-2501207 | Discussion on on-demand SIB1 for idle/inactive mode UEs | NTT DOCOMO, INC. |
R1-2501252 | On-demand SIB1 for UEs in idle/inactive mode for NES | Ericsson |
R1-2501263 | Discussion on on-demand SIB1 in idle/inactive mode | CAICT |
R1-2501278 | Discussion on on-demand SIB1 | CEWiT |
R1-2501299 | On-demand SIB1 for NES | Fraunhofer IIS, Fraunhofer HHI |
R1-2501378 | FL summary 1 for on-demand SIB1 in idle/inactive mode | Moderator (MediaTek) |
R1-2501379 | FL summary 2 for on-demand SIB1 in idle/inactive mode | Moderator (MediaTek) |
R1-2501380 | FL summary 3 for on-demand SIB1 in idle/inactive mode | Moderator (MediaTek) |
R1-2501381 | FL summary 4 for on-demand SIB1 in idle/inactive mode | Moderator (MediaTek) |
R1-2501382 | FL summary 5 for on-demand SIB1 in idle/inactive mode | Moderator (MediaTek) |
TDoc | Title | Source |
---|---|---|
R1-2500055 | Discussion of the adaptation of common signal/channel transmissions | FUTUREWEI |
R1-2500079 | On common channel/signal adaptation for eNES | Huawei, HiSilicon |
R1-2500130 | Discussion on common signal channel for NES | ZTE Corporation, Sanechips |
R1-2500175 | Discussion on adaptation of common signal/channel transmissions | Spreadtrum, UNISOC |
R1-2500230 | Discussion on adaptation of common signal/channel transmissions | CATT |
R1-2500265 | Discussion on common signal/channel adaptation | China Telecom |
R1-2500293 | Discussion on adaptation of common signal/channel transmissions | CMCC |
R1-2500355 | Discussion on adaptation of common signal/channel transmissions | vivo |
R1-2500399 | Adaptation of common signals/channels | Tejas Networks Limited |
R1-2500442 | Discussion on adaptation of common signal/channel transmission | OPPO |
R1-2500478 | Adaptation of common signal/channel transmissions | Nokia, Nokia Shanghai Bell |
R1-2500527 | Discussion on adaptation of common signal/channel transmissions | InterDigital, Inc. |
R1-2500554 | Adaptation of Common Signals | |
R1-2500623 | Discussion on adaptation of common signal/channel transmissions | NEC |
R1-2500630 | Discussion on adaptation of common signal / channel transmissions | Fujitsu |
R1-2500655 | Adaptation of common signal/channel transmissions | Sony |
R1-2500683 | Discussion on Adaptation of common signal/channel transmissions | KT Corp. |
R1-2500738 | Discussion on adaptation of common signal and channel transmissions | Xiaomi |
R1-2500787 | On adaptation of common signal/channel for NES enhancements | Apple |
R1-2500856 | Adaptation of common signal/channel transmissions | Samsung |
R1-2500915 | Adaptation of common signal/channel transmissions | ETRI |
R1-2500946 | Discussion on adaptation of common signal/channel transmission | Panasonic |
R1-2500955 | Adaptation of common signal/channel transmissions | LG Electronics |
R1-2500969 | Discussion on adaptive transmission of common signal or common channel | Transsion Holdings |
R1-2501022 | Adaptation of common signal/channel transmissions | MediaTek Inc. |
R1-2501053 | Adaptation of common signals and channels | Lenovo |
R1-2501112 | Discussion on adaptation of common signal channel transmissions | HONOR |
R1-2501134 | Discussion on adaptation of common signal/channel transmissions | Sharp |
R1-2501162 | Adaptation of common channel transmissions | Qualcomm Incorporated |
R1-2501208 | Discussion on adaptation of common signal/channel transmissions | NTT DOCOMO, INC. |
R1-2501253 | Adaptation of common signal/channel transmissions for NES | Ericsson |
R1-2501279 | Discussion on adaptation of common signal and channel transmissions | CEWiT |
R1-2501451 | Summary#1 of AI 9.5.3 for R19 NES | Moderator (Ericsson) |
R1-2501452 | Summary#2 of AI 9.5.3 for R19 NES | Moderator (Ericsson) |
R1-2501453 | Summary#3 of AI 9.5.3 for R19 NES | Moderator (Ericsson) |
R1-2501599 | Summary#4 of AI 9.5.3 for R19 NES | Moderator (Ericsson) |
R1-2501600 | Final Summary of AI 9.5.3 for R19 NES | Moderator (Ericsson) |
TDoc | Title | Source |
---|---|---|
R1-2500356 | Rapporteur input on RRC parameters for Rel-19 LP-WUS/WUR | vivo, DOCOMO |
R1-2501585 | Summary of RAN1 agreements on LP-WUS/WUR for NR | Rapporteur (vivo) |
R1-2501630 | Summary of discussion on RRC parameters for Rel-19 LP-WUS/WUR | vivo (WI rapporteur) |
TDoc | Title | Source |
---|---|---|
R1-2500048 | Discussion on LP-WUS and LP-SS Design | FUTUREWEI |
R1-2500063 | Discussion on LP-WUS and LP-SS Design | TCL |
R1-2500073 | Signal Design of LP-WUS and LP-SS | Huawei, HiSilicon |
R1-2500131 | Discussion on LP-WUS design | ZTE Corporation, Sanechips |
R1-2500176 | Discussion on LP-WUS and LP-SS design | Spreadtrum, UNISOC |
R1-2500231 | Design of LP-WUS and LP-SS | CATT |
R1-2500294 | Discussion on LP-WUS and LP-SS design | CMCC |
R1-2500357 | Discussion on LP-WUS and LP-SS design | vivo |
R1-2500437 | Signal design for LP-WUS and LP-SS | OPPO |
R1-2500491 | Discussion on the LP-WUS and LP-SS design | Panasonic |
R1-2500496 | Discussion on LP-WUS and LP-SS Design | EURECOM |
R1-2500530 | Discussion on LP-WUS and LP-SS design | InterDigital, Inc. |
R1-2500573 | LP-WUS and LP-SS design | Nokia |
R1-2500602 | Discussion on LP-WUS and LP-SS design | NEC |
R1-2500656 | LP-WUS and LP-SS design | Sony |
R1-2500739 | Discussion on LP-WUS and LP-SS design | Xiaomi |
R1-2500788 | LP-WUS and LP-SS design | Apple |
R1-2500857 | Discussion on LP-WUS and LP-SS design | Samsung |
R1-2500956 | Discussion on LP-WUS and LP-SS design | LG Electronics |
R1-2501023 | LP-WUS and LP-SS design | MediaTek Inc. |
R1-2501096 | Discussion on LP-WUS and LP-SS design | Sharp |
R1-2501100 | Discussion on LP-WUS and LP-SS design | Lenovo |
R1-2501113 | Discussion on LP-WUS and LP-SS design | HONOR |
R1-2501163 | LP-WUS and LP-SS design | Qualcomm Incorporated |
R1-2501209 | Discussion on LP-WUS and LP-SS design | NTT DOCOMO, INC. |
R1-2501254 | LP-WUS and LP-SS design | Ericsson |
R1-2501294 | On LP-WUS and LP-SS design | Nordic Semiconductor ASA |
R1-2501364 | Signal design for LP-WUS and LP-SS | OPPO |
R1-2501424 | Summary #1 of discussions on LP-WUS and LP-SS design | Moderator (vivo) |
R1-2501425 | Summary #2 of discussions on LP-WUS and LP-SS design | Moderator (vivo) |
R1-2501519 | Summary #3 of discussions on LP-WUS and LP-SS design | Moderator (vivo) |
R1-2501520 | Summary #4 of discussions on LP-WUS and LP-SS design | Moderator (vivo) |
R1-2501583 | Summary #5 of discussions on LP-WUS and LP-SS design | Moderator (vivo) |
R1-2501584 | Final summary of discussions on LP-WUS and LP-SS design | Moderator (vivo) |
TDoc | Title | Source |
---|---|---|
R1-2500049 | Discussion on LP-WUS Operation in IDLE/INACTIVE Modes | FUTUREWEI |
R1-2500064 | Discussion on LP-WUS Operation in IDLE/INACTIVE state | TCL |
R1-2500074 | Procedures and functionalities of LP-WUS in IDLE/INACTIVE mode | Huawei, HiSilicon |
R1-2500132 | Discussion on LP-WUS operation in IDLE/INACTIVE mode | ZTE Corporation, Sanechips |
R1-2500177 | Discussion on LP-WUS operation in IDLE/INACTIVE modes | Spreadtrum, UNISOC |
R1-2500232 | System design and procedure of LP-WUS operation for UE in IDLE/Inactive Modes | CATT |
R1-2500295 | Discussion on LP-WUS operation in IDLE/INACTIVE modes | CMCC |
R1-2500358 | Discussion on LP-WUS operation in IDLE/INACTIVE modes | vivo |
R1-2500438 | Further consideration on LP-WUS operation in RRC_IDLE/INACTIVE modes | OPPO |
R1-2500492 | Discussion on LP-WUS operation in IDLE/INACTIVE modes | Panasonic |
R1-2500531 | Discussion on LP-WUS operation in IDLE/INACTIVE modes | InterDigital, Inc. |
R1-2500574 | LP-WUS operation in IDLE/Inactive mode | Nokia |
R1-2500603 | Discussion on LP-WUS operation in RRC IDLE/INACTIVE mode | NEC |
R1-2500657 | LP-WUS operation in IDLE / INACTIVE modes | Sony |
R1-2500740 | Discussion on LP-WUS operation in Idle/Inactive modes | Xiaomi |
R1-2500789 | LP-WUS operation in IDLE/INACTIVE modes | Apple |
R1-2500791 | Summary #1 on LP-WUS operation in IDLE/INACTIVE mode | Moderator (Apple) |
R1-2500792 | Summary #2 on LP-WUS operation in IDLE/INACTIVE mode | Moderator (Apple) |
R1-2500793 | Summary #3 on LP-WUS operation in IDLE/INACTIVE mode | Moderator (Apple) |
R1-2500794 | Summary #4 on LP-WUS operation in IDLE/INACTIVE mode | Moderator (Apple) |
R1-2500795 | Summary #5 on LP-WUS operation in IDLE/INACTIVE mode | Moderator (Apple) |
R1-2500858 | Discussion on LP-WUS operation in IDLE/INACTIVE modes | Samsung |
R1-2500916 | Discussion on LP-WUS operation in IDLE/INACTIVE modes | ETRI |
R1-2500957 | Discussion on LP-WUS operation in IDLE/INACTIVE modes | LG Electronics |
R1-2501024 | LP-WUS operation in IDLE/INACTIVE modes | MediaTek Inc. |
R1-2501097 | Discussion on LP-WUS operation in IDLE/INACTIVE modes | Sharp |
R1-2501101 | Discussion on LP-WUS operation in Idle/Inactive modes | Lenovo |
R1-2501164 | LP-WUR operation in idle and inactive modes | Qualcomm Incorporated |
R1-2501210 | Discussion on LP-WUS operation in IDLE/INACTIVE modes | NTT DOCOMO, INC. |
R1-2501255 | LP-WUS operation in IDLE and INACTIVE modes | Ericsson |
R1-2501293 | On LP-WUS operation in IDLE/Inactive | Nordic Semiconductor ASA |
R1-2501615 | Draft LS on the wake-up delay for LP-WUS operation in IDLE/INACTIVE mode | Moderator (Apple) |
R1-2501624 | LS on the wake-up delay for LP-WUS operation in IDLE/INACTIVE mode | RAN1, Apple |
TDoc | Title | Source |
---|---|---|
R1-2500075 | Procedures and functionalities of LP-WUS in CONNECTED mode | Huawei, HiSilicon |
R1-2500133 | Discussion on LP-WUS operation in CONNECTED mode | ZTE Corporation, Sanechips |
R1-2500178 | Discussion on LP-WUS operation in CONNECTED modes | Spreadtrum, UNISOC |
R1-2500233 | System design and procedure of LP-WUS operation for UE in CONNECTED Modes | CATT |
R1-2500296 | Discussion on LP-WUS operation in CONNECTED mode | CMCC |
R1-2500359 | Discussion on LP-WUS operation in CONNECTED modes | vivo |
R1-2500439 | Further consideration on LP-WUS operation in connected mode | OPPO |
R1-2500505 | Discussion on LP-WUS operation in CONNECTED mode | Panasonic |
R1-2500532 | Discussion on RRC CONNECTED mode LP-WUS monitoring | InterDigital, Inc. |
R1-2500575 | LP-WUS operation in CONNECTED mode | Nokia |
R1-2500604 | Discussion on LP-WUS operation in RRC CONNECTED mode | NEC |
R1-2500658 | LP-WUS operation in CONNECTED mode | Sony |
R1-2500741 | Discussion on LP-WUS operation in Connected mode | Xiaomi |
R1-2500790 | LP-WUS operation in CONNECTED modes | Apple |
R1-2500859 | Discussion on LP-WUS operation in CONNECTED modes | Samsung |
R1-2500886 | Discussion on LP-WUS operation in CONNECTED modes | Lenovo |
R1-2500917 | Discussion on LP-WUS operation in CONNECTED modes | ETRI |
R1-2500958 | Discussion on LP-WUS operation in CONNECTED modes | LG Electronics |
R1-2501025 | LP-WUS operation in CONNECTED modes | MediaTek Inc. |
R1-2501098 | Discussion on LP-WUS operation in CONNECTED modes | Sharp |
R1-2501165 | LP-WUR operation in connected mode | Qualcomm Incorporated |
R1-2501211 | Discussion on LP-WUS operation in CONNECTED mode | NTT DOCOMO, INC. |
R1-2501256 | LP-WUS operation in CONNECTED mode | Ericsson |
R1-2501296 | Discussion on LP-WUS procedures in Connected mode | TCL |
R1-2501420 | FL summary #1 on LP-WUS operation in CONNECTED mode | Moderator (NTT DOCOMO) |
R1-2501487 | FL summary #2 on LP-WUS operation in CONNECTED mode | Moderator (NTT DOCOMO) |
R1-2501535 | FL summary #3 on LP-WUS operation in CONNECTED mode | Moderator (NTT DOCOMO) |
R1-2501561 | FL summary #4 on LP-WUS operation in CONNECTED mode | Moderator (NTT DOCOMO) |
R1-2501586 | FL summary #5 on LP-WUS operation in CONNECTED mode | Moderator (NTT DOCOMO) |
R1-2501587 | Final summary on LP-WUS operation in CONNECTED mode | Moderator (NTT DOCOMO) |
TDoc | Title | Source |
---|---|---|
R1-2500998 | Draft CR for TR 38.901 to introduce channel model for ISAC | Xiaomi, AT&T |
R1-2501548 | Session notes for 9.7 (Study on channel modelling for Integrated Sensing And Communication for NR) | Ad-Hoc Chair (Huawei) |
R1-2501640 | Draft CR for TR 38.901 to introduce channel model for ISAC | Moderator (Xiaomi) |
R1-2501641 | Summary on discussions on CR to 38.901 on ISAC channel modeling | Moderator (Xiaomi) |
TDoc | Title | Source |
---|---|---|
R1-2500059 | Email discussion summary on ISAC CM calibration assumptions | Moderator (AT&T) |
R1-2500071 | Deployment scenarios for ISAC channel model | Huawei, HiSilicon |
R1-2500234 | Discussion on ISAC deployment scenarios | CATT, CICTCI |
R1-2500266 | Discussion on ISAC deployment scenarios | China Telecom |
R1-2500297 | Discussion on ISAC deployment scenarios | CMCC, China Southern Power Grid |
R1-2500312 | Discussion on ISAC scenario | CALTTA |
R1-2500360 | Views on Rel-19 ISAC deployment scenarios | vivo |
R1-2500413 | Discussion on ISAC deployment scenarios and requirements | EURECOM |
R1-2500417 | Discussion on ISAC deployment scenarios | Tiami Networks |
R1-2500462 | Discussion on ISAC deployment scenarios and calibration | OPPO |
R1-2500482 | Discussion on ISAC Deployment Scenarios | Tejas Network Limited |
R1-2500576 | Discussion on ISAC deployment scenarios | ZTE Corporation, Sanechips |
R1-2500659 | Discussion on ISAC deployment scenarios | Sony |
R1-2500679 | Discussion on ISAC Deployment Scenarios | Nokia, Nokia Shanghai Bell |
R1-2500684 | Discussion on ISAC deployment scenarios | SK Telecom |
R1-2500691 | Deployment scenarios for integrated sensing and communication with NR | NVIDIA |
R1-2500742 | Deployment scenarios and evaluation assumptions for ISAC channel model | Xiaomi |
R1-2500747 | Discussion on ISAC deployment scenarios | InterDigital, Inc. |
R1-2500755 | Discussion on ISAC Deployment Scenarios | Ericsson |
R1-2500796 | Discussion on ISAC deployment scenarios | Apple |
R1-2500860 | Discussion on ISAC deployment scenarios | Samsung |
R1-2500891 | Considerations on ISCA deployment scenarios | CAICT |
R1-2501011 | Discussion on ISAC deployment scenarios for Automotive | Continental Automotive |
R1-2501026 | Discussion on ISAC deployment scenario | MediaTek Inc. |
R1-2501045 | Discussion on ISAC deployment scenarios | LG Electronics |
R1-2501059 | Discussion on ISAC deployment scenarios | Lenovo |
R1-2501076 | FL Summary #1 on ISAC Scenarios and Calibrations | Moderator (AT&T) |
R1-2501077 | FL Summary #2 on ISAC Scenarios and Calibrations | Moderator (AT&T) |
R1-2501078 | FL Summary #3 on ISAC Scenarios and Calibrations | Moderator (AT&T) |
R1-2501081 | ISAC channel model calibration and scenario parameters | AT&T, FirstNet |
R1-2501135 | Discussion on ISAC channel calibration | BUPT, CMCC |
R1-2501166 | Discussion on ISAC deployment scenarios | Qualcomm Incorporated |
R1-2501574 | FL Summary #4 on ISAC Scenarios and Calibrations | Moderator (AT&T) |
R1-2501607 | FL Summary #5 on ISAC Scenarios and Calibrations | Moderator (AT&T) |
TDoc | Title | Source |
---|---|---|
R1-2500072 | Channel modelling for ISAC | Huawei, HiSilicon |
R1-2500179 | Discussion on ISAC channel modeling | Spreadtrum, UNISOC |
R1-2500235 | Discussion on ISAC channel modelling | CATT, CICTCI |
R1-2500267 | Discussion on ISAC channel modelling | China Telecom |
R1-2500298 | Discussion on channel modeling methodology for ISAC | CMCC, BUPT, SEU, PML |
R1-2500313 | Discussion on ISAC channel modelling | CALTTA |
R1-2500361 | Views on Rel-19 ISAC channel modelling | vivo, BUPT |
R1-2500414 | Discussion on ISAC channel modeling | EURECOM |
R1-2500418 | Discussion on ISAC Channel Modeling | Tiami Networks |
R1-2500463 | Study on ISAC channel modelling | OPPO |
R1-2500483 | Discussion on ISAC channel modelling | Tejas Network Limited |
R1-2500577 | Discussion on channel modelling for ISAC | ZTE Corporation, Sanechips |
R1-2500626 | ISAC Channel Modeling and Measurement Validation | BUPT, CMCC, VIVO |
R1-2500660 | Discussion on Channel Modelling for ISAC | Sony |
R1-2500680 | Discussion on ISAC channel modeling | Nokia, Nokia Shanghai Bell |
R1-2500681 | Discussion on ISAC Channel Modeling | NIST |
R1-2500685 | Discussion on ISAC channel modelling | SK Telecom |
R1-2500692 | Channel modeling for integrated sensing and communication with NR | NVIDIA |
R1-2500743 | Discussion on ISAC channel model | Xiaomi, BJTU, BUPT |
R1-2500748 | Discussion on ISAC channel modeling | InterDigital, Inc. |
R1-2500756 | Discussion on ISAC Channel Modelling | Ericsson |
R1-2500797 | Discussion on ISAC channel modelling | Apple |
R1-2500861 | Discussion on ISAC channel modelling | Samsung |
R1-2500892 | Considerations on ISAC channel modelling | CAICT |
R1-2500979 | Discussion on ISAC Channel Modelling | Panasonic |
R1-2500999 | Summary #1 on ISAC channel modelling | Moderator (Xiaomi) |
R1-2501000 | Summary #2 on ISAC channel modelling | Moderator (Xiaomi) |
R1-2501001 | Summary #3 on ISAC channel modelling | Moderator (Xiaomi) |
R1-2501002 | Summary #4 on ISAC channel modelling | Moderator (Xiaomi) |
R1-2501027 | Discussion on ISAC channel modelling | MediaTek Inc. |
R1-2501046 | Discussion on ISAC channel modelling | LG Electronics |
R1-2501060 | Discussion on Channel Modelling for ISAC | Lenovo |
R1-2501082 | Discussions on ISAC Channel Modeling | AT&T |
R1-2501167 | Discussion on ISAC channel modelling | Qualcomm Incorporated |
R1-2501212 | Discussion on ISAC channel modeling | NTT DOCOMO, INC. |
R1-2501363 | Study on ISAC channel modelling | OPPO |
R1-2501368 | Discussion on ISAC channel modeling | InterDigital, Inc. |
R1-2501369 | ISAC Channel Modeling and Measurement Validation | BUPT, CMCC, VIVO |
R1-2501654 | Email summary on values/pattern of A*B1 of monostatic RCS for target | Moderator (Xiaomi) |
TDoc | Title | Source |
---|---|---|
R1-2500411 | Draft CR for Rel-19 7-24GHz Channel model | Intel Corporation, ZTE Corporation |
R1-2501549 | Session notes for 9.8 (Study on channel modelling enhancements for 7-24GHz for NR) | Ad-Hoc Chair (CMCC) |
R1-2501655 | Summary of email discussions for calibration assumptions for 7-24 GHz channel modeling | Moderator (Intel Corporation) |
TDoc | Title | Source |
---|---|---|
R1-2500087 | Considerations on the 7-24GHz channel model validation | Huawei, HiSilicon |
R1-2500122 | Discussion on Evaluation of FR3 Channel Modeling | InterDigital, Inc. |
R1-2500236 | Views on channel model validation for 7-24GHz | CATT |
R1-2500362 | Views on channel model validation of TR38.901 for 7-24GHz | vivo, BUPT |
R1-2500380 | Discussion on the channel model validation | ZTE Corporation, Sanechips |
R1-2500393 | Channel model validation of TR38.901 for 7-24 GHz | Sharp |
R1-2500409 | Discussion on channel modeling verification for 7-24 GHz | Intel Corporation |
R1-2500506 | Discussion on validation of channel model | Ericsson |
R1-2500541 | Discussion on channel model validation of TR38.901 for 7-24GHz | BUPT, Spark NZ Ltd |
R1-2500640 | Measurements of the angular spreads in urban and suburban macrocells | Vodafone, Ericsson |
R1-2500661 | Discussion of channel model validation of TR38.901 for 7-24GHz | Sony |
R1-2500677 | Channel model validation for 7-24 GHz | Lenovo |
R1-2500693 | Channel model validation of TR 38901 for 7-24 GHz | NVIDIA |
R1-2500798 | On Validation of Channel Model | Apple |
R1-2500862 | Discussion on channel model validation of TR38.901 for 7 - 24 GHz | Samsung |
R1-2501048 | Intra cluster power profile | Keysight Technologies UK Ltd |
R1-2501083 | Discussion on Validation of the Channel Model in 38901 | AT&T |
R1-2501168 | Channel Model Validation of TR38.901 for 7-24 GHz | Qualcomm Incorporated |
R1-2501213 | Discussion on channel model validation for 7-24 GHz | NTT DOCOMO, INC. |
R1-2501348 | Discussion on Channel model validation of TR38.901 for 7-24GHz | Nokia |
R1-2501371 | Discussion on Validation of the Channel Model in 38901 | AT&T |
R1-2501426 | Data source descriptions for 7 – 24 GHz SI | Moderator (Intel Corporation) |
R1-2501427 | Summary of issues for Rel-19 7-24 GHz Channel Modeling Validation | Moderator (Intel Corporation) |
R1-2501428 | Summary #1 of discussions for Rel-19 7-24 GHz Channel Modeling Validation | Moderator (Intel Corporation) |
R1-2501429 | Summary #2 of discussions for Rel-19 7-24 GHz Channel Modeling Validation | Moderator (Intel Corporation) |
R1-2501430 | Summary #3 of discussions for Rel-19 7-24 GHz Channel Modeling Validation | Moderator (Intel Corporation) |
R1-2501431 | Summary #4 of discussions for Rel-19 7-24 GHz Channel Modeling Validation | Moderator (Intel Corporation) |
R1-2501638 | Summary#5 of issues for Rel-19 7-24 GHz Channel Modeling Validation | Moderator (Intel Corporation) |
TDoc | Title | Source |
---|---|---|
R1-2500088 | Considerations on the 7-24GHz channel model extension | Huawei, HiSilicon |
R1-2500123 | Discussion on Extension of FR3 Channel Modeling | InterDigital, Inc. |
R1-2500237 | Views on channel model adaptation/extension for 7-24GHz | CATT |
R1-2500252 | Discussion on channel modelling adaptation/extension for 7-24GHz | LG Electronics |
R1-2500363 | Views on channel model adaptation/extension of TR38.901 for 7-24GHz | vivo, BUPT |
R1-2500381 | Discussion on the channel model adaptation and extension | ZTE Corporation, Sanechips |
R1-2500410 | Discussion on channel model adaptation/extension | Intel Corporation |
R1-2500464 | Channel model adaptation and extension for 7-24GHz | OPPO |
R1-2500507 | Discussion on adaptation and extension of channel model | Ericsson |
R1-2500542 | Discussion on modeling near-field propagation and spatial non-stationarity in TR38.901 for 7-24GHz | BUPT, CMCC |
R1-2500561 | Discussions on FR3 Channel Modelling | Lekha Wireless Solutions |
R1-2500627 | Near-field channel modelling for FR3 | VIAVI Solutions |
R1-2500628 | Near-field channel modelling for FR3 | VIAVI Solutions |
R1-2500678 | Channel model extension for 7-24 GHz | Lenovo |
R1-2500694 | Channel model adaptation of TR 38901 for 7-24 GHz | NVIDIA |
R1-2500799 | On Channel Model Adaptation and Extension of TR38.901 for 7-24 GHz | Apple |
R1-2500863 | Discussion on channel model adaptation/extension of TR38.901 for 7 - 24 GHz | Samsung |
R1-2501028 | Discussion on channel modelling enhancements for 7-24GHz for NR | MediaTek Inc. |
R1-2501169 | Channel Model Adaptation/Extension of TR38.901 for 7-24GHz | Qualcomm Incorporated |
R1-2501281 | Discussion of channel model adaptation/extension of TR38.901 for 7-24GHz | Sony |
R1-2501349 | Discussion on Channel model adaptation/extension of TR38.901 for 7-24GHz | Nokia |
R1-2501482 | Summary#1 of channel model adaptation and extension | Moderator (ZTE) |
R1-2501483 | Summary#2 of channel model adaptation and extension | Moderator (ZTE) |
R1-2501484 | Summary#3 of channel model adaptation and extension | Moderator (ZTE) |
R1-2501485 | Summary#4 of channel model adaptation and extension | Moderator (ZTE) |
TDoc | Title | Source |
---|---|---|
R1-2500081 | Measurements related enhancements for LTM | Huawei, HiSilicon |
R1-2500180 | Discussion on measurements related enhancements for LTM | Spreadtrum, UNISOC |
R1-2500238 | Views on measurements related enhancements for LTM | CATT |
R1-2500245 | Discussion on measurements related enhancements for LTM | ZTE Corporation, Sanechips |
R1-2500253 | Discussion on measurements related enhancements for LTM | LG Electronics |
R1-2500299 | Discussion on measurements related enhancements for LTM | CMCC |
R1-2500318 | Measurements enhancements for LTM | TCL |
R1-2500364 | Discussion on measurements related enhancements for LTM | vivo |
R1-2500415 | Measurement related enhancements for LTM | Nokia |
R1-2500419 | FL plan for mobility enhancements in RAN1#120 | Moderator (Fujitsu) |
R1-2500420 | FL summary 1 of Measurements related enhancements for LTM | Moderator (Fujitsu) |
R1-2500421 | FL summary 2 of Measurements related enhancements for LTM | Moderator (Fujitsu) |
R1-2500422 | FL summary 3 of Measurements related enhancements for LTM | Moderator (Fujitsu) |
R1-2500423 | Final FL summary of Measurements related enhancements for LTM | Moderator (Fujitsu) |
R1-2500475 | Discussions on measurement enhancement for LTM | OPPO |
R1-2500562 | Discussion on measurement related enhancements for LTM | Lekha Wireless Solutions |
R1-2500624 | Discussion on measurements related enhancements for LTM | NEC |
R1-2500631 | Discussion on measurement related enhancements for LTM | Fujitsu |
R1-2500641 | Measurements related enhancements for LTM | InterDigital, Inc. |
R1-2500662 | Measurements related enhancements for LTM | Sony |
R1-2500703 | Measurements related enhancements for LTM | Lenovo |
R1-2500744 | Discussion on measurements related enhancements for LTM | Xiaomi |
R1-2500803 | Measurement related enhancements for LTM | Apple |
R1-2500864 | Views on Rel-19 measurement related enhancements for LTM | Samsung |
R1-2500918 | Discussion on measurements related enhancements for LTM | ETRI |
R1-2500992 | Measurement related enhancements for LTM | Ericsson |
R1-2501086 | Measurement Enhancements for LTM | Meta |
R1-2501091 | Discussion on measurements related enhancements for LTM | KDDI Corporation |
R1-2501170 | Measurements related enhancement for LTM | Qualcomm Incorporated |
R1-2501214 | Discussion on measurement related enhancements for LTM | NTT DOCOMO, INC. |
R1-2501244 | Discussion on measurements related enhancements for LTM | Sharp |
R1-2501315 | LTM measurements related enhancements | MediaTek |
R1-2501337 | Discussion on measurements related enhancements for LTM | |
R1-2501499 | [Draft] LS on activation/deactivation of semi-persistent CSI-RS resource for LTM candidate cells | Moderator (Fujitsu) |
R1-2501500 | LS on activation/deactivation of semi-persistent CSI-RS resource for LTM candidate cells | RAN1, Fujitsu |
R1-2501576 | [Draft] LS on L1filtering for LTM event triggered reporting | Moderator (Fujitsu) |
R1-2501577 | LS on L1filtering for LTM event triggered reporting | RAN1, Fujitsu |
TDoc | Title | Source |
---|---|---|
R1-2501171 | Initial higher layer parameters for Rel-19 XR for NR Phase3 | Qualcomm, Nokia (WI rapporteurs) |
TDoc | Title | Source |
---|---|---|
R1-2500102 | Discussions on scheduling enhancements considering RRM measurements for XR | Huawei, HiSilicon |
R1-2500134 | Discussion on measurement gap for XR | ZTE Corporation, Sanechips |
R1-2500181 | Discussion on enabling TXRX for XR during RRM measurements | Spreadtrum, UNISOC |
R1-2500206 | Signaling control of scheduling restriction during measurement gap in support of XR services | CATT |
R1-2500300 | Discussion on enabling TX/RX for XR during RRM measurements | CMCC |
R1-2500365 | Remaining issues on enabling data transmissions for XR during RRM measurements | vivo |
R1-2500459 | Enhancements to enable TX/RX for XR during RRM measurements | OPPO |
R1-2500486 | Discussion on enabling TX/RX for XR during RRM measurements | Panasonic |
R1-2500528 | Discussion on enabling TX/RX for XR during RRM measurements | InterDigital, Inc. |
R1-2500605 | Discussion on enabling TX/RX for XR during RRM measurements | NEC |
R1-2500663 | Discussion on enabling TX/RX for XR during RRM measurements | Sony |
R1-2500715 | Discussion on enabling TX/RX for XR during RRM measurements | Xiaomi |
R1-2500804 | Enabling TX/RX for XR during RRM measurements | Apple |
R1-2500865 | Remaining topics on enabling TX/RX during RRM measurements for XR | Samsung |
R1-2500959 | Discussion on XR during RRM measurements | LG Electronics |
R1-2501008 | Enabling TX/RX for XR during RRM measurements | Nokia |
R1-2501009 | Moderator summary #1 - Enabling TX/RX for XR during RRM measurements | Moderator (Nokia) |
R1-2501172 | Enabling Tx/Rx for XR during RRM measurements | Qualcomm Incorporated |
R1-2501215 | Discussion on Enabling TX/RX for XR during RRM | NTT DOCOMO, INC. |
R1-2501289 | Discussion on Enabling TX/RX for XR During RRM Measurements | Meta |
R1-2501290 | On enabling Tx/Rx for XR during RRM measurements | Google Ireland Limited |
R1-2501343 | Enabling TX/RX for XR traffic during RRM measurement gaps | Ericsson |
R1-2501531 | Moderator summary #2 - Enabling TX/RX for XR during RRM measurements | Moderator (Nokia) |
TDoc | Title | Source |
---|---|---|
R1-2500043 | Work plan for Rel-19 NR_NTN_Ph3 | THALES |
R1-2500523 | Work plan WID: introduction of IoT-NTN TDD mode | Iridium Satellite LLC |
R1-2501550 | Session notes for 9.11 (Non-Terrestrial Networks for NR Phase 3 and Internet of Things Phase 3) | Ad-Hoc Chair (Huawei) |
R1-2501608 | Draft Reply LS on Ku band numerology | Eutelsat Group |
R1-2501609 | Reply LS on Ku band numerology | RAN1, Eutelsat Group |
TDoc | Title | Source |
---|---|---|
R1-2500037 | NR NTN Downlink coverage enhancements | THALES |
R1-2500039 | FL Summary #1: NR-NTN downlink coverage enhancements | THALES |
R1-2500040 | FL Summary #2: NR-NTN downlink coverage enhancements | THALES |
R1-2500041 | FL Summary #3: NR-NTN downlink coverage enhancements | THALES |
R1-2500042 | FL Summary #4: NR-NTN downlink coverage enhancements | THALES |
R1-2500082 | Discussion on downlink coverage enhancements for NR NTN | Huawei, HiSilicon |
R1-2500109 | Discussions on downlink coverage enhancement for NR NTN | Fraunhofer IIS, Fraunhofer HHI |
R1-2500182 | Discussion on NR-NTN downlink coverage enhancement | Spreadtrum, UNISOC |
R1-2500207 | Discussion on downlink coverage enhancement for NR NTN | CATT |
R1-2500268 | Discussion on NR NTN downlink coverage enhancement | China Telecom |
R1-2500301 | Discussion on NR-NTN DL coverage enhancement | CMCC |
R1-2500366 | Discussion on NR-NTN downlink coverage enhancement | vivo |
R1-2500382 | Discussion on DL coverage enhancement for NR NTN | ZTE Corporation, Sanechips |
R1-2500443 | Discussion on NR-NTN downlink coverage enhancement | OPPO |
R1-2500501 | NR-NTN downlink coverage enhancement | InterDigital, Inc. |
R1-2500519 | Discussion on downlink coverage enhancement for NR NTN | Baicells |
R1-2500607 | NR-NTN downlink coverage enhancement | NEC |
R1-2500632 | Discussion on downlink coverage enhancements | Fujitsu |
R1-2500672 | On NR-NTN downlink coverage enhancement | Ericsson |
R1-2500716 | Discussion on NR-NTN downlink coverage enhancement | Xiaomi |
R1-2500800 | NR-NTN Downlink Coverage Enhancement | Apple |
R1-2500866 | Discussion on downlink coverage enhancement for NR-NTN | Samsung |
R1-2500878 | Discussion on downlink coverage enhancements for NR NTN | CCU |
R1-2500887 | Discussion on downlink coverage enhancement for NR NTN | Lenovo |
R1-2500919 | Discussion on NR-NTN downlink coverage enhancement | ETRI |
R1-2500924 | NR-NTN Downlink Coverage Enhancement | Panasonic |
R1-2500983 | Discussion on NR-NTN downlink coverage enhancement | TCL |
R1-2500993 | Discussions on downlink coverage enhancements | Nokia, Nokia Shanghai Bell |
R1-2501029 | NR-NTN downlink coverage enhancement | MediaTek Inc. |
R1-2501040 | Discussion on NR-NTN downlink coverage enhancement | LG Electronics |
R1-2501099 | Discussion on DL coverage enhancements for NR-NTN | NICT |
R1-2501114 | Discussion on NR-NTN downlink coverage enhancement | HONOR |
R1-2501122 | Discussion on downlink coverage enhancement for NR-NTN | CSCN |
R1-2501173 | Downlink coverage enhancement for NR NTN | Qualcomm Incorporated |
R1-2501216 | Discussion on DL coverage enhancement for NR-NTN | NTT DOCOMO, INC. |
R1-2501229 | Downlink Coverage Enhancement for NR NTN | Google Korea LLC |
R1-2501280 | Discussion on Downlink Coverage Enhancements for NR NTN | CEWiT |
TDoc | Title | Source |
---|---|---|
R1-2500083 | Discussion on HD-FDD RedCap UEs and eRedCap UEs for FR1-NTN | Huawei, HiSilicon |
R1-2500183 | Discussion on support of RedCap and eRedCap UEs with NR NTN operating in FR1-NTN bands | Spreadtrum, UNISOC |
R1-2500208 | Discussion on the enhancement of RedCap and eRedCap UEs In NTN | CATT |
R1-2500269 | Discussion on Support of RedCap and eRedCap UEs with NR NTN operating in FR1-NTN bands | China Telecom |
R1-2500302 | Discussion on the collision issues of HD-FDD Redcap UE in FR1-NTN | CMCC |
R1-2500367 | Discussion on support of RedCap and eRedCap UEs with NR-NTN | vivo |
R1-2500383 | Discussion on support of RedCap/eRedCap UEs for NR NTN | ZTE Corporation, Sanechips |
R1-2500444 | Discussion on supporting of RedCap and eRedCap UEs with NR NTN operating in FR1-NTN bands | OPPO |
R1-2500502 | Discussion on half-duplex RedCap issues for NTN FR1 operation | InterDigital, Inc. |
R1-2500673 | On HD-FDD Redcap UEs for NTN | Ericsson |
R1-2500717 | Discussion on the support of Redcap and eRedcap UEs in NR NTN | Xiaomi |
R1-2500805 | Discussion on support of RedCap UEs with NR NTN operation | Apple |
R1-2500867 | Discussion on support of RedCap and eRedCap UEs with NR NTN operating in FR1-NTN bands | Samsung |
R1-2500893 | Discussion on support of RedCap/eRedCap UEs in NTN | CAICT |
R1-2500920 | Discussion on HD UEs with NR NTN | ETRI |
R1-2500984 | Discussion on HD-FDD Redcap UEs and eRedcap UEs for FR1-NTN | TCL |
R1-2500994 | Discussion of support for RedCap and eRedCap UEs with NR NTN operating in FR1-NTN bands | Nokia, Nokia Shanghai Bell |
R1-2501030 | Support of RedCap and eRedCap UEs with NR NTN operating in FR1-NTN bands | MediaTek Inc. |
R1-2501041 | Discussion on support of (e)RedCap UEs with NR-NTN operating in FR1-NTN bands | LG Electronics |
R1-2501062 | Support of (e)RedCap UEs with NR NTN | Sharp |
R1-2501115 | Discussion on support of (e)RedCap UEs in NR NTN | HONOR |
R1-2501174 | Support of Redcap and eRedcap UEs in NR NTN | Qualcomm Incorporated |
R1-2501217 | Discussion on support of RedCap and eRedCap UEs in FR1-NTN | NTT DOCOMO, INC. |
R1-2501261 | Support of RedCap and eRedCap UEs in NR NTN | Nordic Semiconductor ASA |
R1-2501465 | Summary #1 for Support of RedCap and eRedCap UEs with NR NTN operating in FR1-NTN bands | Moderator (CATT) |
R1-2501466 | Summary #2 for Support of RedCap and eRedCap UEs with NR NTN operating in FR1-NTN bands | Moderator (CATT) |
R1-2501467 | Summary #3 for Support of RedCap and eRedCap UEs with NR NTN operating in FR1-NTN bands | Moderator (CATT) |
R1-2501605 | Final Summary for Support of RedCap and eRedCap UEs with NR NTN operating in FR1-NTN bands | Moderator (CATT) |
TDoc | Title | Source |
---|---|---|
R1-2500084 | Discussion on uplink capacity/throughput enhancement for FR1-NTN | Huawei, HiSilicon |
R1-2500184 | Discussion on NR-NTN uplink capacity/throughput enhancement | Spreadtrum, UNISOC |
R1-2500209 | Discussion on UL capacity enhancement for NR NTN | CATT |
R1-2500270 | Discussion on NR-NTN uplink enhancement | China Telecom |
R1-2500303 | Discussion on the NR-NTN uplink capacity/throughput enhancements | CMCC |
R1-2500368 | Discussion on NR-NTN uplink capacity enhancement | vivo |
R1-2500384 | Discussion on UL capacity enhancement for NR NTN | ZTE Corporation, Sanechips |
R1-2500445 | Discussion on NR-NTN uplink capacity/throughput enhancement | OPPO |
R1-2500503 | NR-NTN uplink capacity/throughput enhancement | InterDigital, Inc. |
R1-2500608 | NR-NTN uplink capacity/throughput enhancement | NEC |
R1-2500633 | Discussion on uplink capacity/cell throughput enhancement for FR1-NTN | Fujitsu |
R1-2500718 | Discussion on NR-NTN PUSCH capacity enhancement | Xiaomi |
R1-2500801 | NR-NTN Uplink Capacity Enhancement | Apple |
R1-2500868 | Discussion on uplink capacity/throughput enhancement for NR-NTN | Samsung |
R1-2500890 | Uplink capacity/throughput enhancement for NR-NTN | Panasonic |
R1-2500921 | Discussion on NR-NTN uplink capacity/throughput enhancement | ETRI |
R1-2500980 | Discussion on the NR-NTN uplink capacity/throughput enhancements | TCL |
R1-2500987 | On uplink capacity/cell throughput enhancement for NR NTN | Ericsson |
R1-2500995 | Discussion of NR-NTN uplink capacity enhancements | Nokia, Nokia Shanghai Bell |
R1-2501031 | NR-NTN uplink capacity and throughput enhancements | MediaTek Inc. |
R1-2501042 | Discussion on NR-NTN uplink capacity/throughput enhancement | LG Electronics |
R1-2501051 | Discussion on NR-NTN uplink capacity/throughput enhancement | Lenovo |
R1-2501090 | Discussion on NR-NTN uplink capacity/throughput enhancement | Hyundai Motor Company |
R1-2501116 | Discussion on NR-NTN UL capacity/throughput enhancement | HONOR |
R1-2501175 | NR-NTN uplink capacity / throughput enhancement | Qualcomm Incorporated |
R1-2501218 | Discussion on NR-NTN uplink capacity/throughput enhancement | NTT DOCOMO, INC. |
R1-2501400 | Feature lead summary #1 of AI 9.11.3 on NR-NTN uplink capacity and throughput enhancements | Moderator (MediaTek) |
R1-2501401 | Feature lead summary #2 of AI 9.11.3 on NR-NTN uplink capacity and throughput enhancements | Moderator (MediaTek) |
R1-2501402 | Feature lead summary #3 of AI 9.11.3 on NR-NTN uplink capacity and throughput enhancements | Moderator (MediaTek) |
TDoc | Title | Source |
---|---|---|
R1-2500085 | Discussion on UL capacity enhancements for IoT NTN | Huawei, HiSilicon |
R1-2500185 | Discussion on IoT-NTN uplink capacity/throughput enhancement | Spreadtrum, UNISOC |
R1-2500210 | Discussion on UL capacity enhancement for IoT NTN | CATT |
R1-2500304 | Discussion on the IoT-NTN uplink capacity/throughput enhancements | CMCC |
R1-2500369 | Discussion on IoT-NTN uplink capacity enhancement | vivo |
R1-2500385 | Discussion on UL capacity enhancement for IoT NTN | ZTE Corporation, Sanechips |
R1-2500446 | Discussion on IoT-NTN uplink capacity/throughput enhancement | OPPO |
R1-2500504 | IoT-NTN uplink capacity/throughput enhancement | InterDigital, Inc. |
R1-2500508 | IoT-NTN uplink capacity enhancement | Nokia, Nokia Shanghai Bell |
R1-2500609 | IoT-NTN uplink capacity/throughput enhancement | NEC |
R1-2500664 | On IoT-NTN uplink capacity enhancements | Sony |
R1-2500665 | FL Summary #1 for IoT-NTN | Moderator (Sony) |
R1-2500666 | FL Summary #2 for IoT-NTN | Moderator (Sony) |
R1-2500667 | Final FL Summary for IoT-NTN | Moderator (Sony) |
R1-2500674 | On uplink capacity enhancements for IoT-NTN | Ericsson |
R1-2500719 | Discussion on IoT-NTN uplink capacity enhancement | Xiaomi |
R1-2500806 | Discussion on IoT-NTN Uplink Capacity Enhancement | Apple |
R1-2500869 | Discussion on uplink capacity/throughput enhancement for IoT-NTN | Samsung |
R1-2500888 | Discussion on uplink capacity enhancement for IoT NTN | Lenovo |
R1-2500922 | Discussion on uplink capacity/throughput enhancement for IoT NTN | ETRI |
R1-2500981 | Discussion on the IoT-NTN uplink capacity/throughput enhancements | TCL |
R1-2501032 | IoT-NTN uplink capacity and throughput enhancement | MediaTek Inc. |
R1-2501043 | Discussion on IoT-NTN uplink capacity/throughput enhancement | LG Electronics |
R1-2501074 | IoT NTN OCC methods and signaling for NPUSCH and NPRACH | Sharp |
R1-2501176 | IOT-NTN uplink capacity/throughput enhancement | Qualcomm Incorporated |
R1-2501260 | IoT-NTN uplink capacity/throughput enhancement | Nordic Semiconductor ASA |
R1-2501481 | Moderator Summary for response to LS on PWS Support for NB-IoT NTN UEs | Moderator (InterDigital, Inc.) |
R1-2501517 | Draft reply LS on PWS support in RRC_CONNECTED for NB-IoT NTN | Moderator (InterDigital) |
R1-2501518 | Draft reply LS on PWS support in RRC_CONNECTED for NB-IoT NTN | Moderator (InterDigital) |
R1-2501555 | Moderator Summary#2 for response to LS on PWS Support for NB-IoT NTN UEs | Moderator (InterDigital, Inc.) |
R1-2501612 | Draft reply LS on PWS support in RRC_CONNECTED for NB-IoT NTN | Moderator (InterDigital) |
R1-2501613 | Reply LS on PWS support in RRC_CONNECTED for NB-IoT NTN | RAN1, InterDigital |
R1-2501621 | [Draft] LS on TDM DMRS for 3.75kHz SCS OCC | Moderator (Sony) |
R1-2501622 | LS on TDM DMRS for 3.75kHz SCS OCC | RAN1, Sony |
TDoc | Title | Source |
---|---|---|
R1-2500038 | Discussion on IoT-NTN TDD mode | THALES |
R1-2500086 | Discussion on IoT-NTN TDD mode | Huawei, HiSilicon |
R1-2500186 | Discussion on IoT-NTN TDD mode | Spreadtrum, UNISOC |
R1-2500211 | Physical layer design on IoT-NTN TDD mode | CATT |
R1-2500305 | Discussion on the new NB-IoT NTN TDD mode | CMCC |
R1-2500370 | Discussion on IoT-NTN TDD mode | vivo |
R1-2500386 | Discussion on the IoT-NTN TDD mode | ZTE Corporation, Sanechips |
R1-2500447 | Discussion on IoT-NTN TDD mode | OPPO |
R1-2500509 | Discussion on IoT-NTN TDD mode | Nokia, Nokia Shanghai Bell |
R1-2500524 | loT-NTN TDD mode scheduling, timing and channel decoding performance | Iridium Satellite LLC |
R1-2500720 | Discussion on IoT-NTN TDD mode | Xiaomi |
R1-2500807 | Discussion on IoT-NTN TDD mode | Apple |
R1-2500870 | Discussion on IoT-NTN TDD mode | Samsung |
R1-2500889 | Discussion on IoT-NTN TDD mode | Lenovo |
R1-2500982 | Discussion on the IoT-NTN TDD mode | TCL |
R1-2501044 | Discussion on IoT-NTN TDD mode | LG Electronics |
R1-2501075 | IoT NTN TDD frame structure and synchronization signal mapping | Sharp |
R1-2501177 | IOT-NTN TDD mode | Qualcomm Incorporated |
R1-2501219 | Discussion on IoT-NTN TDD mode | NTT DOCOMO, INC. |
R1-2501295 | On R19 TDD IoT-NTN | Nordic Semiconductor ASA |
R1-2501366 | Feature lead summary #1 on IoT-NTN TDD mode | Moderator (Qualcomm Incorporated) |
R1-2501367 | Feature lead summary #2 on IoT-NTN TDD mode | Moderator (Qualcomm Incorporated) |
R1-2501614 | Feature lead summary #3 on IoT-NTN TDD mode | Moderator (Qualcomm Incorporated) |
TDoc | Title | Source |
---|---|---|
R1-2501551 | Session notes for 9.12 (Multi-Carrier Enhancements for NR Phase 2) | Ad-Hoc Chair (CMCC) |
TDoc | Title | Source |
---|---|---|
R1-2500065 | On Rel-19 Multi-carrier enhancements | Nokia |
R1-2500092 | Discussion on Rel-19 Multi-carrier enhancements | Huawei, HiSilicon |
R1-2500139 | Discussion on multi-cell scheduling with a single DCI | Lenovo |
R1-2500147 | Discussion on multi-cell PUSCH/PDSCH scheduling with a single DCI | ZTE Corporation, Sanechips |
R1-2500187 | Discussion on multi-cell PUSCH/PDSCH scheduling with a single DCI | Spreadtrum, UNISOC |
R1-2500212 | Discussion on multi-cell PUSCH/PDSCH scheduling with a single DCI | CATT |
R1-2500271 | Discussion on multi-carrier enhancements for NR phase 3 | China Telecom |
R1-2500306 | Discussion on multi-cell PUSCH/PDSCH scheduling with a single DCI | CMCC |
R1-2500371 | Discussion on enhancement of multi-cell PUSCH/PDSCH scheduling with a single DCI | vivo |
R1-2500461 | Discussion of multi-cell scheduling with a single DCI | OPPO |
R1-2500808 | On multi-cell PUSCH/PDSCH scheduling with single DCI | Apple |
R1-2500818 | Discussion on multi-carrier enhancements for NR Phase 3 | Panasonic |
R1-2500871 | Enhancements for multi-cell PUSCH/PDSCH scheduling | Samsung |
R1-2500923 | Discussion on multi-cell PUSCH/PDSCH scheduling with a single DCI | ETRI |
R1-2500960 | Discussion on single DCI based multi-cell scheduling for Rel-19 | LG Electronics |
R1-2500985 | Discussion on Multi-cell PUSCH/PDSCH scheduling with a single DCI | TCL |
R1-2501033 | Multi-cell PUSCH/PDSCH scheduling with a single DCI | MediaTek Inc. |
R1-2501178 | Multi-cell PUSCH/PDSCH scheduling with a single DCI | Qualcomm Incorporated |
R1-2501220 | Discussion on multi-cell PUSCH/PDSCH scheduling with a single DCI | NTT DOCOMO, INC. |
R1-2501345 | Multi-cell PxSCH scheduling with a single DCI | Ericsson |
R1-2501374 | Feature lead summary#1 on multi-cell scheduling with a single DCI | Moderator (Lenovo) |
R1-2501375 | Feature lead summary#2 on multi-cell scheduling with a single DCI | Moderator (Lenovo) |
R1-2501376 | Feature lead summary#3 on multi-cell scheduling with a single DCI | Moderator (Lenovo) |
R1-2501377 | Feature lead summary#4 on multi-cell scheduling with a single DCI | Moderator (Lenovo) |
TDoc | Title | Source |
---|---|---|
R1-2501057 | Introduction of WI “Time and Frequency Interleaving for LTE-based 5G Terrestrial Broadcast” | EBU |
R1-2501552 | Session notes for 9.13 (LTE-based 5G Broadcast Phase 2) | Ad-Hoc Chair (Huawei) |
TDoc | Title | Source |
---|---|---|
R1-2500148 | Discussion on time-frequency interleaver design for LTE-based 5G Broadcast | ZTE Corporation, Sanechips |
R1-2500150 | On time-frequency interleavers for LTE-based 5G Broadcast | Huawei, HiSilicon |
R1-2500582 | Design of Time and Frequency Interleaver for LTE-based 5G Broadcast | Shanghai Jiao Tong University |
R1-2500872 | Time-frequency interleaver design for MBMS dedicated cells | Samsung |
R1-2501058 | Details of Time and Frequency Interleaving for LTE-based 5G Terrestrial Broadcast | EBU |
R1-2501179 | Time and Frequency Interleaving for 5G Broadcast | Qualcomm Incorporated |
R1-2501432 | FL summary#1 on Rel-19 LTE-based 5G Broadcast Phase 2 | Moderator (EBU) |
R1-2501433 | FL summary#2 on Rel-19 LTE-based 5G Broadcast Phase 2 | Moderator (EBU) |
TDoc | Title | Source |
---|---|---|
R1-2500499 | Enhancement of CDM DMRS port allocation combinations for enhanced uplink and downlink performance | Tejas Network Limited |
R1-2500579 | Rel-19 TEI on UE frequency hopping for positioning | ZTE Corporation, Sanechips |
R1-2500615 | On TEI-19 | Ericsson |
R1-2500809 | Rel-19 TEI proposal on remaining ambiguities with SRS carrier switching | Apple |
R1-2501034 | Proposals for TEI19 | MediaTek Inc. |
R1-2501180 | TEI proposal on SR triggered SSSG fallback | Qualcomm Incorporated |
R1-2501284 | TEI19: Counting of active NZP-CSI-RS resources | Nokia, Apple, Ericsson, MediaTek, NTT DOCOMO, Spreadtrum |
R1-2501323 | Enhancement of SRS beamforming for FR2 positioning | Huawei, HiSilicon, China Unicom, ZTE, Sanechips, CATT |
R1-2501418 | Enhancement of CDM DMRS port allocation combinations for enhanced uplink and downlink performance | Tejas Network Limited |
R1-2501464 | FL Summary #1 on Rel-19 TEIs | Moderator (NTT DOCOMO, INC.) |
R1-2501534 | FL Summary #2 on Rel-19 TEIs | Moderator (NTT DOCOMO, INC.) |
R1-2501539 | Draft LS on non-RedCap UE UL SRS frequency hopping for positioning | ZTE Corporation, Sanechips |
R1-2501553 | Session notes for 9.14 (TEI19) | Ad-Hoc Chair (CMCC) |
R1-2501562 | FL Summary #3 on Rel-19 TEIs | Moderator (NTT DOCOMO, INC.) |
R1-2501573 | LS on non-RedCap UE UL SRS frequency hopping for positioning | RAN1, ZTE Corporation |
R1-2501598 | FL Summary #4 on Rel-19 TEIs | Moderator (NTT DOCOMO, INC.) |
TDoc | Title | Source |
---|---|---|
R1-2501397 | Initial RAN1 UE features list for Rel-19 NR after RAN1 #120 | Moderators (AT&T, NTT DOCOMO, INC.) |
R1-2501398 | Draft LS on Rel-19 RAN1 UE features lists for NR after RAN1#120 | Moderators (AT&T, NTT DOCOMO, INC.) |
R1-2501399 | LS on Rel-19 RAN1 UE features lists for NR after RAN1#120 | RAN1, AT&T, NTT DOCOMO, INC. |
TDoc | Title | Source |
---|---|---|
R1-2500101 | UE features for NR MIMO Phase 5 | Huawei, HiSilicon |
R1-2500108 | UE features for NR MIMO Phase 5 | MediaTek Inc. |
R1-2500110 | Views on NR MIMO Phase 5 UE features | Nokia |
R1-2500213 | Discussion on UE features for NR MIMO Phase 5 | CATT |
R1-2500246 | Discussion on UE features for NR MIMO Phase 5 | ZTE Corporation, Sanechips |
R1-2500307 | Discussion on UE features for NR MIMO Phase 5 | CMCC |
R1-2500372 | Discussion on UE features for NR MIMO Phase 5 | vivo |
R1-2500474 | UE features for NR MIMO Phase 5 | OPPO |
R1-2500721 | Discussion on UE features for NR MIMO Phase 5 | Xiaomi |
R1-2500802 | Views on UE features for NR MIMO Phase 5 | Apple |
R1-2501120 | UE features for NR MIMO Phase 5 | BEIJING SAMSUNG TELECOM R&D |
R1-2501181 | UE features for NR MIMO phase 5 | Qualcomm Incorporated |
R1-2501221 | Discussion on UE features for NR MIMO Phase 5 | NTT DOCOMO, INC. |
R1-2501271 | UE features for NR MIMO Phase 5 | Ericsson |
R1-2501601 | Summary of UE features for NR MIMO Phase 5 | Moderator (AT&T) |
R1-2501602 | Session Notes of AI 9.15.2 | Ad-Hoc Chair (AT&T) |
TDoc | Title | Source |
---|---|---|
R1-2500096 | UE features for evolution of NR duplex operation | Huawei, HiSilicon |
R1-2500111 | Views on SBFD UE features | Nokia |
R1-2500149 | Discussion on UE features for Rel-19 SBFD | ZTE Corporation, Sanechips |
R1-2500188 | Discussion on UE features for evolution of NR duplex operation: SBFD | Spreadtrum, UNISOC |
R1-2500214 | UE features for SBFD | CATT |
R1-2500308 | Discussion on UE features for evolution of NR duplex operation: SBFD | CMCC |
R1-2500373 | Discussion on UE features for evolution of NR duplex operation | vivo |
R1-2500457 | Discussion on UE features for Rel-19 NR Duplex | OPPO |
R1-2500722 | UE features for SBFD | Xiaomi |
R1-2500754 | UE-features for SBFD | Ericsson |
R1-2500810 | Views on UE features for Rel-19 SBFD | Apple |
R1-2500874 | UE features for Rel-19 Duplex Evolution for NR | Samsung |
R1-2501182 | UE features for evolution of NR duplex operation | Qualcomm Incorporated |
R1-2501222 | Discussion on UE features for Rel-19 duplex evolution enhancements | NTT DOCOMO, INC. |
R1-2501391 | Summary of discussion on Rel-19 NR UE features for SBFD | Moderator (NTT DOCOMO, INC.) |
R1-2501392 | Session Notes of AI 9.15.3 | Ad-Hoc Chair (NTT DOCOMO, INC.) |
R1-2501508 | Summary#2 of discussion on Rel-19 NR UE features for SBFD | Moderator (NTT DOCOMO, INC.) |
R1-2501588 | Summary#3 of discussion on Rel-19 NR UE features for SBFD | Moderator (NTT DOCOMO, INC.) |
TDoc | Title | Source |
---|---|---|
R1-2500080 | UE features for Rel-19 NES | Huawei, HiSilicon |
R1-2500112 | Views on Network Energy Saving Enhancement UE features | Nokia |
R1-2500135 | Discussion on NES features | ZTE Corporation, Sanechips |
R1-2500310 | Discussion on UE features for enhancements of network energy savings for NR | CMCC |
R1-2500374 | Discussions on UE features for enhancements of network energy savings for NR | vivo |
R1-2500427 | Discussion of Rel-19 NES UE Features | FUTUREWEI |
R1-2500723 | UE features for NES enhancements | Xiaomi |
R1-2500811 | Views on UE features for Rel-19 NES | Apple |
R1-2500873 | UE features for enhancements of network energy savings for NR | Samsung |
R1-2500961 | Discussion on UE features for enhancements of NES | LG Electronics |
R1-2501183 | UE features for Rel-19 NES | Qualcomm Incorporated |
R1-2501223 | Discussion on UE features for eNES | NTT DOCOMO, INC. |
R1-2501250 | Rapporteur initial input for R19 NES WI UE features | Rapporteur(Ericsson) |
R1-2501257 | UE features for R19 NES | Ericsson |
R1-2501603 | Summary of UE features for enhancements of network energy savings for NR | Moderator (AT&T) |
R1-2501604 | Session Notes of AI 9.15.4 | Ad-Hoc Chair (AT&T) |
TDoc | Title | Source |
---|---|---|
R1-2500076 | UE features for Rel-19 LP-WUS | Huawei, HiSilicon |
R1-2500113 | Views on LP-WUS/WUR UE features | Nokia |
R1-2500136 | Discussion on WUR features | ZTE Corporation, Sanechips |
R1-2500215 | LP-WUS/WUR UE feature | CATT |
R1-2500311 | Discussion on UE features for low-power wake-up signal and receiver for NR | CMCC |
R1-2500375 | Rapporteur input on UE features for Rel-19 LP-WUS/WUR | vivo, DOCOMO |
R1-2500724 | UE features for NR LP-WUS/WUR | Xiaomi |
R1-2500876 | UE features for LP-WUS/LP-WUR | Samsung |
R1-2501039 | UE features for LP-WUS/WUR for NR | MediaTek Inc. |
R1-2501050 | UE Features for LP-WUS | Vodafone |
R1-2501184 | UE features for LP-WUS/WUR for NR | Qualcomm Incorporated |
R1-2501258 | Initial view on UE features for Rel-19 LP-WUS/WUR WI | Ericsson |
R1-2501393 | Summary of discussion on Rel-19 NR UE features for LP-WUS/WUR | Moderator (NTT DOCOMO, INC.) |
R1-2501394 | Session Notes of AI 9.15.5 | Ad-Hoc Chair (NTT DOCOMO, INC.) |
R1-2501570 | Summary#2 of discussion on Rel-19 NR UE features for LP-WUS/WUR | Moderator (NTT DOCOMO, INC.) |
R1-2501589 | Summary#3 of discussion on Rel-19 NR UE features for LP-WUS/WUR | Moderator (NTT DOCOMO, INC.) |
TDoc | Title | Source |
---|---|---|
R1-2500103 | UE feature for R19 XR | Huawei, HiSilicon |
R1-2500114 | Views on Rel-19 XR UE features | Nokia |
R1-2500137 | Discussion on XR features | ZTE Corporation, Sanechips |
R1-2500189 | Discussion on UE features for XR for NR Phase 3 | Spreadtrum, UNISOC |
R1-2500216 | XR UE feature | CATT |
R1-2500309 | Discussion on UE features for XR for NR Phase 3 | CMCC |
R1-2500376 | Discussion on Rel-19 UE features for XR for NR Phase 3 | vivo |
R1-2500460 | Discussion on UE features for Rel-19 XR | OPPO |
R1-2500812 | Views on UE features for XR | Apple |
R1-2500875 | UE features for XR for NR Phase 3 | Samsung |
R1-2501007 | Initial UE feature list for Rel-19 XR for NR Phase3 | Nokia, Qualcomm (WI rapporteurs) |
R1-2501185 | UE features for Rel-19 XR for NR Phase3 | Qualcomm Incorporated |
R1-2501224 | Discussion on UE features for Rel-19 XR enhancements | NTT DOCOMO, INC. |
R1-2501344 | UE features for XR enhancements Phase 3 | Ericsson |
R1-2501395 | Summary of discussion on Rel-19 NR UE features for XR Phase 3 | Moderator (NTT DOCOMO, INC.) |
R1-2501396 | Session Notes of AI 9.15.7 | Ad-Hoc Chair (NTT DOCOMO, INC.) |
R1-2501509 | Summary#2 of discussion on Rel-19 NR UE features for XR Phase 3 | Moderator (NTT DOCOMO, INC.) |
R1-2501590 | Summary#3 of discussion on Rel-19 NR UE features for XR Phase 3 | Moderator (NTT DOCOMO, INC.) |