| TDoc | Title | Source |
|---|---|---|
| R1-2501680 | Draft Agenda of RAN1#120bis meeting | RAN1 Chair |
| R1-2501683 | RAN1#120bis Meeting Timelines, Scope, Process | RAN1 Chair, ETSI MCC |
| TDoc | Title | Source |
|---|---|---|
| R1-2501681 | Highlights from RAN#107 and 6G Workshop | RAN1 Chair |
| TDoc | Title | Source |
|---|---|---|
| R1-2501682 | Report of RAN1#120 meeting | ETSI MCC |
| TDoc | Title | Source |
|---|---|---|
| R1-2501684 | Reply LS on LP-WUS operation in IDLE/INACTIVE mode | RAN2, vivo |
| R1-2501685 | Reply LS on LP-WUS operation in CONNECTED mode | RAN2, NTT DOCOMO |
| R1-2501686 | LS on number of beam measurements in the measurement report MAC CE | RAN2, Huawei |
| R1-2501687 | Reply LS to SA2 | RAN2, vivo |
| R1-2501688 | Reply LS on Ku band numerology | RAN2, Eutelsat |
| R1-2501689 | Response LS on simultaneous operation between GNSS and NR NTN | RAN2, Nokia |
| R1-2501690 | Reply LS on UE capability for FDD-FDD inter-band CA simultaneous Rx/Tx | RAN2, CATT |
| R1-2501691 | Reply LS on LP-WUS subgrouping | RAN2, Huawei |
| R1-2501692 | LS on paging enhancement in R19 NES | RAN2, xiaomi |
| R1-2501693 | Reply LS on SSB adaptation | RAN2, Apple |
| R1-2501694 | Reply LS on inter-gNB RACH-less HO in NTN | RAN3, Nokia |
| R1-2501695 | Reply LS on LMF-based AI/ML Positioning for case 3b | RAN3, ZTE |
| R1-2501696 | SBFD information exchange among gNBs for CLI mitigation | RAN3, Huawei |
| R1-2501697 | Reply LS to RAN1 on collision between SSB and RA occasion for LTM | RAN4, MediaTek |
| R1-2501698 | LS on L1 CLI measurement | RAN4, Huawei |
| R1-2501699 | LS on DL timing reference to support two TA enhancement for asymmetric DL sTRP/ UL mTRP | RAN4, CMCC |
| R1-2501700 | LS of RAN4 RRM agreements on LB CA via switching | RAN4, Apple |
| R1-2501701 | Reply LS on soft satellite switch with re-sync | RAN4, Huawei |
| R1-2501702 | LS on switching periods for low-low band switching | RAN4, AT&T |
| R1-2501703 | LS on LP-WUS UE RF | RAN4, vivo |
| R1-2501704 | LS on NR NB-IoT in-band operation | RAN4, Ericsson |
| R1-2501705 | Reply LS to RAN2 on UE capabilities for FR2-NTN | RAN4, vivo |
| R1-2501731 | Discussion on RAN2 LS on soft satellite switch with re-sync | Ericsson |
| R1-2501741 | Discussion on RAN4 LS on L1 CLI measurement | MediaTek Inc |
| R1-2501758 | Discussion on LP-WUS UE RF | ZTE Corporation, Sanechips |
| R1-2501759 | Draft reply on LP-WUS UE RF | ZTE Corporation, Sanechips |
| R1-2501788 | Draft reply LS to RAN2 on number of beam measurements in the measurement report MAC CE | ZTE Corporation, Sanechips |
| R1-2501789 | Draft reply LS to RAN4 on DL timing reference to support two TA enhancement for asymmetric DL sTRP/ UL mTRP | ZTE Corporation, Sanechips |
| R1-2501790 | Discussion on collision handling of SSB and RA occasion for LTM | ZTE Corporation, Sanechips |
| R1-2501791 | Draft LS reply on DL timing reference to support two TA enhancement for asymmetric DL sTRP/ UL mTRP | vivo |
| R1-2501792 | Discussion on L1 CLI measurement | vivo |
| R1-2501793 | Draft reply LS on number of beam measurements in the measurement report MAC CE | vivo |
| R1-2501794 | Draft reply LS on LP-WUS UE RF | vivo |
| R1-2501854 | Draft reply LS on DL timing reference to support two TA enhancement for asymmetric DL sTRP/ UL mTRP | MediaTek Inc. |
| R1-2501855 | Draft reply LS on number of beam measurements in the measurement report MAC CE | Spreadtrum, UNISOC |
| R1-2501856 | Draft reply LS on L1 CLI measurement | Spreadtrum, UNISOC |
| R1-2501857 | Draft reply LS on DL timing reference to support two TA enhancement for asymmetric DL sTRP/ UL mTRP | Spreadtrum, UNISOC |
| R1-2501904 | Draft reply LS on soft satellite switch with re-sync | vivo |
| R1-2501906 | Draft reply LS on L1 CLI measurement | ZTE Corporation, Sanechips |
| R1-2501961 | Discussion on RAN4 LS on L1 CLI measurement | CATT |
| R1-2501962 | Draft reply LS on L1 CLI measurement | CATT |
| R1-2501963 | Discussion on LS on differentiation of mTRP and sTRP | CATT |
| R1-2501964 | Draft reply LS on differentiation of mTRP and sTRP | CATT |
| R1-2501965 | Discussion on LS on two TA enhancement for asymmetric DL sTRP/ UL mTRP | CATT |
| R1-2501966 | Discussions on LS on number of beam measurements in the measurement report MAC CE | CATT |
| R1-2501967 | Draft reply LS on number of beam measurements in the measurement report MAC CE | CATT |
| R1-2502018 | Discussion on RAN4 LS of DL timing reference to support two TA enhancement for asymmetric DL sTRP/ UL mTRP | China Telecom |
| R1-2502061 | Discussion on RAN4 LS on DL timing reference to support two TA enhancement for asymmetric DL sTRP/ UL mTRP | ZTE Corporation, Sanechips |
| R1-2502081 | Draft LS reply on DL timing reference to support two TA enhancement for asymmetric DL sTRP UL mTRP | NEC |
| R1-2502112 | Discussion on LS on differentiation of sTRP and sDCI mTRP | Lenovo |
| R1-2502113 | Reply LS on DL timing reference to support two TA enhancement for asymmetric DL sTRP UL mTRP | Lenovo |
| R1-2502114 | Reply LS on number of beam measurements in the measurement report MAC CE | Lenovo |
| R1-2502144 | Discussion on RAN4 LS on L1 CLI measurement | CMCC |
| R1-2502145 | Discussion on Reply LS on soft satellite switch with re-sync | CMCC |
| R1-2502146 | Discussion on LS on DL timing reference to support two TA enhancement for asymmetric DL sTRP UL mTRP | CMCC |
| R1-2502147 | Draft reply on LS on DL timing reference to support two TA enhancement for asymmetric DL sTRP UL mTRP | CMCC |
| R1-2502148 | Discussion on LS on number of beam measurements in the measurement report MAC CE | CMCC |
| R1-2502255 | Discussion on LS on differentiation of sDCI mTRP, mDCI mTRP and sTRP | OPPO |
| R1-2502256 | Discussion on LS on DL timing reference to support two TA enhancement for asymmetric DL sTRP/ UL mTRP | OPPO |
| R1-2502281 | Discussion on RAN4 LS for L1 CLI measurement | OPPO |
| R1-2502300 | Discussion on LS on number of beam measurements in the measurement report MAC CE | OPPO |
| R1-2502346 | Discussion on RAN4 reply LS on soft satellite switch with re-sync | Samsung |
| R1-2502347 | Draft reply LS to RAN2 LS on number of beam measurement(s) in beam measurement report MAC CE | Samsung |
| R1-2502348 | Discussion on RAN4 reply LS on signal configuration LP-WUS and LP-SS | Samsung |
| R1-2502349 | Draft reply LS on DL timing reference to support two TA enhancement for asymmetric DL sTRP/ UL mTRP | Samsung |
| R1-2502350 | Draft reply LS on differentiation of sDCI mTRP, mDCI mTRP and sTRP | Samsung |
| R1-2502351 | Discussion on LS reply to RAN4 on L1 CLI measurement | Samsung |
| R1-2502408 | Discussion on RAN4 LS on CLI measurement | Nokia, Nokia Shanghai Bell |
| R1-2502423 | Discussion on RAN4 LS on L1 CLI measurement | Ericsson |
| R1-2502424 | [Draft] Reply to RAN4 LS on L1 CLI measurement | Ericsson |
| R1-2502427 | Discussion on RAN4 LS on L1 CLI measurement | Xiaomi |
| R1-2502428 | Discussion on the LS on soft satellite switch with re-sync | Xiaomi |
| R1-2502429 | Draft reply LS on DL timing reference issue for Rel-19 MIMO | Xiaomi |
| R1-2502523 | Draft LS reply on DL timing reference to support two TA enhancement for asymmetric DL sTRP/ UL mTRP | Nokia |
| R1-2502535 | Discussion of LS response related to soft satellite switch with re-sync | Nokia |
| R1-2502564 | Discussion on RAN2 LS on number of beam measurements in the measurement report MAC CE | Ericsson |
| R1-2502590 | Discussion on the RAN4 LS on LP-WUS UE RF | Apple |
| R1-2502591 | [Draft] Reply LS on LP-WUS UE RF | Apple |
| R1-2502592 | [Draft] Reply LS on number of beams in the measurement report MAC CE | Apple |
| R1-2502593 | Discussion on RAN4 LS on RRM aspects for LB CA via switching | Apple |
| R1-2502654 | Discussion on Reply LS on collision between SSB and RA occasion for LTM | Nokia |
| R1-2502655 | Discussion on LS on number of beam measurements in the measurement report MAC CE | Nokia |
| R1-2502754 | Discussion on LS on L1 CLI measurement | NTT DOCOMO, INC. |
| R1-2502800 | Discussion on RAN4 LS on LP-WUS UE RF | Ericsson |
| R1-2502825 | Draft reply LS on L1 CLI measurement | Qualcomm Incorporated |
| R1-2502826 | Discussion on response to RAN4 LS on LP-WUS UE RF | Qualcomm Incorporated |
| R1-2502827 | Discussion for LS reply on DL timing reference to support two TA enhancement for asymmetric DL sTRP and UL mTRP | Qualcomm Incorporated |
| R1-2502885 | Draft reply of LS on number of beam measurements in the measurement report MAC CE | |
| R1-2502886 | Draft reply of LS on DL timing reference to support two TA enhancement for asymmetric DL sTRP and UL mTRP | |
| R1-2502887 | Discussion on RAN4 LS on collision between SSB and RA occasion for LTM | |
| R1-2502892 | Correction on handling collision of SSB and RA occasion for LTM | |
| R1-2502893 | Draft reply LS on differentiation of sDCI mTRP, mDCI mTRP and sTRP | vivo |
| R1-2502935 | Discussion on RAN4 LS on switching periods for low-low band switching | Ericsson |
| R1-2502936 | Discussion on RAN4 LS on RRM aspects for LB CA via switching | Ericsson |
| R1-2502943 | Discussion on RAN4 LS on L1 CLI measurement | Huawei, HiSilicon |
| R1-2502944 | Draft reply LS on L1 CLI measurement | Huawei, HiSilicon |
| R1-2502945 | Draft reply LS on LP-WUS UE RF | Huawei, HiSilicon |
| R1-2502946 | Discussion on the RAN2 LS on number of beam measurements in the measurement report MAC CE | Huawei, HiSilicon |
| R1-2502947 | Draft Reply LS on number of beam measurements in the measurement report MAC CE | Huawei, HiSilicon |
| R1-2502948 | Discussion on DL timing reference to support two TA enhancement for asymmetric DL sTRP/ UL mTRP | Huawei, HiSilicon |
| R1-2502949 | Discussion on differentiation of sDCI mTRP, mDCI mTRP and sTRP | Huawei, HiSilicon |
| R1-2502950 | Discussion on the RAN4 LS on soft satellite switch with re-sync | Huawei, HiSilicon |
| R1-2503019 | Summary on LS on differentiation of sDCI mTRP and sTRP | Moderator (CATT) |
| R1-2503105 | Reply LS on signalling feasibility of dataset and parameter sharing | RAN2, xiaomi, Ericsson |
| TDoc | Title | Source |
|---|---|---|
| R1-2503148 | TS 38.291 V0.1.0 - Ambient IoT Physical layer | Huawei |
| R1-2503149 | Email discussion summary on Rel-19 higher layers parameters list Post RAN1#120bis | Moderator (Ericsson) |
| R1-2503153 | DRAFT LS on Rel-19 higher layers parameters list Post RAN1#120bis | Moderator (Ericsson) |
| R1-2503154 | LS on Rel-19 higher layers parameters list Post RAN1#120bis | RAN1, Ericsson |
| R1-2503155 | Consolidated Rel-19 higher layers parameters list Post RAN1#120bis | Moderator (Ericsson) |
| R1-2503156 | Collection of Rel-19 higher layers parameters list Post RAN1#120bis | Moderator (Ericsson) |
| R1-2503159 | Summary of email discussion [Post-120bis-Rel19-36.212-LTE_terr_bcast_Ph2] | Moderator (FUTUREWEI) |
| R1-2503160 | Introduction of Rel-19 LTE-based 5G Broadcast Phase 2 | FUTUREWEI |
| R1-2503161 | Summary of email discussion [Post-120bis-Rel19-36.212-IoT_NTN_Ph3] | Moderator (FUTUREWEI) |
| R1-2503162 | Introduction of Rel-19 OCC for IoT-NTN for LTE | FUTUREWEI |
| R1-2503167 | Introduction of enhancements of network energy savings for NR | Samsung |
| R1-2503168 | Summary of email discussions [120bis-R19-38.213-Netw_Energy_NR_enh] | Moderator (Samsung) |
| R1-2503169 | Introduction of evolution of NR duplex operation: Sub-band full duplex (SBFD) | Samsung |
| R1-2503170 | Summary of email discussions [120bis-R19-38.213-NR_duplex_evo] | Moderator (Samsung) |
| R1-2503171 | Introduction of low-power wake-up signal and receiver for NR (LP-WUS/WUR) | Samsung |
| R1-2503172 | Summary of email discussions [120bis-R19-38.213-NR_LPWUS] | Moderator (Samsung) |
| R1-2503173 | Introduction of multi-carrier enhancements for NR Phase 3 | Samsung |
| R1-2503174 | Summary of email discussions [120bis-R19-38.213-NR_MC_enh2] | Moderator (Samsung) |
| R1-2503175 | Introduction of NR MIMO Phase 5 | Samsung |
| R1-2503176 | Summary of email discussions [120bis-R19-38.213-NR_MIMO_Ph5] | Moderator (Samsung) |
| R1-2503177 | Introduction of NR mobility enhancements Phase 4 | Samsung |
| R1-2503178 | Summary of email discussions [120bis-R19-38.213-NR_Mob_Ph4] | Moderator (Samsung) |
| R1-2503179 | Introduction of Non-Terrestrial Networks (NTN) for NR Phase 3 | Samsung |
| R1-2503180 | Summary of email discussions [120bis-R19-38.213-NR_NTN_Ph3] | Moderator (Samsung) |
| R1-2503181 | Introduction of SR triggered SSSG switching [SRTrig_SSSGSwitch] | Samsung |
| R1-2503182 | Summary of email discussions [120bis-R19-38.213-NR_TEI19] | Moderator (Samsung) |
| TDoc | Title | Source |
|---|---|---|
| R1-2502828 | Rapporteur view on higher layer signalling of Rel-19 AI-ML for NR air interface | Qualcomm Incorporated |
| R1-2503111 | Session notes for 9.1 (AI/ML for NR Air Interface) | Ad-Hoc Chair (CMCC) |
| TDoc | Title | Source |
|---|---|---|
| R1-2501717 | Discussion on specification support for AI/ML-based beam management | FUTUREWEI |
| R1-2501751 | Specification Support for AI/ML for Beam Management | Kyocera |
| R1-2501775 | AI/ML for beam management | Ericsson |
| R1-2501795 | Specification support for beam management | vivo |
| R1-2501858 | Discussion on AIML for beam management | Spreadtrum, UNISOC |
| R1-2501905 | Discussion on AI/ML-based beam management | ZTE Corporation, Sanechips |
| R1-2501938 | Specification support for AI-enabled beam management | NVIDIA |
| R1-2501946 | AI/ML based Beam Management | |
| R1-2501959 | Discussion on AIML beam management | TCL |
| R1-2501968 | Specification support for AI/ML-based beam management | CATT |
| R1-2502036 | Discussion on AI/ML for beam management | Ofinno |
| R1-2502066 | Discussion on specification support for beam management | Panasonic |
| R1-2502078 | Discussion on specification support for beam management | NEC |
| R1-2502097 | Specification support for beam management | Tejas Network Limited |
| R1-2502099 | Discussions on AI/ML for beam management | LG Electronics |
| R1-2502115 | Discussion on specification support on AI/ML for beam management | Fujitsu |
| R1-2502149 | Discussion on specification support for beam management | CMCC |
| R1-2502193 | AI/ML specification support for beam management | Lenovo |
| R1-2502210 | Discussion on AIML for beam management | Huawei, HiSilicon |
| R1-2502288 | On specification for AI/ML-based beam management | OPPO |
| R1-2502301 | Discussion on AI/ML for beam management | InterDigital, Inc. |
| R1-2502309 | Discussion on specification support for beam management | Sony |
| R1-2502352 | Discussion for supporting AI/ML based beam management | Samsung |
| R1-2502411 | Discussion on specification support for beam management | Ruijie Networks Co. Ltd |
| R1-2502430 | Discussion on AI/ML for beam management | Xiaomi |
| R1-2502501 | Discussion on specification support for beam management | ETRI |
| R1-2502528 | AI/ML for Beam Management | Nokia |
| R1-2502537 | Discussion on specification support for AI/ML beam management | Transsion Holdings |
| R1-2502585 | Specification support for AI/ML beam management | ITL |
| R1-2502594 | AI/ML for beam management | Apple |
| R1-2502683 | Discussions on specification support for beam management | Sharp |
| R1-2502686 | Discussion on AI/ML for beam management | HONOR |
| R1-2502700 | Specification support for beam management | KDDI Corporation (TTC) |
| R1-2502701 | Discussion on specification support for AIML-based beam management | MediaTek Inc. |
| R1-2502728 | Discussion on AI/ML based beam management | KT Corp. |
| R1-2502755 | Discussion on AI/ML for beam management | NTT DOCOMO, INC. |
| R1-2502829 | Specification support for AI-ML-based beam management | Qualcomm Incorporated |
| R1-2502876 | Discussion on AIML based beam management | ASUSTeK |
| R1-2502894 | On Performance Monitoring for Beam Management Use Case | NTU |
| R1-2502895 | Specification support for beam management | Fraunhofer HHI, Fraunhofer IIS |
| R1-2503040 | FL summary #0 for AI/ML in beam management | Moderator (Samsung) |
| R1-2503041 | FL summary #1 for AI/ML in beam management | Moderator (Samsung) |
| R1-2503042 | FL summary #2 for AI/ML in beam management | Moderator (Samsung) |
| R1-2503043 | FL summary #3 for AI/ML in beam management | Moderator (Samsung) |
| R1-2503044 | FL summary #4 for AI/ML in beam management | Moderator (Samsung) |
| TDoc | Title | Source |
|---|---|---|
| R1-2501796 | Specification support for positioning accuracy enhancement | vivo |
| R1-2501859 | Discussion on AIML for positioning accuracy enhancement | Spreadtrum, UNISOC |
| R1-2501917 | Discussion on AI/ML-based positioning enhancement | ZTE Corporation, Pengcheng Laboratory |
| R1-2501925 | Discussion on support for AIML positioning | InterDigital, Inc. |
| R1-2501940 | Specification support for AI-enabled positioning | NVIDIA |
| R1-2501947 | AI/ML based Positioning | |
| R1-2501969 | Specification support for AI/ML-based positioning | CATT, CICTCI |
| R1-2502064 | Discussion on specification support for positioning accuracy enhancement | TCL |
| R1-2502071 | Discussion on specification support for AIML based positioning accuracy enhancement | NEC |
| R1-2502098 | Specification support for positioning accuracy enhancement | Tejas Network Limited |
| R1-2502116 | Discussion on specification support for AIML-based positioning accuracy enhancement | Fujitsu |
| R1-2502150 | Discussion on specification support for positioning accuracy enhancement | CMCC |
| R1-2502194 | Specification impacts for AI/ML positioning | Lenovo |
| R1-2502211 | Discussion on AI/ML for positioning accuracy enhancement | Huawei, HiSilicon |
| R1-2502289 | On specification for AI/ML-based positioning accuracy enhancements | OPPO |
| R1-2502310 | Discussion on Specification support for positioning accuracy enhancement | Sony |
| R1-2502353 | Discussion for supporting AI/ML based positioning accuracy enhancement | Samsung |
| R1-2502412 | Discussion on specification support for positioning accuracy enhancement | Ruijie Networks Co. Ltd |
| R1-2502431 | Discussion on AI/ML-based positioning accuracy enhancement | Xiaomi |
| R1-2502502 | Discussion on specification support for positioning accuracy enhancement | ETRI |
| R1-2502529 | AI/ML for Positioning Accuracy Enhancement | Nokia |
| R1-2502561 | AI/ML positioning accuracy enhancement | Fraunhofer IIS, Fraunhofer HHI |
| R1-2502595 | Specification Support for AI/ML-based positioning | Apple |
| R1-2502660 | AI/ML for Positioning Accuracy Enhancement | Ericsson |
| R1-2502663 | Design for AI/ML based positioning | MediaTek Korea Inc. |
| R1-2502684 | Discussion on specification support for AI/ML based positioning accuracy enhancements | Sharp |
| R1-2502756 | Discussion on AI/ML for positioning accuracy enhancement | NTT DOCOMO, INC. |
| R1-2502830 | Specification support for AI-ML-based positioning accuracy enhancement | Qualcomm Incorporated |
| R1-2502911 | Discussion on specification support for AI/ML positioning accuracy enhancement | CEWiT |
| R1-2502933 | Discussions on specification support for positioning accuracy enhancement for AI/ML | ITL |
| R1-2502987 | Summary #1 of specification support for positioning accuracy enhancement | Moderator (Ericsson) |
| R1-2502988 | Summary #2 of specification support for positioning accuracy enhancement | Moderator (Ericsson) |
| R1-2502989 | Summary #3 of specification support for positioning accuracy enhancement | Moderator (Ericsson) |
| R1-2502990 | Summary #4 of specification support for positioning accuracy enhancement | Moderator (Ericsson) |
| R1-2502991 | Summary #5 of specification support for positioning accuracy enhancement | Moderator (Ericsson) |
| R1-2503144 | Final summary of specification support for positioning accuracy enhancement | Moderator (Ericsson) |
| TDoc | Title | Source |
|---|---|---|
| R1-2501797 | Specification support for CSI prediction | vivo |
| R1-2501848 | Discussion on AI-based CSI prediction | TCL |
| R1-2501860 | Discussion on AIML for CSI prediction | Spreadtrum, UNISOC |
| R1-2501918 | Discussion on specification support for AI CSI prediction | ZTE Corporation, Sanechips |
| R1-2501923 | AI/ML for CSI prediction | Ericsson |
| R1-2501931 | Discussion on CSI Processing Unit | FUTUREWEI |
| R1-2501939 | Specification support for AI-enabled CSI prediction | NVIDIA |
| R1-2501945 | Discussions on AI/ML for CSI prediction | KT Corp. |
| R1-2501948 | AI/ML based CSI Prediction | |
| R1-2501970 | Specification support for AI/ML-based CSI prediction | CATT |
| R1-2502072 | Discussion on specification support for CSI prediction | NEC |
| R1-2502100 | Discussions on CSI prediction | LG Electronics |
| R1-2502117 | Discussion on specification support for CSI prediction | Fujitsu |
| R1-2502151 | Discussion on AI/ML for CSI prediction | CMCC |
| R1-2502195 | Specification support for CSI prediction | Lenovo |
| R1-2502212 | Discussion on AIML for CSI prediction | Huawei, HiSilicon |
| R1-2502290 | On specification for AI/ML-based CSI prediction | OPPO |
| R1-2502311 | Specification Support for AI/ML CSI prediction | Sony |
| R1-2502337 | On AI/ML-based CSI prediction | InterDigital, Inc. |
| R1-2502354 | Views on AI/ML based CSI prediction | Samsung |
| R1-2502413 | Discussion on specification support for CSI prediction | Ruijie Networks Co. Ltd |
| R1-2502432 | Further discussion on AI/ML model based CSI prediction | Xiaomi |
| R1-2502472 | Specification support for CSI Prediction | Tejas Network Limited |
| R1-2502491 | Discussion on AI/ML-based CSI prediction | Panasonic |
| R1-2502503 | Discussion on specification support for CSI prediction | ETRI |
| R1-2502530 | AI/ML for CSI Prediction | Nokia |
| R1-2502567 | Specification support for CSI prediction | Continental Automotive |
| R1-2502596 | Discussion on AI based CSI prediction | Apple |
| R1-2502685 | Discussion on specification support for AI/ML based CSI prediction | Sharp |
| R1-2502702 | AI/ML - Specification support for CSI Prediction | MediaTek Inc. |
| R1-2502735 | Discussion on AI/ML for CSI prediction | AT&T |
| R1-2502757 | Discussion on AI/ML for CSI prediction | NTT DOCOMO, INC. |
| R1-2502831 | Specification support for CSI prediction | Qualcomm Incorporated |
| R1-2503056 | Summary #1 of CSI prediction | Moderator (LG Electronics) |
| R1-2503057 | Summary #2 of CSI prediction | Moderator (LG Electronics) |
| R1-2503058 | Summary #3 of CSI prediction | Moderator (LG Electronics) |
| R1-2503059 | Summary #4 of CSI prediction | Moderator (LG Electronics) |
| R1-2503139 | Summary #5 of CSI prediction | Moderator (LG Electronics) |
| TDoc | Title | Source |
|---|---|---|
| R1-2501718 | Discussion of CSI compression on AI/ML for NR air interface | FUTUREWEI |
| R1-2501798 | Discussion on CSI compression and other aspects on AI/ML model/data | vivo |
| R1-2501861 | Discussion on AIML for CSI compression | Spreadtrum, UNISOC |
| R1-2501919 | Discussion on study for AI/ML CSI compression | ZTE Corporation, Sanechips |
| R1-2501924 | AI/ML for CSI compression and other aspects on AI/ML model/data | Ericsson |
| R1-2501934 | Additional study on AI-enabled CSI compression and other aspects of AI model and data | NVIDIA |
| R1-2501949 | AI/ML based CSI Compression | |
| R1-2501958 | Discussion on AIML CSI compression | TCL |
| R1-2501971 | Discussion on AI/ML-based CSI compression | CATT |
| R1-2502037 | Views on UCI loss mitigation | Ofinno |
| R1-2502073 | Discussion CSI compression | NEC |
| R1-2502096 | Discussion on CSI Compression and other aspects of AIML | Tejas Network Limited |
| R1-2502101 | Study on CSI compression | LG Electronics |
| R1-2502118 | Discussion on CSI compression with AI/ML | Fujitsu |
| R1-2502152 | Discussion on AI/ML for CSI compression | CMCC |
| R1-2502196 | On AI/ML for CSI compression | Lenovo |
| R1-2502213 | Discussion on AI/ML for CSI compression | Huawei, HiSilicon |
| R1-2502291 | Additional study on AI/ML-based CSI compression | OPPO |
| R1-2502338 | On AI/ML-based CSI compression and other aspects | InterDigital, Inc. |
| R1-2502355 | Views on additional study for AI/ML based CSI compression | Samsung |
| R1-2502433 | Discussion on AI/ML model based CSI compression and other aspects on AI/ML model/data | Xiaomi |
| R1-2502489 | AI/ML for CSI feedback enhancement | Mavenir |
| R1-2502492 | Discussion on AI/ML for CSI compression | Panasonic |
| R1-2502504 | Discussion on AI/ML for CSI compression | ETRI |
| R1-2502531 | AI/ML for CSI Compression | Nokia |
| R1-2502571 | CSI compression and other aspects on AI/ML model/data | Continental Automotive |
| R1-2502597 | Discussion on AI based CSI compression and AI processing units | Apple |
| R1-2502703 | Additional study on AI/ML for NR air interface - CSI compression | MediaTek Inc. |
| R1-2502758 | Discussion on AI/ML for CSI compression | NTT DOCOMO, INC. |
| R1-2502832 | Additional study on CSI compression | Qualcomm Incorporated |
| R1-2502912 | Discussion on AI/ML for CSI Compression | CEWiT |
| R1-2502934 | Discussion on AI/ML-based CSI compression | Pengcheng laboratory |
| R1-2502937 | Discussion on AI/ML model-based CSI compression | IIT Kanpur |
| R1-2502952 | AI/ML for CSI compression and other aspects on AI/ML model/data | Ericsson |
| R1-2502996 | Discussion of CSI compression on AI/ML for NR air interface | FUTUREWEI |
| R1-2503028 | Summary#1 of Additional study on AI/ML for NR air interface: CSI compression and any other aspects on AI/ML model/data | Moderator (Qualcomm) |
| R1-2503029 | Summary#2 of Additional study on AI/ML for NR air interface: CSI compression and any other aspects on AI/ML model/data | Moderator (Qualcomm) |
| R1-2503030 | Summary#3 of Additional study on AI/ML for NR air interface: CSI compression and any other aspects on AI/ML model/data | Moderator (Qualcomm) |
| R1-2503031 | Summary#4 of Additional study on AI/ML for NR air interface: CSI compression and any other aspects on AI/ML model/data | Moderator (Qualcomm) |
| R1-2503032 | Summary#5 of Additional study on AI/ML for NR air interface: CSI compression and any other aspects on AI/ML model/data | Moderator (Qualcomm) |
| R1-2503033 | Summary#6 of Additional study on AI/ML for NR air interface: CSI compression and any other aspects on AI/ML model/data | Moderator (Qualcomm) |
| R1-2503034 | Final summary of Additional study on AI/ML for NR air interface: CSI compression and any other aspects on AI/ML model/data | Moderator (Qualcomm) |
| TDoc | Title | Source |
|---|---|---|
| R1-2502361 | List of RRC impact for Rel-19 MIMO Ph5 | Moderator (Samsung) |
| R1-2502362 | Draft LS to RAN2 on MAC impact for Rel-19 MIMO Ph5 | Moderator (Samsung) |
| R1-2502363 | LS to RAN2 on MAC impact for Rel-19 MIMO Ph5 | Moderator (Samsung) |
| R1-2502364 | Draft Stage-2 CR for Rel-19 NR MIMO Ph5 in TS38.300 | Samsung |
| R1-2503093 | Summary of discussion on Draft CR on TS38.300 for Rel-19 MIMO | Moderator (Samsung) |
| TDoc | Title | Source |
|---|---|---|
| R1-2501716 | Enhancements for UE-initiated/event-driven beam management | FUTUREWEI |
| R1-2501742 | On Specifications of Rel-19 UE/Event-Driven Beam Management | InterDigital, Inc. |
| R1-2501780 | Discussion on enhancements for UE-initiated/event-driven beam management | ZTE Corporation, Sanechips |
| R1-2501799 | Remaining issues on UE-initiated/event-driven beam management | vivo |
| R1-2501850 | Enhancements for UE-initiated/event-driven beam management | MediaTek Inc. |
| R1-2501862 | Discussion on UE-initiated/event-driven beam management | Spreadtrum, UNISOC |
| R1-2501985 | On enhancements for UE-initiated/event-driven beam management | CATT |
| R1-2502038 | On UE-initiated/event-driven beam management | Ofinno |
| R1-2502053 | Remaining issues for UE-initiated beam management | Ericsson |
| R1-2502065 | Discussions on UEIBM | China Telecom |
| R1-2502079 | Discussion on enhancements for UE-initiated or event-driven beam management | NEC |
| R1-2502103 | UE-initiated beam management | LG Electronics |
| R1-2502107 | Enhancements for UE-initiated/event-driven beam management | Lenovo |
| R1-2502119 | Discussion on enhancements for UE-initiated/event-driven beam management | Fujitsu |
| R1-2502153 | Discussion on enhancements for UE-initiated/event-driven beam management | CMCC |
| R1-2502224 | On UE initiated/event-driven beam management | Huawei, HiSilicon |
| R1-2502293 | Discussions on UE-initiated/event-driven beam management | OPPO |
| R1-2502312 | Enhancements for UE-initiated/event-driven beam management | Sony |
| R1-2502356 | Views on Rel-19 UE-initiated/event-driven beam management | Samsung |
| R1-2502414 | Discussion on enhancements for UE-initiated/event-driven beam management | Ruijie Networks Co. Ltd |
| R1-2502434 | Discussion on enhancements for UE-initiated/event-driven beam management | Xiaomi |
| R1-2502505 | Enhancements for UE-initiated/event-driven beam management | ETRI |
| R1-2502524 | Enhancements to facilitate UE-initiated/event-driven beam management | Nokia |
| R1-2502538 | Enhancements for UE-initiated/event-driven beam management | Transsion Holdings |
| R1-2502545 | Discussion on UE-initiated/event-driven beam management | TCL |
| R1-2502598 | Remaining issues for UE-initiated beam management | Apple |
| R1-2502665 | Enhancements for UE-initiated/event-driven beam management | Sharp |
| R1-2502687 | Discussion on the UE-initiated/event-driven beam management | HONOR |
| R1-2502744 | Offline summary for Rel-19 MIMO UEIBM (9.2.1) pre-RAN1#120b | Moderator (ZTE) |
| R1-2502745 | Moderator Summary #1 on UE-initiated/event-driven beam management | Moderator (ZTE) |
| R1-2502746 | Moderator Summary #2 on UE-initiated/event-driven beam management | Moderator (ZTE) |
| R1-2502747 | Moderator Summary #3 on UE-initiated/event-driven beam management | Moderator (ZTE) |
| R1-2502759 | Discussion on enhancements for UE-initiated/event-driven beam management | NTT DOCOMO, INC. |
| R1-2502793 | Discussion on UE-initiated/event-driven beam management | ITRI |
| R1-2502812 | Enhancements for UE-initiated/event-driven beam management | Panasonic |
| R1-2502833 | UE-initiated/event-driven beam management | Qualcomm Incorporated |
| R1-2502877 | Discussion on UE initiated beam report | ASUSTeK |
| R1-2502888 | Discussion on enhancements for UE-initiated or event-driven beam management | |
| R1-2502897 | Discussions on enhancements for UE-initiated/event-driven beam management | KDDI Corporation (TTC) |
| R1-2503092 | Moderator Summary #4 on UE-initiated/event-driven beam management | Moderator (ZTE) |
| TDoc | Title | Source |
|---|---|---|
| R1-2501743 | On Specifications of Rel-19 Enhancements of CSI | InterDigital, Inc. |
| R1-2501781 | Discussion on CSI enhancements | ZTE Corporation, Sanechips |
| R1-2501800 | Remaining issues on Rel-19 CSI enhancements | vivo |
| R1-2501851 | CSI enhancements | MediaTek Inc. |
| R1-2501863 | Discussion on CSI enhancements | Spreadtrum, UNISOC |
| R1-2501950 | CSI Enhancement for NR MIMO | |
| R1-2501986 | Remaining issues on CSI enhancements for NR MIMO Phase 5 | CATT |
| R1-2502011 | Discussion on Rel-19 CSI Enhancements | Tejas Network Limited |
| R1-2502074 | Discussion on CSI enhancements | NEC |
| R1-2502108 | Discussion on CSI enhancements | Lenovo |
| R1-2502120 | Remaining issues on Rel-19 CSI enhancements | Fujitsu |
| R1-2502154 | Discussion on CSI enhancements | CMCC |
| R1-2502225 | On 128 CSI-RS ports and UE reporting enhancement | Huawei, HiSilicon |
| R1-2502294 | CSI enhancements for Rel-19 MIMO | OPPO |
| R1-2502313 | Further discussion of CSI enhancements | Sony |
| R1-2502357 | Moderator Summary#1 on Rel-19 CSI enhancements: Round 1 | Moderator (Samsung) |
| R1-2502358 | Views on Rel-19 CSI enhancements | Samsung |
| R1-2502435 | Maintenance on CSI enhancement for up to 128 ports and CJT | Xiaomi |
| R1-2502506 | Discussion on CSI enhancements for NR MIMO Phase 5 | ETRI |
| R1-2502525 | CSI enhancement for NR MIMO Phase 5 | Nokia |
| R1-2502551 | Discussion on the Remaining Issues of CSI Enhancement | Rakuten Mobile, Inc |
| R1-2502599 | Views on R19 MIMO CSI enhancement | Apple |
| R1-2502666 | CSI enhancements | Sharp |
| R1-2502688 | Discussion on CSI enhancements | HONOR |
| R1-2502730 | Discussion on Beamforming Template for CSI Enhancement | China Unicom |
| R1-2502760 | Discussion on CSI enhancements | NTT DOCOMO, INC., NTT CORPORATION |
| R1-2502811 | Maintenance on CSI for large antenna arrays and CJT | Ericsson |
| R1-2502834 | CSI enhancements for >32 ports and UE-assisted CJT | Qualcomm Incorporated |
| R1-2502904 | CSI enhancements for Rel. 19 MIMO | Fraunhofer IIS, Fraunhofer HHI |
| R1-2502932 | Discussion on CSI enhancements for NR MIMO Phase 5 | KDDI Corporation |
| R1-2503011 | Moderator Summary#2 on Rel-19 CSI enhancements: Round 2 | Moderator (Samsung) |
| R1-2503012 | Moderator Summary#3 on Rel-19 CSI enhancements: Round 3 | Moderator (Samsung) |
| R1-2503013 | Moderator Summary for 1st offline on Rel-19 CSI enhancements | Moderator (Samsung) |
| TDoc | Title | Source |
|---|---|---|
| R1-2501744 | On Specifications of Rel-19 CB-based UL for 3TX UE | InterDigital, Inc. |
| R1-2501746 | FL Summary Support for 3TX CB-based Uplink; First Round | Moderator (InterDigital, Inc.) |
| R1-2501747 | FL Summary Support for 3TX CB-based Uplink; Second Round | Moderator (InterDigital, Inc.) |
| R1-2501748 | Summary of Discussion on 3TX CB-based Uplink in RAN1#120bis | Moderator (InterDigital, Inc.) |
| R1-2501782 | Discussion on 3-antenna-port codebook-based transmissions | ZTE Corporation, Sanechips |
| R1-2501801 | Remaining issues on 3-antenna-port codebook-based uplink transmissions | vivo |
| R1-2501852 | 3-antenna-port UL transmissions | MediaTek Inc. |
| R1-2501941 | Remaining issues for 3 Tx UL transmissions | Ericsson Japan K.K. |
| R1-2501951 | Uplink 3 Port Codebook based Transmission | |
| R1-2501987 | Remaining issues on 3-antenna-port uplink transmission | CATT |
| R1-2502109 | Support for 3-antenna-port codebook-based transmissions | Lenovo |
| R1-2502155 | Discussion on support for 3-antenna-port codebook-based transmissions | CMCC |
| R1-2502226 | Discussion on 3-antenna-port UL transmission | Huawei, HiSilicon |
| R1-2502295 | Discussion on 3-antenna-port uplink transmissions | OPPO |
| R1-2502359 | Views on Rel-19 3-antenna-port codebook-based transmissions | Samsung |
| R1-2502436 | Discussion on the support of 3-antenna-port CB based transmissions | Xiaomi |
| R1-2502526 | On the support for 3-antenna-port codebook-based transmissions | Nokia |
| R1-2502600 | Remaining issues on R19 MIMO 3Tx transmission | Apple |
| R1-2502667 | Support for 3-antenna-port transmission | Sharp |
| R1-2502761 | Discussion on support for 3-antenna-port codebook-based transmissions | NTT DOCOMO, INC. |
| TDoc | Title | Source |
|---|---|---|
| R1-2501745 | On Specifications of Rel-19 Asymmetric mTRP Operation | InterDigital, Inc. |
| R1-2501783 | Discussion on enhancements for asymmetric DL sTRP/UL mTRP scenarios | ZTE Corporation, Sanechips, China Telecom |
| R1-2501802 | Remaining issues on asymmetric DL sTRP/UL mTRP scenarios | vivo |
| R1-2501853 | Enhancement for asymmetric DL sTRP/UL mTRP scenarios | MediaTek Inc. |
| R1-2501864 | Enhancements for asymmetric DL sTRP/UL mTRP scenarios | Spreadtrum, UNISOC |
| R1-2501988 | Discussion on enhancements for asymmetric DL sTRP and UL mTRP scenarios | CATT |
| R1-2502012 | Enhancement for asymmetric DL sTRP UL mTRP | Tejas Network Limited |
| R1-2502019 | Discussion on enhancements for asymmetric DL sTRP/UL mTRP scenarios | China Telecom, ZTE |
| R1-2502039 | Enhancements on asymmetric DL STRP/UL MTRP scenarios | Ofinno |
| R1-2502080 | Discussion on enhancements for asymmetric DL sTRP and UL mTRP scenarios | NEC |
| R1-2502104 | Discussions on asymmetric DL sTRP/UL mTRP scenarios | LG Electronics |
| R1-2502105 | Remaining issues on asymmetric DL sTRP UL mTRP scenarios | Ericsson |
| R1-2502106 | Remaining issues on asymmetric DL sTRP UL mTRP scenarios | Ericsson |
| R1-2502110 | Enhancement for asymmetric DL sTRP/UL mTRP scenarios | Lenovo |
| R1-2502156 | Discussion on enhancement for asymmetric DL sTRP/UL mTRP scenarios | CMCC |
| R1-2502227 | Enhancements for asymmetric DL sTRP/UL mTRP scenarios | Huawei, HiSilicon |
| R1-2502296 | Enhancements on asymmetric DL sTRP/UL mTRP scenarios | OPPO |
| R1-2502314 | Enhancement for asymmetric DL sTRP/UL mTRP scenarios | Sony |
| R1-2502360 | Views on Rel-19 asymmetric DL sTRP/UL mTRP scenarios | Samsung |
| R1-2502437 | Discussion on enhancement for asymmetric DL sTRP/UL mTRP scenarios | Xiaomi |
| R1-2502507 | Discussion on asymmetric UL MIMO operation | ETRI |
| R1-2502527 | Enhancement for asymmetric DL sTRP/UL mTRP scenarios | Nokia |
| R1-2502536 | Discussion on asymmetric DL sTRP/UL mTRP scenarios | TCL |
| R1-2502539 | Discussion on enhancements for asymmetric DL sTRP/UL mTRP scenarios | Transsion Holdings |
| R1-2502601 | Enhancements for asymmetric DL sTRP/UL mTRP scenarios | Apple |
| R1-2502670 | Enhancement for asymmetric DL sTRP/UL mTRP scenarios | Sharp |
| R1-2502762 | Discussion on enhancement for asymmetric DL sTRP/UL mTRP scenarios | NTT DOCOMO, INC. |
| R1-2502813 | Enhancement for asymmetric DL sTRP/UL mTRP scenarios | Panasonic |
| R1-2502835 | Enhancement for asymmetric DL sTRP and UL mTRP deployment scenarios | Qualcomm Incorporated |
| R1-2502889 | Discussion on enhancement for asymmetric DL sTRP and UL mTRP scenarios | |
| R1-2502953 | Summary #1 on Rel-19 asymmetric DL sTRP/UL mTRP | Moderator (OPPO) |
| R1-2502954 | Summary #2 on Rel-19 asymmetric DL sTRP/UL mTRP | Moderator (OPPO) |
| R1-2502955 | Summary #3 on Rel-19 asymmetric DL sTRP/UL mTRP | Moderator (OPPO) |
| R1-2502956 | Draft Reply to RAN4 LS on DL timing reference to support two TA enhancement for asymmetric DL sTRP/ UL mTRP | Moderator (OPPO) |
| R1-2503091 | Reply to RAN4 LS on DL timing reference to support two TA enhancement for asymmetric DL sTRP/ UL mTRP | RAN1, OPPO |
| TDoc | Title | Source |
|---|---|---|
| R1-2502245 | Higher layer parameters for Rel-19 SBFD | Huawei, HiSilicon |
| TDoc | Title | Source |
|---|---|---|
| R1-2501738 | Discussion on SBFD TX/RX/measurement procedures | MediaTek Inc |
| R1-2501752 | Discussion on SBFD TX/RX/measurement procedures | LG Electronics |
| R1-2501803 | Discussion on Rel-19 SBFD operation | vivo |
| R1-2501843 | Discussion on SBFD TX/RX/measurement procedures | TCL |
| R1-2501865 | Discussion on SBFD TX/RX/measurement procedures | Spreadtrum, UNISOC |
| R1-2501907 | Discussion on transmission, reception and measurement procedures for SBFD operation | ZTE Corporation, Sanechips |
| R1-2501928 | On SBFD TX_RX_measurement procedures | InterDigital, Inc. |
| R1-2501989 | Discussion on SBFD TX/RX/measurement procedures | CATT |
| R1-2502013 | Discussion for SBFD TX/RX/ measurement procedures | Tejas Network Limited |
| R1-2502020 | Discussion on SBFD TX/RX/measurement procedures | China Telecom |
| R1-2502040 | Discussion on SBFD TX/RX/measurement procedures | Ofinno |
| R1-2502121 | Discussion on SBFD Tx/Rx/measurement procedures | Fujitsu |
| R1-2502157 | Discussion on SBFD TX/RX/measurement procedures | CMCC |
| R1-2502197 | Discussion on subband non-overlapping full duplex Tx-Rx and measurement operations | NEC |
| R1-2502241 | On subband full duplex design | Huawei, HiSilicon |
| R1-2502277 | Discussion on SBFD Tx/Rx/measurement procedures | OPPO |
| R1-2502315 | SBFD procedures | Sony |
| R1-2502365 | SBFD operation and procedures | Samsung |
| R1-2502402 | Discussion on SBFD TX/RX/measurement procedures | Panasonic |
| R1-2502405 | On SBFD TX/RX/measurement procedures | Nokia, Nokia Shanghai Bell |
| R1-2502420 | SBFD TX/RX/measurement procedures | Ericsson |
| R1-2502438 | Discussion on reception and transmission procedure for SBFD operation | Xiaomi |
| R1-2502497 | Discussion on SBFD Tx/Rx/measurement procedures | Fraunhofer HHI, Fraunhofer IIS |
| R1-2502508 | Discussion on SBFD TX/RX/measurement procedures | ETRI |
| R1-2502540 | Discussion on SBFD operation | Transsion Holdings |
| R1-2502602 | Discussion on SBFD TX/RX/measurement procedures | Apple |
| R1-2502652 | Discussion on SBFD Tx/Rx/measurement procedures | Charter Communications, Inc |
| R1-2502656 | SBFD Tx/Rx/measurement aspects | Sharp |
| R1-2502668 | Discussion on SBFD TX/RX/measurement procedures | Kookmin University |
| R1-2502680 | Partial PRG handling for SBFD | ASUSTeK |
| R1-2502689 | Discussion on SBFD TX/RX/measurement procedures | HONOR |
| R1-2502763 | Discussion on SBFD TX/RX/measurement procedures | NTT DOCOMO, INC. |
| R1-2502794 | Discussion on SBFD TX/RX/measurement procedures | ITRI |
| R1-2502798 | Summary #1 of SBFD TX/RX/measurement procedures | Moderator (Xiaomi) |
| R1-2502799 | Summary #2 of SBFD TX/RX/measurement procedures | Moderator (Xiaomi) |
| R1-2502836 | SBFD Transmission, Reception and Measurement Procedures | Qualcomm Incorporated |
| R1-2502901 | Discussion on SBFD TX/RX/measurement procedures | Google Korea LLC |
| R1-2502913 | Discussion on SBFD TX/RX/measurement procedures | CEWiT |
| R1-2502925 | Discussion on SBFD TX/RX/measurement procedures | WILUS Inc. |
| TDoc | Title | Source |
|---|---|---|
| R1-2501739 | Discussion on SBFD Random Access Operation | MediaTek Inc |
| R1-2501753 | Discussion on SBFD random access operation | LG Electronics |
| R1-2501804 | Discussion on random access for Rel-19 SBFD | vivo |
| R1-2501844 | Discussion on SBFD random access operation | TCL |
| R1-2501866 | Discussion on SBFD random access operation | Spreadtrum, UNISOC |
| R1-2501908 | Discussion on SBFD random access operation | ZTE Corporation, Sanechips |
| R1-2501929 | On SBFD random access operation | InterDigital, Inc. |
| R1-2501990 | Discussion on SBFD random access operation | CATT |
| R1-2502014 | Discussion on SBFD Random Access Operation | Tejas Network Limited |
| R1-2502021 | Discussion on SBFD random access operation | China Telecom |
| R1-2502041 | Discussion on SBFD random access operation | Ofinno |
| R1-2502085 | Discussion on random access for SBFD | NEC |
| R1-2502122 | Discussion on SBFD random access operation | Fujitsu |
| R1-2502158 | Discussion on SBFD random access operation | CMCC |
| R1-2502242 | On subband full duplex random access operation | Huawei, HiSilicon |
| R1-2502278 | Discussion on SBFD random access operation | OPPO |
| R1-2502316 | SBFD RACH operations | Sony |
| R1-2502366 | Random access on SBFD resources | Samsung |
| R1-2502404 | Discussion on SBFD random access operation | Panasonic |
| R1-2502406 | SBFD random access operation | Nokia, Nokia Shanghai Bell |
| R1-2502421 | SBFD Random access operation | Ericsson |
| R1-2502439 | Discussion on SBFD random access operation | Xiaomi |
| R1-2502494 | Discussion on SBFD random access operation | Korea Testing Laboratory |
| R1-2502509 | SBFD random access operation | ETRI |
| R1-2502541 | Discussion on SBFD random access operation | Transsion Holdings |
| R1-2502557 | On SBFD random access operation | Google Korea LLC |
| R1-2502568 | SBFD random access operation | Lenovo |
| R1-2502577 | Discussion on SBFD random access remaining aspects | Fainity Innovation |
| R1-2502603 | Views on SBFD random access operation | Apple |
| R1-2502657 | SBFD random access aspects | Sharp |
| R1-2502669 | Discussion on SBFD random access operation | Kookmin University |
| R1-2502764 | Discussion on SBFD random access operation | NTT DOCOMO, INC. |
| R1-2502795 | Discussion on SBFD random access operation | ITRI |
| R1-2502837 | SBFD Random Access Operation | Qualcomm Incorporated |
| R1-2502926 | Discussion on SBFD random access operation | WILUS Inc. |
| R1-2503016 | Summary#1 on SBFD random access operation | Moderator (CMCC) |
| R1-2503017 | Summary#2 on SBFD random access operation | Moderator (CMCC) |
| R1-2503018 | Summary#3 on SBFD random access operation | Moderator (CMCC) |
| TDoc | Title | Source |
|---|---|---|
| R1-2501740 | Discussion on CLI Handling in SBFD System | MediaTek Inc |
| R1-2501754 | Discussion on CLI handling | LG Electronics |
| R1-2501805 | Discussion on CLI handling for Rel-19 NR duplex | vivo |
| R1-2501867 | Discussion on CLI handling | Spreadtrum, UNISOC |
| R1-2501909 | Discussion on CLI handling for Rel-19 duplex operation | ZTE Corporation, Sanechips |
| R1-2501930 | On CLI handling for SBFD operation | InterDigital, Inc. |
| R1-2501991 | Discussion on CLI handling for NR duplex evolution | CATT |
| R1-2502015 | Discussion on gNB-gNB CLI handling | Tejas Network Limited |
| R1-2502086 | CLI handling for NR duplex operations | NEC |
| R1-2502159 | Discussion on CLI handling | CMCC |
| R1-2502243 | On cross-link interference handling for subband full duplex | Huawei, HiSilicon |
| R1-2502279 | CLI handling in NR duplex operation | OPPO |
| R1-2502317 | SBFD CLI handling | Sony |
| R1-2502367 | Cross-link interference handling for SBFD | Samsung |
| R1-2502407 | Cross-link interference handling for duplex evolution | Nokia, Nokia Shanghai Bell |
| R1-2502410 | Discussion on CLI handling | Panasonic |
| R1-2502422 | CLI handling | Ericsson |
| R1-2502440 | Discussion on CLI handling for SBFD operation | Xiaomi |
| R1-2502510 | Discussion on CLI handling for SBFD operation | ETRI |
| R1-2502558 | On the gNB-to-gNB CLI and the UE-to-UE CLI handling | Google Korea LLC |
| R1-2502604 | Discussion on CLI handling | Apple |
| R1-2502650 | Cross-link interference (CLI) handling | Sharp |
| R1-2502765 | Discussion on CLI handling | NTT DOCOMO, INC. |
| R1-2502838 | Enhancements for CLI handling | Qualcomm Incorporated |
| R1-2502914 | Discussion on CLI Handling | CEWiT |
| R1-2502958 | Discussion on CLI handling | NTT DOCOMO, INC. |
| R1-2503035 | Summary #1 of CLI handling | Moderator (Huawei) |
| R1-2503036 | Summary #2 of CLI handling | Moderator (Huawei) |
| R1-2503089 | LS on impact on transmit signal quality/MPR requirement | RAN1, Huawei |
| R1-2503090 | Reply LS on L1 measurement | RAN1, Huawei |
| TDoc | Title | Source |
|---|---|---|
| R1-2501957 | Discussion on timing acquisition and synchronisation for Ambient IoT | Lekha Wireless Solutions |
| R1-2502662 | Skeleton for TS 38.291: “Ambient IoT Physical layer” v0.0.1 | Huawei |
| R1-2503112 | Session notes for 9.4 (Solutions for Ambient IoT in NR) | Ad-Hoc Chair (Huawei) |
| R1-2503183 | Summary of email discussion [Post-120bis-Rel-19-38.291-Ambient_IoT_Solutions] | Moderator (Huawei) |
| TDoc | Title | Source |
|---|---|---|
| R1-2501706 | Discussion on modulation aspects for A-IoT physical channel | FUTUREWEI |
| R1-2501719 | Modulation aspects for Ambient IoT | Ericsson |
| R1-2501733 | Discussion on general aspects of physical layer design for Ambient IoT | TCL |
| R1-2501760 | Discussion on Ambient IoT modulation | ZTE Corporation, Sanechips |
| R1-2501776 | AIoT Physical channels design - modulation aspects | Nokia |
| R1-2501806 | Discussion on Modulation Aspects of Physical Channels Design | vivo |
| R1-2501868 | Discussion on modulation aspects of physical channels design for Ambient IoT | Spreadtrum, UNISOC |
| R1-2501992 | Ambient IoT physical channel design and modulation | CATT |
| R1-2502016 | Discussion on modulation aspects for A-IoT physical channel | Tejas Network Limited |
| R1-2502022 | Discussion on physical channels design about modulation aspects for Ambient IoT | China Telecom |
| R1-2502068 | Discussion on modulation aspects of ambient IoT | NEC |
| R1-2502123 | Modulation for R2D and D2R | Fujitsu |
| R1-2502160 | Discussion on modulation aspects of physical channel design | CMCC |
| R1-2502233 | Physical channels design on modulation | Huawei, HiSilicon |
| R1-2502273 | Discussion on modulation aspects of A-IoT | OPPO |
| R1-2502318 | Physical channel design aspects for Ambient IoT | Sony |
| R1-2502368 | Views on Physical channels design – modulation aspects | Samsung |
| R1-2502441 | Discussion on modulation aspects for Ambient IoT | Xiaomi |
| R1-2502467 | A-IoT Physical Channels Design on Modulation Aspects | Panasonic |
| R1-2502474 | A-IoT PHY layer design - waveform and modulation aspects | LG Electronics |
| R1-2502584 | Discussion on modulation aspects of physical channel design for Ambient IoT | InterDigital Finland Oy |
| R1-2502586 | Discussion on Physical Channel Modulation Aspects for Ambient-IoT | EURECOM |
| R1-2502605 | On modulation aspects for Ambient IoT | Apple |
| R1-2502671 | Discussion on modulation aspects | Sharp |
| R1-2502690 | Discussion on Physical channels design for Ambient IoT-modulation aspects | HONOR |
| R1-2502704 | A-IoT - PHY modulation aspects | MediaTek Inc. |
| R1-2502766 | Discussion on modulation aspects of physical channel design for Ambient IoT | NTT DOCOMO, INC. |
| R1-2502839 | Physical channels design – modulation aspects | Qualcomm Incorporated |
| R1-2502898 | Discussion on modulation aspects for Ambient-IOT | Fraunhofer IIS, Fraunhofer HHI |
| R1-2502905 | Discussion on modulation aspects for Ambient IoT physical channels | Lenovo |
| R1-2502927 | Discussion on modulation aspects of physical channels design for Ambient IoT | WILUS Inc. |
| R1-2502938 | Discussion on modulation related aspects of AIoT | IIT Kanpur |
| R1-2502992 | FL summary #1 for Ambient IoT: “9.4.1 Physical channels design – modulation aspects” | Moderator (Huawei) |
| R1-2502993 | FL summary #2 for Ambient IoT: “9.4.1 Physical channels design – modulation aspects” | Moderator (Huawei) |
| R1-2502994 | FL summary #3 for Ambient IoT: “9.4.1 Physical channels design – modulation aspects” | Moderator (Huawei) |
| R1-2503109 | FL summary #4 for Ambient IoT: “9.4.1 Physical channels design – modulation aspects” | Moderator (Huawei) |
| TDoc | Title | Source |
|---|---|---|
| R1-2501707 | Discussion on coding aspects for A-IoT physical channel | FUTUREWEI |
| R1-2501720 | Coding aspects for Ambient IoT | Ericsson |
| R1-2501734 | Discussion on other aspects for Ambient IoT physical design | TCL |
| R1-2501761 | Discussion on Ambient IoTcoding | ZTE Corporation, Sanechips |
| R1-2501777 | AIoT Physical channels design - line coding, FEC, CRC, repetition aspects | Nokia |
| R1-2501807 | Discussion on line coding, FEC, CRC and repetition for A-IoT | vivo |
| R1-2501869 | Discussion on line coding, FEC, CRC, repetition aspects for Ambient IoT | Spreadtrum, UNISOC |
| R1-2501993 | Ambient IoT channel coding and small frequency shift | CATT |
| R1-2502023 | Discussion on physical channels design about line coding, FEC, CRC, repetition aspects for Ambient IoT | China Telecom |
| R1-2502069 | Physical layer design – line coding, FEC, CRC, repetition aspects | NEC |
| R1-2502124 | Discussion on coding aspects | Fujitsu |
| R1-2502161 | Discussion on coding aspects of physical channel design | CMCC |
| R1-2502204 | Discussion on Physical Channel Designs for A-IoT | Panasonic |
| R1-2502234 | Physical channel design on channel coding | Huawei, HiSilicon |
| R1-2502274 | Discussion on physical channels design for A-IoT | OPPO |
| R1-2502369 | Views on Physical channels design – line coding, FEC, CRC, repetition aspects | Samsung |
| R1-2502442 | Discussion on line coding, FEC, CRC and repetition aspects for Ambient IoT | Xiaomi |
| R1-2502475 | A-IoT PHY layer design - line coding, FEC, CRC and repetition aspects | LG Electronics |
| R1-2502583 | Discussion on coding aspects of physical channel design for Ambient IoT | InterDigital Finland Oy |
| R1-2502606 | On coding aspects for Ambient IoT | Apple |
| R1-2502672 | Discussion on coding aspects | Sharp |
| R1-2502691 | Discussion on Physical channels design for Ambient IoT-other aspects | HONOR |
| R1-2502705 | A-IoT - PHY line coding, FEC, CRC, repetition aspects | MediaTek Inc. |
| R1-2502752 | Discussion on A-IoT Physical channels design | ASUSTeK |
| R1-2502767 | Discussion on coding and CRC aspects of physical channel design for Ambient IoT | NTT DOCOMO, INC. |
| R1-2502840 | Physical channels design – line coding, FEC, CRC, repetition aspects | Qualcomm Incorporated |
| R1-2502906 | Discussion on the Ambient IoT physical layer design aspects for Line coding, FEC, CRC, Repetition | Lenovo |
| R1-2502930 | Coding aspects for Ambient IoT | ITL |
| R1-2502939 | Discussion on other aspects of Phy design for AIoT | IIT Kanpur |
| R1-2503020 | Summary #1 for coding aspects of physical channel design | Moderator (CMCC) |
| R1-2503021 | Summary #2 for coding aspects of physical channel design | Moderator (CMCC) |
| R1-2503022 | Summary #3 for coding aspects of physical channel design | Moderator (CMCC) |
| R1-2503023 | Summary #4 for coding aspects of physical channel design | Moderator (CMCC) |
| R1-2503106 | Summary #5 for coding aspects of physical channel design | Moderator (CMCC) |
| R1-2503107 | Summary #6 for coding aspects of physical channel design | Moderator (CMCC) |
| TDoc | Title | Source |
|---|---|---|
| R1-2501708 | Discussion on timing acquisition and synchronization aspects for A-IoT | FUTUREWEI |
| R1-2501721 | Timing acquisition and synchronization for Ambient IoT | Ericsson |
| R1-2501735 | Discussion on timing acquisition and synchronization functionalities for Ambient IoT | TCL |
| R1-2501762 | Discussion on Ambient IoT signals | ZTE Corporation, Sanechips |
| R1-2501778 | AIoT Timing acquisition and synchronization | Nokia |
| R1-2501808 | Discussion on Timing acquisition and synchronization for AIoT | vivo |
| R1-2501870 | Discussion on timing acquisition and synchronization for Ambient IoT | Spreadtrum, UNISOC |
| R1-2501895 | Discussion on timing acquisition and synchronization for Ambient IoT | Lenovo |
| R1-2501921 | Discussion on timing acquisition and synchronization | InterDigital, Inc. |
| R1-2501994 | Ambient IoT Timing and synchronization | CATT |
| R1-2502024 | Discussion on timing acquisition and synchronization for Ambient IoT | China Telecom |
| R1-2502042 | Views on Timing acquisition and synchronization | Ofinno |
| R1-2502125 | Discussion on timing acquisition and synchronization | Fujitsu |
| R1-2502162 | Discussion on timing acquisition and synchronization | CMCC |
| R1-2502202 | Discussion on timing acquisition and synchronization | NEC |
| R1-2502235 | Physical signals design | Huawei, HiSilicon |
| R1-2502275 | Discussion on timing acquisition and synchronization for A-IoT | OPPO |
| R1-2502319 | Timing acquisition and synchronisation for Ambient IoT | Sony |
| R1-2502370 | Views on timing acquisition and synchronization | Samsung |
| R1-2502443 | Discussion on timing acquisition and synchronization for Ambient IoT | Xiaomi |
| R1-2502468 | A-IoT Timing Acquisition and Synchronization | Panasonic |
| R1-2502471 | Discussion on timing acquisition and synchronisation for Ambient IoT | Lekha Wireless Solutions |
| R1-2502476 | Timing acquisition and synchronization for A-IoT | LG Electronics |
| R1-2502511 | Discussion on timing acquisition and synchronization | ETRI |
| R1-2502607 | On timing acquisition & synchronization aspects for Ambient IoT | Apple |
| R1-2502609 | FL Summary#1 on timing acquisition and synchronization for Ambient IoT | Moderator (Apple) |
| R1-2502610 | FL Summary#2 on timing acquisition and synchronization for Ambient IoT | Moderator (Apple) |
| R1-2502611 | FL Summary#3 on timing acquisition and synchronization for Ambient IoT | Moderator (Apple) |
| R1-2502664 | Discussion on timing and synchronization aspects | Fraunhofer HHI, Fraunhofer IIS |
| R1-2502673 | Discussion on timing acquisition and synchronization | Sharp |
| R1-2502706 | A-IoT - Timing acquisition and synchronization | MediaTek Inc. |
| R1-2502768 | Discussion on timing acquisition and synchronization for Ambient IoT | NTT DOCOMO, INC. |
| R1-2502841 | Timing acquisition and synchronization | Qualcomm Incorporated |
| R1-2502896 | Timing acquisition and synchronization aspects for Ambient-IOT | Fraunhofer IIS, Fraunhofer HHI |
| R1-2502915 | Discussion on timing acquisition and synchronization aspects for Ambient IoT | CEWiT |
| R1-2502940 | Discussion on timing and synchronization aspects for AIoT | IIT Kanpur |
| R1-2503123 | Final summary on timing acquisition and synchronization for Ambient IoT | Moderator (Apple) |
| TDoc | Title | Source |
|---|---|---|
| R1-2501709 | Discussion on multiple access, scheduling and timing aspects for A-IoT | FUTUREWEI |
| R1-2501722 | Other aspects for Ambient IoT | Ericsson |
| R1-2501763 | Discussion on Ambient IoT multiple access and timing | ZTE Corporation, Sanechips |
| R1-2501779 | AIoT Other aspects incl. multiplexing/multiple access, scheduling information, and timing relationships | Nokia |
| R1-2501809 | Discussion on other aspects for Rel-19 Ambient IoT | vivo |
| R1-2501871 | Discussion on other aspects for Ambient IoT | Spreadtrum, UNISOC |
| R1-2501896 | Discussion on multiple access, scheduling and timing aspects of Ambient IoT | Lenovo |
| R1-2501922 | Discussion on multiplexing/multiple access, scheduling information, and timing relationships | InterDigital, Inc. |
| R1-2501995 | Ambient IoT frame structure, system control and resource allocation | CATT |
| R1-2502017 | Discussion on multiple access, scheduling and timing aspects for A-IoT | Tejas Network Limited |
| R1-2502025 | Discussion on other aspects for Ambient IoT | China Telecom |
| R1-2502043 | Views on other aspects for AIoT | Ofinno |
| R1-2502070 | Discussion on control and other aspects of ambient IoT | NEC |
| R1-2502126 | Discussion on other aspects of Ambient IoT | Fujitsu |
| R1-2502163 | Discussion on access, scheduling and timing relationships | CMCC |
| R1-2502205 | Discussion on other aspects of A-IoT | Panasonic |
| R1-2502236 | Multiplexing, scheduling, and other physical-layer procedures | Huawei, HiSilicon |
| R1-2502276 | Discussions on other aspects of A-IoT communication | OPPO |
| R1-2502320 | Multiplexing, multiple access and timing relationships for Ambient IoT | Sony |
| R1-2502371 | Views on aspects including multiplexing/multiple access, scheduling information, and timing relationships | Samsung |
| R1-2502444 | Discussion on other aspects for Ambient IoT | Xiaomi |
| R1-2502477 | Other aspects for A-IoT | LG Electronics |
| R1-2502498 | FL summary #1 on other aspects for Rel-19 Ambient IoT | Moderator (vivo) |
| R1-2502499 | FL summary #2 on other aspects for Rel-19 Ambient IoT | Moderator (vivo) |
| R1-2502500 | FL summary #3 on other aspects for Rel-19 Ambient IoT | Moderator (vivo) |
| R1-2502512 | Discussion on other aspects for Ambient IoT | ETRI |
| R1-2502608 | On multiple access, scheduling and control for Ambient IoT | Apple |
| R1-2502674 | Discussion on other aspects | Sharp |
| R1-2502692 | Discuss on L1 control information and L1 procedural aspects | HONOR |
| R1-2502699 | Discussion on multiple access, scheduling information and timing relationships for Ambient IoT | TCL |
| R1-2502707 | A-IoT - Other aspects | MediaTek Inc. |
| R1-2502729 | Discussion on other aspects of Ambient IoT | KT Corp. |
| R1-2502753 | Discussion on control information and procedural aspects | ASUSTeK |
| R1-2502769 | Discussion on other aspects for Ambient IoT | NTT DOCOMO, INC. |
| R1-2502842 | Discussion on other aspects for Rel-19 Ambient IoT | Qualcomm Incorporated |
| R1-2502890 | Discussion on multiplexing, multiple access, scheduling information, and timing relationships | |
| R1-2502916 | Discussion on multiple access, scheduling and timing aspects for Ambient IoT | CEWiT |
| R1-2502928 | Discussion on multiplexing/multiple access and timing relationships for Ambient IoT | WILUS Inc. |
| R1-2502941 | Discussion on other aspects of AIoT | IIT Kanpur |
| R1-2503104 | FL summary #4 on other aspects for Rel-19 Ambient IoT | Moderator (vivo) |
| TDoc | Title | Source |
|---|---|---|
| R1-2502801 | Update of RAN1 RRC parameter list for R19 NES WI | Rapporteur(Ericsson) |
| R1-2503126 | Updated list of RAN1 agreements for Rel-19 NES WI | Rapporteur (Ericsson) |
| R1-2503145 | Summary of the discussion on RAN1 RRC parameter list for R19 NES | Rapporteur (Ericsson) |
| TDoc | Title | Source |
|---|---|---|
| R1-2501713 | Discussion of on-demand SSB Scell operation | FUTUREWEI |
| R1-2501736 | On-demand SSB Scell operation for NES | TCL |
| R1-2501764 | Discussion on on-demond SSB for NES | ZTE Corporation, Sanechips |
| R1-2501772 | On-demand SSB SCell Operation | Nokia, Nokia Shanghai Bell |
| R1-2501810 | Discussions on on-demand SSB Scell operation | vivo |
| R1-2501872 | Discussion on on-demand SSB SCell operation | Spreadtrum, UNISOC |
| R1-2501952 | On-demand SSB SCell Operation | |
| R1-2501996 | Discussion on on-demand SSB SCell operation | CATT |
| R1-2502010 | OD-SSB for SCELL | Tejas Network Limited |
| R1-2502026 | Discussion on on-demand SSB operation for SCell | China Telecom |
| R1-2502044 | Discussion on on-demand SSB SCell operation | Ofinno |
| R1-2502092 | Discussion on on-demand SSB SCell operation | KT Corp. |
| R1-2502127 | Discussion on on-demand SSB SCell operation | Fujitsu |
| R1-2502164 | Discussion on on-demand SSB SCell operation | CMCC |
| R1-2502198 | Discussion on on-demand SSB for SCell operation | NEC |
| R1-2502229 | On-demand SSB SCell operation for eNES | Huawei, HiSilicon |
| R1-2502261 | Discussion on the enhancement to support on demand SSB SCell operation | OPPO |
| R1-2502334 | Discussion on on-demand SSB SCell operation | InterDigital, Inc. |
| R1-2502372 | On-demand SSB SCell operation | Samsung |
| R1-2502403 | Discussion on remaining details of on-demand SSB operation on SCell | Sharp |
| R1-2502445 | Discussion on on-demand SSB SCell operation | Xiaomi |
| R1-2502478 | On-demand SSB SCell operation | LG Electronics |
| R1-2502513 | Discussion on On-demand SSB SCell operation | ETRI |
| R1-2502542 | Discussion on On-Demand SSB SCell operation | Transsion Holdings |
| R1-2502569 | On-demand SSB SCell operation | Lenovo |
| R1-2502578 | Discussion on on-demand SSB SCell operation | Panasonic |
| R1-2502612 | On-demand SSB SCell Operation | Apple |
| R1-2502679 | DCI based signaling for on-demand SSB | ASUSTeK |
| R1-2502708 | On-demand SSB SCell operation | MediaTek Inc. |
| R1-2502770 | Discussion on on-demand SSB SCell operation | NTT DOCOMO, INC. |
| R1-2502796 | Discussion on on-demand SSB SCell operation | ITRI |
| R1-2502802 | On-demand SSB SCell operation | Ericsson |
| R1-2502843 | On-demand SSB operation for Scell | Qualcomm Incorporated |
| R1-2502917 | Discussion on on-demand SSB Scell operation | CEWiT |
| R1-2503045 | Summary #1 of on-demand SSB for NES | Moderator (LG Electronics) |
| R1-2503046 | Summary #2 of on-demand SSB for NES | Moderator (LG Electronics) |
| R1-2503047 | Summary #3 of on-demand SSB for NES | Moderator (LG Electronics) |
| R1-2503048 | Summary #4 of on-demand SSB for NES | Moderator (LG Electronics) |
| R1-2503096 | DRAFT LS to RAN4 on time instance B for on-demand SSB SCell operation | LG Electronics |
| R1-2503108 | LS to RAN4 on time instance B for on-demand SSB SCell operation | RAN1, LG Electronics |
| R1-2503119 | Summary #5 of on-demand SSB for NES | Moderator (LG Electronics) |
| TDoc | Title | Source |
|---|---|---|
| R1-2501714 | Discussion of on-demand SIB1 for idle/inactive mode UEs | FUTUREWEI |
| R1-2501765 | Discussion on on-demand SIB1 for NES | ZTE Corporation, Sanechips |
| R1-2501773 | On-demand SIB1 for Idle/Inactive mode UEs | Nokia, Nokia Shanghai Bell |
| R1-2501811 | Discussions on on-demand SIB1 for idle/inactive mode UEs | vivo |
| R1-2501873 | Discussion on on-demand SIB1 for idle/inactive mode UEs | Spreadtrum, UNISOC |
| R1-2501953 | On-demand SIB1 for Idle/Inactive Mode UE | |
| R1-2501997 | Discussion on on-demand SIB1 | CATT |
| R1-2502027 | Discussion on on-demand SIB1 for idle/inactive mode UEs | China Telecom |
| R1-2502045 | Discussion on on-demand SIB1 for idle/inactive mode UEs | Ofinno |
| R1-2502128 | Discussion on on-demand SIB1 transmission for network energy savings | Fujitsu |
| R1-2502165 | Discussion on on-demand SIB1 for UEs in idle/inactive mode | CMCC |
| R1-2502199 | Discussion on on-demand SIB1 for UEs in idle/inactive mode | NEC |
| R1-2502230 | Discussion on on-demand SIB1 for eNES | Huawei, HiSilicon |
| R1-2502262 | Discussion on the enhancement to support on demand SIB1 for idle/inactive mode UE | OPPO |
| R1-2502321 | On-demand SIB1 for idle/inactive mode UEs | Sony |
| R1-2502335 | Discussion on on-demand SIB1 for idle/inactive mode UEs | InterDigital, Inc. |
| R1-2502373 | On-demand SIB1 for idle/inactive mode UEs | Samsung |
| R1-2502446 | Discussion on on-demand SIB1 for idle/inactive mode UEs | Xiaomi |
| R1-2502469 | OD-SIB1 for Idle/Inactive UEs | Tejas Network Limited |
| R1-2502479 | On-demand SIB1 for idle/inactive mode UEs | LG Electronics |
| R1-2502514 | On-demand SIB1 for idle/inactive mode UEs | ETRI |
| R1-2502543 | Discussion on on-demand SIB1 transmission for idle/inactive mode UEs | Transsion Holdings |
| R1-2502570 | On-demand SIB1 for idle/inactive mode UEs | Lenovo |
| R1-2502579 | Discussion on on-demand SIB1 for idle/inactive mode UEs | Panasonic |
| R1-2502613 | On On-demand SIB1 for IDLE/INACTIVE mode UEs | Apple |
| R1-2502658 | On-demand SIB1 for NES | Fraunhofer IIS, Fraunhofer HHI |
| R1-2502678 | Remaining details for OD-SIB1 request | ASUSTeK |
| R1-2502681 | Discussion on on-demand SIB1 transmission for idle UEs | Sharp |
| R1-2502709 | On-demand SIB1 for idle or inactive mode UEs | MediaTek Inc. |
| R1-2502750 | Discussion on on-demand SIB1 for idle/inactive mode UEs | DENSO CORPORATION |
| R1-2502771 | Discussion on on-demand SIB1 for idle/inactive mode UEs | NTT DOCOMO, INC. |
| R1-2502803 | On-demand SIB1 for UEs in idle/inactive mode for NES | Ericsson |
| R1-2502844 | On-demand SIB1 procedure | Qualcomm Incorporated |
| R1-2502918 | Discussion on on-demand SIB1 | CEWiT |
| R1-2502921 | Discussion on on-demand SIB1 in idle/inactive mode | CAICT |
| R1-2503004 | FL summary 1 for on-demand SIB1 in idle/inactive mode | Moderator (MediaTek) |
| R1-2503005 | FL summary 2 for on-demand SIB1 in idle/inactive mode | Moderator (MediaTek) |
| R1-2503006 | FL summary 3 for on-demand SIB1 in idle/inactive mode | Moderator (MediaTek) |
| R1-2503007 | FL summary 4 for on-demand SIB1 in idle/inactive mode | Moderator (MediaTek) |
| R1-2503008 | FL summary 5 for on-demand SIB1 in idle/inactive mode | Moderator (MediaTek) |
| TDoc | Title | Source |
|---|---|---|
| R1-2501715 | Discussion of the adaptation of common signal/channel transmissions | FUTUREWEI |
| R1-2501766 | Discussion on common signal channel for NES | ZTE Corporation, Sanechips |
| R1-2501774 | Adaptation of common signal/channel transmissions | Nokia, Nokia Shanghai Bell |
| R1-2501812 | Discussions on adaptation of common signal/channel transmissions | vivo |
| R1-2501874 | Discussion on adaptation of common signal/channel transmissions | Spreadtrum, UNISOC |
| R1-2501954 | Adaptation of Common Signals | |
| R1-2501998 | Discussion on adaptation of common signal/channel transmissions | CATT |
| R1-2502028 | Discussion on common signal/channel adaptation | China Telecom |
| R1-2502093 | Discussion on adaptation of common signal/channel transmissions | KT Corp. |
| R1-2502129 | Discussion on adaptation of common signal channel transmissions | Fujitsu |
| R1-2502166 | Discussion on adaptation of common signal/channel transmissions | CMCC |
| R1-2502192 | Discussion on adaptation of common signal/channel transmission | Panasonic |
| R1-2502200 | Discussion on adaptation of common signal/channel transmissions | NEC |
| R1-2502231 | On common channel/signal adaptation for eNES | Huawei, HiSilicon |
| R1-2502254 | Adaptation of common signals and channels | Lenovo |
| R1-2502263 | Discussion on adaptation of common signal/channel transmission | OPPO |
| R1-2502336 | Discussion on adaptation of common signal/channel transmissions | InterDigital, Inc. |
| R1-2502374 | Adaptation of common signal/channel transmissions | Samsung |
| R1-2502447 | Discussion on adaptation of common signal and channel transmissions | Xiaomi |
| R1-2502470 | Adaptation of common signal/channels | Tejas Network Limited |
| R1-2502480 | Adaptation of common signal/channel transmissions | LG Electronics |
| R1-2502515 | Adaptation of common signal/channel transmissions | ETRI |
| R1-2502544 | Discussion on adaptive transmission of common signal or common channel | Transsion Holdings |
| R1-2502614 | On adaptation of common signal/channel for NES enhancements | Apple |
| R1-2502659 | Adaptation of Common Signals and Channels for NES | Fraunhofer IIS, Fraunhofer HHI |
| R1-2502682 | Discussion on adaptation of common signal/channel transmissions | Sharp |
| R1-2502693 | Discussion on adaptation of common signal channel transmissions | HONOR |
| R1-2502710 | Adaptation of common signal/channel transmissions | MediaTek Inc. |
| R1-2502772 | Discussion on adaptation of common signal/channel transmissions | NTT DOCOMO, INC. |
| R1-2502797 | Discussion on common signal adaptation | KDDI Corporation |
| R1-2502804 | Adaptation of common signal/channel transmissions for NES | Ericsson |
| R1-2502845 | Adaptation of common channel transmissions | Qualcomm Incorporated |
| R1-2502919 | Discussion on adaptation of common signal and channel transmissions | CEWiT |
| R1-2503052 | Summary#1 of AI 9.5.3 for R19 NES | Moderator (Ericsson) |
| R1-2503053 | Summary#2 of AI 9.5.3 for R19 NES | Moderator (Ericsson) |
| R1-2503054 | Summary#3 of AI 9.5.3 for R19 NES | Moderator (Ericsson) |
| R1-2503085 | Draft LS on DCI-based PRACH adaptation | Moderator (Ericsson) |
| R1-2503086 | LS on DCI-based PRACH adaptation | RAN1, Ericsson |
| R1-2503124 | Summary#4 of AI 9.5.3 for R19 NES | Moderator (Ericsson) |
| R1-2503125 | Final Summary of AI 9.5.3 for R19 NES | Moderator (Ericsson) |
| TDoc | Title | Source |
|---|---|---|
| R1-2501813 | Updated RRC parameters list for Rel-19 LP-WUS/WUR | vivo |
| R1-2503100 | Summary of RAN1 agreements on LP-WUS/WUR for NR | Rapporteur (vivo) |
| R1-2503137 | Summary of discussion on RRC parameters for Rel-19 LP-WUS/WUR | vivo (WI rapporteur) |
| TDoc | Title | Source |
|---|---|---|
| R1-2501710 | Discussion on LP-WUS and LP-SS Design | FUTUREWEI |
| R1-2501737 | Discussion on LP-WUS and LP-SS Design | EURECOM |
| R1-2501767 | Discussion on LP-WUS design | ZTE Corporation, Sanechips |
| R1-2501814 | Remaining issues on LP-WUS and LP-SS design | vivo |
| R1-2501845 | Discussion on LP-WUS and LP-SS Design | TCL |
| R1-2501875 | Discussion on LP-WUS and LP-SS design | Spreadtrum, UNISOC |
| R1-2501999 | Design of LP-WUS and LP-SS | CATT |
| R1-2502007 | LP-WUS and LP-SS design | Nokia |
| R1-2502075 | Discussion on LP-WUS and LP-SS design | NEC |
| R1-2502167 | Discussion on LP-WUS and LP-SS design | CMCC |
| R1-2502237 | Signal Design of LP-WUS and LP-SS | Huawei, HiSilicon |
| R1-2502257 | Signal design for LP-WUS and LP-SS | OPPO |
| R1-2502302 | Discussion on LP-WUS and LP-SS design | InterDigital, Inc. |
| R1-2502322 | LP-WUS and LP-SS design | Sony |
| R1-2502375 | Discussion on LP-WUS and LP-SS design | Samsung |
| R1-2502448 | Discussion on LP-WUS and LP-SS design | Xiaomi |
| R1-2502481 | Discussion on LP-WUS and LP-SS design | LG Electronics |
| R1-2502580 | Discussion on the LP-WUS and LP-SS design | Panasonic |
| R1-2502615 | LP-WUS and LP-SS design | Apple |
| R1-2502675 | Discussion on LP-WUS and LP-SS design | Sharp |
| R1-2502694 | Discussion on LP-WUS and LP-SS design | HONOR |
| R1-2502711 | LP-WUS and LP-SS design | MediaTek Inc. |
| R1-2502773 | Discussion on LP-WUS and LP-SS design | NTT DOCOMO, INC. |
| R1-2502805 | LP-WUS and LP-SS design | Ericsson |
| R1-2502846 | LP-WUS and LP-SS design | Qualcomm Incorporated |
| R1-2502880 | On LP-WUS and LP-SS design | Nordic Semiconductor ASA |
| R1-2502908 | Discussion on LP-WUS and LP-SS design | Lenovo |
| R1-2503000 | LP-WUS and LP-SS design | Nokia |
| R1-2503014 | Summary #1 of discussions on LP-WUS and LP-SS design | Moderator (vivo) |
| R1-2503015 | Summary #2 of discussions on LP-WUS and LP-SS design | Moderator (vivo) |
| R1-2503082 | Summary #3 of discussions on LP-WUS and LP-SS design | Moderator (vivo) |
| R1-2503083 | Summary #4 of discussions on LP-WUS and LP-SS design | Moderator (vivo) |
| R1-2503097 | Summary #5 of discussions on LP-WUS and LP-SS design | Moderator (vivo) |
| R1-2503098 | Summary #6 of discussions on LP-WUS and LP-SS design | Moderator (vivo) |
| R1-2503099 | Final summary of discussions on LP-WUS and LP-SS design | Moderator (vivo) |
| TDoc | Title | Source |
|---|---|---|
| R1-2501711 | Discussion on LP-WUS Operation in IDLE/INACTIVE Modes | FUTUREWEI |
| R1-2501768 | Discussion on LP-WUS operation in IDLE/INACTIVE mode | ZTE Corporation, Sanechips |
| R1-2501815 | Remaining issues on LP-WUS operation in IDLE/INACTIVE modes | vivo |
| R1-2501846 | Discussion on LP-WUS Operation in IDLE/INACTIVE state | TCL |
| R1-2501876 | Discussion on LP-WUS operation in IDLE/INACTIVE modes | Spreadtrum, UNISOC |
| R1-2502000 | System design and procedure of LP-WUS operation for UE in IDLE/Inactive Modes | CATT |
| R1-2502008 | LP-WUS operation in IDLE/Inactive mode | Nokia |
| R1-2502076 | Discussion on LP-WUS operation in RRC IDLE/INACTIVE mode | NEC |
| R1-2502168 | Discussion on LP-WUS operation in IDLE/INACTIVE modes | CMCC |
| R1-2502238 | Procedures and functionalities of LP-WUS in IDLE/INACTIVE mode | Huawei, HiSilicon |
| R1-2502258 | Further consideration on LP-WUS operation in RRC_IDLE/INACTIVE modes | OPPO |
| R1-2502303 | Discussion on LP-WUS operation in IDLE/INACTIVE modes | InterDigital, Inc. |
| R1-2502323 | LP-WUS operation in IDLE / INACTIVE modes | Sony |
| R1-2502376 | Discussion on LP-WUS operation in IDLE/INACTIVE modes | Samsung |
| R1-2502449 | Discussion on LP-WUS operation in Idle/Inactive modes | Xiaomi |
| R1-2502482 | Discussion on LP-WUS operation in IDLE/INACTIVE modes | LG Electronics |
| R1-2502516 | Discussion on LP-WUS operation in IDLE/INACTIVE modes | ETRI |
| R1-2502581 | Discussion on LP-WUS operation in IDLE/INACTIVE modes | Panasonic |
| R1-2502616 | LP-WUS operation in IDLE/INACTIVE modes | Apple |
| R1-2502618 | Summary #1 on LP-WUS operation in IDLE/INACTIVE mode | Moderator (Apple) |
| R1-2502619 | Summary #2 on LP-WUS operation in IDLE/INACTIVE mode | Moderator (Apple) |
| R1-2502620 | Summary #3 on LP-WUS operation in IDLE/INACTIVE mode | Moderator (Apple) |
| R1-2502621 | Summary #4 on LP-WUS operation in IDLE/INACTIVE mode | Moderator (Apple) |
| R1-2502622 | Summary #5 on LP-WUS operation in IDLE/INACTIVE mode | Moderator (Apple) |
| R1-2502676 | Discussion on LP-WUS operation in IDLE/INACTIVE modes | Sharp |
| R1-2502712 | LP-WUS operation in IDLE/INACTIVE modes | MediaTek Inc. |
| R1-2502774 | Discussion on LP-WUS operation in IDLE/INACTIVE modes | NTT DOCOMO, INC. |
| R1-2502806 | LP-WUS operation in IDLE and INACTIVE modes | Ericsson |
| R1-2502847 | LP-WUR operation in idle and inactive modes | Qualcomm Incorporated |
| R1-2502879 | On LP-WUS operation in IDLE/Inactive | Nordic Semiconductor ASA |
| R1-2502907 | Discussion on LP-WUS operation in Idle/Inactive modes | Lenovo |
| R1-2503087 | Draft LS on the RRM measurement metrics for OFDM-based LP-WUR | Moderator (Apple) |
| R1-2503103 | LS on the RRM measurement metrics for OFDM-based LP-WUR | RAN1, Apple |
| R1-2503147 | Summary #6 on LP-WUS operation in IDLE/INACTIVE mode | Moderator (Apple) |
| TDoc | Title | Source |
|---|---|---|
| R1-2501769 | Discussion on LP-WUS operation in CONNECTED mode | ZTE Corporation, Sanechips |
| R1-2501816 | Remaining issues on LP-WUS operation in CONNECTED modes | vivo |
| R1-2501877 | Discussion on LP-WUS operation in CONNECTED modes | Spreadtrum, UNISOC |
| R1-2502001 | System design and procedure of LP-WUS operation for UE in CONNECTED Modes | CATT |
| R1-2502009 | LP-WUS operation in CONNECTED mode | Nokia |
| R1-2502060 | Discussion on LP-WUS operation in CONNECTED mode | Panasonic |
| R1-2502077 | Discussion on LP-WUS operation in RRC CONNECTED mode | NEC |
| R1-2502169 | Discussion on LP-WUS operation in CONNECTED mode | CMCC |
| R1-2502239 | Procedures and functionalities of LP-WUS in CONNECTED mode | Huawei, HiSilicon |
| R1-2502259 | Further consideration on LP-WUS operation in connected mode | OPPO |
| R1-2502304 | Discussion on RRC CONNECTED mode LP-WUS monitoring | InterDigital, Inc. |
| R1-2502324 | LP-WUS operation in CONNECTED mode | Sony |
| R1-2502377 | Discussion on LP-WUS operation in CONNECTED modes | Samsung |
| R1-2502450 | Discussion on LP-WUS operation in Connected mode | Xiaomi |
| R1-2502483 | Discussion on LP-WUS operation in CONNECTED modes | LG Electronics |
| R1-2502517 | Discussion on LP-WUS operation in CONNECTED modes | ETRI |
| R1-2502576 | Discussion on LP-WUS procedures in Connected mode | TCL |
| R1-2502617 | LP-WUS operation in CONNECTED modes | Apple |
| R1-2502677 | Discussion on LP-WUS operation in CONNECTED modes | Sharp |
| R1-2502713 | LP-WUS operation in CONNECTED modes | MediaTek Inc. |
| R1-2502775 | Discussion on LP-WUS operation in CONNECTED mode | NTT DOCOMO, INC. |
| R1-2502807 | LP-WUS operation in CONNECTED mode | Ericsson |
| R1-2502848 | LP-WUR operation in connected mode | Qualcomm Incorporated |
| R1-2502997 | FL summary #1 on LP-WUS operation in CONNECTED mode | Moderator (NTT DOCOMO) |
| R1-2503055 | FL summary #2 on LP-WUS operation in CONNECTED mode | Moderator (NTT DOCOMO) |
| R1-2503088 | FL summary #3 on LP-WUS operation in CONNECTED mode | Moderator (NTT DOCOMO) |
| R1-2503102 | FL summary #4 on LP-WUS operation in CONNECTED mode | Moderator (NTT DOCOMO) |
| R1-2503120 | FL summary #5 on LP-WUS operation in CONNECTED mode | Moderator (NTT DOCOMO) |
| R1-2503121 | Final summary on LP-WUS operation in CONNECTED mode | Moderator (NTT DOCOMO) |
| TDoc | Title | Source |
|---|---|---|
| R1-2502552 | Draft CR for TR 38.901 to introduce channel model for ISAC | Xiaomi, AT&T |
| R1-2503072 | Draft CR for TR 38.901 to introduce channel model for ISAC | Xiaomi, AT&T |
| R1-2503113 | Session notes for 9.7 (Study on channel modelling for Integrated Sensing And Communication for NR) | Ad-Hoc Chair (Huawei) |
| R1-2503157 | Draft CR for TR 38.901 to introduce channel model for ISAC | Xiaomi, AT&T |
| R1-2503158 | Summary on discussions on CR to 38.901 on ISAC CM | Moderator (Xiaomi) |
| TDoc | Title | Source |
|---|---|---|
| R1-2501817 | Views on Rel-19 ISAC deployment scenarios | vivo |
| R1-2501839 | Discussion on ISAC deployment scenarios and requirements | EURECOM |
| R1-2501926 | Discussion on ISAC deployment scenarios | InterDigital, Inc. |
| R1-2501935 | Deployment scenarios for integrated sensing and communication with NR | NVIDIA |
| R1-2502002 | Discussion on ISAC deployment scenarios | CATT, CICTCI |
| R1-2502029 | Discussion on ISAC deployment scenarios | China Telecom |
| R1-2502051 | Discussion on ISAC Deployment Scenarios | Nokia, Nokia Shanghai Bell |
| R1-2502054 | Discussion on ISAC deployment scenarios | Tiami Networks |
| R1-2502062 | Discussion on ISAC deployment scenarios | ZTE Corporation, Sanechips |
| R1-2502067 | Discussion on ISAC deployment scenarios | Panasonic |
| R1-2502170 | Discussion on ISAC channel model calibration | CMCC, China Southern Power Grid |
| R1-2502207 | Deployment scenarios for ISAC channel model | Huawei, HiSilicon |
| R1-2502285 | Discussion on ISAC channel model calibration | OPPO |
| R1-2502325 | Discussion on ISAC deployment scenarios | Sony |
| R1-2502378 | Discussion on ISAC deployment scenarios | Samsung |
| R1-2502416 | Discussion on ISAC deployment scenarios | CALTTA |
| R1-2502418 | Discussion on ISAC channel calibration | BUPT, CMCC |
| R1-2502451 | Deployment scenarios and evaluation assumptions for ISAC channel model | Xiaomi |
| R1-2502465 | Discussion on ISAC deployment scenarios | TOYOTA InfoTechnology Center |
| R1-2502588 | Discussion on ISAC deployment scenarios | Lenovo |
| R1-2502623 | Discussion on ISAC deployment scenarios | Apple |
| R1-2502714 | Discussion on ISAC deployment scenario | MediaTek Inc. |
| R1-2502725 | Discussion on ISAC Deployment Scenarios | Ericsson |
| R1-2502731 | FL Summary #1 on ISAC Scenarios and Calibrations | Moderator (AT&T) |
| R1-2502732 | FL Summary #2 on ISAC Scenarios and Calibrations | Moderator (AT&T) |
| R1-2502733 | FL Summary #3 on ISAC Scenarios and Calibrations | Moderator (AT&T) |
| R1-2502734 | FL Summary #4 on ISAC Scenarios and Calibrations | Moderator (AT&T) |
| R1-2502820 | Discussion on ISAC deployment scenarios | LG Electronics |
| R1-2502849 | Discussion on ISAC deployment scenarios | Qualcomm Incorporated |
| R1-2502922 | Considerations on ISCA deployment scenarios | CAICT |
| R1-2503150 | Email summary on Post-120bis-ISAC-01 | Moderator (AT&T) |
| R1-2503151 | ISAC calibration templates | Moderator (AT&T) |
| TDoc | Title | Source |
|---|---|---|
| R1-2501818 | Views on Rel-19 ISAC channel modelling | vivo, BUPT |
| R1-2501840 | Discussion on ISAC channel modeling | EURECOM |
| R1-2501878 | Discussion on ISAC channel modeling | Spreadtrum, UNISOC |
| R1-2501927 | Discussion on ISAC channel modeling | InterDigital, Inc. |
| R1-2501933 | Channel modelling for integrated sensing and communication with NR | NVIDIA |
| R1-2502003 | Discussion on ISAC channel modelling | CATT, CICTCI |
| R1-2502030 | Discussion on ISAC channel modelling | China Telecom |
| R1-2502052 | Discussion on ISAC channel modeling | Nokia, Nokia Shanghai Bell |
| R1-2502055 | Discussion on ISAC Channel Modeling | Tiami Networks |
| R1-2502063 | Joint views on mono-static background channel modeling | ZTE Corporation, Sanechips, OPPO, BUPT, BJTU, CAICT, Xiaomi |
| R1-2502171 | Discussion on channel modeling methodology for ISAC | CMCC, BUPT, SEU, PML |
| R1-2502208 | Channel modelling for ISAC | Huawei, HiSilicon |
| R1-2502286 | Study on ISAC channel modelling | OPPO |
| R1-2502326 | Discussion on Channel Modelling for ISAC | Sony |
| R1-2502379 | Discussion on ISAC channel modelling | Samsung |
| R1-2502417 | Discussion on channel modelling for ISAC | CALTTA, ZTE Corporation, Sanechips |
| R1-2502419 | ISAC Channel Modeling and Measurement Validation | BUPT, CMCC, VIVO |
| R1-2502452 | Discussion on ISAC channel model | Xiaomi, BJTU, BUPT |
| R1-2502466 | Discussion on ISAC channel modelling | TOYOTA InfoTechnology Center |
| R1-2502553 | Summary #1 on ISAC channel modelling | Moderator (Xiaomi) |
| R1-2502554 | Summary #2 on ISAC channel modelling | Moderator (Xiaomi) |
| R1-2502555 | Summary #3 on ISAC channel modelling | Moderator (Xiaomi) |
| R1-2502556 | Summary #4 on ISAC channel modelling | Moderator (Xiaomi) |
| R1-2502565 | Discussion on ISAC channel modelling | Tejas Network Limited |
| R1-2502572 | Discussion on ISAC Channel Modeling | NIST |
| R1-2502587 | Discussion on Channel Modelling for ISAC | Lenovo |
| R1-2502624 | Discussion on ISAC channel modelling | Apple |
| R1-2502715 | Discussion on ISAC channel modelling | MediaTek Inc. |
| R1-2502726 | Discussion on ISAC Channel Modelling | Ericsson |
| R1-2502736 | Discussions on ISAC Channel Modeling | AT&T |
| R1-2502776 | Discussion on ISAC Channel Modelling | NTT DOCOMO, INC. |
| R1-2502814 | Discussion on ISAC channel modelling | Panasonic |
| R1-2502821 | Discussion on ISAC channel modelling | LG Electronics |
| R1-2502850 | Discussion on ISAC channel modelling | Qualcomm Incorporated |
| R1-2502923 | Considerations on ISAC channel modelling | CAICT |
| R1-2503080 | Study on ISAC channel modelling | OPPO |
| R1-2503146 | Summary #5 on ISAC channel modelling | Moderator (Xiaomi) |
| R1-2503152 | Email summary on [Post-120bis-ISAC-02] | Moderator (Xiaomi) |
| TDoc | Title | Source |
|---|---|---|
| R1-2502343 | Draft CR for Rel-19 7-24GHz Channel model | Intel Corporation, ZTE Corporation |
| R1-2502415 | Curve fittings for UMi & UMa scenarios: DS, ASA, ASD LOS/NLOS | Sharp, Nokia, Ericsson, Apple, BUPT |
| R1-2503061 | Summary #1 of discussions for draft CR for 7-24 GHz SI | Moderator (Intel Corporation) |
| R1-2503062 | Summary #2 of discussions for draft CR for 7-24 GHz SI | Moderator (Intel Corporation) |
| R1-2503114 | Session notes for 9.8 (Study on channel modelling enhancements for 7-24GHz for NR) | Ad-Hoc Chair (CMCC) |
| R1-2503129 | Draft CR for Rel-19 7-24GHz Channel model | Intel Corporation, ZTE Corporation |
| TDoc | Title | Source |
|---|---|---|
| R1-2501749 | Remaining Issues on Evaluation of FR3 Channel Modeling | InterDigital, Inc. |
| R1-2501819 | Views on channel model validation of TR38.901 for 7-24GHz | vivo, BUPT |
| R1-2501897 | Discussion on the channel model validation | ZTE Corporation, Sanechips |
| R1-2501937 | Channel model validation of TR 38.901 for 7-24 GHz | NVIDIA |
| R1-2502004 | On channel model validation for 7-24GHz | CATT |
| R1-2502186 | Discussion on channel model validation of TR38.901 for 7-24GHz | BUPT, Spark NZ Ltd, X-Net |
| R1-2502217 | Considerations on the 7-24GHz channel model validation | Huawei, HiSilicon |
| R1-2502327 | Further discussion of channel model validation of TR38.901 for 7-24GHz | Sony |
| R1-2502339 | Channel model validation for 7-24 GHz | Lenovo |
| R1-2502341 | Discussion on channel modeling verification for 7-24 GHz | Intel Corporation |
| R1-2502380 | Discussion on channel model validation of TR38.901 for 7 - 24 GHz | Samsung |
| R1-2502625 | Validation of Channel Model | Apple |
| R1-2502737 | Discussion on Validation of the Channel Model in 38901 | AT&T |
| R1-2502751 | Views on Channel model validation of TR38.901 for 7-24 GHz | Sharp |
| R1-2502777 | Discussion on channel model validation for 7-24 GHz | NTT DOCOMO, INC. |
| R1-2502851 | Channel Model Validation of TR38.901 for 7-24 GHz | Qualcomm Incorporated |
| R1-2502878 | Discussion on validation of channel model | Ericsson |
| R1-2502899 | Discussion on Channel model validation of TR38.901 for 7-24GHz | Nokia |
| R1-2502909 | Measurements of the angular spreads in a urban and suburban macrocells | Vodafone, Ericsson |
| R1-2502951 | Discussion on channel model validation of TR38.901 for 7-24GHz | BUPT, X-Net |
| R1-2502957 | Discussion on channel modeling verification for 7-24 GHz | Intel Corporation |
| R1-2502986 | Views on Channel model validation of TR38.901 for 7-24 GHz | Sharp |
| R1-2503060 | Data source descriptions for 7 – 24 GHz SI | Moderator (Intel Corporation) |
| R1-2503063 | Summary of issues for Rel-19 7-24 GHz Channel Modeling Validation | Moderator (Intel Corporation) |
| R1-2503064 | Summary #1 of discussions for Rel-19 7-24 GHz Channel Modeling Validation | Moderator (Intel Corporation) |
| R1-2503065 | Summary #2 of discussions for Rel-19 7-24 GHz Channel Modeling Validation | Moderator (Intel Corporation) |
| R1-2503066 | Summary #3 of discussions for Rel-19 7-24 GHz Channel Modeling Validation | Moderator (Intel Corporation) |
| R1-2503067 | Summary #4 of discussions for Rel-19 7-24 GHz Channel Modeling Validation | Moderator (Intel Corporation) |
| R1-2503130 | Summary #5 of discussions for Rel-19 7-24 GHz Channel Modeling Validation | Moderator (Intel Corporation) |
| TDoc | Title | Source |
|---|---|---|
| R1-2501750 | Remaining Issues on Extension of FR3 Channel Modeling | InterDigital, Inc. |
| R1-2501755 | Discussion on channel modelling adaptation/extension for 7-24GHz | LG Electronics |
| R1-2501820 | Views on channel model adaptation/extension of TR38.901 for 7-24GHz | vivo, BUPT |
| R1-2501898 | Discussion on the channel model adaptation and extension | ZTE Corporation, Sanechips |
| R1-2501936 | Channel model adaptation of TR 38.901 for 7-24 GHz | NVIDIA |
| R1-2501955 | Discussions on FR3 Channel Modelling | Lekha Wireless Solutions |
| R1-2502005 | On channel model adaptation/extension for 7-24GHz | CATT |
| R1-2502187 | Discussion on modeling near-field propagation and spatial non-stationarity in TR38.901 for 7-24GHz | BUPT, CMCC, X-Net |
| R1-2502218 | Considerations on the 7-24GHz channel model extension | Huawei, HiSilicon |
| R1-2502287 | Channel model adaptation and extension for 7-24GHz | OPPO |
| R1-2502328 | Further discussion of channel model adaptation/extension of TR38.901 for 7-24GHz | Sony |
| R1-2502340 | Channel model extension for 7-24 GHz | Lenovo |
| R1-2502342 | Discussion on channel model adaptation/extension | Intel Corporation |
| R1-2502381 | Discussion on channel model adaptation/extension of TR38.901 for 7 - 24 GHz | Samsung |
| R1-2502626 | Channel Model Adaptation and Extension of TR38.901 for 7-24 GHz | Apple |
| R1-2502852 | Channel Model Adaptation/Extension of TR38.901 for 7-24GHz | Qualcomm Incorporated |
| R1-2502884 | Discussion on adaptation and extension of channel model | Ericsson |
| R1-2502900 | Discussion on Channel model adaptation/extension of TR38.901 for 7-24GHz | Nokia |
| R1-2503024 | Summary#1 of channel model adaptation and extension | Moderator (ZTE) |
| R1-2503025 | Summary#2 of channel model adaptation and extension | Moderator (ZTE) |
| R1-2503026 | Summary#3 of channel model adaptation and extension | Moderator (ZTE) |
| R1-2503027 | Summary#4 of channel model adaptation and extension | Moderator (ZTE) |
| TDoc | Title | Source |
|---|---|---|
| R1-2502627 | Higher layer parameters for Rel-19 NR mobility enhancements Ph4 | Rapporteur (Apple) |
| R1-2503140 | Summary of RRC parameters for NR mobility enhancement WI for RAN1 120bis meeting | Rapporteur (Apple) |
| TDoc | Title | Source |
|---|---|---|
| R1-2501756 | Discussion on measurements related enhancements for LTM | LG Electronics |
| R1-2501784 | Discussion on measurements related enhancements for LTM | ZTE Corporation, Sanechips |
| R1-2501821 | Discussion on measurements related enhancements for LTM | vivo |
| R1-2501849 | Discussion on LTM enhancements | TCL |
| R1-2501879 | Discussion on measurements related enhancements for LTM | Spreadtrum, UNISOC |
| R1-2501956 | Discussion on measurement related enhancements for LTM | Lekha Wireless Solutions |
| R1-2502006 | Discussions on measurements related enhancements for LTM | CATT |
| R1-2502087 | FL plan for mobility enhancements in RAN1#120bis | Moderator (Fujitsu) |
| R1-2502088 | FL summary 1 of Measurements related enhancements for LTM | Moderator (Fujitsu) |
| R1-2502089 | FL summary 2 of Measurements related enhancements for LTM | Moderator (Fujitsu) |
| R1-2502090 | FL summary 3 of Measurements related enhancements for LTM | Moderator (Fujitsu) |
| R1-2502091 | Final FL summary of Measurements related enhancements for LTM | Moderator (Fujitsu) |
| R1-2502111 | Measurements related enhancements for LTM | Lenovo |
| R1-2502132 | Discussion on measurement related enhancements for LTM | Fujitsu |
| R1-2502172 | Discussion on measurements related enhancements for LTM | CMCC |
| R1-2502201 | Discussion on measurements related enhancements for LTM | NEC |
| R1-2502206 | Measurements related enhancements for LTM | InterDigital, Inc. |
| R1-2502214 | Measurements related enhancements for LTM | Huawei, HiSilicon |
| R1-2502298 | Discussions on measurement enhancement for LTM | OPPO |
| R1-2502329 | Measurements related enhancements for LTM | Sony |
| R1-2502382 | Views on Rel-19 measurement related enhancements for LTM | Samsung |
| R1-2502453 | Discussion on measurements related enhancements for LTM | Xiaomi |
| R1-2502490 | Discussion on measurements related enhancements for LTM | Sharp |
| R1-2502518 | Discussion on measurements related enhancements for LTM | ETRI |
| R1-2502562 | Measurement related enhancements for LTM | Ericsson |
| R1-2502628 | Measurement related enhancements for LTM | Apple |
| R1-2502653 | Measurement related enhancements for LTM | Nokia |
| R1-2502749 | Discussion on measurements related enhancements for LTM | KDDI Corporation |
| R1-2502778 | Discussion on measurement related enhancements for LTM | NTT DOCOMO, INC. |
| R1-2502853 | Measurements related enhancement for LTM | Qualcomm Incorporated |
| R1-2502891 | Discussion on measurements related enhancements for LTM | |
| R1-2502929 | LTM measurements related enhancements | MediaTek |
| R1-2503076 | [Draft] Reply LS on number of beam measurements in the measurement report MAC CE | Moderator (Fujitsu) |
| R1-2503077 | Reply LS on number of beam measurements in the measurement report MAC CE | RAN1, Fujitsu |
| R1-2503078 | [Draft] LS on the support of semi-persistent CSI-RS resource for LTM CSI acquisition for candidate cells | Moderator (Fujitsu) |
| R1-2503079 | LS on the support of semi-persistent CSI-RS resource for LTM CSI acquisition for candidate cells | RAN1, Fujitsu |
| TDoc | Title | Source |
|---|---|---|
| R1-2502942 | Discussions on scheduling enhancements considering RRM measurements for XR | Huawei, HiSilicon |
| TDoc | Title | Source |
|---|---|---|
| R1-2501729 | Work plan for Rel-19 NR_NTN_Ph3 | THALES, CATT |
| R1-2501842 | RAN1 agreements for NR NTN Phase 3 up to RAN1#120 | Rapporteur (THALES) |
| R1-2502056 | Work plan for WID: introduction of IoT-NTN TDD mode | Iridium Satellite LLC |
| R1-2502566 | Initial RRC parameters list for Rel-19 NR NTN Phase 3 | Rapporteur (THALES) |
| R1-2503115 | Session notes for 9.11 (Non-Terrestrial Networks for NR Phase 3 and Internet of Things Phase 3) | Ad-Hoc Chair (Huawei) |
| R1-2503127 | Summary#1 of discussions on RRC parameters for Rel-19 NR NTN Phase 3 | Moderator (Thales) |
| R1-2503128 | Summary#2 of discussions on RRC parameters for Rel-19 NR NTN Phase 3 | Moderator (Thales) |
| TDoc | Title | Source |
|---|---|---|
| R1-2501723 | NR NTN Downlink coverage enhancements | THALES |
| R1-2501725 | FL Summary #1: NR-NTN downlink coverage enhancements | Moderator (THALES) |
| R1-2501726 | FL Summary #2: NR-NTN downlink coverage enhancements | Moderator (THALES) |
| R1-2501727 | FL Summary #3: NR-NTN downlink coverage enhancements | Moderator (THALES) |
| R1-2501728 | FL Summary #4: NR-NTN downlink coverage enhancements | Moderator (THALES) |
| R1-2501822 | Discussion on NR-NTN downlink coverage enhancement | vivo |
| R1-2501841 | On NR-NTN downlink coverage enhancement | Ericsson |
| R1-2501847 | Discussion on downlink coverage enhancements for NR NTN | CCU |
| R1-2501880 | Discussion on NR-NTN downlink coverage enhancement | Spreadtrum, UNISOC |
| R1-2501890 | Discussion on downlink coverage enhancement for NR NTN | Fraunhofer IIS, Fraunhofer HHI |
| R1-2501899 | Discussion on DL coverage enhancement for NR NTN | ZTE Corporation, Sanechips |
| R1-2501972 | Discussion on downlink coverage enhancement for NR NTN | CATT |
| R1-2502031 | Further Discussion on NR NTN downlink coverage enhancement | China Telecom |
| R1-2502082 | NR-NTN downlink coverage enhancement | NEC |
| R1-2502130 | Discussion on downlink coverage enhancements | Fujitsu |
| R1-2502173 | Discussion on NR-NTN DL coverage enhancement | CMCC |
| R1-2502188 | NR-NTN downlink coverage enhancement | InterDigital, Inc. |
| R1-2502219 | Discussion on downlink coverage enhancements for NR NTN | Huawei, HiSilicon |
| R1-2502265 | Discussion on NR-NTN downlink coverage enhancement | OPPO |
| R1-2502383 | Discussion on downlink coverage enhancement for NR-NTN | Samsung |
| R1-2502454 | Discussion on NR-NTN downlink coverage enhancement | Xiaomi |
| R1-2502473 | Discussion on DL coverage enhancements for NR-NTN | NICT |
| R1-2502488 | Discussion on downlink coverage enhancement for NR NTN | Baicells Technologies Co. Ltd |
| R1-2502519 | Discussion on NR-NTN downlink coverage enhancement | ETRI |
| R1-2502532 | Discussions on downlink coverage enhancements | Nokia, Nokia Shanghai Bell |
| R1-2502549 | Discussion on NR-NTN downlink coverage enhancement | TCL |
| R1-2502559 | NR-NTN Downlink Coverage Enhancement | Panasonic |
| R1-2502629 | On NR-NTN Downlink Coverage Enhancement | Apple |
| R1-2502695 | Discussion on NR-NTN downlink coverage enhancement | HONOR |
| R1-2502716 | NR-NTN downlink coverage enhancement | MediaTek Inc. |
| R1-2502727 | Discussion on downlink coverage enhancement for NR-NTN | CSCN |
| R1-2502779 | Discussion on DL coverage enhancement for NR-NTN | NTT DOCOMO, INC. |
| R1-2502815 | Discussion on NR-NTN downlink coverage enhancement | LG Electronics |
| R1-2502822 | Discussion on downlink coverage enhancement for NR NTN | Lenovo |
| R1-2502854 | Downlink coverage enhancement for NR NTN | Qualcomm Incorporated |
| R1-2502902 | Discussion on Downlink Coverage Enhancement for NR NTN | Google Korea LLC |
| R1-2502920 | Discussion on Downlink Coverage Enhancements for NR NTN | CEWiT |
| TDoc | Title | Source |
|---|---|---|
| R1-2501757 | Discussion on support of HD-FDD (e)RedCap UEs with NR NTN | SageRAN |
| R1-2501823 | Discussion on support of RedCap and eRedCap UEs with NR-NTN | vivo |
| R1-2501881 | Discussion on support of RedCap and eRedCap UEs with NR NTN operating in FR1-NTN bands | Spreadtrum, UNISOC |
| R1-2501900 | Discussion on support of RedCap/eRedCap UEs for NR NTN | ZTE Corporation, Sanechips |
| R1-2501973 | Discussion on the enhancement of RedCap and eRedCap UEs In NTN | CATT |
| R1-2502032 | Discussion on Support of RedCap and eRedCap UEs with NR NTN operating in FR1-NTN bands | China Telecom |
| R1-2502174 | Discussion on the collision issues of HD-FDD Redcap UE in FR1-NTN | CMCC |
| R1-2502189 | Discussion on half-duplex RedCap issues for NTN FR1 operation | InterDigital, Inc. |
| R1-2502220 | Discussion on HD-FDD RedCap UEs and eRedCap UEs for FR1-NTN | Huawei, HiSilicon |
| R1-2502266 | Discussion on supporting of RedCap and eRedCap UEs with NR NTN operating in FR1-NTN bands | OPPO |
| R1-2502305 | On HD-FDD Redcap UEs for NTN | Ericsson |
| R1-2502384 | Discussion on support of RedCap and eRedCap UEs with NR NTN operating in FR1-NTN bands | Samsung |
| R1-2502455 | Discussion on the support of Redcap and eRedcap UEs in NR NTN | Xiaomi |
| R1-2502520 | Discussion on HD UEs with NR NTN | ETRI |
| R1-2502533 | Discussion of support for RedCap and eRedCap UEs with NR NTN operating in FR1-NTN bands | Nokia, Nokia Shanghai Bell |
| R1-2502573 | Discussion on HD-FDD RedCap UEs and eRedCap UEs for FR1-NTN | TCL |
| R1-2502630 | Discussion on support of RedCap UEs with NR NTN operation | Apple |
| R1-2502651 | Support of (e)RedCap UEs with NR NTN | Sharp |
| R1-2502696 | Discussion on support of (e)RedCap UEs in NR NTN | HONOR |
| R1-2502717 | Support of RedCap and eRedCap UEs with NR NTN operating in FR1-NTN bands | MediaTek Inc. |
| R1-2502780 | Discussion on support of RedCap and eRedCap UEs in FR1-NTN | NTT DOCOMO, INC. |
| R1-2502816 | Discussion on support of (e)RedCap UEs with NR-NTN operating in FR1-NTN bands | LG Electronics |
| R1-2502855 | Support of Redcap and eRedcap UEs in NR NTN | Qualcomm Incorporated |
| R1-2502883 | Support of RedCap and eRedCap UEs in NR NTN | Nordic Semiconductor ASA |
| R1-2502924 | Discussion on support of RedCap/eRedCap UEs in NTN | CAICT |
| R1-2503049 | Summary #1 for Support of RedCap and eRedCap UEs with NR NTN operating in FR1-NTN bands | Moderator (CATT) |
| R1-2503050 | Summary #2 for Support of RedCap and eRedCap UEs with NR NTN operating in FR1-NTN bands | Moderator (CATT) |
| R1-2503051 | Summary #3 for Support of RedCap and eRedCap UEs with NR NTN operating in FR1-NTN bands | Moderator (CATT) |
| TDoc | Title | Source |
|---|---|---|
| R1-2501730 | On uplink capacity enhancement for NR-NTN | Ericsson |
| R1-2501824 | Discussion on NR-NTN uplink capacity enhancement | vivo |
| R1-2501882 | Discussion on NR-NTN uplink capacity/throughput enhancement | Spreadtrum, UNISOC |
| R1-2501901 | Discussion on UL capacity enhancement for NR NTN | ZTE Corporation, Sanechips |
| R1-2501974 | Discussion on UL capacity enhancement for NR NTN | CATT |
| R1-2502033 | Discussion on NR-NTN uplink enhancement | China Telecom |
| R1-2502083 | NR-NTN uplink capacity/throughput enhancement | NEC |
| R1-2502131 | Discussion on uplink capacity/cell throughput enhancement for FR1-NTN | Fujitsu |
| R1-2502175 | Discussion on the NR-NTN uplink capacity/throughput enhancements | CMCC |
| R1-2502190 | NR-NTN uplink capacity/throughput enhancement | InterDigital, Inc. |
| R1-2502221 | Discussion on uplink capacity/throughput enhancement for FR1-NTN | Huawei, HiSilicon |
| R1-2502267 | Discussion on NR-NTN uplink capacity/throughput enhancement | OPPO |
| R1-2502385 | Discussion on uplink capacity/throughput enhancement for NR-NTN | Samsung |
| R1-2502409 | Discussion on the NR-NTN uplink capacity/throughput enhancements | TCL |
| R1-2502456 | Discussion on NR-NTN PUSCH capacity enhancement | Xiaomi |
| R1-2502521 | Discussion on NR-NTN uplink capacity/throughput enhancement | ETRI |
| R1-2502534 | Discussion of NR-NTN uplink capacity enhancements | Nokia, Nokia Shanghai Bell |
| R1-2502589 | Discussion on NR-NTN Uplink Capacity/Throughput Enhancement | Lenovo |
| R1-2502631 | On NR-NTN Uplink Capacity Enhancement | Apple |
| R1-2502697 | Discussion on NR-NTN UL capacity/throughput enhancement | HONOR |
| R1-2502698 | Uplink capacity/throughput enhancement for NR-NTN | Panasonic |
| R1-2502718 | NR-NTN uplink capacity and throughput enhancements | MediaTek Inc. |
| R1-2502781 | Discussion on NR-NTN uplink capacity/throughput enhancement | NTT DOCOMO, INC. |
| R1-2502817 | Discussion on NR-NTN uplink capacity/throughput enhancement | LG Electronics |
| R1-2502856 | NR-NTN uplink capacity / throughput enhancement | Qualcomm Incorporated |
| R1-2502903 | Discussion on NR-NTN uplink capacity/throughput enhancement | Google Korea LLC |
| R1-2502983 | Feature lead summary #1 of AI 9.11.3 on NR-NTN uplink capacity and throughput enhancements | Moderator (MediaTek) |
| R1-2502984 | Feature lead summary #2 of AI 9.11.3 on NR-NTN uplink capacity and throughput enhancements | Moderator (MediaTek) |
| R1-2502985 | Feature lead summary #3 of AI 9.11.3 on NR-NTN uplink capacity and throughput enhancements | Moderator (MediaTek) |
| R1-2503070 | Draft LS on requirements for the phase continuity and power consistency for OCC with PUSCH in NR NTN Ph3 | Moderator (MediaTek) |
| R1-2503071 | LS on requirements for the phase continuity and power consistency for OCC with PUSCH in NR NTN Ph3 | RAN1, MediaTek |
| R1-2503094 | Feature lead summary #4 of AI 9.11.3 on NR-NTN uplink capacity and throughput enhancements | Moderator (MediaTek) |
| TDoc | Title | Source |
|---|---|---|
| R1-2501825 | Discussion on IoT-NTN uplink capacity enhancement | vivo |
| R1-2501883 | Discussion on IoT-NTN uplink capacity/throughput enhancement | Spreadtrum, UNISOC |
| R1-2501902 | Discussion on UL capacity enhancement for IoT NTN | ZTE Corporation, Sanechips |
| R1-2501975 | Discussion on UL capacity enhancement for IoT NTN | CATT |
| R1-2502084 | IoT-NTN uplink capacity/throughput enhancement | NEC |
| R1-2502094 | IoT-NTN uplink capacity enhancement | Nokia, Nokia Shanghai Bell |
| R1-2502176 | Discussion on the IoT-NTN uplink capacity/throughput enhancements | CMCC |
| R1-2502191 | IoT-NTN uplink capacity/throughput enhancement | InterDigital, Inc. |
| R1-2502222 | Discussion on UL capacity enhancements for IoT NTN | Huawei, HiSilicon |
| R1-2502268 | Discussion on IoT-NTN uplink capacity/throughput enhancement | OPPO |
| R1-2502306 | On uplink capacity enhancements for IoT-NTN | Ericsson |
| R1-2502330 | On IoT-NTN uplink capacity enhancements | Sony |
| R1-2502331 | FL Summary #1 for IoT-NTN | Moderator (Sony) |
| R1-2502332 | FL Summary #2 for IoT-NTN | Moderator (Sony) |
| R1-2502333 | Final FL Summary for IoT-NTN | Moderator (Sony) |
| R1-2502344 | IoT NTN OCC signaling for NPUSCH | Sharp |
| R1-2502386 | Discussion on uplink capacity/throughput enhancement for IoT-NTN | Samsung |
| R1-2502457 | Discussion on IoT-NTN uplink capacity enhancement | Xiaomi |
| R1-2502522 | Discussion on uplink capacity/throughput enhancement for IoT NTN | ETRI |
| R1-2502560 | Discussion on the IoT-NTN uplink capacity/throughput enhancements | TCL |
| R1-2502632 | Discussion on IoT-NTN Uplink Capacity Enhancement | Apple |
| R1-2502719 | IoT-NTN uplink capacity and throughput enhancement | MediaTek Inc. |
| R1-2502818 | Discussion on IoT-NTN uplink capacity/throughput enhancement | LG Electronics |
| R1-2502823 | Discussion on uplink capacity enhancement for IoT NTN | Lenovo |
| R1-2502857 | IOT-NTN uplink capacity/throughput enhancement | Qualcomm Incorporated |
| R1-2502882 | IoT-NTN uplink capacity/throughput enhancement | Nordic Semiconductor ASA |
| R1-2503122 | FL Summary #3 for IoT-NTN | Moderator (Sony) |
| TDoc | Title | Source |
|---|---|---|
| R1-2501724 | Discussion on IoT-NTN TDD mode | THALES |
| R1-2501826 | Discussion on IoT-NTN TDD mode | vivo |
| R1-2501884 | Discussion on IoT-NTN TDD mode | Spreadtrum, UNISOC |
| R1-2501903 | Discussion on the IoT-NTN TDD mode | ZTE Corporation, Sanechips |
| R1-2501976 | Discussion on Physical layer design of IoT-NTN TDD | CATT |
| R1-2502057 | Remaining aspects of loT-NTN TDD mode | Iridium Satellite LLC |
| R1-2502059 | Stage 2 proposal (for RAN2 TS 36.300) for Introduction of IoT-NTN TDD mode | Iridium Satellite LLC |
| R1-2502095 | Discussion on IoT-NTN TDD mode | Nokia, Nokia Shanghai Bell |
| R1-2502177 | Discussion on the new NB-IoT NTN TDD mode | CMCC |
| R1-2502223 | Discussion on IoT-NTN TDD mode | Huawei, HiSilicon |
| R1-2502269 | Discussion on IoT-NTN TDD mode | OPPO |
| R1-2502345 | IoT NTN TDD guard period and uplink segmentation | Sharp |
| R1-2502387 | Discussion on IoT-NTN TDD mode | Samsung |
| R1-2502458 | Discussion on IoT-NTN TDD mode | Xiaomi |
| R1-2502633 | Discussion on IoT-NTN TDD mode | Apple |
| R1-2502782 | Discussion on IoT-NTN TDD mode | NTT DOCOMO, INC. |
| R1-2502819 | Discussion on IoT-NTN TDD mode | LG Electronics |
| R1-2502824 | Discussion on IoT-NTN TDD mode | Lenovo |
| R1-2502858 | IOT-NTN TDD mode | Qualcomm Incorporated |
| R1-2502881 | On R19 TDD IoT-NTN | Nordic Semiconductor ASA |
| R1-2502999 | Feature lead summary #1 on IoT-NTN TDD mode | Moderator (Qualcomm Incorporated) |
| R1-2503081 | Feature lead summary #2 on IoT-NTN TDD mode | Moderator (Qualcomm Incorporated) |
| R1-2503101 | Feature lead summary #3 on IoT-NTN TDD mode | Moderator (Qualcomm Incorporated) |
| R1-2503141 | [DRAFT] LS on precompensation for NB-IoT NTN TDD mode | Qualcomm Incorporated |
| R1-2503142 | LS on precompensation for NB-IoT NTN TDD mode | RAN1, Qualcomm Incorporated |
| R1-2503165 | Introduction of IoT-NTN TDD mode | Motorola Mobility |
| R1-2503166 | Summary of email discussion [Post-120bis-Rel-19-36.213- IoT_NTN_TDD-Core] | Moderator (Motorola Mobility) |
| TDoc | Title | Source |
|---|---|---|
| R1-2501891 | High layer parameters for Rel-19 Multi-Carrier Enhancements | Lenovo (Rapporteur) |
| R1-2503116 | Session notes for 9.12 (Multi-Carrier Enhancements for NR Phase 2) | Ad-Hoc Chair (CMCC) |
| TDoc | Title | Source |
|---|---|---|
| R1-2501827 | Discussion on enhancement of multi-cell PUSCH/PDSCH | vivo |
| R1-2501885 | Discussion on multi-cell PUSCH/PDSCH scheduling with a single DCI | Spreadtrum, UNISOC |
| R1-2501892 | Discussion on multi-cell scheduling with a single DCI | Lenovo |
| R1-2501910 | Discussion on multi-cell PUSCH/PDSCH scheduling with a single DCI | ZTE Corporation, Sanechips |
| R1-2501960 | Multi-cell PxSCH scheduling with a single DCI | Ericsson |
| R1-2501977 | Discussion on multi-cell PUSCH/PDSCH scheduling with a single DCI | CATT |
| R1-2502034 | Discussion on multi-carrier enhancements for NR phase 3 | China Telecom |
| R1-2502215 | Discussion on Rel-19 Multi-carrier enhancements | Huawei, HiSilicon |
| R1-2502282 | Discussion of multi-cell scheduling with a single DCI | OPPO |
| R1-2502388 | Enhancements for multi-cell PUSCH/PDSCH scheduling | Samsung |
| R1-2502484 | Discussion on single DCI based multi-cell scheduling for Rel-19 | LG Electronics |
| R1-2502493 | Discussion on multi-carrier enhancements for NR Phase 3 | Panasonic |
| R1-2502495 | Remaining details on Rel-19 Multi-carrier enhancements | Nokia |
| R1-2502574 | Discussion on Multi-cell PUSCHPDSCH scheduling with a single DCI | TCL |
| R1-2502720 | Multi-carrier enhancements for NR phase 3 | MediaTek Inc. |
| R1-2502783 | Discussion on multi-cell PUSCH/PDSCH scheduling with a single DCI | NTT DOCOMO, INC. |
| R1-2502859 | Multi-cell PUSCH/PDSCH scheduling with a single DCI | Qualcomm Incorporated |
| R1-2502998 | Multi-carrier enhancements for NR phase 3 | MediaTek Inc. |
| R1-2503037 | Feature lead summary#1 on multi-cell scheduling with a single DCI | Moderator (Lenovo) |
| R1-2503038 | Feature lead summary#2 on multi-cell scheduling with a single DCI | Moderator (Lenovo) |
| R1-2503039 | Feature lead summary#3 on multi-cell scheduling with a single DCI | Moderator (Lenovo) |
| TDoc | Title | Source |
|---|---|---|
| R1-2501828 | Discussion on Low band carrier aggregation via switching | vivo |
| R1-2501886 | Discussion on low band carrier aggregation via switching | Spreadtrum, UNISOC |
| R1-2501893 | Discussion on carrier switching pattern for low band carrier aggregation via switching | Lenovo |
| R1-2501911 | Discussion on low band carrier aggregation via switching | ZTE Corporation, Sanechips |
| R1-2501978 | Discussion on low band carrier aggregation via switching | CATT |
| R1-2502046 | Discussion on a low-band CA with switching | Ofinno |
| R1-2502203 | Discussion on low band carrier aggregation via switching | NEC |
| R1-2502216 | Discussion on low band CA via switching | Huawei, HiSilicon |
| R1-2502283 | Discussion of low-band CA via switching | OPPO |
| R1-2502389 | Discussion on low band carrier aggregation via switching | Samsung |
| R1-2502426 | Low band carrier aggregation through switching | Ericsson |
| R1-2502485 | Discussion on low band CA operation via switching for Rel-19 | LG Electronics |
| R1-2502496 | Principles for low-band CA via switching | Nokia |
| R1-2502575 | Discussion on Low band carrier aggregation via switching | TCL |
| R1-2502634 | On low-band carrier aggregation via switching | Apple |
| R1-2502635 | FL summary #1 of Low band carrier aggregation via switching | Moderator (Apple) |
| R1-2502636 | FL summary #2 of Low band carrier aggregation via switching | Moderator (Apple) |
| R1-2502637 | FL summary #3 of Low band carrier aggregation via switching | Moderator (Apple) |
| R1-2502721 | Low band carrier aggregation via switching | MediaTek Inc. |
| R1-2502784 | Discussion on Low band carrier aggregation via switching | NTT DOCOMO, INC. |
| R1-2502860 | Low band carrier aggregation via switching | Qualcomm Incorporated |
| R1-2503110 | FL summary #4 of Low band carrier aggregation via switching | Moderator (Apple) |
| TDoc | Title | Source |
|---|---|---|
| R1-2502548 | Higher layer parameters for Rel-19 LTE-based 5G Broadcast after RAN1#120 | EBU |
| R1-2503117 | Session notes for 9.13 (LTE-based 5G Broadcast Phase 2) | Ad-Hoc Chair (Huawei) |
| R1-2503163 | Introduction of LTE-based 5G Broadcast Phase 2 | Motorola Mobility |
| R1-2503164 | Summary of email discussion [Post-120bis-Rel-19-36.213- LTE_terr_bcast_Ph2-Core] | Moderator (Motorola Mobility) |
| TDoc | Title | Source |
|---|---|---|
| R1-2501912 | Discussion on time-frequency interleaver design for LTE-based 5G Broadcast | ZTE Corporation, Sanechips |
| R1-2502209 | On time-frequency interleavers for LTE-based 5G Broadcast | Huawei, HiSilicon |
| R1-2502390 | Views on LTE-based 5G broadcast | Samsung |
| R1-2502546 | Further details on open issues regarding TFI for LTE-based 5G Broadcast | EBU |
| R1-2502582 | Design of Time-frequency interleaver for 5G Broadcast | Shanghai Jiao Tong University |
| R1-2502861 | Time and Frequency Interleaving for 5G Broadcast | Qualcomm Incorporated |
| R1-2503001 | FL summary#1 on Rel-19 LTE-based 5G Broadcast Phase 2 | Moderator (EBU) |
| R1-2503002 | FL summary#2 on Rel-19 LTE-based 5G Broadcast Phase 2 | Moderator (EBU) |
| R1-2503003 | FL summary#3 on Rel-19 LTE-based 5G Broadcast Phase 2 | Moderator (EBU) |
| R1-2503143 | Final summary on Rel-19 LTE-based 5G Broadcast Phase 2 | Moderator (EBU) |
| TDoc | Title | Source |
|---|---|---|
| R1-2501787 | On Rel-19 TEI proposals | ZTE Corporation, Sanechips |
| R1-2502550 | Rel-19 TEI on muting of always-on signals for 5G Broadcast | EBU |
| R1-2502638 | Higher layer parameters for Rel-19 TEI SRSCS_ULTxSwitch | Apple |
| R1-2502722 | Proposal for TEI19 | MediaTek Inc. |
| R1-2502748 | Enhancement of SRS antenna switching pattern reporting | CATT |
| R1-2502862 | Proposal for Rel-19 RAN1 TEI | Qualcomm Incorporated |
| R1-2502995 | Rel-19 TEI on muting of always-on signals for 5G Broadcast | EBU |
| R1-2503009 | FL Summary #1 on Rel-19 TEIs | Moderator (NTT DOCOMO, INC.) |
| R1-2503010 | FL Summary #2 on Rel-19 TEIs | Moderator (NTT DOCOMO, INC.) |
| R1-2503073 | Proposal for Rel-19 RAN1 TEI | Qualcomm, Apple, Verizon, ZTE |
| R1-2503095 | FL Summary #3 on Rel-19 TEIs | Moderator (NTT DOCOMO, INC.) |
| R1-2503118 | Session notes for 9.14 (TEI19) | Ad-Hoc Chair (CMCC) |
| TDoc | Title | Source |
|---|---|---|
| R1-2502977 | Updated RAN1 UE features list for Rel-19 NR after RAN1 #120bis | Moderators (AT&T, NTT DOCOMO, INC.) |
| R1-2502978 | Draft LS on updated Rel-19 RAN1 UE features lists for NR after RAN1#120bis | Moderators (AT&T, NTT DOCOMO, INC.) |
| R1-2502979 | LS on updated Rel-19 RAN1 UE features lists for NR after RAN1#120bis | RAN1, AT&T, NTT DOCOMO, INC. |
| R1-2502980 | Initial RAN1 UE features list for Rel-19 LTE after RAN1 #120bis | Moderators (AT&T, NTT DOCOMO, INC.) |
| R1-2502981 | Draft LS on initial Rel-19 RAN1 UE features lists for LTE after RAN1#120bis | Moderators (AT&T, NTT DOCOMO, INC.) |
| R1-2502982 | LS on initial Rel-19 RAN1 UE features lists for LTE after RAN1#120bis | RAN1, AT&T, NTT DOCOMO, INC. |
| TDoc | Title | Source |
|---|---|---|
| R1-2501829 | Discussion on UE features for AI/ML for NR Air Interface | vivo |
| R1-2501920 | Discussion on UE features for AI/ML for NR Air Interface | ZTE Corporation, Sanechips |
| R1-2501979 | Discussion on UE features for AI/ML for NR Air Interface | CATT, CICTCI |
| R1-2502047 | Views on UE features for AI/ML for NR Air Interface | Ofinno |
| R1-2502102 | Discussions on UE features for AI/ML for NR Air Interface | LG Electronics |
| R1-2502133 | Views on UE features for AI/ML for NR Air Interface | Nokia |
| R1-2502178 | Discussion on UE features for AI/ML for NR air Interface | CMCC |
| R1-2502246 | UE features for AI/ML for NR air interface | Huawei, HiSilicon |
| R1-2502292 | UE features for AIML for NR air interface | OPPO |
| R1-2502391 | UE features for AI/ML for NR Air Interface | Samsung |
| R1-2502459 | Discussion on UE features for AI/ML for NR Air Interface | Xiaomi |
| R1-2502639 | View on UE features for R19 AI/ML for NR Air Interface | Apple |
| R1-2502661 | UE Features for Rel-19 AI/ML for NR Air Interface | Ericsson |
| R1-2502738 | Summary of UE features for AI/ML for NR Air Interface | Moderator (AT&T) |
| R1-2502785 | Discussion on UE features for AI/ML for NR Air Interface | NTT DOCOMO, INC. |
| R1-2502863 | Rapporteur's view on Rel-19 UE features for AI/ML air interface | Qualcomm Incorporated |
| R1-2502864 | UE features for AI/ML for NR air interface | Qualcomm Incorporated |
| R1-2502959 | Session Notes of AI 9.15.1 | Ad-Hoc Chair (NTT DOCOMO, INC.) |
| R1-2503131 | Final Summary of UE features for AI/ML for NR Air Interface | Moderator (AT&T) |
| TDoc | Title | Source |
|---|---|---|
| R1-2501732 | UE features for NR MIMO Phase 5 | MediaTek Inc. |
| R1-2501785 | Discussion on UE features for NR MIMO Phase 5 | ZTE Corporation, Sanechips |
| R1-2501830 | Discussion on UE features for NR MIMO Phase 5 | vivo |
| R1-2501980 | UE features for NR MIMO Phase 5 | CATT |
| R1-2502048 | Views on UE features for MIMO Ph5 | Ofinno |
| R1-2502134 | Views on NR MIMO Phase 5 UE features | Nokia |
| R1-2502179 | Discussion on UE features for NR MIMO Phase 5 | CMCC |
| R1-2502228 | UE features for NR MIMO Phase 5 | Huawei, HiSilicon |
| R1-2502297 | UE features for NR MIMO Phase 5 | OPPO |
| R1-2502392 | UE features for NR MIMO Phase 5 | Samsung |
| R1-2502460 | Discussion on UE features for NR MIMO Phase 5 | Xiaomi |
| R1-2502640 | Views on UE features for NR MIMO Phase 5 | Apple |
| R1-2502739 | Summary of UE features for NR MIMO Phase 5 | Moderator (AT&T) |
| R1-2502786 | Discussion on UE features for NR MIMO Phase 5 | NTT DOCOMO, INC. |
| R1-2502810 | UE features for NR MIMO Phase 5 | Ericsson |
| R1-2502865 | UE features for NR MIMO phase 5 | Qualcomm Incorporated |
| R1-2502960 | Session Notes of AI 9.15.2 | Ad-Hoc Chair (NTT DOCOMO, INC.) |
| R1-2503132 | Final Summary of UE features for NR MIMO Phase 5 | Moderator (AT&T) |
| TDoc | Title | Source |
|---|---|---|
| R1-2501831 | Discussion on UE features for evolution of NR duplex operation: SBFD | vivo |
| R1-2501887 | Discussion on UE features for evolution of NR duplex operation: SBFD | Spreadtrum, UNISOC |
| R1-2501913 | Discussion on UE features for Rel-19 SBFD | ZTE Corporation, Sanechips |
| R1-2501981 | UE features for SBFD | CATT |
| R1-2502049 | Discussion on Rel-19 NR UE features for evolution of NR duplex operation | Ofinno |
| R1-2502135 | Views on SBFD UE features | Nokia |
| R1-2502143 | Discussion on UE features for evolution of NR duplex operation | MediaTek Inc |
| R1-2502180 | Discussion on UE features for evolution of NR duplex operation: SBFD | CMCC |
| R1-2502244 | UE features for evolution of NR duplex operation | Huawei, HiSilicon |
| R1-2502280 | Discussion on UE features for Rel-19 NR Duplex | OPPO |
| R1-2502393 | UE features for Rel-19 Duplex Evolution for NR | Samsung |
| R1-2502425 | UE-features for SBFD | Ericsson |
| R1-2502461 | UE features for SBFD | Xiaomi |
| R1-2502641 | Views on UE features for Rel-19 SBFD | Apple |
| R1-2502787 | Discussion on UE features for evolution of NR duplex operation | NTT DOCOMO, INC. |
| R1-2502866 | UE features for evolution of NR duplex operation | Qualcomm Incorporated |
| R1-2502965 | Session Notes of AI 9.15.3 | Ad-Hoc Chair (NTT DOCOMO, INC.) |
| R1-2502971 | Summary of discussion on Rel-19 NR UE features for SBFD | Moderator (NTT DOCOMO, INC.) |
| R1-2503068 | Summary#2 of discussion on Rel-19 NR UE features for SBFD | Moderator (NTT DOCOMO, INC.) |
| TDoc | Title | Source |
|---|---|---|
| R1-2501770 | Discussion on NES features | ZTE Corporation, Sanechips |
| R1-2501832 | Discussions on UE features for enhancements of network energy savings for NR | vivo |
| R1-2501932 | Discussion of Rel-19 NES UE Features | FUTUREWEI |
| R1-2501982 | Discussion on UE features for Rel-19 NES | CATT |
| R1-2502035 | Discussion on UE features for Rel-19 Network Energy Saving | China Telecom |
| R1-2502050 | UE features for enhancements of network energy savings for NR | Ofinno |
| R1-2502136 | Views on Network Energy Saving Enhancement UE features | Nokia |
| R1-2502181 | Discussion on UE features for enhancements of network energy savings for NR | CMCC |
| R1-2502232 | UE features for Rel-19 NES | Huawei, HiSilicon |
| R1-2502264 | Discussion on UE features for enhancements of network energy savings for NR | OPPO |
| R1-2502394 | UE features for enhancements of network energy savings for NR | Samsung |
| R1-2502462 | UE features for NES enhancements | Xiaomi |
| R1-2502486 | Discussion on UE features for enhancements of NES | LG Electronics |
| R1-2502642 | Views on UE features for Rel-19 NES | Apple |
| R1-2502740 | Summary of UE features for enhancements of network energy savings for NR | Moderator (AT&T) |
| R1-2502788 | Discussion on UE features for eNES | NTT DOCOMO, INC. |
| R1-2502808 | UE features for R19 NES | Ericsson |
| R1-2502867 | UE features for Rel-19 NES | Qualcomm Incorporated |
| R1-2502961 | Session Notes of AI 9.15.4 | Ad-Hoc Chair (NTT DOCOMO, INC.) |
| R1-2503133 | Final Summary of UE features for enhancements of network energy savings for NR | Moderator (AT&T) |
| TDoc | Title | Source |
|---|---|---|
| R1-2501712 | Views on UE Features for LP-WUS | FUTUREWEI |
| R1-2501771 | Discussion on WUR features | ZTE Corporation, Sanechips |
| R1-2501833 | UE features for Rel-19 LP-WUS/WUR | vivo |
| R1-2501983 | LP-WUS/WUR UE feature | CATT |
| R1-2502137 | Views on LP-WUS/WUR UE features | Nokia |
| R1-2502182 | Discussion on UE features for low-power wake-up signal and receiver for NR | CMCC |
| R1-2502240 | UE features for Rel-19 LP-WUS | Huawei, HiSilicon |
| R1-2502260 | Discussion for UE features of LP-WUS/WUR | OPPO |
| R1-2502395 | Discussion on UE features for LP-WUS/WUR | Samsung |
| R1-2502463 | UE features for NR LP-WUS/WUR | Xiaomi |
| R1-2502487 | UE features for LP-WUS/WUR for NR | LG Electronics |
| R1-2502643 | On Rel-19 LP-WUS/WUR UE features | Apple |
| R1-2502724 | UE features for LP-WUS/WUR for NR | MediaTek Inc. |
| R1-2502789 | Discussion on UE features for LP-WUS/WUR for NR | NTT DOCOMO, INC. |
| R1-2502809 | UE features for Rel-19 LP-WUS/WUR WI | Ericsson |
| R1-2502868 | UE features for LP-WUS/WUR for NR | Qualcomm Incorporated |
| R1-2502910 | UE Features for LP-WUS | Vodafone, Deutsche Telekom |
| R1-2502966 | Session Notes of AI 9.15.5 | Ad-Hoc Chair (NTT DOCOMO, INC.) |
| R1-2502972 | Summary of discussion on Rel-19 NR UE features for LP-WUS/WUR | Moderator (NTT DOCOMO, INC.) |
| R1-2503084 | Summary#2 of discussion on Rel-19 NR UE features for LP-WUS/WUR | Moderator (NTT DOCOMO, INC.) |
| TDoc | Title | Source |
|---|---|---|
| R1-2501786 | Discussion on UE features for NR mobility enhancements Phase 4 | ZTE Corporation, Sanechips |
| R1-2501834 | Discussion on UE features for NR mobility enhancements Phase 4 | vivo |
| R1-2501984 | Discussion on UE features for NR mobility enhancements Phase 4 | CATT |
| R1-2502138 | UE Features for NR mobility enhancements Phase 4 | Nokia |
| R1-2502183 | Discussion on UE features for NR mobility enhancements Phase 4 | CMCC |
| R1-2502247 | UE features for NR mobility enhancements phase 4 | Huawei, HiSilicon |
| R1-2502299 | Discussion on UE features for NR mobility enhancements | OPPO |
| R1-2502396 | UE features for NR mobility enhancements Phase 4 | Samsung |
| R1-2502464 | Discussion on UE features for NR mobility enhancements Phase 4 | Xiaomi |
| R1-2502563 | UE features for NR mobility enhancements phase 4 | Ericsson |
| R1-2502644 | Rapporteur input on UE features for Rel-19 NR Mobility enhancements Ph4 | Apple |
| R1-2502741 | Summary of UE features for NR mobility enhancements Phase 4 | Moderator (AT&T) |
| R1-2502790 | Discussion on UE features for NR mobility enhancements Phase4 | NTT DOCOMO, INC. |
| R1-2502869 | UE features for NR mobility enhancements Phase 4 | Qualcomm Incorporated |
| R1-2502962 | Session Notes of AI 9.15.6 | Ad-Hoc Chair (NTT DOCOMO, INC.) |
| R1-2503134 | Final Summary of UE features for NR mobility enhancements Phase 4 | Moderator (AT&T) |
| TDoc | Title | Source |
|---|---|---|
| R1-2501835 | Discussion on UE features for NTN for NR Phase 3 | vivo |
| R1-2501888 | Discussion on UE features for NTN for NR | Spreadtrum, UNISOC |
| R1-2501942 | Discussion on the UE feature for NR-NTN Phase-3 | ZTE Corporation, Sanechips |
| R1-2502139 | Views on Rel-19 NTN phase 3 UE features | Nokia |
| R1-2502184 | Discussion on UE features for UE features for NTN for NR Phase 3 | CMCC |
| R1-2502248 | UE features for NTN for NR phase 3 | Huawei, HiSilicon |
| R1-2502270 | Discussion on UE features for NTN for NR Phase 3 | OPPO |
| R1-2502307 | On UE features for NR-NTN Phase 3 | Ericsson |
| R1-2502397 | UE features for NTN for NR Phase 3 | Samsung |
| R1-2502645 | On Rel-19 NR-NTN UE Features | Apple |
| R1-2502791 | Discussion on UE features for Rel-19 NR NTN | NTT DOCOMO, INC. |
| R1-2502870 | UE features for NR NTN | Qualcomm Incorporated |
| R1-2502931 | Initial UE features list for Rel-19 NR NTN Phase 3 | Rapporteur (THALES) |
| R1-2502967 | Session Notes of AI 9.15.8 | Ad-Hoc Chair (NTT DOCOMO, INC.) |
| R1-2502973 | Summary of discussion on Rel-19 NR UE features for NR-NTN Phase 3 | Moderator (NTT DOCOMO, INC.) |
| R1-2503074 | Summary#2 of discussion on Rel-19 NR UE features for NR-NTN Phase 3 | Moderator (NTT DOCOMO, INC.) |
| TDoc | Title | Source |
|---|---|---|
| R1-2501836 | Discussion on UE features for NTN for IoT Phase 3 | vivo |
| R1-2501943 | Discussion on the UE feature for IoT-NTN Phase-3 | ZTE Corporation, Sanechips |
| R1-2502140 | Views on Rel-19 NTN for Internet of Things (IoT) Phase 3 UE features | Nokia |
| R1-2502185 | Discussion on UE features for NTN for IoT Phase 3 | CMCC |
| R1-2502249 | UE features for IoT-NTN Phase 3 | Huawei, HiSilicon |
| R1-2502271 | Discussion on UE features for NTN for Internet of Things Phase 3 | OPPO |
| R1-2502308 | On UE features for IoT-NTN Phase 3 | Ericsson |
| R1-2502398 | UE features for NTN for Internet of Things (IoT) Phase 3 | Samsung |
| R1-2502646 | On Rel-19 IoT-NTN UE Features | Apple |
| R1-2502871 | UE features for NTN IOT | Qualcomm Incorporated |
| R1-2502968 | Session Notes of AI 9.15.9 | Ad-Hoc Chair (NTT DOCOMO, INC.) |
| R1-2502974 | Summary of discussion on Rel-19 LTE UE features for IoT-NTN Phase 3 | Moderator (NTT DOCOMO, INC.) |
| TDoc | Title | Source |
|---|---|---|
| R1-2501837 | Discussion on UE features for IoT-NTN TDD mode | vivo |
| R1-2501944 | Discussion on the UE feature for IoT-NTN TDD | ZTE Corporation, Sanechips |
| R1-2502058 | UE features for IoT-NTN TDD mode | Iridium Satellite LLC |
| R1-2502141 | Views on Rel-19 NTN for Internet of Things (IoT) TDD mode UE features | Nokia |
| R1-2502250 | UE features for IoT-NTN TDD mode | Huawei, HiSilicon |
| R1-2502272 | Discussion on UE features for IoT-NTN TDD mode | OPPO |
| R1-2502399 | UE features for IoT-NTN TDD mode | Samsung |
| R1-2502647 | On Rel-19 IoT-NTN TDD mode UE Features | Apple |
| R1-2502872 | UE features for IOT-NTN TDD mode | Qualcomm Incorporated |
| R1-2502969 | Session Notes of AI 9.15.10 | Ad-Hoc Chair (NTT DOCOMO, INC.) |
| R1-2502975 | Summary of discussion on Rel-19 LTE UE features for IoT-NTN TDD mode | Moderator (NTT DOCOMO, INC.) |
| R1-2503075 | Summary#2 of discussion on Rel-19 LTE UE features for IoT-NTN TDD mode | Moderator (NTT DOCOMO, INC.) |
| TDoc | Title | Source |
|---|---|---|
| R1-2501838 | Discussion on UE features for MCE for NR Phase 3 | vivo |
| R1-2501889 | Discussion on UE features for MCE | Spreadtrum, UNISOC |
| R1-2501894 | Discussion on UE feature for Rel-19 Multi-Carrier Enhancements | Lenovo (Rapporteur) |
| R1-2501914 | Discussion on UE features for Rel-19 MCE | ZTE Corporation, Sanechips |
| R1-2502142 | Initial views on NR Multi-carrier Enhancements Phase 2 UE features | Nokia |
| R1-2502251 | UE features for Rel-19 MCE | Huawei, HiSilicon |
| R1-2502284 | Discussion on UE feature for multi-cell scheduling with a single DCI | OPPO |
| R1-2502400 | UE features for multi-carrier enhancements | Samsung |
| R1-2502648 | On UE features for Rel-19 multi-carrier enhancements | Apple |
| R1-2502723 | UE features for MCE for NR Phase 3 | MediaTek Inc. |
| R1-2502792 | Discussion on UE features for multi-cell PUSCH/PDSCH scheduling with a single DCI | NTT DOCOMO, INC. |
| R1-2502873 | UE features for MCE for NR Phase 2 | Qualcomm Incorporated |
| R1-2502970 | Session Notes of AI 9.15.11 | Ad-Hoc Chair (NTT DOCOMO, INC.) |
| R1-2502976 | Summary of discussion on Rel-19 NR UE features for MCE for NR Phase 3 | Moderator (NTT DOCOMO, INC.) |
| R1-2503069 | Summary#2 of discussion on Rel-19 NR UE features for MCE for NR Phase 3 | Moderator (NTT DOCOMO, INC.) |
| R1-2503138 | Summary#3 of discussion on Rel-19 NR UE features for MCE for NR Phase 3 | Moderator (NTT DOCOMO, INC.) |
| TDoc | Title | Source |
|---|---|---|
| R1-2501915 | Discussion on UE features for Rel-19 LTE based 5G broadcast | ZTE Corporation, Sanechips |
| R1-2502252 | UE features for LTE based 5G broadcast Phase 2 | Huawei, HiSilicon |
| R1-2502401 | UE features for LTE-based 5G broadcast | Samsung |
| R1-2502547 | UE feature list for Rel-19 LTE-based 5G Broadcast after RAN1#120 | EBU |
| R1-2502742 | Summary of UE features for LTE based 5G broadcast Phase 2 | Moderator (AT&T) |
| R1-2502874 | UE features for LTE-based 5G Broadcast Phase 2 | Qualcomm Incorporated |
| R1-2502963 | Session Notes of AI 9.15.13 | Ad-Hoc Chair (NTT DOCOMO, INC.) |
| R1-2503135 | Final Summary of UE features for LTE based 5G broadcast Phase 2 | Moderator (AT&T) |
| TDoc | Title | Source |
|---|---|---|
| R1-2501916 | Discussion on UE features for Rel-19 TEIs | ZTE Corporation, Sanechips |
| R1-2502253 | UE features for TEI-19 features | Huawei, HiSilicon |
| R1-2502649 | UE features for Rel-19 TEI SRSCS_ULTxSwitch | Apple |
| R1-2502743 | Summary of UE features for Rel-19 TEI and other relevant issues | Moderator (AT&T) |
| R1-2502875 | UE features for Rel-19 TEI | Qualcomm Incorporated |
| R1-2502964 | Session Notes of AI 9.15.14 | Ad-Hoc Chair (NTT DOCOMO, INC.) |
| R1-2503136 | Final Summary of UE features for Rel-19 TEI and other relevant issues | Moderator (AT&T) |