TDoc | Title | Source |
---|---|---|
R1-2503200 | Draft Agenda of RAN1#121 meeting | RAN1 Chair |
R1-2503202 | RAN1#121 Meeting Timelines, Scope, Process | RAN1 Chair, ETSI MCC |
TDoc | Title | Source |
---|---|---|
R1-2503201 | Report of RAN1#120bis meeting | ETSI MCC |
TDoc | Title | Source |
---|---|---|
R1-2503203 | Reply LS on paging enhancement in R19 NES | CT1, Huawei |
R1-2503204 | LS on the removal of service type information | SA2, InterDigital |
R1-2503205 | Reply LS on soft satellite switch with re-sync | RAN2, Huawei |
R1-2503206 | LS on the startSFN parameter for positioning SRS with TX frequency hopping | RAN2, ZTE |
R1-2503207 | Reply LS on signalling feasibility of dataset and parameter sharing | RAN2, xiaomi, Ericsson |
R1-2503208 | LS on Rel-19 higher layer parameter and UE Feature | RAN2, xiaomi |
R1-2503209 | LS on on-demand SSB | RAN2, Apple |
R1-2503210 | LS reply on AI/ML Positioning Case 3b | RAN3, Ericsson |
R1-2503211 | LS reply on TDM DMRS | RAN4, Sony |
R1-2503212 | Reply LS on measurement quantities for IoT NTN | RAN4, vivo, Ericsson |
R1-2503213 | LS on the transient period for SBFD operation | RAN4, Samsung |
R1-2503214 | Reply LS on L1 based UE-to-UE CLI measurement and reporting | RAN4, Huawei |
R1-2503215 | LS of RAN4 RRM agreements on LB CA via switching | RAN4, Apple |
R1-2503216 | Reply LS on UE assistance information | RAN4, Nokia |
R1-2503217 | LS on UL Tx switching for TEI19 | RAN4, MediaTek |
R1-2503218 | Reply LS to RAN2 on additionalSpectrumEmission | RAN4, ZTE Corporation |
R1-2503219 | LS on DL MIMO layers capabilities for 6Rx UEs | RAN4, Intel |
R1-2503258 | Discussion on startSFN for positioning UTW | Huawei, HiSilicon |
R1-2503265 | Discussion on LS on the transient period for SBFD operation | Huawei, HiSilicon |
R1-2503309 | Discussion on LP-WUS UE RF | ZTE Corporation, Sanechips |
R1-2503310 | Draft reply on LP-WUS UE RF | ZTE Corporation, Sanechips |
R1-2503339 | Discussion LS on CB-msg3-EDT | Ericsson |
R1-2503340 | Draft reply on UL Tx switching for TEI19 | vivo |
R1-2503341 | Discussion on the transient period for SBFD operation | vivo |
R1-2503342 | Draft reply LS on LP-WUS UE RF | vivo |
R1-2503343 | Draft reply LS on LP-WUS in RRC_CONNECTED | vivo |
R1-2503344 | Draft reply LS on differentiation of sDCI mTRP, mDCI mTRP and sTRP | vivo |
R1-2503345 | Draft Reply LS on the startSFN parameter for positioning SRS with TX frequency hopping | vivo |
R1-2503431 | On UL Switching for TEI19 | Nokia |
R1-2503504 | Draft reply on UL Tx switching for TEI19 | Spreadtrum, UNISOC |
R1-2503540 | Draft reply LS on UL Tx switching for TEI19 | Samsung |
R1-2503541 | Discussion on RAN4 reply LS for LP-WUS UE RF | Samsung |
R1-2503542 | Discussion on the startSFN parameter for positioning SRS with TX frequency hopping | Samsung |
R1-2503543 | Discussion on RAN4 LS on the transient period for SBFD operation | Samsung |
R1-2503613 | LS on CB-msg3-EDT | RAN2, MediaTek |
R1-2503614 | Reply LS on non-RedCap UE UL SRS frequency hopping for positioning | RAN2, ZTE |
R1-2503615 | LS on simultaneous configuration of SBFD and DC | RAN2, Huawei |
R1-2503616 | LS on LP-WUS in RRC_CONNECTED | RAN2, InterDigital |
R1-2503617 | Reply LS on NR NB-IoT in-band operation | RAN2, Ericsson |
R1-2503622 | LS on the creation of the Getting Ready for Energy-Efficient Networking Working Group in the IETF | IETF GREEN |
R1-2503632 | Discussion on the LS on CB-msg3-EDT | ZTE Corporation, Sanechips |
R1-2503662 | Draft reply LS on simultaneous configuration of SBFD and DC | vivo |
R1-2503663 | Draft reply LS on CB-msg3-EDT | vivo |
R1-2503664 | Draft reply LS on the transient period for SBFD operation | ZTE Corporation, Sanechips |
R1-2503665 | Draft reply LS on UL Tx switching for TEI19 | ZTE Corporation, Sanechips |
R1-2503666 | Discussion on UL Tx switching for TEI19 | ZTE Corporation, Sanechips |
R1-2503667 | Draft reply LS on simultaneous configuration of SBFD and DC | ZTE Corporation, Sanechips |
R1-2503676 | Discussion on differentiation of sDCI mTRP, mDCI mTRP and sTRP | ZTE Corporation, Sanechips |
R1-2503699 | Draft reply LS on the startSFN parameter for positioning SRS FH | ZTE Corporation, Sanechips |
R1-2503700 | Discussion on RAN2 LS on the startSFN parameter for positioning SRS FH | ZTE Corporation, Sanechips |
R1-2503758 | Draft reply LS on LP-WUS in RRC_CONNECTED | Samsung |
R1-2503765 | Discussion on LS reply on CB-msg3-EDT | CATT |
R1-2503766 | Draft reply LS on simultaneous configuration of SBFD and DC | CATT |
R1-2503768 | Discussion on LS on differentiation of sDCI based mTRP and sTRP | CATT |
R1-2503769 | Draft reply LS on differentiation of sDCI based mTRP and sTRP | CATT |
R1-2503807 | Discussion on the startSFN parameter for positioning SRS with TX frequency hopping | CATT |
R1-2503808 | Draft reply LS on the startSFN parameter for positioning SRS with TX frequency hopping | CATT |
R1-2503818 | Discussion on Reply LS on soft satellite switch with re-sync | CMCC |
R1-2503819 | Discussion on LS on UL Tx switching for TEI19 | CMCC |
R1-2503868 | Discussion on simultaneous configuration of SBFD and DC | Xiaomi |
R1-2503869 | Discussion on reply to RAN2 LS on LP-WUS in RRC_CONNECTED | Xiaomi |
R1-2503870 | Discussion on RAN2 LS on CB-msg3-EDT | Xiaomi |
R1-2503871 | Discussion on LS on differentiation of sDCI mTRP and sTRP | Xiaomi |
R1-2504003 | Discussion on RAN2 LS on simultaneous configuration of SBFD and DC | Samsung |
R1-2504011 | Draft Reply LS to RAN2 on positioning SRS frequency hopping | Nokia |
R1-2504036 | Discussion on LS from RAN2 on CB-Msg3-EDT | Nokia, Nokia Shanghai Bell |
R1-2504124 | Discussion on RAN4 LS on transition periods | Nokia, Nokia Shanghai Bell |
R1-2504125 | Discussion on RAN2 LS on simultaneous configuration of SBFD and DC | Nokia, Nokia Shanghai Bell |
R1-2504127 | Discussion on the transient period for SBFD operation | ETRI |
R1-2504128 | Discussion on simultaneous configuration of SBFD and DC | ETRI |
R1-2504154 | Draft reply LS on simultaneous configuration of SBFD and DC | Spreadtrum, UNISOC |
R1-2504186 | Discussion on LS on differentiation of sDCI mTRP, mDCI mTRP and sTRP | OPPO |
R1-2504191 | Draft reply LS on LP-WUS in RRC_CONNECTED | OPPO |
R1-2504204 | Discussion on LS on CB-msg3-EDT | OPPO |
R1-2504213 | Discussion on RAN2 LS for simultaneous configuration of SBFD and DC | OPPO |
R1-2504242 | Discussion on RAN2 LS on LP-WUS in RRC_CONNECTED | LG Electronics |
R1-2504284 | Discussion on reply LS on CB Msg3 EDT | MediaTek Inc. |
R1-2504291 | Discussion on LP-WUS in RRC_CONNECTED | Huawei, HiSilicon |
R1-2504292 | Discussion on LS rely on CB-msg3-EDT | Huawei, HiSilicon |
R1-2504293 | Discussion on LS on UL Tx Switching for TEI19 | Huawei, HiSilicon |
R1-2504294 | Discussion on LS on simultaneous configuration of SBFD and DC | Huawei, HiSilicon |
R1-2504303 | Discussion on the LS on UL Tx switching for TEI19 | Apple |
R1-2504304 | Discussion on RAN4 LS on RRM agreements on LB CA via switching | Apple |
R1-2504305 | Discussion on LS on LP-WUS in RRC_CONNECTED | Apple |
R1-2504376 | UL Tx switching for TEI19 | Qualcomm Incorporated |
R1-2504377 | CB-msg3-EDT for IOT NTN | Qualcomm Incorporated |
R1-2504378 | Discussion on response to RAN4 LS on LP-WUS UE RF | Qualcomm Incorporated |
R1-2504379 | Draft LS reply on the transient period for SBFD operation | Qualcomm Incorporated |
R1-2504380 | Draft LS reply on simultaneous configuration of SBFD and DC | Qualcomm Incorporated |
R1-2504452 | Discussion on LS on differentiation of sTRP and sDCI mTRP | Ericsson |
R1-2504469 | Discussion on RAN4 LS on LP-WUS UE RF | Ericsson |
R1-2504470 | Discussion on RAN2 LS on LP-WUS in RRC_Connected | Ericsson |
R1-2504477 | Discussion on Reply to LS on simultaneous configuration of SBFD and DC | Sharp |
R1-2504486 | Discussion on LS on UL Tx switching for TEI19 | NTT DOCOMO, INC. |
R1-2504487 | Discussion on reply LS on L1 based UE-to-UE CLI measurement and reporting | NTT DOCOMO, INC. |
R1-2504488 | Discussion on LS on simultaneous configuration of SBFD and DC | NTT DOCOMO, INC. |
R1-2504586 | Discussion on RAN4 LS on UL Tx switching for TEI19 | MediaTek Inc. |
R1-2504612 | On RAN4 LS on the transient period for SBFD operation | Ericsson |
R1-2504613 | Discussion on RAN2 LS on simultaneous configuration of SBFD and DC | Ericsson |
R1-2504619 | On RAN4 TEI Uplink Tx Switching Scenarios | Ericsson |
R1-2504622 | Discussion on LS on the startSFN parameter for positioning SRS with TX frequency hopping | Ericsson |
R1-2504623 | Discussion on LS on non-RedCap UE UL SRS frequency hopping for positioning | Ericsson |
R1-2504639 | Draft reply LS on LP-WUS in RRC_CONNECTED | Huawei, HiSilicon |
TDoc | Title | Source |
---|---|---|
R1-2503346 | Draft CR on E-UTRAN measurement in IoT NTN | vivo, Ericsson |
R1-2504573 | CR for MAC-CE TA command in NTN | Nordic Semiconductor ASA |
R1-2504640 | Draft CR on E-UTRAN measurement in IoT NTN | Huawei, HiSilicon |
R1-2504722 | Summary#1 of discussion on E-UTRAN measurement in IoT NTN | Moderator (vivo) |
R1-2504806 | CR on E-UTRAN measurement in IoT NTN | Moderator (vivo), Ericsson, Huawei, HiSilicon, Nokia, Nokia Shanghai Bell, OPPO, LG Electronics, CATT |
R1-2504808 | Summary#1 of discussion on TA command MAC-CE in NTN IoT | Moderator (Nordic Semiconductor ASA) |
R1-2504862 | Summary#2 of discussion on TA command MAC-CE in NTN IoT | Moderator (Nordic Semiconductor ASA) |
R1-2504901 | Session notes for Pre-Rel-19 E-UTRA Maintenance | Ad-Hoc Chair (Huawei) |
TDoc | Title | Source |
---|---|---|
R1-2503397 | Draft CR on determination of monitoring occasion of SS#0 associated with CORESET#0 following unified TCI state | vivo |
R1-2503398 | Draft CR on determination of monitoring occasion of SS#0 associated with CORESET#0 following unified TCI state (Rel-18 mirror) | vivo |
R1-2503423 | Discussion on Reply LS on collision between SSB and RA occasion for LTM | Nokia |
R1-2503544 | Discussion on differentiation of sDCI mTRP, mDCI mTRP and sTRP | Samsung |
R1-2503545 | Draft CR on UE capability for SRS antenna switching | Samsung |
R1-2503546 | Discussions on collision handling between SSB and RA occasion for LTM | Samsung |
R1-2503547 | Discussion on HARQ-ACK aspects of Rel-17 multi-PDSCH scheduling | Samsung |
R1-2503548 | Draft CR on timeline for 8Tx PUSCH | Samsung |
R1-2503549 | Draft CR on pseudo-code in Section 9.2.5 of TS38.213 | Samsung |
R1-2503644 | Rel-15 correction of RE mapping for UCI only PUSCH | Intel Corporation |
R1-2503645 | Discussion on correction of RE mapping for UCI only PUSCH | Intel Corporation |
R1-2503677 | Discussion on aperiodic CSI reporting configuration for Rel-18 LTM | ZTE Corporation, Sanechips |
R1-2503678 | Draft CR on aperiodic CSI reporting configuration for Rel-18 LTM in TS 38.214 | ZTE Corporation, Sanechips |
R1-2503679 | Discussion on collision handling of SSB and RA occasion for LTM | ZTE Corporation, Sanechips |
R1-2503680 | Draft CR on collision handling of SSB and RA occasion for LTM | ZTE Corporation, Sanechips |
R1-2503681 | Draft CR on transmission power reduction for STxMP in TS 38.213 | ZTE Corporation, Sanechips |
R1-2503682 | Discussion on transmission power reduction for STxMP in TS 38.213 | ZTE Corporation, Sanechips |
R1-2503683 | Draft CR on SRS frequency hopping with repetition in TS 38.214 | ZTE Corporation, Sanechips |
R1-2503743 | Semi-Persistent SRS Frequency Hopping Discussion | Ofinno |
R1-2503744 | Discussion on suspending the RRC connection for SDT | Ofinno |
R1-2503745 | Draft CR on Suspending the RRC connection for SDT | Ofinno |
R1-2503746 | Draft CR on Suspending the RRC connection for SDT | Ofinno |
R1-2503918 | Draft CR on PDCCH repetition in TS38.213 | NEC |
R1-2503919 | Discussion on starting slot for typeII Doppler CSI | NEC |
R1-2503920 | Draft CR on starting slot for typeII Doppler CSI in TS38.214 | NEC |
R1-2503933 | Draft CR for TS 38.213 on PUSCH transmission in RACH-less handover | NEC |
R1-2503934 | Draft CR for TS 38.214 on UE DM-RS transmission procedure in RACH-less handover | NEC |
R1-2503935 | Draft CR for TS 38.214 on UE DM-RS transmission procedure in RACH-less LTM | NEC |
R1-2503941 | Discussion on missing parameter for Rel-18 group based beam reporting | NEC |
R1-2503942 | Discussion on the support of group based beam reporting in Rel-17 and Rel-18 | NEC |
R1-2503943 | Draft CR on Rel-18 group based beam reporting in TS 38.214 | NEC |
R1-2503944 | Draft CR on Rel-17 group based beam reporting in TS 38.214 | NEC |
R1-2503945 | Draft CR on SRS hopping for positioning in TS 38.211 | NEC |
R1-2503946 | Draft CR on CSI sub configurations in TS 38.214 | NEC |
R1-2503947 | Draft CR on suspending of power ramping counter for preamble repetition | NEC |
R1-2503948 | Draft CR on reference point for the PDSCH starting symbol determination in TS 38.214 | NEC |
R1-2503956 | Draft CR for Correction on Type0/0A/1A/2-PDCCH CSS set Monitoring with Unified TCI | Ofinno |
R1-2503957 | Draft CR on Pathloss Reference RS for positioning SRS | Ofinno |
R1-2503979 | Correction on PTRS to PDSCH EPRE ratio | Ericsson |
R1-2503980 | Draft CR for HARQ-ACK aspects of Rel-17 multi-PDSCH scheduling | Samsung |
R1-2504033 | Draft CR on Collision Handling between TDCP report and SRS | |
R1-2504169 | Draft CR on transform precoding for a PUSCH with PTRS | ZTE Corporation, Sanechips |
R1-2504182 | Draft CR on the PDSCH mapping type B starting symbol determination in TS 38.214 | NEC Corporation |
R1-2504280 | On DCI 1_0/0_0 monitoring with Rel-17 SSSG switching | MediaTek Inc. |
R1-2504281 | On R17 SSSG reset with BWP switch triggered by RA procedure | MediaTek Inc. |
R1-2504282 | [R17] Draft 38.213 CR on SSSG reset with BWP switch triggered by RA procedure | MediaTek Inc. |
R1-2504283 | [R18] Draft 38.213 CR on SSSG reset with BWP switch triggered by RA procedure | MediaTek Inc. |
R1-2504295 | Discussion on beam determination in FR1 | Google, MediaTek Inc. |
R1-2504296 | Discussion on collision between SSB and RA occasion for LTM | |
R1-2504301 | Correction on handling collision of SSB and RA occasion for LTM | |
R1-2504302 | Correction on CG PUSCH transmission in RACH-less LTM | Google, Huawei, HiSilicon |
R1-2504306 | On TCI-state determination for BWP Switching | Apple |
R1-2504307 | Draft CR on TCI-state determination for BWP switching | Apple |
R1-2504381 | Draft CR on triggering offset of aperiodic CSI-IM for Type-II-Doppler codebook | Qualcomm Incorporated |
R1-2504448 | Discussion on aperiodic CSI-RS active time for CSI report configured with 'none' | Sharp |
R1-2504449 | Correction on aperiodic CSI-RS active time for CSI report configured with 'none' | Sharp |
R1-2504489 | Draft CR on group-based beam reporting for Rel.18 STxMP | NTT DOCOMO, INC. |
R1-2504490 | Draft CR on multi-channel transmission within a shared COT | NTT DOCOMO, INC. |
R1-2504540 | Draft CR on group-based beam reporting for Rel.18 STxMP | NTT DOCOMO, INC. |
R1-2504550 | Discussion on aperiodic triggering offset of CSI-IM for Rel-18 type II Doppler codebook and Rel-18 type II Doppler port selection codebook | CATT |
R1-2504551 | Correction on aperiodic triggering offset of CSI-IM for Rel-18 type II Doppler codebook and Rel-18 type II Doppler port selection codebook | CATT |
R1-2504552 | Discussion on CSI-RS resource slot offsets for the Rel-18 Type-II codebook refinement for CJT mTRP | CATT |
R1-2504553 | Discussion on aperiodic CSI-RS resource slot offsets for the Rel-17 CSI enhancements for NC-JT | CATT |
R1-2504555 | Correction on maxrank for DCI format 0_3 | ASUSTeK |
R1-2504636 | Correction on handling collision of SSB and RA occasion for LTM in 38.213 | Huawei, HiSilicon |
R1-2504637 | Corrections on default QCL assumption for DCI format 1_3 | Huawei, HiSilicon |
R1-2504638 | Clarification on the starting MO of PEI-O | Huawei, HiSilicon |
R1-2504641 | Discussion on maximum transmission power for STxMP in 38.213 | Huawei, HiSilicon |
R1-2504642 | Correction on maximum transmission power for STxMP in 38.213 | Huawei, HiSilicon |
R1-2504643 | Correction on TCI-state update for mDCI mTRP in 38.214 | Huawei, HiSilicon |
R1-2504644 | Correction on STxMP scheme configuration in 38.212 | Huawei, HiSilicon |
R1-2504645 | Correction on NCJT CSI reporting | Huawei, HiSilicon |
R1-2504646 | Correction on mapping order for TDCP reporting | Huawei, HiSilicon |
R1-2504648 | Correction on Short Message indicator | Huawei, HiSilicon |
R1-2504720 | Summary on discussion on determination of monitoring occasion of SS#0 associated with CORESET#0 following unified TCI state” | Moderator (vivo) |
R1-2504735 | Summary on LS on differentiation of sDCI based mTRP and sTRP | Moderator (CATT) |
R1-2504736 | Summary of discussion on the timeline issue for 8Tx PUSCH | Moderator (Samsung) |
R1-2504748 | Summary on draft CR discussion for group based beam reporting | Moderator (NEC) |
R1-2504759 | Summary of correction on PTRS to PDSCH EPRE ratio | Moderator (Ericsson) |
R1-2504760 | Correction on mapping order for TDCP reporting | Huawei, HiSilicon |
R1-2504765 | Summary on maximum transmission power for STxMP | Moderator (Huawei) |
R1-2504766 | Summary on TCI-state update for mDCI mTRP | Moderator (Huawei) |
R1-2504767 | Summary#1 on startSFN for positioning SRS FH | Moderator (ZTE) |
R1-2504768 | Summary for discussion of CR on multi-channel transmission within a shared COT | Moderator (NTT DOCOMO, INC.) |
R1-2504779 | Summary of discussion on HARQ-ACK aspects of Rel-17 multi-PDSCH scheduling | Moderator (Samsung) |
R1-2504780 | Summary on the reference point for the PDSCH starting symbol determination in TS 38.214 | Moderator (NEC) |
R1-2504781 | Summary on the PDSCH mapping type B starting symbol determination in TS 38.214 | Moderator (NEC) |
R1-2504783 | Summary of discussion on UE capability for SRS antenna switching | Moderator (Samsung) |
R1-2504784 | Summary of UE DM-RS transmission in RACH-less HO | Moderator (NEC) |
R1-2504785 | Summary of UE DM-RS transmission in RACH-less LTM | Moderator (NEC) |
R1-2504786 | Summary of PUSCH transmission in RACH-less HO | Moderator (NEC) |
R1-2504787 | Summary on discussion on SP SRS frequency hopping support | Moderator (Ofinno) |
R1-2504788 | Summary on discussion on PL RS fallback for positioning SRS | Moderator (Ofinno) |
R1-2504789 | Summary of discussion on transmission power reduction for STxMP in TS 38.213 | Moderator (ZTE) |
R1-2504790 | Summary of discussion on SRS frequency hopping with repetition in TS 38.214 | Moderator (ZTE) |
R1-2504792 | Summary on starting slot for typeII Doppler CSI | Moderator (NEC) |
R1-2504793 | Summary on SRS hopping for positioning in TS 38.211 | Moderator (NEC) |
R1-2504795 | Summary#2 on draft CR discussion for group based beam reporting | Moderator (NEC) |
R1-2504796 | Summary on aperiodic CSI reporting configuration for Rel-18 LTM in TS 38.214 | Moderator (ZTE) |
R1-2504797 | Summary #1 on collision handling between SSB and RA occasion | Moderator (MediaTek) |
R1-2504800 | Summary of discussion on suspending the RRC connection for SDT | Moderator (Ofinno) |
R1-2504807 | FL summary of transform precoding for a PUSCH with PTRS | Moderator (ZTE) |
R1-2504809 | Summary discussion aperiodic CMR slot offsets for the Rel-17 NCJT | Moderator (CATT) |
R1-2504810 | Summary on discussion on aperiodic triggering offset of CSI-IM for Rel-18 Type-II Doppler codebook | Moderator (Qualcomm) |
R1-2504811 | Draft CR on aperiodic triggering offset of CSI-IM for Rel-18 Type-II Doppler codebook | Moderator (Qualcomm), CATT, Ericsson, Samsung, Xiaomi |
R1-2504812 | Summary of draft CR discussion on power ramping counter | Moderator (NEC) |
R1-2504815 | Summary on aperiodic CSI-RS active time for CSI report configured with 'none' | Moderator (Sharp) |
R1-2504816 | Summary#2 for discussion of CR on multi-channel transmission within a shared COT | Moderator (NTT DOCOMO, INC.) |
R1-2504817 | Draft CR on transmission within a shared COT with multiple channels | Moderator (NTT DOCOMO, INC.), OPPO, CATT, CICTCI |
R1-2504818 | CR on transmission within a shared COT with multiple channels | Moderator (NTT DOCOMO, INC.), OPPO, CATT, CICTCI, Samsung |
R1-2504819 | Draft CR for HARQ-ACK aspects of Rel-17 multi-PDSCH scheduling | Moderator (Samsung) |
R1-2504820 | Draft CR for HARQ-ACK aspects of Rel-17 multi-PDSCH scheduling | Moderator (Samsung) |
R1-2504823 | Summary#2 on startSFN for positioning SRS FH | Moderator (ZTE) |
R1-2504824 | Summary#2 on LS on differentiation of sDCI based mTRP and sTRP | Moderator (CATT) |
R1-2504825 | CR on Collision Handling between TDCP report and SRS | Google, Samsung |
R1-2504826 | CR on UE capability for SRS antenna switching | Samsung |
R1-2504829 | Summary on beam determination in FR1 | Moderator (Google) |
R1-2504838 | Draft LS on maximum transmission power for STxMP | Huawei |
R1-2504839 | LS on maximum transmission power for STxMP | RAN1, Huawei |
R1-2504844 | CR on SSSG reset with BWP switch triggered by RA procedure | MediaTek Inc., Ericsson, Samsung |
R1-2504845 | CR on SSSG reset with BWP switch triggered by RA procedure | MediaTek Inc., Ericsson, Samsung |
R1-2504846 | CR on SRS hopping for positioning in TS 38.211 | NEC |
R1-2504848 | Correction on beam determination in FR1 | Google, MediaTek Inc., Samsung |
R1-2504849 | Correction on beam determination in FR1 | Google, MediaTek Inc., Samsung |
R1-2504850 | Draft CR on timeline for 8TX PUSCH | Moderator (Samsung), Ericsson, OPPO |
R1-2504851 | CR on timeline for 8TX PUSCH | Moderator (Samsung), Ericsson, OPPO |
R1-2504853 | FL summary of discussion on TCI-state determination with BWP Switching operation | Moderator (Apple Inc.) |
R1-2504854 | Reply LS on startSFN for positioning SRS frequency hopping | RAN1, ZTE Corporation |
R1-2504855 | CR on Rel-18 group based beam reporting in TS 38.214 | Moderator (NEC), NTT DOCOMO, INC., Samsung, Huawei, HiSilicon, Ericsson |
R1-2504859 | Correction on beam determination in FR1 | Google, MediaTek Inc., Samsung, NTT DOCOMO, INC. |
R1-2504860 | Correction on beam determination in FR1 | Google, MediaTek Inc., Samsung, NTT DOCOMO, INC. |
R1-2504865 | Summary#2 discussion aperiodic CMR slot offsets for the Rel-17 NCJT and Rel-18 CJT | Moderator (CATT) |
R1-2504870 | Draft CR on transform precoding for a PUSCH with PTRS | Moderator (ZTE) |
R1-2504871 | Draft CR on reference point for the PDSCH starting symbol determination | NEC |
R1-2504872 | CR on reference point for the PDSCH starting symbol determination | NEC |
R1-2504873 | Draft CR on reference point for the PDSCH starting symbol determination | NEC |
R1-2504874 | CR on reference point for the PDSCH starting symbol determination | NEC |
R1-2504876 | Summary#3 on LS on differentiation of sDCI based mTRP and sTRP | Moderator (CATT) |
R1-2504877 | Draft CR on suspending of power ramping counter for preamble repetition | NEC |
R1-2504878 | Summary#2 of draft CR discussion on power ramping counter | Moderator (NEC) |
R1-2504880 | CR for HARQ-ACK aspects of Rel-17 multi-PDSCH scheduling | Moderator (Samsung) |
R1-2504881 | CR for HARQ-ACK aspects of Rel-17 multi-PDSCH scheduling | Moderator (Samsung) |
R1-2504884 | Draft reply LS on differentiation of sDCI based mTRP and sTRP | CATT |
R1-2504885 | Reply LS on differentiation of sDCI based mTRP and sTRP | RAN1, CATT |
R1-2504902 | Session notes for Pre-Rel-19 NR Maintenance (adhoc2) | Ad-Hoc Chair (Huawei) |
R1-2504903 | Session notes for 7 (Pre-Rel-18 NR maintenance-Adhoc#1) | Ad-Hoc Chair (CMCC) |
R1-2504910 | Summary on CG-PUSCH in RACH-less LTM | Moderator (Google) |
R1-2504911 | CR on starting slot for typeII Doppler CSI | Moderator (NEC), Samsung, Ericsson, OPPO |
R1-2504916 | CR on transmission power reduction for STxMP in TS 38.213 | Moderator (ZTE), ZTE Corporation, Sanechips, Samsung, Google |
R1-2504917 | Draft CR on the validation of RO for LTM candidate cells | Moderator (MediaTek) |
R1-2504918 | CR on the validation of RO for LTM candidate cells | Moderator (MediaTek), Huawei, NTT DOCOMO, Ericsson, Samsung, ZTE, Nokia, Google |
R1-2504919 | Final summary on collision handling between SSB and RA occasion | Moderator (MediaTek) |
R1-2504942 | CR on suspending of power ramping counter for preamble repetition | Moderator (NEC), China Telecom |
R1-2504944 | Draft CR for UE DM-RS transmission in NTN RACH-less HO or RACH-less LTM in TS 38.214 | NEC |
R1-2504952 | Correction on CG PUSCH transmission in RACH-less LTM | Google, Huawei, HiSilicon, Nokia |
R1-2504957 | CR for UE DM-RS transmission in NTN RACH-less HO or RACH-less LTM in TS 38.214 | NEC |
R1-2504958 | CR on aperiodic triggering offset of CSI-IM for Rel-18 Type-II Doppler codebook | Moderator (Qualcomm), CATT, Ericsson, Samsung, Xiaomi |
R1-2505010 | Rel-17 editorial corrections for TS 38.212 | Huawei |
R1-2505011 | Rel-17 editorial corrections for TS 38.212 (mirrored to Rel-18) | Huawei |
R1-2505012 | Rel-18 editorial corrections for TS 38.212 | Huawei |
R1-2505013 | Rel-17 editorial corrections for TS 38.213 | Samsung |
R1-2505014 | Rel-17 editorial corrections for TS 38.213 (mirrored to Rel-18) | Samsung |
R1-2505015 | Rel-18 editorial corrections for TS 38.213 | Samsung |
R1-2505016 | Rel-17 editorial corrections for TS 38.214 | Nokia |
R1-2505017 | Rel-17 editorial corrections for TS 38.214 (mirrored to Rel-18) | Nokia |
R1-2505018 | Rel-18 editorial corrections for TS 38.214 | Nokia |
TDoc | Title | Source |
---|---|---|
R1-2503241 | DRAFT LS on Rel-19 higher layers parameters list Post RAN1#121 | Moderator (Ericsson) |
R1-2503242 | LS on Rel-19 higher layers parameters list Post RAN1#121 | RAN1, Ericsson |
R1-2503243 | Consolidated Rel-19 higher layers parameters list Post RAN1#121 | Moderator (Ericsson) |
R1-2503244 | Collection of Rel-19 higher layers parameters list Post RAN1#121 | Moderator (Ericsson) |
R1-2503449 | Editor’s summary on draft CR 38.215 for NR_MIMO_Ph5 | Moderator (Intel Corporation) |
R1-2503450 | Introduction of Rel-19 MIMO evolution for TS38.215 | Intel Corporation |
R1-2503451 | Editor’s summary on draft CR 38.215 for NR_AIML_air | Moderator (Intel Corporation) |
R1-2503452 | Introduction of Rel-19 AI/ML air-interface for TS38.215 | Intel Corporation |
R1-2503453 | Editor’s summary on draft CR 38.215 for NR_LPWUS | Moderator (Intel Corporation) |
R1-2503454 | Introduction of Rel-19 LP-WUS for TS38.215 | Intel Corporation |
R1-2503455 | Introduction of sub-band full duplex (SBFD) | Ericsson |
R1-2503456 | Editor’s summary on draft CR 38.211 for NR_duplex_evo | Moderator (Ericsson) |
R1-2503457 | Introduction of low-power wake-up signal | Ericsson |
R1-2503458 | Editor’s summary on draft CR 38.211 for NR_LPWUS | Moderator (Ericsson) |
R1-2503459 | Introduction of NR MIMO Phase5 | Ericsson |
R1-2503460 | Editor’s summary on draft CR 38.211 for NR_MIMO_Ph5 | Moderator (Ericsson) |
R1-2503461 | Introduction of low-power wake-up signal and receiver for NR (LP-WUS/WUR) | NTT DOCOMO, INC. |
R1-2503462 | Summary of [Post-120bis-R19-38.201-NR_LPWUS] | Moderator (NTT DOCOMO, INC.) |
R1-2503463 | Introduction of Rel-19 enhancements of network energy savings for NR | Huawei |
R1-2503464 | Summary of email discussion [Post-120bis-Rel19-38.212-Netw_Energy_NR_enh-Core] | Moderator (Huawei) |
R1-2503465 | Introduction of Rel-19 AI/ML for NR Air Interface | Huawei |
R1-2503466 | Summary of email discussion [Post-120bis-Rel19-38.212-NR_AIML_Air-Core] | Moderator (Huawei) |
R1-2503467 | Introduction of Rel-19 low-power Wake-up Signal for NR | Huawei |
R1-2503468 | Summary of email discussion [Post-120bis-Rel19-38.212-NR_LPWUS-Core] | Moderator (Huawei) |
R1-2503469 | Introduction of Rel-19 evolution of NR duplex operation | Huawei |
R1-2503470 | Summary of email discussion [Post-120bis-Rel19-38.212-NR_duplex_evo-Core] | Moderator (Huawei) |
R1-2503471 | Introduction of Rel-19 Multi-carrier enhancements | Huawei |
R1-2503472 | Summary of email discussion [Post-120bis-Rel19-38.212-NR_MC_enh2-Core] | Moderator (Huawei) |
R1-2503473 | Introduction of Rel-19 NR MIMO Phase 5 | Huawei |
R1-2503474 | Summary of email discussion [Post-120bis-Rel19-38.212-NR_MIMO_Ph5-Core] | Moderator (Huawei) |
R1-2503475 | Introduction of Rel-19 NR mobility enhancements Phase 4 in 38.212 | Huawei |
R1-2503476 | Introduction of 32 HARQ process numbers in Rel-19 [TN32HARQ] | Huawei |
R1-2503477 | Summary of the discussion concerning the Netw_Energy_NR_enh for Release 19 | Moderator (Nokia) |
R1-2503478 | Introduction of AI/ML beam prediction | Nokia |
R1-2503479 | Summary of the discussion concerning the NR_AIML_air draft CR for Release 19 | Moderator (Nokia) |
R1-2503480 | Introduction of evolution of NR duplex operation: Sub-band full duplex (SBFD) | Nokia |
R1-2503481 | Summary of the discussion concerning the NR_duplex_evo draft CR for Release 19 | Moderator (Nokia) |
R1-2503482 | Introduction of specification support for WUS functionality | Nokia |
R1-2503483 | Summary of the discussion concerning the NR_LPWUS draft CR for Release 19 | Moderator (Nokia) |
R1-2503484 | Introduction of Multi-carrier enhancements for NR Phase 3 | Nokia |
R1-2503485 | Summary of the discussion concerning the NR_MC_enh2-Core draft CR for Release 19 | Moderator (Nokia) |
R1-2503486 | Introduction of 3Tx UL enhancements and asymmetric UL mTRP operation for NR MIMO Phase 5 | Nokia |
R1-2503487 | Summary of the discussion concerning the 3Tx and asymmetric UL mTRP operation draft CR for Release 19 | Moderator (Nokia) |
R1-2503488 | Title:\t\tIntroduction of CSI enhancements for NR MIMO Phase 5 | Nokia |
R1-2503489 | Summary of the discussion concerning the CSI draft CR for Release 19 | Moderator (Nokia) |
R1-2503490 | Introduction of UE-initiated/event-driven beam management | Nokia |
R1-2503491 | Summary of the discussion concerning the UEIBM draft CR for Release 19 | Moderator (Nokia) |
R1-2503492 | Introduction of specification support for NR mobility enhancements phase 4 | Nokia |
R1-2503493 | Summary of the discussion concerning the NR_Mob_Ph4 draft CR for Release 19 | Moderator (Nokia) |
R1-2503494 | Introduction of specification support for NR_NTN_Ph3 functionality | Nokia |
R1-2503495 | Summary of the discussion concerning the NR_NTN_Ph3 for Release 19 | Moderator (Nokia) |
R1-2503496 | TEI19 Counting of CSI-RS resource referred by N CSI reporting settings | Nokia |
R1-2503497 | Summary of the discussion concerning the TEI19 Counting of CSI-RS resource referred by N CSI reporting settings draft CR for Release 19 | Moderator (Nokia) |
R1-2503498 | TEI19 Combination of carrier-switching SRS and UL carrier aggregation | Nokia |
R1-2503499 | Summary of the discussion concerning the TEI19 Combination of carrier-switching SRS and UL carrier aggregation draft CR for Release 19 | Moderator (Nokia) |
R1-2503500 | TEI19 Extension of SRS frequency hopping for positioning to non-RedCap Ues | Nokia |
R1-2503501 | Summary of the discussion concerning the TEI19 Extension of SRS frequency hopping for positioning to non-RedCap UEs draft CR for Release 19 | Moderator (Nokia) |
R1-2503502 | TEI19 Carrier-Switching SRS with UL Tx Switching | Nokia |
R1-2503503 | Summary of the discussion concerning the TEI19 Carrier-Switching SRS with UL Tx Switching draft CR for Release 19 | Moderator (Nokia) |
R1-2504965 | Introduction of Rel-19 LTE-based 5G Broadcast Phase 2 | FUTUREWEI |
R1-2504966 | Introduction of Rel-19 OCC for IoT-NTN for LTE | FUTUREWEI |
R1-2504969 | Introduction of enhancements of network energy savings for NR | Samsung |
R1-2504970 | Introduction of evolution of NR duplex operation: Sub-band full duplex (SBFD) | Samsung |
R1-2504971 | Introduction of low-power wake-up signal and receiver for NR (LP-WUS/WUR) | Samsung |
R1-2504972 | Introduction of multi-carrier enhancements for NR Phase 3 | Samsung |
R1-2504973 | Introduction of NR MIMO Phase 5 | Samsung |
R1-2504974 | Introduction of NR mobility enhancements Phase 4 | Samsung |
R1-2504975 | Introduction of Non-Terrestrial Networks (NTN) for NR Phase 3 | Samsung |
R1-2504976 | Introduction of SR triggered SSSG switching [SRTrig_SSSGSwitch] | Samsung |
R1-2504977 | Introduction of Rel-19 MIMO evolution for TS38.215 | Intel Corporation |
R1-2504978 | Introduction of Rel-19 AI/ML air-interface for TS38.215 | Intel Corporation |
R1-2504979 | Introduction of Rel-19 LP-WUS for TS38.215 | Intel Corporation |
R1-2504980 | Introduction of sub-band full duplex (SBFD) | Ericsson |
R1-2504981 | Introduction of low-power wake-up signal | Ericsson |
R1-2504982 | Introduction of NR MIMO Phase5 | Ericsson |
R1-2504983 | Introduction of low-power wake-up signal and receiver for NR (LP-WUS/WUR) | NTT DOCOMO, INC. |
R1-2504984 | Introduction of Rel-19 enhancements of network energy savings for NR | Huawei |
R1-2504985 | Introduction of Rel-19 AI/ML for NR Air Interface | Huawei |
R1-2504986 | Introduction of Rel-19 low-power Wake-up Signal for NR | Huawei |
R1-2504987 | Introduction of Rel-19 evolution of NR duplex operation | Huawei |
R1-2504988 | Introduction of Rel-19 Multi-carrier enhancements | Huawei |
R1-2504989 | Introduction of Rel-19 NR MIMO Phase 5 | Huawei |
R1-2504990 | Introduction of Rel-19 NR mobility enhancements Phase 4 in 38.212 | Huawei |
R1-2504991 | Introduction of 32 HARQ process numbers in Rel-19 [TN32HARQ] | Huawei |
R1-2504992 | Introduction of AI/ML beam prediction | Nokia |
R1-2504993 | Introduction of evolution of NR duplex operation: Sub-band full duplex (SBFD) | Nokia |
R1-2504994 | Introduction of specification support for WUS functionality | Nokia |
R1-2504995 | Introduction of Multi-carrier enhancements for NR Phase 3 | Nokia |
R1-2504996 | Introduction of 3Tx UL enhancements and asymmetric UL mTRP operation for NR MIMO Phase 5 | Nokia |
R1-2504997 | Title:\t\tIntroduction of CSI enhancements for NR MIMO Phase 5 | Nokia |
R1-2504998 | Introduction of UE-initiated/event-driven beam management | Nokia |
R1-2504999 | Introduction of specification support for NR mobility enhancements phase 4 | Nokia |
R1-2505000 | Introduction of specification support for NR_NTN_Ph3 functionality | Nokia |
R1-2505001 | TEI19 Counting of CSI-RS resource referred by N CSI reporting settings | Nokia |
R1-2505002 | TEI19 Combination of carrier-switching SRS and UL carrier aggregation | Nokia |
R1-2505003 | TEI19 Extension of SRS frequency hopping for positioning to non-RedCap Ues | Nokia |
R1-2505004 | TEI19 Carrier-Switching SRS with UL Tx Switching | Nokia |
R1-2505020 | Editor’s summary on draft CR 36.211 for IoT_NTN_Ph3 | Ericsson |
R1-2505021 | Editor’s summary on draft CR 36.211 for IoT_NTN_TDD | Ericsson |
R1-2505022 | Editor’s summary on draft CR 36.211 for LTE_terr_bcast_Ph2 | Ericsson |
R1-2505023 | Editor’s summary on draft CR 36.211 for TEI19 [5GB_CASMuting] | Ericsson |
R1-2505024 | Editor’s summary on draft CR 38.211 for NR_duplex_evo | Ericsson |
R1-2505025 | Editor’s summary on draft CR 38.211 for NR_MIMO_Ph5 | Ericsson |
R1-2505026 | Editor’s summary on draft CR 38.211 for NR_NTN_Ph3 | Ericsson |
R1-2505027 | Summary of email discussion [Post-121-Rel19-38.212-Netw_Energy_NR_enh-Core] | Moderator (Huawei) |
R1-2505028 | Summary of email discussion [Post-121-Rel19-38.212-NR_AIML_Air-Core] | Moderator (Huawei) |
R1-2505029 | Summary of email discussion [Post-121-Rel19-38.212-NR_NTN_Ph3-Core] | Moderator (Huawei) |
R1-2505030 | Summary of email discussions [121-R19-38.213- Netw_Energy_NR_enh] | Samsung |
R1-2505031 | Summary of email discussions [121-R19-38.213-NR_duplex_evo] | Samsung |
R1-2505032 | Summary of email discussions [121-R19-38.213-NR_LBCA_Sw] | Samsung |
R1-2505033 | Summary of email discussions [121-R19-38.213-NR_LPWUS] | Samsung |
R1-2505034 | Summary of email discussions [121-R19-38.213-NR_MC_enh2] | Samsung |
R1-2505035 | Summary of email discussions [121-R19-38.213-NR_MIMO_Ph5] | Samsung |
R1-2505036 | Summary of email discussions [121-R19-38.213-NR_NTN_Ph3] | Samsung |
R1-2505037 | Summary of email discussions [121-R19-38.213-NR_XR_Ph3] | Samsung |
R1-2505038 | Summary of the discussion concerning the Netw_Energy_NR_enh for Release 19 | Nokia |
R1-2505039 | Summary of the discussion concerning the NR_AIML_air draft CR for Release 19 | Nokia |
R1-2505040 | Summary of the discussion concerning the NR_duplex_evo draft CR for Release 19 | Nokia |
R1-2505041 | Summary of the discussion concerning the CSI draft CR for Release 19 | Nokia |
R1-2505042 | Summary of the discussion concerning the UEIBM draft CR for Release 19 | Nokia |
R1-2505043 | Summary of the discussion concerning the NR_NTN_Ph3 for Release 19 | Nokia |
R1-2505044 | Summary of the discussion concerning the TEI19 Counting of CSI-RS resource referred by N CSI reporting settings draft CR for Release 19 | Nokia |
R1-2505045 | Summary of the discussion concerning the TEI19: Simultaneous NZP-CSI-RS resource counting with NES | Nokia |
R1-2505046 | Summary of the discussion concerning the TEI19 Combination of carrier-switching SRS and UL carrier aggregation draft CR for Release 19 | Nokia |
R1-2505047 | Editor’s summary on draft CR 38.215 for NR_AIML_air | Moderator (InterDigital) |
R1-2505048 | Editor’s summary on draft CR 38.215 for NR_MIMO_Ph5 | Moderator (InterDigital) |
R1-2505049 | Summary of email discussion [Post-120bis-Rel19-36.212-IoT_NTN_Ph3] | Moderator (FUTUREWEI) |
R1-2505050 | Summary of email discussion [Post-121-Rel-19-36.213- IoT_NTN_Ph3] | Motorola Mobility |
R1-2505051 | Summary of email discussion [Post-121-Rel19-36.212-LTE_terr_bcast_Ph2] | Moderator (FUTUREWEI) |
R1-2505052 | Summary of email discussion [Post-121-Rel-19-36.213- LTE_terr_bcast_Ph2] | Motorola Mobility |
R1-2505053 | Summary of email discussion [Post-121-Rel-19-36.213- IoT_NTN_TDD] | Motorola Mobility |
R1-2505054 | Editor’s summary on draft CR 38.215 for NR_LPWUS | Moderator (InterDigital) |
R1-2505055 | Introduction of Ambient IoT | NTT DOCOMO, INC. |
R1-2505056 | Introduction of Non-Terrestrial Networks (NTN) for Internet of Things (IoT) Phase 3 | Motorola Mobility |
R1-2505057 | Introduction of IoT_NTN_Ph3 | Ericsson |
R1-2505058 | Introduction of IoT_NTN_TDD | Ericsson |
R1-2505059 | Introduction of LTE-based 5G Broadcast Phase 2 | Ericsson |
R1-2505060 | Introduction of enhancements of network energy savings | Nokia |
R1-2505061 | Introduction of low NR band carrier aggregation via switching for NR | Samsung |
R1-2505062 | Introduction of Rel-19 NR NTN Phase 3 in 38.212 | Huawei |
R1-2505063 | Introduction of NR_NTN_Ph3 | Ericsson |
R1-2505064 | Introduction of XR (eXtended Reality) for NR Phase 3 | Samsung |
R1-2505065 | Introduction of Rel-19 XR enhancements for NR | Huawei |
R1-2505066 | Introduction of TEI19 - CAS muting for LTE-based 5G Broadcast | Ericsson |
R1-2505067 | TEI19: Simultaneous NZP-CSI-RS resource counting with NES | Nokia |
TDoc | Title | Source |
---|---|---|
R1-2504382 | Rapporteur view on higher layer signalling of Rel-19 AI-ML for NR air interface | Qualcomm Incorporated |
R1-2504383 | Draft TP to capture the output of Agenda Item 9.1.4.1 into TR | Qualcomm Incorporated |
R1-2504893 | Session notes for 9.1 (AI/ML for NR Air Interface) | Ad-Hoc Chair (CMCC) |
R1-2504963 | Rapporteur view on higher layer signalling of Rel-19 AI-ML for NR air interface after RAN1#121 | Qualcomm Incorporated |
R1-2505009 | TPs capturing the new agreements of other aspects | Moderator (OPPO) |
TDoc | Title | Source |
---|---|---|
R1-2503230 | Discussion on specification support for AI/ML-based beam management | FUTUREWEI |
R1-2503251 | Discussion on AIML for beam management | Huawei, HiSilicon |
R1-2503298 | Specification Support for AI/ML in Beam Management | Kyocera |
R1-2503347 | Remaining issues on specification support for beam management | vivo |
R1-2503432 | AI/ML for beam management | Ericsson |
R1-2503505 | Discussion on AIML for beam management | Spreadtrum, UNISOC |
R1-2503550 | Discussion for supporting AI/ML based beam management | Samsung |
R1-2503627 | Discussion on AIML beam management | TCL |
R1-2503648 | Discussion on AI/ML-based beam management | ZTE Corporation, Sanechips |
R1-2503709 | Discussion on AI/ML-based beam management | Tejas Network Limited |
R1-2503727 | Discussion on AI/ML for beam management | Ofinno |
R1-2503757 | Discussion on Specification Support of AI/ML for Beam Management | Indian Institute of Tech (M), IIT Kanpur |
R1-2503770 | Discussion on AI/ML-based beam management | CATT |
R1-2503820 | Discussion on specification support for beam management | CMCC |
R1-2503872 | Discussion on AI/ML for beam management | Xiaomi |
R1-2503927 | Discussion on specification support for beam management | NEC |
R1-2503950 | Discussion on specification support for beam management | Ruijie Networks Co. Ltd |
R1-2503963 | Discussion on AI/ML for beam management | InterDigital, Inc. |
R1-2503981 | Discussions on AI/ML for beam management | LG Electronics |
R1-2503987 | Discussion on specification support for beam management | Panasonic |
R1-2503996 | Specification support for AI-enabled beam management | NVIDIA |
R1-2504024 | AI/ML based Beam Management | |
R1-2504039 | AI/ML specification support for beam management | Lenovo |
R1-2504043 | Discussion on AI/ML for beam management | China Telecom |
R1-2504058 | Discussion on specification support for beam management | Sony |
R1-2504080 | Discussion on specification support on AI/ML for beam management | Fujitsu |
R1-2504093 | Discussion on AI/ML for beam management | HONOR |
R1-2504112 | AI/ML for Beam Management | Nokia |
R1-2504116 | Discussion on AI/ML based beam management | Hyundai Motor Company |
R1-2504129 | Discussion on specification support for beam management | ETRI |
R1-2504171 | Discussion on specification support for AI/ML beam management | Transsion Holdings |
R1-2504183 | Specification support for beam management | KDDI Corporation (TTC) |
R1-2504223 | On specification for AI/ML-based beam management | OPPO |
R1-2504258 | Discussion on specification support for AIML-based beam management | MediaTek Inc. |
R1-2504308 | AI/Ml based beam management | Apple |
R1-2504384 | Specification support for AI-ML-based beam management | Qualcomm Incorporated |
R1-2504464 | Discussions on specification support for beam management | Sharp |
R1-2504491 | Discussion on AI/ML for beam management | NTT DOCOMO, INC. |
R1-2504541 | Discussion on AI/ML based beam management | KT Corp. |
R1-2504560 | Specification support for beam management | Fraunhofer HHI, Fraunhofer IIS |
R1-2504571 | Discussion on AIML based beam management | ASUSTeK |
R1-2504592 | On Performance Monitoring for Beam Management Use Case | NTU |
R1-2504625 | Specification support for AI/ML beam management | ITL |
R1-2504769 | FL summary #0 for AI/ML in beam management | Moderator (Samsung) |
R1-2504770 | FL summary #1 for AI/ML in beam management | Moderator (Samsung) |
R1-2504771 | FL summary #2 for AI/ML in beam management | Moderator (Samsung) |
R1-2504772 | FL summary #3 for AI/ML in beam management | Moderator (Samsung) |
R1-2504773 | FL summary #4 for AI/ML in beam management | Moderator (Samsung) |
TDoc | Title | Source |
---|---|---|
R1-2503238 | AI/ML for Positioning Accuracy Enhancement | Ericsson |
R1-2503252 | Discussion on AI/ML for positioning accuracy enhancement | Huawei, HiSilicon |
R1-2503348 | Remaining issues on specification support for positioning accuracy enhancement | vivo |
R1-2503506 | Discussion on AIML for positioning accuracy enhancement | Spreadtrum, UNISOC |
R1-2503551 | Discussion for supporting AI/ML based positioning accuracy enhancement | Samsung |
R1-2503649 | Discussion on AI/ML-based positioning enhancement | ZTE Corporation, Pengcheng Laboratory |
R1-2503719 | Discussion on AI/ML for positioning accuracy enhancement | Tejas Network Limited |
R1-2503750 | Remaining issues on specification support for positioning accuracy enhancement | TCL |
R1-2503751 | Discussion on support for AIML positioning | InterDigital, Inc. |
R1-2503771 | Discussion on AI/ML-based positioning | CATT, CICTCI |
R1-2503811 | AI/ML positioning accuracy enhancement | Fraunhofer IIS, Fraunhofer HHI |
R1-2503821 | Discussion on specification support for positioning accuracy enhancement | CMCC |
R1-2503873 | Discussion on AI/ML-based positioning accuracy enhancement | Xiaomi |
R1-2503921 | Discussion on specification support for AIML based positioning accuracy enhancement | NEC |
R1-2503951 | Discussion on specification support for positioning accuracy enhancement | Ruijie Networks Co. Ltd |
R1-2503997 | Specification support for AI-enabled positioning | NVIDIA |
R1-2504025 | AI/ML based Positioning | |
R1-2504040 | Specification impacts for AI/ML positioning | Lenovo |
R1-2504059 | On supporting AI/ML based positioning accuracy enhancement | Sony |
R1-2504081 | Discussion on specification support for AIML-based positioning accuracy enhancement | Fujitsu |
R1-2504113 | AI/ML for Positioning Accuracy Enhancement | Nokia |
R1-2504130 | Discussion on specification support for positioning accuracy enhancement | ETRI |
R1-2504224 | On specification for AI/ML-based positioning accuracy enhancements | OPPO |
R1-2504285 | Discussion on Specification Support of AI/ML for Positioning Accuracy Enhancement | Indian Institute of Tech (M) |
R1-2504309 | Specification Support for AI/ML-based positioning | Apple |
R1-2504385 | Specification support for AI-ML-based positioning accuracy enhancement | Qualcomm Incorporated |
R1-2504465 | Discussion on specification support for AI/ML based positioning accuracy enhancements | Sharp |
R1-2504492 | Discussion on AI/ML for positioning accuracy enhancement | NTT DOCOMO, INC. |
R1-2504570 | Design for AI/ML based positioning | MediaTek Korea Inc. |
R1-2504580 | Discussions on specification support for positioning accuracy enhancement for AI/ML | ITL |
R1-2504596 | Discussion on specification support for AI/ML positioning accuracy enhancement | CEWiT |
R1-2504691 | Summary #1 of specification support for positioning accuracy enhancement | Moderator (Ericsson) |
R1-2504692 | Summary #2 of specification support for positioning accuracy enhancement | Moderator (Ericsson) |
R1-2504693 | Summary #3 of specification support for positioning accuracy enhancement | Moderator (Ericsson) |
R1-2504694 | Summary #4 of specification support for positioning accuracy enhancement | Moderator (Ericsson) |
R1-2504695 | Summary #5 of specification support for positioning accuracy enhancement | Moderator (Ericsson) |
R1-2504955 | Final summary of specification support for positioning accuracy enhancement | Moderator (Ericsson) |
TDoc | Title | Source |
---|---|---|
R1-2503232 | Discussion on CSI Processing Unit for AI/ML-based CSI prediction | FUTUREWEI |
R1-2503246 | AI/ML for CSI prediction | Ericsson |
R1-2503253 | Discussion on AIML for CSI prediction | Huawei, HiSilicon |
R1-2503349 | Remaining issues on specification support for CSI prediction | vivo |
R1-2503448 | Discussion on AI-based CSI prediction | TCL |
R1-2503507 | Discussion on AIML for CSI prediction | Spreadtrum, UNISOC |
R1-2503552 | Views on AI/ML based CSI prediction | Samsung |
R1-2503650 | Discussion on specification support for AI CSI prediction | ZTE Corporation, Sanechips |
R1-2503749 | Specification support for CSI prediction | Quectel |
R1-2503772 | Discussion on AI/ML-based CSI prediction | CATT |
R1-2503822 | Discussion on AI/ML for CSI prediction | CMCC |
R1-2503874 | Further discussion on remained issues for AI/ML model based CSI prediction | Xiaomi |
R1-2503922 | Discussion on specification support for CSI prediction | NEC |
R1-2503952 | Discussion on specification support for CSI prediction | Ruijie Networks Co. Ltd |
R1-2503976 | On AI/ML-based CSI prediction | InterDigital, Inc. |
R1-2503982 | Discussions on CSI prediction | LG Electronics |
R1-2503988 | Discussion on AI/ML-based CSI prediction | Panasonic |
R1-2503998 | Specification support for AI-enabled CSI prediction | NVIDIA |
R1-2504026 | AI/ML based CSI Prediction | |
R1-2504041 | Specification support for CSI prediction | Lenovo |
R1-2504060 | Specification support for UE-side AI/ML CSI prediction model monitoring | Sony |
R1-2504082 | Discussion on specification support for CSI prediction | Fujitsu |
R1-2504094 | Discussion on AI/ML for CSI prediction | HONOR |
R1-2504114 | AI/ML for CSI Prediction | Nokia |
R1-2504131 | Discussion on specification support for CSI prediction | ETRI |
R1-2504225 | On specification for AI/ML-based CSI prediction | OPPO |
R1-2504259 | AI/ML - Specification support for CSI Prediction | MediaTek Inc. |
R1-2504310 | Discussion on AI based CSI prediction | Apple |
R1-2504386 | Specification support for CSI prediction | Qualcomm Incorporated |
R1-2504466 | Discussion on specification support for AI/ML based CSI prediction | Sharp |
R1-2504493 | Discussion on AI/ML for CSI prediction | NTT DOCOMO, INC. |
R1-2504597 | Discussion on specification support for CSI prediction | CEWiT |
R1-2504649 | Discussion on AI/ML CSI prediction | Continental Automotive |
R1-2504774 | Summary #1 of CSI prediction | Moderator (LG Electronics) |
R1-2504775 | Summary #2 of CSI prediction | Moderator (LG Electronics) |
R1-2504776 | Summary #3 of CSI prediction | Moderator (LG Electronics) |
R1-2504777 | Summary #4 of CSI prediction | Moderator (LG Electronics) |
R1-2504778 | Summary #5 of CSI prediction | Moderator (LG Electronics) |
R1-2504939 | Summary #6 of CSI prediction | Moderator (LG Electronics) |
TDoc | Title | Source |
---|---|---|
R1-2503231 | Discussion of CSI compression on AI/ML for NR air interface | FUTUREWEI |
R1-2503245 | AI/ML for CSI compression | Ericsson |
R1-2503254 | Discussion on AI/ML for CSI compression | Huawei, HiSilicon |
R1-2503350 | Discussion on CSI compression | vivo |
R1-2503508 | Discussion on AIML for CSI compression | Spreadtrum, UNISOC |
R1-2503553 | Views on additional study for AI/ML based CSI compression | Samsung |
R1-2503628 | Discussion on CSI compression and other aspects on AlML air interface | TCL |
R1-2503651 | Discussion on study for AI/ML CSI compression | ZTE Corporation, Sanechips |
R1-2503710 | Discussion on study for AI/ML CSI compression | Tejas Network Limited |
R1-2503728 | Views on UCI loss mitigation | Ofinno |
R1-2503756 | Discussion on Additional Study for AI/ML CSI Compression | Indian Institute of Tech (M), IIT Kanpur |
R1-2503773 | Discussion on AI/ML-based CSI compression | CATT |
R1-2503823 | Discussion on AI/ML for CSI compression | CMCC |
R1-2503875 | Further discussion on remained issues for AI/ML model based CSI compression | Xiaomi |
R1-2503923 | Discussion on CSI compression | NEC |
R1-2503977 | On AI/ML-based CSI compression and other aspects | InterDigital, Inc. |
R1-2503983 | Study on CSI compression | LG Electronics |
R1-2503989 | Discussion on AI/ML for CSI compression | Panasonic |
R1-2503995 | Additional study on AI-enabled CSI compression | NVIDIA |
R1-2504027 | AI/ML based CSI Compression | |
R1-2504042 | On AI/ML for CSI compression | Lenovo |
R1-2504083 | Discussion on CSI compression with AI/ML | Fujitsu |
R1-2504115 | AI/ML for CSI Compression | Nokia |
R1-2504132 | Discussion on AI/ML for CSI compression | ETRI |
R1-2504226 | Additional study on AI/ML-based CSI compression | OPPO |
R1-2504260 | Additional study on AI/ML for NR air interface - CSI compression | MediaTek Inc. |
R1-2504311 | Discussion on AI based CSI compression | Apple |
R1-2504387 | Additional study on CSI compression | Qualcomm Incorporated |
R1-2504494 | Discussion on AI/ML for CSI compression | NTT DOCOMO, INC. |
R1-2504569 | Discussion on AI/ML CSI compression | Continental Automotive |
R1-2504587 | Discussion on AI/ML-based CSI compression | Pengcheng Laboratory |
R1-2504624 | Discussion on AI/ML based CSI compression | IIT Kanpur, Indian Institute of Tech (M) |
R1-2504737 | Summary#1 of Additional study on AI/ML for NR air interface: CSI compression and any other aspects on AI/ML model/data | Moderator (Qualcomm) |
R1-2504738 | Summary#2 of Additional study on AI/ML for NR air interface: CSI compression and any other aspects on AI/ML model/data | Moderator (Qualcomm) |
R1-2504739 | Summary#3 of Additional study on AI/ML for NR air interface: CSI compression and any other aspects on AI/ML model/data | Moderator (Qualcomm) |
R1-2504740 | Summary#4 of Additional study on AI/ML for NR air interface: CSI compression and any other aspects on AI/ML model/data | Moderator (Qualcomm) |
R1-2504741 | Summary#5 of Additional study on AI/ML for NR air interface: CSI compression and any other aspects on AI/ML model/data | Moderator (Qualcomm) |
R1-2504742 | Summary#6 of Additional study on AI/ML for NR air interface: CSI compression and any other aspects on AI/ML model/data | Moderator (Qualcomm) |
R1-2504743 | Final summary of Additional study on AI/ML for NR air interface: CSI compression and any other aspects on AI/ML model/data | Moderator (Qualcomm) |
R1-2505019 | Text proposal to capture the output of Rel-19 study of Agenda Item 9.1.4.1 into TR 38.843 | Moderator (Qualcomm) |
TDoc | Title | Source |
---|---|---|
R1-2503559 | List of RRC impact for Rel-19 MIMO Ph5 | Moderator (Samsung) |
R1-2503560 | Draft LS to RAN2 on MAC impact for Rel-19 MIMO Ph5 | Moderator (Samsung) |
R1-2503561 | LS to RAN2 on MAC impact for Rel-19 MIMO Ph5 | Moderator (Samsung) |
R1-2503562 | Draft Stage-2 CR for Rel-19 NR MIMO Ph5 in TS38.300 | Samsung |
R1-2503721 | An Improved DOA Estimation Method Based on Sparse Reconstruction | BUPT |
R1-2503722 | An Improved DOA Estimation Method Based on Sparse Reconstruction | BUPT |
R1-2503911 | AnImproved DOAEstimation Method Based on Sparse Reconstruction | BUPT |
R1-2504568 | Discussions on DOA estimation algorithm for MIMO | BUPT |
R1-2504731 | Way Forward Proposal for NR MIMO | Moderator (Samsung) |
R1-2504782 | Summary of discussion on Draft CR on TS38.300 for Rel-19 MIMO | Moderator (Samsung) |
R1-2505005 | Summary of email discussion on Draft CR on TS38.300 for Rel-19 MIMO | Moderator (Samsung) |
R1-2505008 | LS on Draft CR on TS38.300 for Rel-19 MIMO | RAN1, Samsung |
TDoc | Title | Source |
---|---|---|
R1-2503237 | Remaining issues for UE-initiated/event-driven beam management | FUTUREWEI |
R1-2503275 | On UE initiated/event-driven beam management | Huawei, HiSilicon |
R1-2503303 | Enhancements for UE-initiated/event-driven beam management | MediaTek Inc. |
R1-2503351 | Remaining issues on UE-initiated/event-driven beam management | vivo |
R1-2503433 | Remaining Details of Rel-19 UE/Event-Driven Beam Management | InterDigital, Inc. |
R1-2503509 | Discussion on UE-initiated/event-driven beam management | Spreadtrum, UNISOC |
R1-2503554 | Views on Rel-19 UE-initiated/event-driven beam management | Samsung |
R1-2503612 | Remaining issues for UE-initiated beam management | Ericsson |
R1-2503668 | Discussion on enhancements for UE-initiated/event-driven beam management | ZTE Corporation, Sanechips |
R1-2503729 | On UE-initiated/event-driven beam management | Ofinno |
R1-2503786 | Remaining issues on UE-initiated/event-driven beam report | CATT |
R1-2503816 | Enhancements for UE-initiated/Event-Driven Beam Management | Panasonic |
R1-2503824 | Discussion on enhancements for UE-initiated/event-driven beam management | CMCC |
R1-2503876 | Discussion on enhancements for UE-initiated/event-driven beam management | Xiaomi |
R1-2503912 | Enhancements for UE-initiated/event-driven beam management | Lenovo |
R1-2503928 | Discussion on enhancements for UE-initiated or event-driven beam management | NEC |
R1-2503953 | Discussion on enhancements for UE-initiated/event-driven beam management | Ruijie Networks Co. Ltd |
R1-2503985 | UE-initiated beam management | LG Electronics |
R1-2504061 | Enhancements for UE-initiated/event-driven beam management | Sony |
R1-2504076 | Enhancements to facilitate UE-initiated/event-driven beam management | Nokia |
R1-2504084 | Discussion on enhancements for UE-initiated/event-driven beam management | Fujitsu |
R1-2504095 | Discussion on the UE-initiated/event-driven beam management | HONOR |
R1-2504117 | Discussion on enhancements for UE-initiated/event-driven beam management | Hyundai Motor Company |
R1-2504133 | Enhancements for UE-initiated/event-driven beam management | ETRI |
R1-2504172 | Enhancements for UE-initiated/event-driven beam management | Transsion Holdings |
R1-2504228 | Discussions on UE-initiated/event-driven beam management | OPPO |
R1-2504297 | Discussion on enhancements for UE-initiated or event-driven beam management | |
R1-2504312 | Remaining issues for UE-initiated beam management | Apple |
R1-2504388 | UE-initiated/event-driven beam management | Qualcomm Incorporated |
R1-2504444 | Enhancements for UE-initiated/event-driven beam management | Sharp |
R1-2504453 | Discussions on UE-initiated/event-driven beam management | China Telecom |
R1-2504471 | Moderator Summary #1 on UE-initiated/event-driven beam management | Moderator (ZTE) |
R1-2504472 | Moderator Summary #2 on UE-initiated/event-driven beam management | Moderator (ZTE) |
R1-2504473 | Moderator Summary #3 on UE-initiated/event-driven beam management | Moderator (ZTE) |
R1-2504476 | Remaining issues on enhancements for UE-initiated/event-driven beam management | KDDI Corporation (TTC) |
R1-2504495 | Discussion on enhancements for UE-initiated/event-driven beam management | NTT DOCOMO, INC. |
R1-2504535 | Discussion on UE-initiated/event-driven beam management | ITRI, Acer Incorporated |
R1-2504572 | Discussion on UE initiated beam report | ASUSTeK |
R1-2504579 | Discussion on Enhancements for UE-initiated/event-driven beam management | NICT |
R1-2504607 | Discussion on UE-initiated/event-driven beam management | TCL |
TDoc | Title | Source |
---|---|---|
R1-2503276 | On 128 CSI-RS ports and UE reporting enhancement | Huawei, HiSilicon |
R1-2503352 | Remaining issues on Rel-19 CSI enhancements | vivo |
R1-2503434 | Remaining Details of Rel-19 Enhancements of CSI | InterDigital, Inc. |
R1-2503510 | Remaining issues on CSI enhancements | Spreadtrum, UNISOC |
R1-2503555 | Moderator Summary#1 on Rel-19 CSI enhancements: Round 1 | Moderator (Samsung) |
R1-2503556 | Views on Rel-19 CSI enhancements | Samsung |
R1-2503669 | Discussion on CSI enhancements | ZTE Corporation, Sanechips |
R1-2503711 | Discussion on Rel-19 CSI Enhancements | Tejas Network Limited |
R1-2503787 | Remaining issues on Rel-19 CSI enhancements | CATT |
R1-2503825 | Discussion on CSI enhancements | CMCC |
R1-2503860 | Discussion on the Remaining Issues of CSI Enhancement | Rakuten Mobile, Inc |
R1-2503877 | Further discussion on the remained issues for CSI enhancement | Xiaomi |
R1-2503910 | CSI enhancements for Rel. 19 MIMO | Fraunhofer IIS, Fraunhofer HHI |
R1-2503913 | Discussion on CSI enhancements | Lenovo |
R1-2503917 | Discussion on CSI enhancements | NEC |
R1-2504028 | CSI Enhancement for NR MIMO | |
R1-2504062 | Discussion of CSI enhancements | Sony |
R1-2504077 | CSI enhancement for NR MIMO Phase 5 | Nokia |
R1-2504085 | Remaining issues on Rel-19 CSI enhancements | Fujitsu |
R1-2504096 | Discussion on CSI enhancements | HONOR |
R1-2504134 | Discussion on CSI enhancements for NR MIMO Phase 5 | ETRI |
R1-2504229 | CSI enhancements for Rel-19 MIMO | OPPO |
R1-2504389 | Maintenance on CSI for >32 ports and UE-assisted CJT | Qualcomm Incorporated |
R1-2504445 | CSI enhancements | Sharp |
R1-2504451 | Maintenance on CSI enhancements for large antenna arrays and CJT | Ericsson |
R1-2504496 | Discussion on CSI enhancements | NTT DOCOMO, INC. |
R1-2504549 | Discussion on CSI enhancements for NR MIMO Phase 5 | KDDI Corporation |
R1-2504728 | Moderator Summary#2 on Rel-19 CSI enhancements: Round 2 | Moderator (Samsung) |
R1-2504729 | Moderator Summary for Monday Offline Session on Rel-19 CSI enhancements | Moderator (Samsung) |
R1-2504730 | Moderator Summary for Wednesday Offline Session on Rel-19 CSI enhancements | Moderator (Samsung) |
TDoc | Title | Source |
---|---|---|
R1-2503277 | Discussion on 3-antenna-port UL transmission | Huawei, HiSilicon |
R1-2503353 | Remaining issues on 3-antenna-port codebook-based uplink transmissions | vivo |
R1-2503435 | Remaining Details of Rel-19 CB-based UL for 3TX UE | InterDigital, Inc. |
R1-2503437 | FL Summary Support for 3TX CB-based Uplink; First Round | Moderator (InterDigital, Inc.) |
R1-2503438 | Summary of Discussion on 3TX CB-based Uplink in RAN1#121 | Moderator (InterDigital, Inc.) |
R1-2503557 | Views on Rel-19 3-antenna-port codebook-based transmissions | Samsung |
R1-2503670 | Discussion on 3-antenna-port codebook-based transmissions | ZTE Corporation, Sanechips |
R1-2503723 | Remaining issues for 3 Tx UL transmissions | Ericsson Japan K.K. |
R1-2503788 | Maintenance on 3-antenna-port uplink transmission | CATT |
R1-2503914 | Support for 3-antenna-port codebook-based transmissions | Lenovo |
R1-2504029 | Uplink 3 Port Codebook based Transmission | |
R1-2504078 | On the support for 3-antenna-port codebook-based transmissions | Nokia |
R1-2504230 | Discussion on 3-antenna-port uplink transmissions | OPPO |
R1-2504313 | Remaining issues on R19 MIMO 3Tx transmission | Apple |
R1-2504446 | Support for 3-antenna-port transmission | Sharp |
R1-2504456 | Discussions on 3-antenna-port UL transmission | China Telecom |
TDoc | Title | Source |
---|---|---|
R1-2503278 | Enhancements for asymmetric DL sTRP/UL mTRP scenarios | Huawei, HiSilicon |
R1-2503304 | Enhancement for asymmetric DL sTRP/UL mTRP scenarios | MediaTek Inc. |
R1-2503354 | Remaining issues on asymmetric DL sTRP/UL mTRP scenarios | vivo |
R1-2503436 | Remaining Details of Rel-19 Asymmetric mTRP Operation | InterDigital, Inc. |
R1-2503511 | Enhancements for asymmetric DL sTRP/UL mTRP scenarios | Spreadtrum, UNISOC |
R1-2503558 | Views on Rel-19 asymmetric DL sTRP/UL mTRP scenarios | Samsung |
R1-2503671 | Discussion on enhancements for asymmetric DL sTRP/UL mTRP scenarios | ZTE Corporation, Sanechips, China Telecom |
R1-2503712 | Enhancement for asymmetric DL sTRP UL mTRP | Tejas Network Limited |
R1-2503730 | Enhancements on asymmetric DL STRP/UL MTRP scenarios | Ofinno |
R1-2503789 | Remaining issues on asymmetric DL sTRP and UL mTRP scenarios | CATT |
R1-2503817 | Enhancement for Asymmetric DL sTRP/UL mTRP Scenarios | Panasonic |
R1-2503826 | Discussion on enhancements for asymmetric DL sTRP/UL mTRP scenarios | CMCC |
R1-2503878 | Discussion on enhancement for asymmetric DL sTRP/UL mTRP scenarios | Xiaomi |
R1-2503915 | Enhancement for asymmetric DL sTRP/UL mTRP scenarios | Lenovo |
R1-2503929 | Discussion on enhancements for asymmetric DL sTRP and UL mTRP scenarios | NEC |
R1-2503978 | Remaining issues on asymmetric DL sTRP UL mTRP scenarios | Ericsson |
R1-2503986 | Discussions on asymmetric DL sTRP/UL mTRP scenarios | LG Electronics |
R1-2504063 | Enhancement for asymmetric DL sTRP/UL mTRP scenarios | Sony |
R1-2504079 | Enhancement for asymmetric DL sTRP/UL mTRP scenarios | Nokia |
R1-2504135 | Remaining issues in asymmetric UL MIMO operation | ETRI |
R1-2504173 | Discussion on enhancements for asymmetric DL sTRP/UL mTRP scenarios | Transsion Holdings |
R1-2504231 | Enhancements on asymmetric DL sTRP/UL mTRP scenarios | OPPO |
R1-2504298 | Discussion on enhancement for asymmetric DL sTRP and UL mTRP scenarios | |
R1-2504314 | Enhancements for asymmetric DL sTRP/UL mTRP scenarios | Apple |
R1-2504390 | Enhancement for asymmetric DL sTRP and UL mTRP deployment scenarios | Qualcomm Incorporated |
R1-2504458 | Enhancement for asymmetric DL sTRP/UL mTRP scenarios | Sharp |
R1-2504462 | Discussion on asymmetric DL sTRP/UL mTRP scenarios | TCL |
R1-2504463 | Discussion on asymmetric DL sTRP/UL mTRP scenarios | TCL |
R1-2504497 | Discussion on enhancement for asymmetric DL sTRP/UL mTRP scenarios | NTT DOCOMO, INC. |
R1-2504655 | Summary #1 on Rel-19 asymmetric DL sTRP/UL mTRP | Moderator (OPPO) |
R1-2504656 | Summary #2 on Rel-19 asymmetric DL sTRP/UL mTRP | Moderator (OPPO) |
TDoc | Title | Source |
---|---|---|
R1-2503266 | Higher layer parameters for Rel-19 SBFD | Huawei, HiSilicon |
TDoc | Title | Source |
---|---|---|
R1-2503261 | On subband full duplex design | Huawei, HiSilicon |
R1-2503327 | Discussion on transmission, reception and measurement procedures for SBFD operation | ZTE Corporation, Sanechips |
R1-2503355 | Remaining issues on Rel-19 SBFD operation | vivo |
R1-2503415 | Discussion on subband non-overlapping full duplex Tx-Rx and measurement operations | NEC |
R1-2503424 | Discussion on SBFD TX/RX/measurement procedures | LG Electronics |
R1-2503441 | Discussion on SBFD TX/RX/measurement procedures | MediaTek Inc. |
R1-2503512 | Discussion on SBFD TX/RX/measurement procedures | Spreadtrum, UNISOC |
R1-2503563 | SBFD operation and procedures | Samsung |
R1-2503623 | Discussion on SBFD TX/RX/measurement procedures | InterDigital, Inc. |
R1-2503629 | Discussion on SBFD TX/RX/measurement procedures | TCL |
R1-2503706 | Discussion for SBFD TX/RX/ measurement procedures | Tejas Network Limited |
R1-2503731 | Discussion on SBFD TX/RX/measurement procedures | Ofinno |
R1-2503759 | Discussion on SBFD Tx/Rx/measurement procedures | Fraunhofer HHI, Fraunhofer IIS |
R1-2503790 | Discussion on SBFD TX/RX/measurement procedures | CATT |
R1-2503827 | Discussion on SBFD TX/RX/measurement procedures | CMCC |
R1-2503879 | Discussion on reception and transmission procedure for SBFD operation | Xiaomi |
R1-2503970 | Discussion on SBFD TX/RX/measurement procedures | Kookmin University |
R1-2504009 | Discussion on SBFD TX/RX/measurement procedures | Panasonic |
R1-2504044 | Remaining issues on SBFD TX/RX/measurement procedures | China Telecom |
R1-2504086 | Discussion on SBFD Tx/Rx/measurement procedures | Fujitsu |
R1-2504097 | Discussion on SBFD TX/RX/measurement procedures | HONOR |
R1-2504121 | On SBFD TX/RX/measurement procedures | Nokia, Nokia Shanghai Bell |
R1-2504136 | Discussion on SBFD TX/RX/measurement procedures | ETRI |
R1-2504174 | Discussion on SBFD operation | Transsion Holdings |
R1-2504209 | Discussion on SBFD Tx/Rx/measurement procedures | OPPO |
R1-2504286 | SBFD TX/RX Measurement Procedures | Lenovo |
R1-2504289 | Discussion on SBFD Tx/Rx/measurement procedures | Charter Communications, Inc |
R1-2504315 | Remaining issues on SBFD TX/RX/measurement procedures | Apple |
R1-2504391 | SBFD Transmission, Reception and Measurement Procedures | Qualcomm Incorporated |
R1-2504478 | SBFD Tx/Rx/measurement aspects | Sharp |
R1-2504498 | Discussion on SBFD TX/RX/measurement procedures | NTT DOCOMO, INC. |
R1-2504536 | Discussion on SBFD TX/RX/measurement procedures | ITRI, Acer Incorporated |
R1-2504559 | Partial PRG handling for SBFD | ASUSTeK |
R1-2504582 | Discussion on SBFD TX/RX/measurement procedures | Google Korea LLC |
R1-2504593 | Summary #1 of SBFD TX/RX/measurement procedures | Moderator (Xiaomi) |
R1-2504594 | Summary #2 of SBFD TX/RX/measurement procedures | Moderator (Xiaomi) |
R1-2504598 | Discussion on SBFD TX/RX/measurement procedures | CEWiT |
R1-2504609 | SBFD TX/RX/measurement procedures | Ericsson |
R1-2504615 | Discussion on SBFD TX/RX/measurement procedures | WILUS Inc. |
R1-2504626 | SBFD procedures | Sony |
R1-2504857 | Draft reply LS on simultaneous configuration of SBFD and DC | Xiaomi |
R1-2504858 | Reply LS on simultaneous configuration of SBFD and DC | RAN1, Xiaomi |
TDoc | Title | Source |
---|---|---|
R1-2503262 | On subband full duplex random access operation | Huawei, HiSilicon |
R1-2503328 | Discussion on SBFD random access operation | ZTE Corporation, Sanechips |
R1-2503356 | Remaining issues on random access for Rel-19 SBFD | vivo |
R1-2503425 | Discussion on SBFD random access operation | LG Electronics |
R1-2503442 | Discussion on SBFD Random Access Operation | MediaTek Inc. |
R1-2503513 | Discussion on SBFD random access operation | Spreadtrum, UNISOC |
R1-2503564 | Random access on SBFD resources | Samsung |
R1-2503624 | Discussion on SBFD random access operation | InterDigital, Inc. |
R1-2503626 | Discussion on SBFD random access operation | Korea Testing Laboratory |
R1-2503630 | Discussion on SBFD random access operation | TCL |
R1-2503707 | Discussion on SBFD Random Access Operation | Tejas Network Limited |
R1-2503732 | Discussion on SBFD random access operation | Ofinno |
R1-2503791 | Discussion on SBFD random access operation | CATT |
R1-2503828 | Discussion on SBFD random access operation | CMCC |
R1-2503880 | Discussion on SBFD random access operation | Xiaomi |
R1-2503936 | CLI Handling for NR duplex operation | NEC |
R1-2503971 | Discussion on SBFD random access operation | Kookmin University |
R1-2504010 | Discussion on SBFD random access operation | Panasonic |
R1-2504045 | Discussion on SBFD random access operation | China Telecom |
R1-2504087 | Discussion on SBFD random access operation | Fujitsu |
R1-2504106 | SBFD random access operation | Lenovo |
R1-2504118 | Discussion on SBFD random access operation | Hyundai Motor Company |
R1-2504122 | SBFD random access operation | Nokia, Nokia Shanghai Bell |
R1-2504137 | SBFD random access operation | ETRI |
R1-2504175 | Discussion on SBFD random access operation | Transsion Holdings |
R1-2504210 | Discussion on SBFD random access operation | OPPO |
R1-2504316 | Views on SBFD random access operation | Apple |
R1-2504392 | SBFD Random Access Operation | Qualcomm Incorporated |
R1-2504479 | SBFD Random Access Aspects | Sharp |
R1-2504499 | Discussion on SBFD random access operation | NTT DOCOMO, INC. |
R1-2504537 | Discussion on SBFD random access operation | ITRI, Acer Incorporated |
R1-2504590 | On SBFD random access operation | Google Ireland Limited |
R1-2504610 | SBFD Random access operation | Ericsson |
R1-2504616 | Discussion on SBFD random access operation | WILUS Inc. |
R1-2504627 | SBFD RACH operations | Sony |
R1-2504708 | Summary#1 on SBFD random access operation | Moderator (CMCC) |
R1-2504709 | Summary#2 on SBFD random access operation | Moderator (CMCC) |
TDoc | Title | Source |
---|---|---|
R1-2503263 | On cross-link interference handling for subband full duplex | Huawei, HiSilicon |
R1-2503329 | Discussion on CLI handling for Rel-19 duplex operation | ZTE Corporation, Sanechips |
R1-2503357 | Remaining issues on CLI handling for Rel-19 NR duplex | vivo |
R1-2503426 | Discussion on CLI handling | LG Electronics |
R1-2503443 | Discussion on CLI Handling in SBFD System | MediaTek Inc. |
R1-2503514 | Discussion on CLI handling | Spreadtrum, UNISOC |
R1-2503565 | Cross-link interference handling for SBFD | Samsung |
R1-2503625 | Discussion on CLI handling for SBFD operation | InterDigital, Inc. |
R1-2503708 | Discussion on gNB-gNB CLI handling | Tejas Network Limited |
R1-2503733 | Discussion on CLI handling | Ofinno |
R1-2503792 | Discussion on CLI handling for NR duplex evolution | CATT |
R1-2503829 | Discussion on CLI handling | CMCC |
R1-2503881 | Discussion on CLI handling for SBFD operation | Xiaomi |
R1-2503937 | Discussion on random access for subband non-overlapping full duplex | NEC |
R1-2504023 | Discussion on CLI handling | Panasonic |
R1-2504123 | Cross-link interference handling for duplex evolution | Nokia, Nokia Shanghai Bell |
R1-2504138 | Discussion on CLI handling for SBFD operation | ETRI |
R1-2504211 | CLI handling in NR duplex operation | OPPO |
R1-2504317 | Remaining issues on CLI handling | Apple |
R1-2504375 | Cross-link interference (CLI) handling | Sharp |
R1-2504393 | Enhancements for CLI handling | Qualcomm Incorporated |
R1-2504500 | Discussion on CLI handling | NTT DOCOMO, INC. |
R1-2504591 | On CLI handling for SBFD operation | Google Ireland Limited |
R1-2504599 | Discussion on CLI Handling | CEWiT |
R1-2504611 | SBFD CLI handling | Ericsson |
R1-2504628 | SBFD CLI handling | Sony |
R1-2504798 | Summary #1 of CLI handling | Moderator (Huawei) |
R1-2504799 | Summary #2 of CLI handling | Moderator (Huawei) |
TDoc | Title | Source |
---|---|---|
R1-2503830 | TP for A-IoT physical layer functions for TS 38.300 | CMCC, Huawei, HiSilicon |
R1-2504894 | Session notes for 9.4 (Solutions for Ambient IoT (Internet of Things) in NR) | Ad-Hoc Chair (Huawei) |
R1-2504914 | Draft LS on Ambient IoT R2D control information | CMCC |
R1-2504915 | LS on Ambient IoT R2D control information | RAN1, CMCC |
R1-2504920 | Summary for TP for TS 38.300 PHY function | Moderator (CMCC) |
R1-2504923 | Draft LS on Ambient IoT Stage-2 TP | CMCC |
R1-2504924 | LS on Ambient IoT Stage-2 TP | RAN1, CMCC |
R1-2504961 | Summary of email discussion [Post-121-Rel19-38.291-Ambient_IoT_Solutions] | Moderator (Huawei) |
R1-2504962 | TS 38.291, v0.2.0 on Ambient IoT Physical layer | Editor (Huawei) |
TDoc | Title | Source |
---|---|---|
R1-2503220 | Modulation aspects for Ambient IoT | Ericsson |
R1-2503224 | Discussion on modulation aspects for A-IoT physical channel | FUTUREWEI |
R1-2503294 | Physical channels design on modulation | Huawei, HiSilicon |
R1-2503299 | AIoT Physical channels design - modulation aspects | Nokia |
R1-2503311 | Discussion on Ambient IoT modulation | ZTE Corporation, Sanechips |
R1-2503358 | Remaining issues on Modulation Aspects of Physical Channels Design | vivo |
R1-2503515 | Discussion on modulation aspects of physical channels design for Ambient IoT | Spreadtrum, UNISOC |
R1-2503536 | Discussion on modulation aspects for Ambient IoT physical design | TCL |
R1-2503566 | Views on Physical channels design – modulation aspects | Samsung |
R1-2503703 | Discussion on modulation aspects for A-IoT physical channel | Tejas Network Limited |
R1-2503725 | Discussion on Physical Channel Design and Modulation Aspects for Ambient-IoT | EURECOM |
R1-2503734 | Views on Physical channels design – modulation aspects for AIoT | Ofinno |
R1-2503793 | Ambient IoT physical channel design and modulation | CATT |
R1-2503831 | Discussion on modulation aspects of physical channel design | CMCC |
R1-2503882 | Discussion on modulation aspects for Ambient IoT | Xiaomi |
R1-2503924 | Discussion on modulation aspects of ambient IoT | NEC |
R1-2504007 | A-IoT Physical Channels Design on Modulation Aspects | Panasonic |
R1-2504046 | Discussion on physical channels design about modulation aspects for Ambient IoT | China Telecom |
R1-2504088 | Modulation for R2D | Fujitsu |
R1-2504098 | Discussion on Physical channels design for Ambient IoT-modulation aspects | HONOR |
R1-2504205 | Discussion on modulation aspects of A-IoT | OPPO |
R1-2504243 | A-IoT PHY layer design - waveform and modulation aspects | LG Electronics |
R1-2504287 | Remaining issues on modulation aspects for Ambient IoT | InterDigital, Inc. |
R1-2504318 | On remaining modulation aspects for Ambient IoT | Apple |
R1-2504394 | Physical channels design – modulation aspects | Qualcomm Incorporated |
R1-2504433 | Discussion on modulation aspects | Sharp |
R1-2504482 | Discussion on Modulation Aspects for Ambient IoT | Indian Institute of Tech (M) |
R1-2504501 | Discussion on modulation aspects of physical channel design for Ambient IoT | NTT DOCOMO, INC. |
R1-2504585 | Discussion on physical channels design for A-IoT | China Unicom |
R1-2504617 | Discussion on modulation aspects of physical channels design for Ambient IoT | WILUS Inc. |
R1-2504633 | Discussion on modulation related aspects of AIoT | IIT Kanpur |
R1-2504710 | FL summary #1 for Ambient IoT: “9.4.1 Physical channels design – modulation aspects” | Moderator (Huawei) |
R1-2504711 | FL summary #2 for Ambient IoT: “9.4.1 Physical channels design – modulation aspects” | Moderator (Huawei) |
R1-2504712 | FL summary #3 for Ambient IoT: “9.4.1 Physical channels design – modulation aspects” | Moderator (Huawei) |
R1-2504714 | On remaining modulation aspects for Ambient IoT | Apple |
TDoc | Title | Source |
---|---|---|
R1-2503221 | Coding aspects for Ambient IoT | Ericsson |
R1-2503225 | Coding aspects for A-IoT physical channel | FUTUREWEI |
R1-2503295 | Physical channel design on channel coding | Huawei, HiSilicon |
R1-2503300 | AIoT Physical channels design - line coding, FEC, CRC, repetition aspects | Nokia |
R1-2503312 | Discussion on Ambient IoTcoding and SFS | ZTE Corporation, Sanechips |
R1-2503359 | Remaining issues on line coding, FEC, CRC and repetition for A-IoT | vivo |
R1-2503516 | Discussion on line coding, FEC, CRC, repetition aspects for Ambient IoT | Spreadtrum, UNISOC |
R1-2503537 | Discussion on other aspects for Ambient IoT physical design | TCL |
R1-2503567 | Views on Physical channels design – line coding, FEC, CRC, repetition aspects | Samsung |
R1-2503618 | Discussion on Physical Channel Designs for A-IoT | Panasonic |
R1-2503794 | Ambient IoT channel coding and small frequency shift | CATT |
R1-2503832 | Discussion on coding aspects of physical channel design | CMCC |
R1-2503883 | Discussion on line coding, FEC, CRC and repetition aspects for Ambient IoT | Xiaomi |
R1-2503925 | Physical layer design – line coding, FEC, CRC, repetition aspects | NEC |
R1-2504047 | Discussion on physical channels design about line coding, FEC, CRC, repetition aspects for Ambient IoT | China Telecom |
R1-2504089 | Discussion on coding aspects | Fujitsu |
R1-2504099 | Discussion on Physical channels design for Ambient IoT-other aspects | HONOR |
R1-2504206 | Discussion on physical channels design for A-IoT | OPPO |
R1-2504244 | A-IoT PHY layer design - line coding, FEC, CRC and repetition aspects | LG Electronics |
R1-2504261 | A-IoT - PHY line coding, FEC, CRC, repetition aspects | MediaTek Inc. |
R1-2504288 | Remaining issues on coding aspects for Ambient IoT | InterDigital, Inc. |
R1-2504319 | On remaining coding aspects for Ambient IoT | Apple |
R1-2504395 | Physical channels design – line coding, FEC, CRC, repetition aspects | Qualcomm Incorporated |
R1-2504434 | Discussion on coding aspects | Sharp |
R1-2504474 | Discussion on A-IoT Physical channels design | ASUSTeK |
R1-2504502 | Discussion on coding and CRC aspects of physical channel design for Ambient IoT | NTT DOCOMO, INC. |
R1-2504634 | Discussion on other aspects of Phy design for AIoT | IIT Kanpur |
R1-2504749 | Summary #1 for coding aspects of physical channel design | Moderator (CMCC) |
R1-2504750 | Summary #2 for coding aspects of physical channel design | Moderator (CMCC) |
R1-2504751 | Summary #3 for coding aspects of physical channel design | Moderator (CMCC) |
R1-2504752 | Summary #4 for coding aspects of physical channel design | Moderator (CMCC) |
TDoc | Title | Source |
---|---|---|
R1-2503222 | Timing acquisition and synchronization for Ambient IoT | Ericsson |
R1-2503226 | Discussion on timing acquisition and synchronization aspects for A-IoT | FUTUREWEI |
R1-2503296 | Physical signals design | Huawei, HiSilicon |
R1-2503301 | AIoT Timing acquisition and synchronization | Nokia |
R1-2503313 | Discussion on Ambient IoT signals | ZTE Corporation, Sanechips |
R1-2503360 | Remaining issues on Timing acquisition and synchronization for AIoT | vivo |
R1-2503420 | Discussion on timing acquisition and synchronization | NEC |
R1-2503517 | Discussion on timing acquisition and synchronization for Ambient IoT | Spreadtrum, UNISOC |
R1-2503538 | Discussion on timing acquisition and synchronization functionalities for Ambient IoT | TCL |
R1-2503568 | Views on timing acquisition and synchronization | Samsung |
R1-2503610 | Discussion on timing acquisition and synchronization | InterDigital, Inc. |
R1-2503660 | Discussion on timing acquisition and synchronization for Ambient IoT | Lenovo |
R1-2503704 | Discussion on timing acquisition and synchronization of A-IoT | Tejas Network Limited |
R1-2503715 | Discussion on timing acquisition and synchronisation for Ambient IoT | Lekha Wireless Solutions |
R1-2503735 | Views on Timing acquisition and synchronization | Ofinno |
R1-2503795 | Ambient IoT Timing and synchronization | CATT |
R1-2503833 | Discussion on timing acquisition and synchronization | CMCC |
R1-2503884 | Discussion on timing acquisition and synchronization for Ambient IoT | Xiaomi |
R1-2504008 | A-IoT Timing acquisition and synchronization | Panasonic |
R1-2504048 | Discussion on timing acquisition and synchronization for Ambient IoT | China Telecom |
R1-2504090 | Discussion on timing acquisition and synchronization | Fujitsu |
R1-2504111 | Discussion on timing acquisition and synchronization for Ambient-IOT | Fraunhofer IIS, Fraunhofer HHI |
R1-2504139 | Discussion on timing acquisition and synchronization | ETRI |
R1-2504207 | Discussion on timing acquisition and synchronization for A-IoT | OPPO |
R1-2504245 | Timing acquisition and synchronization for A-IoT | LG Electronics |
R1-2504320 | On remaining timing acquisition & synchronization aspects for Ambient IoT | Apple |
R1-2504322 | FL Summary#1 on timing acquisition and synchronization for Ambient IoT | Moderator (Apple) |
R1-2504323 | FL Summary#2 on timing acquisition and synchronization for Ambient IoT | Moderator (Apple) |
R1-2504324 | FL Summary#3 on timing acquisition and synchronization for Ambient IoT | Moderator (Apple) |
R1-2504396 | Timing acquisition and synchronization | Qualcomm Incorporated |
R1-2504435 | Discussion on timing acquisition and synchronization | Sharp |
R1-2504483 | Discussion on Timing acquisition and synchronization for Ambient IoT | Indian Institute of Tech (M) |
R1-2504503 | Discussion on timing acquisition and synchronization for Ambient IoT | NTT DOCOMO, INC. |
R1-2504600 | Discussion on timing acquisition and synchronization aspects for Ambient IoT | CEWiT |
R1-2504635 | Discussion on timing and synchronization aspects for AIoT | IIT Kanpur |
R1-2504716 | Discussion on Ambient IoT signals | ZTE Corporation, Sanechips |
R1-2504863 | FL Summary#4 on timing acquisition and synchronization for Ambient IoT | Moderator (Apple) |
R1-2504864 | FL Summary#5 on timing acquisition and synchronization for Ambient IoT | Moderator (Apple) |
TDoc | Title | Source |
---|---|---|
R1-2503223 | Other aspects for Ambient IoT | Ericsson |
R1-2503227 | Multiple access, scheduling and timing aspects for A-IoT | FUTUREWEI |
R1-2503297 | Multiplexing, scheduling, and other physical-layer procedures | Huawei, HiSilicon |
R1-2503302 | AIoT Other aspects incl. multiplexing/multiple access, scheduling information, and timing relationships | Nokia |
R1-2503314 | Discussion on Ambient IoT multiple access and timing | ZTE Corporation, Sanechips |
R1-2503361 | Remaining issues on other aspects for Rel-19 Ambient IoT | vivo |
R1-2503362 | FL summary #1 on other aspects for Rel-19 Ambient IoT | Moderator (vivo) |
R1-2503363 | FL summary #2 on other aspects for Rel-19 Ambient IoT | Moderator (vivo) |
R1-2503364 | FL summary #3 on other aspects for Rel-19 Ambient IoT | Moderator (vivo) |
R1-2503518 | Discussion on other aspects for Ambient IoT | Spreadtrum, UNISOC |
R1-2503569 | Views on aspects including multiplexing/multiple access, scheduling information, and timing relationships | Samsung |
R1-2503611 | Discussion on multiplexing/multiple access, scheduling information, and timing relationships | InterDigital, Inc. |
R1-2503619 | Discussion on other aspects of A-IoT | Panasonic |
R1-2503661 | Discussion on multiple access, scheduling and timing aspects of Ambient IoT | Lenovo |
R1-2503705 | Discussion on multiple access, scheduling and timing aspects for A-IoT | Tejas Network Limited |
R1-2503736 | Views on other aspects for AIoT | Ofinno |
R1-2503796 | Ambient IoT frame structure, system control and resource allocation | CATT |
R1-2503834 | Discussion on access, scheduling and timing relationships | CMCC |
R1-2503885 | Discussion on other aspects for Ambient IoT | Xiaomi |
R1-2503926 | Discussion on control and other aspects of ambient IoT | NEC |
R1-2504049 | Discussion on other aspects for Ambient IoT | China Telecom |
R1-2504064 | Multiple access and timing relationships for Ambient IoT | Sony |
R1-2504091 | Discussion on other aspects of Ambient IoT | Fujitsu |
R1-2504100 | Discussion on L1 control information and L1 procedural aspects | HONOR |
R1-2504140 | Discussion on other aspects for Ambient IoT | ETRI |
R1-2504208 | Discussions on other aspects of A-IoT communication | OPPO |
R1-2504246 | Other aspects for A-IoT | LG Electronics |
R1-2504299 | Discussion on multiplexing, multiple access, scheduling information, and timing relationships | |
R1-2504321 | On remaining multiple access, scheduling and control aspects for Ambient IoT | Apple |
R1-2504397 | Discussion on other aspects for Rel-19 Ambient IoT | Qualcomm Incorporated |
R1-2504436 | Discussion on other aspects | Sharp |
R1-2504475 | Discussion on control information and procedural aspects | ASUSTeK |
R1-2504504 | Discussion on other aspects for Ambient IoT | NTT DOCOMO, INC. |
R1-2504542 | Discussion on other aspects of Ambient IoT | KT Corp. |
R1-2504589 | Discussion on multiple access, scheduling information and timing relationships for Ambient IoT | TCL |
R1-2504601 | Discussion on multiple access, scheduling and timing aspects for Ambient IoT | CEWiT |
R1-2504618 | Discussion on multiplexing/multiple access and timing relationships for Ambient IoT | WILUS Inc. |
R1-2504821 | FL summary #4 on other aspects for Rel-19 Ambient IoT | Moderator (vivo) |
R1-2504822 | FL summary #5 on other aspects for Rel-19 Ambient IoT | Moderator (vivo) |
TDoc | Title | Source |
---|---|---|
R1-2504014 | Update of RAN1 RRC parameter list for R19 NES WI | Rapporteur(Ericsson) |
R1-2504938 | List of RAN1 agreements for Rel-19 NES WI | Rapporteur (Ericsson) |
TDoc | Title | Source |
---|---|---|
R1-2503233 | Discussion of on-demand SSB Scell operation | FUTUREWEI |
R1-2503267 | On-demand SSB SCell operation for eNES | Huawei, HiSilicon |
R1-2503315 | Discussion on on-demond SSB for NES | ZTE Corporation, Sanechips |
R1-2503365 | Remaining issues on-demand SSB Scell operation | vivo |
R1-2503412 | On-demand SSB SCell Operation | Nokia, Nokia Shanghai Bell |
R1-2503416 | Discussion on on-demand SSB for SCell operation | NEC |
R1-2503519 | Discussion on on-demand SSB SCell operation | Spreadtrum, UNISOC |
R1-2503539 | On-demand SSB Scell operation for NES | TCL |
R1-2503570 | On-demand SSB SCell operation | Samsung |
R1-2503718 | OD-SSB for SCELL operation | Tejas Network Limited |
R1-2503737 | Discussion on on-demand SSB SCell operation | Ofinno |
R1-2503797 | Discussion on on-demand SSB SCell operation | CATT |
R1-2503835 | Discussion on on-demand SSB SCell operation | CMCC |
R1-2503886 | Discussion on on-demand SSB SCell operation | Xiaomi |
R1-2503972 | Discussion on on-demand SSB SCell operation | InterDigital, Inc. |
R1-2504015 | On-demand SSB SCell operation | Ericsson |
R1-2504030 | On-demand SSB SCell Operation | |
R1-2504037 | Discussion on on-demand SSB SCell operation | KT Corp. |
R1-2504050 | Discussion on on-demand SSB operation for SCell | China Telecom |
R1-2504075 | Discussion on remaining details of on-demand SSB operation on SCell | Sharp |
R1-2504092 | Discussion on on-demand SSB SCell operation | Fujitsu |
R1-2504107 | On-demand SSB SCell operation | Lenovo |
R1-2504141 | Discussion on On-demand SSB SCell operation | ETRI |
R1-2504176 | Discussion on On-Demand SSB SCell operation | Transsion Holdings |
R1-2504192 | Discussion on the enhancement to support on demand SSB SCell operation | OPPO |
R1-2504235 | Discussion on on-demand SSB SCell operation | Panasonic |
R1-2504247 | On-demand SSB SCell operation | LG Electronics |
R1-2504262 | On-demand SSB SCell operation | MediaTek Inc. |
R1-2504325 | On-demand SSB SCell Operation | Apple |
R1-2504398 | On-demand SSB operation for Scell | Qualcomm Incorporated |
R1-2504505 | Discussion on on-demand SSB SCell operation | NTT DOCOMO, INC. |
R1-2504538 | Discussion on on-demand SSB SCell operation | ITRI |
R1-2504554 | Discussion on on-demand SSB SCell operation | KDDI Corporation |
R1-2504558 | DCI based signaling for on-demand SSB | ASUSTeK |
R1-2504602 | Discussion on on-demand SSB Scell operation | CEWiT |
R1-2504744 | Summary #1 of on-demand SSB for NES | Moderator (LG Electronics) |
R1-2504745 | Summary #2 of on-demand SSB for NES | Moderator (LG Electronics) |
R1-2504746 | Summary #3 of on-demand SSB for NES | Moderator (LG Electronics) |
R1-2504747 | Summary #4 of on-demand SSB for NES | Moderator (LG Electronics) |
TDoc | Title | Source |
---|---|---|
R1-2503234 | Discussion of on-demand SIB1 for idle/inactive mode UEs | FUTUREWEI |
R1-2503268 | Discussion on on-demand SIB1 for eNES | Huawei, HiSilicon |
R1-2503316 | Discussion on on-demand SIB1 for NES | ZTE Corporation, Sanechips |
R1-2503366 | Remaining issues on-demand SIB1 for idle/inactive mode UEs | vivo |
R1-2503413 | On-demand SIB1 for Idle/Inactive mode UEs | Nokia, Nokia Shanghai Bell |
R1-2503417 | Discussion on on-demand SIB1 for UEs in idle/inactive mode | NEC |
R1-2503520 | Discussion on on-demand SIB1 for idle/inactive mode UEs | Spreadtrum, UNISOC |
R1-2503571 | On-demand SIB1 for idle/inactive mode UEs | Samsung |
R1-2503717 | OD-SIB1 for idle/inactive UEs | Tejas Network Limited |
R1-2503738 | Discussion on on-demand SIB1 for idle/inactive mode UEs | Ofinno |
R1-2503798 | Discussion on on-demand SIB1 | CATT |
R1-2503836 | Discussion on on-demand SIB1 for UEs in idle/inactive mode | CMCC |
R1-2503887 | Discussion on on-demand SIB1 for idle/inactive mode UEs | Xiaomi |
R1-2503973 | Discussion on on-demand SIB1 for idle/inactive mode UEs | InterDigital, Inc. |
R1-2503999 | Discussion on on-demand SIB1 transmission for network energy savings | Fujitsu |
R1-2504016 | On-demand SIB1 for UEs in idle/inactive mode for NES | Ericsson |
R1-2504031 | On-demand SIB1 for Idle/Inactive Mode UE | |
R1-2504051 | Discussion on on-demand SIB1 for idle/inactive mode UEs | China Telecom |
R1-2504065 | On-demand SIB1 for idle/inactive mode UEs | Sony |
R1-2504108 | On-demand SIB1 for idle/inactive mode UEs | Lenovo |
R1-2504142 | On-demand SIB1 for idle/inactive mode UEs | ETRI |
R1-2504177 | Discussion on on-demand SIB1 transmission for idle/inactive mode UEs | Transsion Holdings |
R1-2504193 | Discussion on the enhancement to support on demand SIB1 for idle/inactive mode UE | OPPO |
R1-2504236 | Discussion on on-demand SIB1 for idle/inactive mode UEs | Panasonic |
R1-2504248 | On-demand SIB1 for idle/inactive mode UEs | LG Electronics |
R1-2504263 | On-demand SIB1 for idle or inactive mode UEs | MediaTek Inc. |
R1-2504326 | On On-demand SIB1 for IDLE/INACTIVE mode UEs | Apple |
R1-2504399 | On-demand SIB1 procedure | Qualcomm Incorporated |
R1-2504457 | Discussion on on-demand SIB1 for idle/inactive mode UEs | DENSO CORPORATION |
R1-2504467 | Discussion on on-demand SIB1 transmission for idle UEs | Sharp |
R1-2504506 | Discussion on on-demand SIB1 for idle/inactive mode UEs | NTT DOCOMO, INC. |
R1-2504556 | Discussion on on-demand SIB1 in idle/inactive mode | CAICT |
R1-2504603 | Discussion on on-demand SIB1 | CEWiT |
R1-2504679 | FL summary 1 for on-demand SIB1 in idle/inactive mode | Moderator (MediaTek) |
R1-2504680 | FL summary 2 for on-demand SIB1 in idle/inactive mode | Moderator (MediaTek) |
R1-2504681 | FL summary 3 for on-demand SIB1 in idle/inactive mode | Moderator (MediaTek) |
R1-2504682 | FL summary 4 for on-demand SIB1 in idle/inactive mode | Moderator (MediaTek) |
R1-2504683 | FL summary 5 for on-demand SIB1 in idle/inactive mode | Moderator (MediaTek) |
TDoc | Title | Source |
---|---|---|
R1-2503235 | Discussion of the adaptation of common signal/channel transmissions | FUTUREWEI |
R1-2503269 | On common channel/signal adaptation for eNES | Huawei, HiSilicon |
R1-2503317 | Discussion on common signal channel for NES | ZTE Corporation, Sanechips |
R1-2503367 | Remaining issues on adaptation of common signal/channel transmissions | vivo |
R1-2503414 | Adaptation of common signal/channel transmissions | Nokia, Nokia Shanghai Bell |
R1-2503418 | Discussion on adaptation of common signal/channel transmissions | NEC |
R1-2503521 | Discussion on adaptation of common signal/channel transmissions | Spreadtrum, UNISOC |
R1-2503572 | Adaptation of common signal/channel transmissions | Samsung |
R1-2503716 | Adaptation of common signals or channels | Tejas Network Limited |
R1-2503799 | Discussion on adaptation of common signal/channel transmissions | CATT |
R1-2503837 | Discussion on adaptation of common signal/channel transmissions | CMCC |
R1-2503867 | Discussion on adaptation of common signal/channel transmission | Panasonic |
R1-2503888 | Discussion on adaptation of common signal and channel transmissions | Xiaomi |
R1-2503974 | Discussion on adaptation of common signal/channel transmissions | InterDigital, Inc. |
R1-2504000 | Discussion on adaptation of common signal / channel transmissions | Fujitsu |
R1-2504017 | Adaptation of common signal/channel transmissions for NES | Ericsson |
R1-2504032 | Adaptation of Common Signals | |
R1-2504038 | Discussion on adaptation of common signal/channel transmissions | KT Corp. |
R1-2504052 | Discussion on common signal/channel adaptation | China Telecom |
R1-2504101 | Discussion on adaptation of common signal channel transmissions | HONOR |
R1-2504143 | Adaptation of common signal/channel transmissions | ETRI |
R1-2504178 | Discussion on adaptive transmission of common signal or common channel | Transsion Holdings |
R1-2504194 | Discussion on adaptation of common signal/channel transmission | OPPO |
R1-2504249 | Adaptation of common signal/channel transmissions | LG Electronics |
R1-2504264 | Adaptation of common signal/channel transmissions | MediaTek Inc. |
R1-2504327 | On adaptation of common signal/channel for NES enhancements | Apple |
R1-2504400 | Adaptation of common channel transmissions | Qualcomm Incorporated |
R1-2504468 | Discussion on adaptation of common signal/channel transmissions | Sharp |
R1-2504507 | Discussion on adaptation of common signal/channel transmissions | NTT DOCOMO, INC. |
R1-2504547 | Adaptation of common signals and channels | Lenovo |
R1-2504604 | Discussion on adaptation of common signal and channel transmissions | CEWiT |
R1-2504757 | Summary#1 of AI 9.5.3 for R19 NES | Moderator (Ericsson) |
R1-2504758 | Summary#2 of AI 9.5.3 for R19 NES | Moderator (Ericsson) |
R1-2504890 | Summary#3 of AI 9.5.3 for R19 NES | Moderator (Ericsson) |
R1-2504937 | Final Summary of AI 9.5.3 for R19 NES | Moderator (Ericsson) |
TDoc | Title | Source |
---|---|---|
R1-2503368 | Updated RRC parameters for Rel-19 LP-WUS/WUR | vivo |
R1-2504909 | Summary of RAN1 agreements on LP-WUS/WUR for NR | Rapporteur (vivo) |
R1-2504956 | Summary of discussion on RRC parameters for Rel-19 LP-WUS/WUR | vivo (WI rapporteur) |
R1-2505068 | Discussion on Draft 38.300 TP for Rel-19 LP-WUS/WUR WI | vivo (WI rapporteur) |
R1-2505069 | TS38.300 TP for Rel-19 LP-WUS/WUR WI | vivo (WI rapporteur) |
R1-2505070 | LS on TP to TS38.300 for Rel-19 LP-WUS/WUR | RAN1, vivo |
TDoc | Title | Source |
---|---|---|
R1-2503228 | Remaining Issues on LP-WUS and LP-SS Design | FUTUREWEI |
R1-2503290 | Signal Design of LP-WUS and LP-SS | Huawei, HiSilicon |
R1-2503318 | Discussion on LP-WUS design | ZTE Corporation, Sanechips |
R1-2503369 | Remaining issues on LP-WUS and LP-SS design | vivo |
R1-2503522 | Discussion on LP-WUS and LP-SS design | Spreadtrum, UNISOC |
R1-2503573 | Discussion on LP-WUS and LP-SS design | Samsung |
R1-2503631 | Discussion on LP-WUS and LP-SS Design | TCL |
R1-2503694 | LP-WUS and LP-SS design | Nokia |
R1-2503724 | Discussion on LP-WUS and LP-SS Design | EURECOM |
R1-2503800 | Design of LP-WUS and LP-SS | CATT |
R1-2503838 | Discussion on LP-WUS and LP-SS design | CMCC |
R1-2503889 | Discussion on LP-WUS and LP-SS design | Xiaomi |
R1-2503938 | Discussion on LP-WUS and LP-SS design | NEC |
R1-2503964 | Discussion on LP-WUS and LP-SS design | InterDigital, Inc. |
R1-2504018 | LP-WUS and LP-SS design | Ericsson |
R1-2504066 | LP-WUS and LP-SS design | Sony |
R1-2504102 | Discussion on LP-WUS and LP-SS design | HONOR |
R1-2504187 | Signal design for LP-WUS and LP-SS | OPPO |
R1-2504237 | Discussion on the LP-WUS and LP-SS design | Panasonic |
R1-2504250 | Discussion on LP-WUS and LP-SS design | LG Electronics |
R1-2504265 | LP-WUS and LP-SS design | MediaTek Inc. |
R1-2504328 | LP-WUS and LP-SS design | Apple |
R1-2504401 | LP-WUS and LP-SS design | Qualcomm Incorporated |
R1-2504437 | Discussion on LP-WUS and LP-SS design | Sharp |
R1-2504508 | Discussion on LP-WUS and LP-SS design | NTT DOCOMO, INC. |
R1-2504575 | On LP-WUS and LP-SS design | Nordic Semiconductor ASA |
R1-2504723 | Summary #1 of discussions on LP-WUS and LP-SS design | Moderator (vivo) |
R1-2504724 | Summary #2 of discussions on LP-WUS and LP-SS design | Moderator (vivo) |
R1-2504831 | Summary #3 of discussions on LP-WUS and LP-SS design | Moderator (vivo) |
R1-2504832 | Summary #4 of discussions on LP-WUS and LP-SS design | Moderator (vivo) |
R1-2504906 | Summary #5 of discussions on LP-WUS and LP-SS design | Moderator (vivo) |
R1-2504907 | Reply LS on LP-WUS UE RF | RAN1, vivo |
R1-2504908 | Final summary of discussions on LP-WUS and LP-SS design | Moderator (vivo) |
R1-2504943 | Reply LS on LP-WUS UE RF | RAN1, vivo |
TDoc | Title | Source |
---|---|---|
R1-2503229 | Remaining Issues on LP-WUS Operation in IDLE/INACTIVE Modes | FUTUREWEI |
R1-2503291 | Procedures and functionalities of LP-WUS in IDLE/INACTIVE mode | Huawei, HiSilicon |
R1-2503319 | Discussion on LP-WUS operation in IDLE/INACTIVE mode | ZTE Corporation, Sanechips |
R1-2503370 | Remaining issues on LP-WUS operation in IDLE/INACTIVE modes | vivo |
R1-2503523 | Discussion on LP-WUS operation in IDLE/INACTIVE modes | Spreadtrum, UNISOC |
R1-2503574 | Discussion on LP-WUS operation in IDLE/INACTIVE modes | Samsung |
R1-2503643 | Discussion on LP-WUS Operation in IDLE/INACTIVE modes | TCL |
R1-2503695 | LP-WUS operation in IDLE/Inactive mode | Nokia |
R1-2503801 | System design and procedure of LP-WUS operation for UE in IDLE/Inactive Modes | CATT |
R1-2503839 | Discussion on LP-WUS operation in IDLE/INACTIVE modes | CMCC |
R1-2503890 | Discussion on LP-WUS operation in Idle/Inactive modes | Xiaomi |
R1-2503939 | Discussion on LP-WUS operation in RRC IDLE/INACTIVE mode | NEC |
R1-2503965 | Discussion on LP-WUS operation in IDLE/INACTIVE modes | InterDigital, Inc. |
R1-2504019 | LP-WUS operation in IDLE and INACTIVE modes | Ericsson |
R1-2504067 | LP-WUS operation in IDLE / INACTIVE modes | Sony |
R1-2504144 | Discussion on LP-WUS operation in IDLE/INACTIVE modes | ETRI |
R1-2504188 | Further consideration on LP-WUS operation in RRC_IDLE/INACTIVE modes | OPPO |
R1-2504238 | Discussion on LP-WUS operation in IDLE/INACTIVE modes | Panasonic |
R1-2504251 | Discussion on LP-WUS operation in IDLE/INACTIVE modes | LG Electronics |
R1-2504266 | LP-WUS operation in IDLE/INACTIVE modes | MediaTek Inc. |
R1-2504329 | LP-WUS operation in IDLE/INACTIVE modes | Apple |
R1-2504331 | Summary #1 on LP-WUS operation in IDLE/INACTIVE mode | Moderator (Apple) |
R1-2504332 | Summary #2 on LP-WUS operation in IDLE/INACTIVE mode | Moderator (Apple) |
R1-2504333 | Summary #3 on LP-WUS operation in IDLE/INACTIVE mode | Moderator (Apple) |
R1-2504334 | Summary #4 on LP-WUS operation in IDLE/INACTIVE mode | Moderator (Apple) |
R1-2504335 | Summary #5 on LP-WUS operation in IDLE/INACTIVE mode | Moderator (Apple) |
R1-2504402 | LP-WUR operation in idle and inactive modes | Qualcomm Incorporated |
R1-2504438 | Discussion on LP-WUS operation in IDLE/INACTIVE modes | Sharp |
R1-2504509 | Discussion on LP-WUS operation in IDLE/INACTIVE modes | NTT DOCOMO, INC. |
R1-2504574 | On LP-WUS operation in IDLE/Inactive | Nordic Semiconductor ASA |
R1-2504891 | Summary #6 on LP-WUS operation in IDLE/INACTIVE mode | Moderator (Apple) |
R1-2504892 | Summary #7 on LP-WUS operation in IDLE/INACTIVE mode | Moderator (Apple) |
TDoc | Title | Source |
---|---|---|
R1-2503292 | Procedures and functionalities of LP-WUS in CONNECTED mode | Huawei, HiSilicon |
R1-2503320 | Discussion on LP-WUS operation in CONNECTED mode | ZTE Corporation, Sanechips |
R1-2503371 | Remaining issues on LP-WUS operation in CONNECTED modes | vivo |
R1-2503524 | Discussion on LP-WUS operation in CONNECTED modes | Spreadtrum, UNISOC |
R1-2503575 | Discussion on LP-WUS operation in CONNECTED modes | Samsung |
R1-2503696 | LP-WUS operation in CONNECTED mode | Nokia |
R1-2503748 | Discussion on LP-WUS operation in CONNECTED mode | Panasonic |
R1-2503802 | System design and procedure of LP-WUS operation for UE in CONNECTED Modes | CATT |
R1-2503840 | Discussion on LP-WUS operation in CONNECTED mode | CMCC |
R1-2503891 | Discussion on LP-WUS operation in Connected mode | Xiaomi |
R1-2503940 | Discussion on LP-WUS operation in RRC CONNECTED mode | NEC |
R1-2503966 | Discussion on RRC CONNECTED mode LP-WUS monitoring | InterDigital, Inc. |
R1-2504020 | LP-WUS operation in CONNECTED mode | Ericsson |
R1-2504145 | Discussion on LP-WUS operation in CONNECTED modes | ETRI |
R1-2504189 | Further consideration on LP-WUS operation in connected mode | OPPO |
R1-2504252 | Discussion on LP-WUS operation in CONNECTED modes | LG Electronics |
R1-2504267 | LP-WUS operation in CONNECTED modes | MediaTek Inc. |
R1-2504330 | LP-WUS operation in CONNECTED modes | Apple |
R1-2504403 | LP-WUR operation in connected mode | Qualcomm Incorporated |
R1-2504439 | Discussion on LP-WUS operation in CONNECTED modes | Sharp |
R1-2504510 | Discussion on LP-WUS operation in CONNECTED mode | NTT DOCOMO, INC. |
R1-2504588 | Discussion on LP-WUS procedures in Connected mode | TCL |
R1-2504713 | FL summary #1 on LP-WUS operation in CONNECTED mode | Moderator (NTT DOCOMO) |
R1-2504805 | FL summary #2 on LP-WUS operation in CONNECTED mode | Moderator (NTT DOCOMO) |
R1-2504833 | FL summary #3 on LP-WUS operation in CONNECTED mode | Moderator (NTT DOCOMO) |
R1-2504886 | FL summary #4 on LP-WUS operation in CONNECTED mode | Moderator (NTT DOCOMO) |
R1-2504887 | Draft reply LS on LP-WUS in RRC_CONNECTED | NTT DOCOMO |
R1-2504888 | Reply LS on LP-WUS in RRC_CONNECTED | RAN1, NTT DOCOMO |
R1-2504940 | Final summary on LP-WUS operation in CONNECTED mode | Moderator (NTT DOCOMO) |
TDoc | Title | Source |
---|---|---|
R1-2504160 | Draft CR for TR 38.901 to introduce channel model for ISAC | Xiaomi, AT&T |
R1-2504895 | Session notes for 9.7 (Study on channel modelling for Integrated Sensing And Communication for NR) | Ad-Hoc Chair (Huawei) |
R1-2504946 | Draft CR to introduce channel model for ISAC | Xiaomi, AT&T |
R1-2504947 | Summary on discussions on CR to 38.901 on ISAC CM | Moderator (Xiaomi) |
R1-2505006 | CR to introduce channel model for ISAC | Xiaomi, AT&T |
R1-2505007 | Summary#2 on discussions on CR to 38.901 on ISAC CM | Moderator (Xiaomi) |
TDoc | Title | Source |
---|---|---|
R1-2503247 | Deployment scenarios for ISAC channel model | Huawei, HiSilicon |
R1-2503372 | Views on Rel-19 ISAC deployment scenarios | vivo |
R1-2503445 | Discussion on ISAC deployment scenarios and requirements | EURECOM |
R1-2503576 | Discussion on ISAC deployment scenarios | Samsung |
R1-2503697 | Discussion on ISAC deployment scenarios | ZTE Corporation, Sanechips, CAICT |
R1-2503752 | Discussion on ISAC deployment scenarios | InterDigital, Inc. |
R1-2503760 | Discussion on ISAC Deployment Scenarios | SK Telecom |
R1-2503803 | Discussion on ISAC deployment scenarios | CATT, CICTCI |
R1-2503841 | Discussion on full calibration of ISAC channel model | CMCC |
R1-2503858 | Discussion on ISAC channel calibration | BUPT, CMCC, X-Net |
R1-2503892 | Scenario and calibration discussion for ISAC CM | Xiaomi |
R1-2503954 | Discussion on ISAC Deployment Scenarios | Nokia, Nokia Shanghai Bell |
R1-2503967 | Discussion on ISAC deployment scenarios | Tiami Networks |
R1-2503968 | Discussion on ISAC Channel Modeling | Tiami Networks |
R1-2503992 | Deployment scenarios for integrated sensing and communication with NR | NVIDIA |
R1-2504012 | Discussion on ISAC Deployment Scenarios | NIST |
R1-2504053 | Discussion on ISAC deployment scenarios | China Telecom |
R1-2504068 | Remaining issues on ISAC deployment scenarios | Sony |
R1-2504120 | Discussion on ISAC deployment scenarios | CALTTA |
R1-2504126 | Discussion on ISAC deployment scenarios | CALTTA |
R1-2504146 | Discussion on calibration results | ETRI |
R1-2504220 | Discussion on ISAC channel model calibration | OPPO |
R1-2504239 | Discussion on ISAC deployment scenarios | Lenovo |
R1-2504268 | Discussion on ISAC deployment scenario | MediaTek Inc. |
R1-2504336 | Discussion on ISAC deployment scenarios and Calibration | Apple |
R1-2504363 | FL Summary #1 on ISAC Scenarios and Calibrations | Moderator (AT&T) |
R1-2504364 | FL Summary #2 on ISAC Scenarios and Calibrations | Moderator (AT&T) |
R1-2504365 | FL Summary #3 on ISAC Scenarios and Calibrations | Moderator (AT&T) |
R1-2504366 | FL Summary #4 on ISAC Scenarios and Calibrations | Moderator (AT&T) |
R1-2504367 | ISAC scenarios and 7-24GHz alignment | AT&T, FirstNet |
R1-2504404 | Discussion on ISAC deployment scenarios | Qualcomm Incorporated |
R1-2504454 | Discussion on ISAC Deployment Scenarios | Ericsson |
R1-2504539 | Discussion of calibration for UAV sensing targets | ITRI, Tron Future Tech Inc. |
R1-2504566 | Discussion on ISAC deployment scenarios | LG Electronics |
R1-2504705 | Discussion on ISAC channel model calibration | NTT DOCOMO, INC. |
R1-2504950 | Initial ISAC calibration results | Moderator (AT&T) |
R1-2504951 | ISAC channel model calibration results | Moderator (AT&T) |
TDoc | Title | Source |
---|---|---|
R1-2503248 | Channel modelling for ISAC | Huawei, HiSilicon |
R1-2503373 | Views on Rel-19 ISAC channel modelling | vivo, BUPT |
R1-2503446 | Discussion on ISAC channel modeling | EURECOM |
R1-2503525 | Discussion on ISAC channel modeling | Spreadtrum, UNISOC |
R1-2503577 | Discussion on ISAC channel modelling | Samsung |
R1-2503646 | Discussion on ISAC channel modelling | Pengcheng Laboratory |
R1-2503698 | Discussion on channel modelling for ISAC | ZTE Corporation, Sanechips, CAICT |
R1-2503720 | Discussion on ISAC channel modelling | Tejas Network Limited |
R1-2503726 | Discussion on ISAC channel modelling | TOYOTA InfoTechnology Center |
R1-2503753 | Discussion on ISAC channel modeling | InterDigital, Inc. |
R1-2503755 | Discussion on channel modelling for ISAC | ZTE Corporation, Sanechips, CAICT |
R1-2503761 | Discussion on ISAC Channel Modeling | SK Telecom |
R1-2503804 | Discussion on ISAC channel modelling | CATT, CICTCI |
R1-2503842 | Discussion on ISAC channel modeling | CMCC |
R1-2503859 | ISAC Channel Modeling and Measurement Validation | BUPT, CMCC, VIVO, X-Net |
R1-2503893 | Discussion on ISAC channel model | Xiaomi, BJTU, BUPT |
R1-2503955 | Discussion on ISAC channel modeling | Nokia, Nokia Shanghai Bell |
R1-2503969 | Discussion on ISAC Channel Modeling | Tiami Networks |
R1-2503991 | Channel modelling for integrated sensing and communication with NR | NVIDIA |
R1-2504013 | Discussion on ISAC Channel Modeling | NIST |
R1-2504054 | Discussion on ISAC channel modelling | China Telecom |
R1-2504069 | Remaining issues on ISAC Channel Modeling | Sony |
R1-2504110 | Discussion on ISAC Channel Modelling | Panasonic |
R1-2504119 | Discussion on channel modelling for ISAC | CALTTA |
R1-2504159 | Discussion on ISAC channel modelling | Pengcheng Laboratory |
R1-2504161 | Summary #1 on ISAC channel modelling | Moderator (Xiaomi) |
R1-2504162 | Summary #2 on ISAC channel modelling | Moderator (Xiaomi) |
R1-2504163 | Summary #3 on ISAC channel modelling | Moderator (Xiaomi) |
R1-2504164 | Summary #4 on ISAC channel modelling | Moderator (Xiaomi) |
R1-2504165 | Summary #5 on ISAC channel modelling | Moderator (Xiaomi) |
R1-2504168 | Discussion on ISAC channel modelling | Pengcheng Laboratory |
R1-2504221 | Study on ISAC channel modelling | OPPO |
R1-2504240 | Discussion on Channel Modelling for ISAC | Lenovo |
R1-2504269 | Discussion on ISAC channel modelling | MediaTek Inc. |
R1-2504337 | Discussion on ISAC channel modelling | Apple |
R1-2504405 | Discussion on ISAC channel modelling | Qualcomm Incorporated |
R1-2504455 | Discussion on ISAC Channel Modelling | Ericsson |
R1-2504511 | Discussion on ISAC Channel Modelling | NTT DOCOMO, INC. |
R1-2504567 | Discussion on ISAC channel modelling | LG Electronics |
R1-2504706 | Discussion on channel modelling for ISAC | ZTE Corporation, Sanechips, CAICT |
R1-2504707 | Discussion on ISAC Channel Modelling | Ericsson |
R1-2504945 | Summary #6 on ISAC channel modelling | Moderator (Xiaomi) |
R1-2504948 | Information on validations for ISAC | Moderator (Xiaomi) |
TDoc | Title | Source |
---|---|---|
R1-2503605 | Draft CR for Rel-19 7-24GHz Channel model | Intel Corporation, ZTE Corporation |
R1-2503747 | LS to CTIA MOSG on TR38.901 updates | Spirent Communications, Keysight Technologies |
R1-2504688 | Draft CR for Rel-19 7-24GHz Channel model | Intel Corporation, ZTE Corporation |
R1-2504696 | Data source descriptions for 7 – 24 GHz SI | Moderator (Intel Corporation) |
R1-2504697 | Summary #1 of discussions for draft CR for 7-24 GHz SI | Moderator (Intel Corporation) |
R1-2504698 | Summary #2 of discussions for draft CR for 7-24 GHz SI | Moderator (Intel Corporation) |
R1-2504791 | Calibration Results for 7 – 24 GHz SI | Intel Corporation, ZTE Corporation |
R1-2504794 | LS to CTIA MOSG on TR38.901 updates | Spirent Communications, Keysight Technologies |
R1-2504847 | LS to CTIA MOSG on TR38.901 updates | Spirent Communications, Keysight Technologies |
R1-2504896 | Session notes for 9.8 (Study on channel modelling enhancements for 7-24GHz for NR) | Ad-Hoc Chair (CMCC) |
R1-2504941 | LS to CTIA MOSG on TR38.901 updates | Spirent Communications, Keysight Technologies |
R1-2504960 | Data source descriptions for 7 – 24 GHz SI | Moderator (Intel Corporation) |
R1-2504964 | Introduction of Rel-19 7-24 GHz channel model enhancements | Intel Corporation, ZTE Corporation |
TDoc | Title | Source |
---|---|---|
R1-2503256 | Considerations on the 7-24GHz channel model validation | Huawei, HiSilicon |
R1-2503374 | Views on channel model validation of TR38.901 for 7-24GHz | vivo, BUPT |
R1-2503439 | Remaining Details of Evaluation of FR3 Channel Modeling | InterDigital, Inc. |
R1-2503578 | Discussion on channel model validation of TR38.901 for 7 - 24 GHz | Samsung |
R1-2503606 | Discussion on channel modeling verification for 7-24 GHz | Intel Corporation |
R1-2503620 | Discussion on validation of channel model | Ericsson |
R1-2503633 | Discussion on the channel model validation | ZTE Corporation, Sanechips |
R1-2503653 | Discussion on channel model validation of TR38.901 for 7-24GHz | BUPT |
R1-2503762 | Discussion on Channel Model Validation of TR38.901 for 7-24GHz | SK Telecom |
R1-2503805 | Views on channel model validation for 7-24GHz | CATT |
R1-2503962 | Views on Channel Model Validation | Sharp |
R1-2503993 | Channel model validation of TR 38.901 for 7-24 GHz | NVIDIA |
R1-2504006 | Channel model validation for 7-24 GHz | Lenovo |
R1-2504147 | Discussion on calibration results | ETRI |
R1-2504338 | Validation of Channel Model | Apple |
R1-2504368 | Discussion on Validation of the Channel Model in 38901 | AT&T |
R1-2504406 | Channel Model Validation of TR38.901 for 7-24 GHz | Qualcomm Incorporated |
R1-2504512 | Discussion on channel model validation for 7-24 GHz | NTT DOCOMO, INC. |
R1-2504548 | Measurements of the angular spreads in urban and suburban macrocells | Vodafone, Ericsson |
R1-2504629 | Discussion of channel model validation of TR38.901 for 7-24GHz | Sony |
R1-2504631 | Discussion on Channel model validation of TR38.901 for 7-24GHz | Nokia |
R1-2504650 | Measurements of the angular spreads in urban, suburban, and rural macrocells | BT plc, Ericsson |
R1-2504685 | Views on channel model validation of TR38.901 for 7-24GHz | vivo, BUPT |
R1-2504699 | Summary of issues for Rel-19 7-24 GHz Channel Modeling Validation | Moderator (Intel Corporation) |
R1-2504700 | Summary #1 of discussions for Rel-19 7-24 GHz Channel Modeling Validation | Moderator (Intel Corporation) |
R1-2504701 | Summary #2 of discussions for Rel-19 7-24 GHz Channel Modeling Validation | Moderator (Intel Corporation) |
R1-2504702 | Summary #3 of discussions for Rel-19 7-24 GHz Channel Modeling Validation | Moderator (Intel Corporation) |
R1-2504703 | Summary #4 of discussions for Rel-19 7-24 GHz Channel Modeling Validation | Moderator (Intel Corporation) |
R1-2504717 | Channel Model Validation of TR38.901 for 7-24 GHz | Qualcomm Incorporated |
R1-2504721 | Discussion on channel model validation of TR38.901 for 7-24GHz | BUPT |
R1-2504813 | Views on channel model validation for 7-24GHz | CATT |
R1-2504913 | Consolidated Measurement Data (Rel-14 to Rel-19) | Sharp |
TDoc | Title | Source |
---|---|---|
R1-2503257 | Considerations on the 7-24GHz channel model extension | Huawei, HiSilicon |
R1-2503375 | Views on channel model adaptation/extension of TR38.901 for 7-24GHz | vivo, BUPT |
R1-2503427 | Discussion on channel modelling adaptation/extension for 7-24GHz | LG Electronics |
R1-2503440 | Remaining Details of Extension of FR3 Channel Modeling | InterDigital, Inc. |
R1-2503579 | Discussion on channel model adaptation/extension of TR38.901 for 7 - 24 GHz | Samsung |
R1-2503621 | Discussion on adaptation and extension of channel model | Ericsson |
R1-2503634 | Discussion on the channel model adaptation and extension | ZTE Corporation, Sanechips |
R1-2503647 | Discussion on channel model adaptation/extension | Intel Corporation |
R1-2503654 | Discussion on modeling near-field propagation and spatial non-stationarity in TR38.901 for 7-24GHz | BUPT, CMCC, X-Net |
R1-2503714 | Discussions on FR3 Channel Modelling | Lekha Wireless Solutions |
R1-2503806 | Views on channel model adaptation/extension for 7-24GHz | CATT |
R1-2503994 | Channel model adaptation of TR 38.901 for 7-24 GHz | NVIDIA |
R1-2504222 | Channel model adaptation and extension for 7-24GHz | OPPO |
R1-2504339 | Channel Model Adaptation and Extension of TR38.901 for 7-24 GHz | Apple |
R1-2504407 | Channel Model Adaptation/Extension of TR38.901 for 7-24GHz | Qualcomm Incorporated |
R1-2504630 | Discussion of channel model adaptation/extension of TR38.901 for 7-24GHz | Sony |
R1-2504632 | Discussion on Channel model adaptation/extension of TR38.901 for 7-24GHz | Nokia |
R1-2504684 | Channel Model Adaptation/Extension of TR38.901 for 7-24GHz | Qualcomm Incorporated |
R1-2504686 | Views on channel model adaptation/extension of TR38.901 for 7-24GHz | vivo, BUPT |
R1-2504753 | Summary#1 of channel model adaptation and extension | Moderator (ZTE Corporation) |
R1-2504754 | Summary#2 of channel model adaptation and extension | Moderator (ZTE Corporation) |
R1-2504755 | Summary#3 of channel model adaptation and extension | Moderator (ZTE Corporation) |
R1-2504756 | Summary#4 of channel model adaptation and extension | Moderator (ZTE Corporation) |
R1-2504814 | Views on channel model adaptation/extension for 7-24GHz | CATT |
TDoc | Title | Source |
---|---|---|
R1-2503259 | Measurements related enhancements for LTM | Huawei, HiSilicon |
R1-2503376 | Remaining issues on measurements related enhancements for LTM | vivo |
R1-2503419 | Discussion on measurements related enhancements for LTM | NEC |
R1-2503422 | Measurement related enhancements for LTM | Nokia |
R1-2503428 | Discussion on measurements related enhancements for LTM | LG Electronics |
R1-2503447 | Measurements related enhancements for LTM | TCL |
R1-2503526 | Discussion on measurements related enhancements for LTM | Spreadtrum, UNISOC |
R1-2503580 | Views on Rel-19 measurement related enhancements for LTM | Samsung |
R1-2503672 | Discussion on measurements related enhancements for LTM | ZTE Corporation, Sanechips |
R1-2503713 | Discussion on measurement related enhancements for LTM | Lekha Wireless Solutions |
R1-2503809 | Remaining issues on measurements related enhancements for LTM | CATT |
R1-2503843 | Discussion on measurements related enhancements for LTM | CMCC |
R1-2503862 | FL plan for mobility enhancements in RAN1#121 | Moderator (Fujitsu) |
R1-2503863 | FL summary 1 of Measurements related enhancements for LTM | Moderator (Fujitsu) |
R1-2503864 | FL summary 2 of Measurements related enhancements for LTM | Moderator (Fujitsu) |
R1-2503865 | FL summary 3 of Measurements related enhancements for LTM | Moderator (Fujitsu) |
R1-2503866 | Final FL summary of Measurements related enhancements for LTM | Moderator (Fujitsu) |
R1-2503894 | Discussion on measurements related enhancements for LTM | Xiaomi |
R1-2503916 | Measurements related enhancements for LTM | Lenovo |
R1-2503949 | Measurements related enhancements for LTM | InterDigital, Inc. |
R1-2504004 | Discussion on measurement related enhancements for LTM | Fujitsu Limited |
R1-2504148 | Discussion on measurements related enhancements for LTM | ETRI |
R1-2504184 | Measurement related enhancements for LTM | Ericsson |
R1-2504233 | Discussions on measurement enhancement for LTM | OPPO |
R1-2504300 | Discussion on measurements related enhancements for LTM | |
R1-2504340 | Measurement related enhancements for LTM | Apple |
R1-2504408 | Measurements related enhancement for LTM | Qualcomm Incorporated |
R1-2504450 | Discussion on measurements related enhancements for LTM | KDDI Corporation |
R1-2504513 | Discussion on measurement related enhancements for LTM | NTT DOCOMO, INC. |
R1-2504546 | Discussion on measurements related enhancements for LTM | Sharp |
R1-2504595 | LTM measurements related enhancements | MediaTek Inc. |
R1-2504827 | [Draft] LS on frequency location of CSI-RS resources for CSI acquisition in LTM | Moderator (Fujitsu) |
R1-2504828 | LS on frequency location of CSI-RS resources for CSI acquisition in LTM | RAN1, Fujitsu |
R1-2504889 | FL summary 4 of Measurements related enhancements for LTM | Moderator (Fujitsu) |
TDoc | Title | Source |
---|---|---|
R1-2504156 | Rapporteur Inputs | Nokia, Qualcomm (WI rapporteurs) |
TDoc | Title | Source |
---|---|---|
R1-2503288 | Discussions on scheduling enhancements considering RRM measurements for XR | Huawei, HiSilicon |
R1-2503321 | Discussion on measurement gap for XR | ZTE Corporation, Sanechips |
R1-2503377 | Remaining issues on enabling data transmissions for XR during RRM measurements | vivo |
R1-2503581 | Remaining topics on enabling TX/RX during RRM measurements for XR | Samsung |
R1-2503844 | Discussion on enabling TX/RX for XR during RRM measurements | CMCC |
R1-2503975 | Discussion on enabling TX/RX for XR during RRM measurements | InterDigital, Inc. |
R1-2504070 | Remaining Issues on Enabling TX/RX during RRM measurements | Sony |
R1-2504157 | Enabling TX/RX for XR during RRM measurements | Nokia |
R1-2504158 | Moderator summary #1 - Enabling TX/RX for XR during RRM measurements | Moderator (Nokia) |
R1-2504214 | Enhancements to enable TX/RX for XR during RRM measurements | OPPO |
R1-2504253 | Discussion on XR during RRM measurements | LG Electronics |
R1-2504341 | Discussion on RRM measurement adaptation for XR | Apple |
R1-2504409 | Enabling Tx/Rx for XR during RRM measurements | Qualcomm Incorporated |
R1-2504514 | Discussion on Enabling TX/RX for XR during RRM | NTT DOCOMO, INC. |
R1-2504608 | On enabling Tx/Rx for XR during RRM measurements | Google Ireland Limited |
R1-2504620 | Enabling TX/RX for XR traffic during RRM measurement gaps | Ericsson |
R1-2504689 | Discussion on RRM measurement adaptation for XR | Apple |
R1-2504843 | Moderator summary #2 - Enabling TX/RX for XR during RRM measurements | Moderator (Nokia) |
TDoc | Title | Source |
---|---|---|
R1-2503693 | RRC parameters list for Rel-19 NR NTN Phase 3 | Rapporteur (THALES) |
R1-2503701 | TP on RAN1 additions to CR for TS 38.300 | Rapporteur (THALES) |
R1-2503702 | RAN1 agreements for NR NTN Phase 3 up to RAN1#120-bis | Rapporteur (THALES) |
R1-2504897 | Session notes for 9.11 (Non-Terrestrial Networks for NR Phase 3 and Internet of Things Phase 3) | Ad-Hoc Chair (Huawei) |
R1-2504931 | Summary of discussions on higher-layers parameters for Rel-19 NR NTN | Moderator (THALES) |
R1-2504932 | Summary of discussions on TP for RAN1 additions to CR for TS 38.300 | Moderator (THALES) |
R1-2504933 | Draft LS on NR-NTN TP for TS 38.300 | Moderator (THALES) |
R1-2504934 | LS on NR-NTN TP for TS 38.300 | RAN1, THALES |
R1-2504954 | Summary of discussions on higher-layers parameters for Rel-19 NR NTN | Moderator (Thales) |
TDoc | Title | Source |
---|---|---|
R1-2503280 | Discussion on downlink coverage enhancements for NR NTN | Huawei, HiSilicon |
R1-2503308 | On NR-NTN downlink coverage enhancement | Ericsson |
R1-2503378 | Remaining issues on NR-NTN downlink coverage enhancement | vivo |
R1-2503527 | Discussion on NR-NTN downlink coverage enhancement | Spreadtrum, UNISOC |
R1-2503582 | Discussion on downlink coverage enhancement for NR-NTN | Samsung |
R1-2503635 | Discussion on DL coverage enhancement for NR NTN | ZTE Corporation, Sanechips |
R1-2503687 | NR NTN Downlink coverage enhancements | THALES |
R1-2503689 | FL Summary #1: NR-NTN downlink coverage enhancements | THALES |
R1-2503690 | FL Summary #2: NR-NTN downlink coverage enhancements | THALES |
R1-2503691 | FL Summary #3: NR-NTN downlink coverage enhancements | THALES |
R1-2503692 | FL Summary #4: NR-NTN downlink coverage enhancements | THALES |
R1-2503774 | Discussion on downlink coverage enhancement for NR NTN | CATT |
R1-2503812 | NR-NTN downlink coverage enhancement | InterDigital, Inc. |
R1-2503845 | Discussion on NR-NTN DL coverage enhancement | CMCC |
R1-2503861 | Discussion on downlink coverage enhancement for NR NTN | Fraunhofer IIS, Fraunhofer HHI |
R1-2503895 | Discussion on NR-NTN downlink coverage enhancement | Xiaomi |
R1-2503930 | NR-NTN downlink coverage enhancement | NEC |
R1-2504001 | Discussion on downlink coverage enhancements | Fujitsu |
R1-2504005 | Discussion on downlink coverage enhancement for NR NTN | Baicells Technologies Co. Ltd |
R1-2504103 | Discussion on NR-NTN downlink coverage enhancement | HONOR |
R1-2504109 | NR-NTN Downlink Coverage Enhancement | Panasonic |
R1-2504149 | Discussion on NR-NTN downlink coverage enhancement | ETRI |
R1-2504166 | Discussion on NR-NTN downlink coverage enhancement | TCL |
R1-2504170 | Discussion on downlink coverage enhancements for NR NTN | CCU |
R1-2504179 | Discussions on downlink coverage enhancements | Nokia, Nokia Shanghai Bell |
R1-2504199 | Discussion on NR-NTN downlink coverage enhancement | OPPO |
R1-2504270 | NR-NTN downlink coverage enhancement | MediaTek Inc. |
R1-2504342 | On NR-NTN Downlink Coverage Enhancement | Apple |
R1-2504410 | Downlink coverage enhancement for NR NTN | Qualcomm Incorporated |
R1-2504447 | Further Discussion on NR NTN downlink coverage enhancement | China Telecom |
R1-2504459 | Discussion on downlink coverage enhancement for NR NTN | Lenovo |
R1-2504480 | Discussion on NR NTN Downlink Enhancements | Sharp |
R1-2504515 | Discussion on DL coverage enhancement for NR-NTN | NTT DOCOMO, INC. |
R1-2504545 | Discussion on downlink coverage enhancement for NR-NTN | CSCN |
R1-2504561 | Discussion on NR-NTN downlink coverage enhancement | LG Electronics |
R1-2504581 | Discussion on DL coverage enhancements for NR-NTN | NICT |
R1-2504583 | Discussion on Downlink Coverage Enhancement for NR NTN | Google Korea LLC |
R1-2504605 | Discussion on Downlink Coverage Enhancements for NR NTN | CEWiT |
R1-2504715 | List of companies’ proposals on NR-NTN downlink coverage enhancement | Moderator (Thales) |
R1-2504935 | Draft LS on Msg4 PDSCH repetition | Moderator (THALES) |
R1-2504936 | LS on Msg4 PDSCH repetition | RAN1, THALES |
R1-2504953 | FL Summary #5: NR-NTN downlink coverage enhancements | Moderator (Thales) |
TDoc | Title | Source |
---|---|---|
R1-2503281 | Discussion on HD-FDD RedCap UEs and eRedCap UEs for FR1-NTN | Huawei, HiSilicon |
R1-2503325 | Discussion on support of HD-FDD (e)RedCap UEs with NR NTN | SageRAN |
R1-2503337 | On HD-FDD Redcap UEs for NTN | Ericsson |
R1-2503379 | Remaining issues on support of RedCap and eRedCap UEs with NR-NTN | vivo |
R1-2503528 | Discussion on support of RedCap and eRedCap UEs with NR NTN operating in FR1-NTN bands | Spreadtrum, UNISOC |
R1-2503583 | Discussion on support of RedCap and eRedCap UEs with NR NTN operating in FR1-NTN bands | Samsung |
R1-2503636 | Discussion on support of RedCap/eRedCap UEs for NR NTN | ZTE Corporation, Sanechips |
R1-2503775 | Discussion on the enhancement of RedCap and eRedCap UEs In NTN | CATT |
R1-2503813 | Discussion on half-duplex RedCap issues for NTN FR1 operation | InterDigital, Inc. |
R1-2503846 | Discussion on the collision issues of HD-FDD Redcap UE in FR1-NTN | CMCC |
R1-2503896 | Discussion on the support of Redcap and eRedcap UEs in NR NTN | Xiaomi |
R1-2504104 | Discussion on support of (e)RedCap UEs in NR NTN | HONOR |
R1-2504150 | Discussion on HD UEs with NR NTN | ETRI |
R1-2504167 | Discussion on HD-FDD Redcap UEs and eRedcap UEs for FR1-NTN | TCL |
R1-2504180 | Discussion of support for RedCap and eRedCap UEs with NR NTN operating in FR1-NTN bands | Nokia, Nokia Shanghai Bell |
R1-2504200 | Discussion on supporting of RedCap and eRedCap UEs with NR NTN operating in FR1-NTN bands | OPPO |
R1-2504271 | Support of RedCap and eRedCap UEs with NR NTN operating in FR1-NTN bands | MediaTek Inc. |
R1-2504343 | Discussion on support of RedCap UEs with NR NTN operation | Apple |
R1-2504411 | Support of Redcap and eRedcap UEs in NR NTN | Qualcomm Incorporated |
R1-2504432 | Support of (e)RedCap UEs with NR NTN | Sharp |
R1-2504516 | Discussion on support of RedCap and eRedCap UEs in FR1-NTN | NTT DOCOMO, INC. |
R1-2504544 | Support of RedCap and eRedCap UEs in NR NTN | Nordic Semiconductor ASA |
R1-2504557 | Discussion on support of RedCap/eRedCap UEs in NTN | CAICT |
R1-2504562 | Discussion on support of (e)RedCap UEs with NR-NTN operating in FR1-NTN bands | LG Electronics |
R1-2504725 | Summary #1 for Support of RedCap and eRedCap UEs with NR NTN operating in FR1-NTN bands | Moderator (CATT) |
R1-2504726 | Summary #2 for Support of RedCap and eRedCap UEs with NR NTN operating in FR1-NTN bands | Moderator (CATT) |
R1-2504727 | Summary #3 for Support of RedCap and eRedCap UEs with NR NTN operating in FR1-NTN bands | Moderator (CATT) |
TDoc | Title | Source |
---|---|---|
R1-2503240 | On uplink capacity enhancements for NR-NTN | Ericsson |
R1-2503282 | Discussion on uplink capacity/throughput enhancement for FR1-NTN | Huawei, HiSilicon |
R1-2503380 | Remaining issues on NR-NTN uplink capacity enhancement | vivo |
R1-2503529 | Discussion on NR-NTN uplink capacity/throughput enhancement | Spreadtrum, UNISOC |
R1-2503584 | Discussion on uplink capacity/throughput enhancement for NR-NTN | Samsung |
R1-2503637 | Discussion on UL capacity enhancement for NR NTN | ZTE Corporation, Sanechips |
R1-2503684 | Feature lead summary #1 of AI 9.11.3 on NR-NTN uplink capacity and throughput | MediaTek Inc. |
R1-2503685 | Feature lead summary #2 of AI 9.11.3 on NR-NTN uplink capacity and throughput | MediaTek Inc. |
R1-2503686 | Feature lead summary #3 of AI 9.11.3 on NR-NTN uplink capacity and throughput | MediaTek Inc. |
R1-2503763 | Discussion on the NR-NTN uplink capacity/throughput enhancements | TCL |
R1-2503776 | Discussion on UL capacity enhancement for NR NTN | CATT |
R1-2503814 | NR-NTN uplink capacity/throughput enhancement | InterDigital, Inc. |
R1-2503847 | Discussion on the NR-NTN uplink capacity/throughput enhancements | CMCC |
R1-2503897 | Discussion on NR-NTN PUSCH capacity enhancement | Xiaomi |
R1-2503909 | Discussion on the NR-NTN uplink capacity/throughput enhancements | NTPU |
R1-2503931 | NR-NTN uplink capacity/throughput enhancement | NEC |
R1-2504002 | Discussion on uplink capacity/cell throughput enhancement for FR1-NTN | Fujitsu |
R1-2504055 | Discussion on NR-NTN uplink enhancement | China Telecom |
R1-2504105 | Discussion on NR-NTN UL capacity/throughput enhancement | HONOR |
R1-2504151 | Discussion on NR-NTN uplink capacity/throughput enhancement | ETRI |
R1-2504155 | Discussion on NR-NTN Uplink Capacity/Throughput Enhancement | Lenovo |
R1-2504181 | Discussion of NR-NTN uplink capacity enhancements | Nokia, Nokia Shanghai Bell |
R1-2504201 | Discussion on NR-NTN uplink capacity/throughput enhancement | OPPO |
R1-2504272 | NR-NTN uplink capacity and throughput enhancements | MediaTek Inc. |
R1-2504344 | On NR-NTN Uplink Capacity Enhancement | Apple |
R1-2504412 | NR-NTN uplink capacity / throughput enhancement | Qualcomm Incorporated |
R1-2504443 | Uplink capacity/throughput enhancement for NR-NTN | Panasonic |
R1-2504481 | Discussion on NR NTN Uplink Enhancements | Sharp |
R1-2504517 | Discussion on NR-NTN uplink capacity/throughput enhancement | NTT DOCOMO, INC. |
R1-2504563 | Discussion on NR-NTN uplink capacity/throughput enhancement | LG Electronics |
R1-2504584 | Discussion on NR-NTN uplink capacity/throughput enhancement | Google Korea LLC |
R1-2504687 | Discussion on NR-NTN uplink capacity/throughput enhancement | NTT DOCOMO, INC. |
TDoc | Title | Source |
---|---|---|
R1-2503283 | Discussion on UL capacity enhancements for IoT NTN | Huawei, HiSilicon |
R1-2503338 | On uplink capacity enhancements for IoT-NTN | Ericsson |
R1-2503381 | Remaining issues on IoT-NTN uplink capacity enhancement | vivo |
R1-2503530 | Discussion on IoT-NTN uplink capacity/throughput enhancement | Spreadtrum, UNISOC |
R1-2503585 | Discussion on uplink capacity/throughput enhancement for IoT-NTN | Samsung |
R1-2503638 | Discussion on UL capacity enhancement for IoT NTN | ZTE Corporation, Sanechips |
R1-2503764 | Discussion on the IoT-NTN uplink capacity/throughput enhancements | TCL |
R1-2503777 | Discussion on UL capacity enhancement for IoT NTN | CATT |
R1-2503815 | IoT-NTN uplink capacity/throughput enhancement | InterDigital, Inc. |
R1-2503848 | Discussion on the IoT-NTN uplink capacity/throughput enhancements | CMCC |
R1-2503898 | Discussion on IoT-NTN uplink capacity enhancement | Xiaomi |
R1-2503932 | IoT-NTN uplink capacity/throughput enhancement | NEC |
R1-2503960 | IoT NTN OCC activation and sequence index indication for NPUSCH | Sharp |
R1-2504034 | IoT-NTN uplink capacity enhancement | Nokia, Nokia Shanghai Bell |
R1-2504071 | On IoT-NTN uplink capacity enhancements | Sony |
R1-2504072 | FL Summary #1 for IoT-NTN | Moderator (Sony) |
R1-2504073 | FL Summary #2 for IoT-NTN | Moderator (Sony) |
R1-2504074 | Final FL Summary for IoT-NTN | Moderator (Sony) |
R1-2504152 | Discussion on uplink capacity/throughput enhancement for IoT NTN | ETRI |
R1-2504202 | Discussion on IoT-NTN uplink capacity/throughput enhancement | OPPO |
R1-2504273 | IoT-NTN uplink capacity and throughput enhancement | MediaTek Inc. |
R1-2504345 | Discussion on IoT-NTN Uplink Capacity Enhancement | Apple |
R1-2504413 | IOT-NTN uplink capacity/throughput enhancement | Qualcomm Incorporated |
R1-2504460 | Discussion on uplink capacity enhancement for IoT NTN | Lenovo |
R1-2504543 | IoT-NTN uplink capacity/throughput enhancement | Nordic Semiconductor ASA |
R1-2504564 | Discussion on IoT-NTN uplink capacity/throughput enhancement | LG Electronics |
R1-2504704 | RAN1 agreements on IoT NTN Phase 3 up to RAN1#121 | Moderator (MediaTek) |
R1-2504803 | Moderator summary #1 on reply LS on CB-msg3-EDT on IoT-NTN uplink capacity and throughput enhancements | Moderator (MediaTek), Qualcomm |
R1-2504804 | Moderator summary #2 on reply LS on CB-msg3-EDT on IoT-NTN uplink capacity and throughput enhancements | Moderator (MediaTek), Qualcomm |
R1-2504904 | Draft reply LS on CB-msg3-EDT for IoT NTN Ph3 | MediaTek |
R1-2504905 | Reply LS on CB-msg3-EDT for IoT NTN Ph3 | RAN1, MediaTek |
R1-2504959 | Reply LS on CB-msg3-EDT for IoT NTN Ph3 | RAN1, MediaTek |
TDoc | Title | Source |
---|---|---|
R1-2503284 | Discussion on IoT-NTN TDD mode | Huawei, HiSilicon |
R1-2503382 | Remaining issues on IoT-NTN TDD mode | vivo |
R1-2503531 | Discussion on IoT-NTN TDD mode | Spreadtrum, UNISOC |
R1-2503586 | Discussion on IoT-NTN TDD mode | Samsung |
R1-2503639 | Discussion on the IoT-NTN TDD mode | ZTE Corporation, Sanechips |
R1-2503688 | Discussion on IoT-NTN TDD mode | THALES |
R1-2503778 | Discussion on Physical layer design of IoT-NTN TDD | CATT |
R1-2503849 | Discussion on the new NB-IoT NTN TDD mode | CMCC |
R1-2503899 | Discussion on IoT-NTN TDD mode | Xiaomi |
R1-2503958 | Remaining aspects of loT-NTN TDD mode | Iridium Satellite LLC |
R1-2503959 | Stage 2 proposal (for RAN2 TS 36.300) for Introduction of IoT-NTN TDD mode | Iridium Satellite LLC |
R1-2503961 | Remaining issues on IoT NTN TDD | Sharp |
R1-2504035 | Discussion on IoT-NTN TDD mode | Nokia, Nokia Shanghai Bell |
R1-2504203 | Discussion on IoT-NTN TDD mode | OPPO |
R1-2504346 | Discussion on IoT-NTN TDD mode | Apple |
R1-2504414 | IOT-NTN TDD mode | Qualcomm Incorporated |
R1-2504461 | Discussion on IoT-NTN TDD mode | Lenovo |
R1-2504518 | Discussion on IoT-NTN TDD mode | NTT DOCOMO, INC. |
R1-2504565 | Discussion on IoT-NTN TDD mode | LG Electronics |
R1-2504576 | On R19 TDD IoT-NTN | Nordic Semiconductor ASA |
R1-2504718 | Feature lead summary #1 on IoT-NTN TDD mode | Moderator (Qualcomm Incorporated) |
R1-2504719 | Feature lead summary #2 on IoT-NTN TDD mode | Moderator (Qualcomm Incorporated) |
R1-2504875 | Feature lead summary #3 on IoT-NTN TDD mode | Moderator (Qualcomm Incorporated) |
R1-2504882 | TP for 36.300 for IOT NTN TDD mode | Qualcomm |
R1-2504883 | TP for 36.300 for IOT NTN TDD mode | RAN1, Qualcomm |
R1-2504968 | Introduction of IoT-NTN TDD mode | Motorola Mobility |
TDoc | Title | Source |
---|---|---|
R1-2503655 | Updated high layer parameters for Rel-19 Multi-Carrier Enhancements | Lenovo (Rapporteur) |
R1-2504898 | Session notes for 9.12 (Multi-Carrier Enhancements for NR Phase 2) | Ad-Hoc Chair (CMCC) |
TDoc | Title | Source |
---|---|---|
R1-2503271 | Discussion on Rel-19 Multi-carrier enhancements | Huawei, HiSilicon |
R1-2503330 | Discussion on multi-cell PUSCH/PDSCH scheduling with a single DCI | ZTE Corporation, Sanechips |
R1-2503383 | Remaining issues on enhancement of multi-cell PUSCH and PDSCH scheduling with a single DCI | vivo |
R1-2503429 | Remaining details on Rel-19 Multi-carrier enhancements | Nokia |
R1-2503587 | Enhancements for multi-cell PUSCH/PDSCH scheduling | Samsung |
R1-2503607 | Multi-cell PxSCH scheduling with a single DCI | Ericsson |
R1-2503656 | Discussion on multi-cell scheduling with a single DCI | Lenovo |
R1-2503779 | Discussion on multi-cell PUSCH/PDSCH scheduling with a single DCI | CATT |
R1-2503990 | Discussion on multi-carrier enhancements for NR Phase 3 | Panasonic |
R1-2504056 | Remaining issues on multi-carrier enhancements for NR phase 3 | China Telecom |
R1-2504216 | Discussion of multi-cell scheduling with a single DCI | OPPO |
R1-2504254 | Discussion on single DCI based multi-cell scheduling for Rel-19 | LG Electronics |
R1-2504274 | Multi-carrier enhancements for NR phase 2 | MediaTek Inc. |
R1-2504415 | Multi-cell PUSCH/PDSCH scheduling with a single DCI | Qualcomm Incorporated |
R1-2504519 | Discussion on multi-cell PUSCH/PDSCH scheduling with a single DCI | NTT DOCOMO, INC. |
R1-2504761 | Feature lead summary#1 on multi-cell scheduling with a single DCI | Moderator (Lenovo) |
R1-2504762 | Feature lead summary#2 on multi-cell scheduling with a single DCI | Moderator (Lenovo) |
R1-2504763 | Feature lead summary#3 on multi-cell scheduling with a single DCI | Moderator (Lenovo) |
R1-2504764 | Draft LS on TS38.300 TP for Multi-carrier enhancements in Rel-19 | Lenovo |
R1-2504861 | LS on TS38.300 TP for Multi-carrier enhancements in Rel-19 | RAN1, Lenovo |
TDoc | Title | Source |
---|---|---|
R1-2503273 | Discussion on low band CA via switching | Huawei, HiSilicon |
R1-2503331 | Discussion on low band carrier aggregation via switching | ZTE Corporation, Sanechips |
R1-2503384 | Remaining issues on Low band carrier aggregation via switching | vivo |
R1-2503421 | Discussion on low band carrier aggregation via switching | NEC |
R1-2503430 | On low-band CA via switching | Nokia |
R1-2503532 | Discussion on low band carrier aggregation via switching | Spreadtrum, UNISOC |
R1-2503588 | Discussion on low band carrier aggregation via switching | Samsung |
R1-2503657 | Discussion on carrier switching pattern for low band carrier aggregation via switching | Lenovo |
R1-2503739 | Discussion on a low-band CA with switching | Ofinno |
R1-2503780 | Discussion on low band carrier aggregation via switching | CATT |
R1-2504153 | Low band carrier aggregation via switching | ETRI |
R1-2504217 | Discussion of low-band CA via switching | OPPO |
R1-2504255 | Discussion on low band CA operation via switching for Rel-19 | LG Electronics |
R1-2504275 | Low band carrier aggregation via switching | MediaTek Inc. |
R1-2504347 | On low band carrier aggregation via switching | Apple |
R1-2504348 | FL summary #1 of Low band carrier aggregation via switching | Moderator (Apple) |
R1-2504349 | FL summary #2 of Low band carrier aggregation via switching | Moderator (Apple) |
R1-2504350 | FL summary #3 of Low band carrier aggregation via switching | Moderator (Apple) |
R1-2504416 | Low-band carrier aggregation via switching | Qualcomm Incorporated |
R1-2504440 | Low band carrier aggregation through switching | Ericsson |
R1-2504520 | Discussion on Low band carrier aggregation via switching | NTT DOCOMO, INC. |
R1-2504606 | On Low band carrier aggregation via switching | Google Ireland Limited |
R1-2504868 | Draft LS on Low NR band carrier aggregation via switching | Apple |
R1-2504869 | LS on NR Low band carrier aggregation via switching | RAN1, Apple |
TDoc | Title | Source |
---|---|---|
R1-2504652 | Higher layer parameters for Rel-19 LTE-based 5G Broadcast after RAN1#120 | EBU |
R1-2504899 | Session notes for 9.13 (LTE-based 5G Broadcast Phase 2) | Ad-Hoc Chair (Huawei) |
R1-2504921 | RAN2 aspects on LTE-based 5G Broadcast Phase 2 | EBU |
R1-2504922 | RAN2 aspects on LTE-based 5G Broadcast Phase 2 | RAN1, EBU |
R1-2504967 | Introduction of LTE-based 5G Broadcast Phase 2 | Motorola Mobility |
TDoc | Title | Source |
---|---|---|
R1-2503249 | On time-frequency interleavers for LTE-based 5G Broadcast | Huawei, HiSilicon |
R1-2503332 | Discussion on time-frequency interleaver design for LTE-based 5G Broadcast | ZTE Corporation, Sanechips |
R1-2503589 | Further details on Time and Frequency Interleaving for 5G Broadcast phase-2 | Samsung |
R1-2503609 | Further discussion on Time-frequency interleaver for 5G Broadcast Phase 2 | Shanghai Jiao Tong University |
R1-2504241 | Further discussion on open issues regarding TFI for LTE-based 5G Broadcast | EBU |
R1-2504417 | Time and Frequency Interleaving for 5G Broadcast | Qualcomm Incorporated |
R1-2504654 | Time and Frequency Interleaving for 5G Broadcast | Qualcomm Incorporated |
R1-2504732 | FL summary#1 on Rel-19 LTE-based 5G Broadcast Phase 2 | Moderator (EBU) |
R1-2504733 | FL summary#2 on Rel-19 LTE-based 5G Broadcast Phase 2 | Moderator (EBU) |
R1-2504734 | FL summary#3 on Rel-19 LTE-based 5G Broadcast Phase 2 | Moderator (EBU) |
R1-2504912 | Codeblock-Based Cyclic Shift for Time and Frequency Interleaver | Shanghai Jiao Tong University |
TDoc | Title | Source |
---|---|---|
R1-2503590 | Views on Rel-19 TEI | Samsung |
R1-2503675 | On Rel-19 TEI proposals | ZTE Corporation, Sanechips |
R1-2503767 | Rel-19 TEI on SRS antenna switching pattern report | CATT, MediaTek Inc. |
R1-2504276 | Proposal for TEI19 | MediaTek Inc., Nokia, Apple, Ericsson, NTT DOCOMO, Orange |
R1-2504290 | On muting cell acquisition signals in MBMS-dedicated cell | Huawei, HiSilicon |
R1-2504351 | On Rel-19 RAN1 TEI | Apple |
R1-2504418 | Rel-19 RAN1 TEI proposal | Qualcomm Incorporated |
R1-2504442 | On TEI-19 | Ericsson |
R1-2504521 | FL Summary #1 on Rel-19 TEIs | Moderator (NTT DOCOMO, INC.) |
R1-2504522 | FL Summary #2 on Rel-19 TEIs | Moderator (NTT DOCOMO, INC.) |
R1-2504653 | Higher layer parameters for Rel-19 TEI_5GB_CAS_Muting after RAN1#120bis | EBU |
R1-2504830 | Summary #1 of Discussion on RAN4 LS on UL Tx switching for TEI19 | Moderator (MediaTek) |
R1-2504852 | Summary #2 of Discussion on RAN4 LS on UL Tx switching for TEI19 | Moderator (MediaTek) |
R1-2504856 | FL Summary #3 on Rel-19 TEIs | Moderator (NTT DOCOMO, INC.) |
R1-2504879 | Summary #3 of Discussion on RAN4 LS on UL Tx switching for TEI19 | Moderator (MediaTek) |
R1-2504900 | Session notes for 9.14 (TEI19) | Ad-Hoc Chair (CMCC) |
R1-2504949 | Summary #4 of Discussion on RAN4 LS on UL Tx switching for TEI19 | Moderator (MediaTek) |
TDoc | Title | Source |
---|---|---|
R1-2504673 | Updated RAN1 UE features list for Rel-19 NR after RAN1 #121 | Moderators (AT&T, NTT DOCOMO, INC.) |
R1-2504674 | Draft LS on updated Rel-19 RAN1 UE features list for NR after RAN1#121 | Moderators (AT&T, NTT DOCOMO, INC.) |
R1-2504675 | LS on updated Rel-19 RAN1 UE features list for NR after RAN1#121 | RAN1, AT&T, NTT DOCOMO, INC. |
R1-2504676 | Updated RAN1 UE features list for Rel-19 LTE after RAN1 #121 | Moderators (AT&T, NTT DOCOMO, INC.) |
R1-2504677 | Draft LS on updated Rel-19 RAN1 UE features lists for LTE after RAN1#121 | Moderators (AT&T, NTT DOCOMO, INC.) |
R1-2504678 | LS on updated Rel-19 RAN1 UE features lists for LTE after RAN1#121 | RAN1, AT&T, NTT DOCOMO, INC. |
TDoc | Title | Source |
---|---|---|
R1-2503239 | UE Features for Rel-19 AI/ML for NR Air Interface | Ericsson |
R1-2503255 | UE features for AI/ML for NR air interface | Huawei, HiSilicon |
R1-2503385 | Discussion on UE features for AI/ML for NR Air Interface | vivo |
R1-2503399 | UE features for AI/ML for NR Air Interface | Nokia |
R1-2503591 | UE features for AI/ML for NR Air Interface | Samsung |
R1-2503652 | Discussion on UE features for AI/ML for NR Air Interface | ZTE Corporation, Sanechips |
R1-2503740 | Views on UE features for AI/ML for NR Air Interface | Ofinno |
R1-2503781 | Discussion on UE features for AI/ML for NR Air Interface | CATT, CICTCI |
R1-2503850 | Discussion on UE features for AI/ML for NR air Interface | CMCC |
R1-2503900 | Discussion on UE features for AI/ML for NR Air Interface | Xiaomi |
R1-2503984 | Discussions on UE features for AI/ML for NR Air Interface | LG Electronics |
R1-2504227 | UE features for AIML for NR air interface | OPPO |
R1-2504352 | On Rel-19 UE features for AI/ML for NR air interface | Apple |
R1-2504369 | Summary of UE features for AI/ML for NR Air Interface | Moderator (AT&T) |
R1-2504419 | UE features for AI/ML for NR air interface | Qualcomm Incorporated |
R1-2504523 | Discussion on UE features for AI/ML for NR Air Interface | NTT DOCOMO, INC. |
R1-2504690 | On Rel-19 UE features for AI/ML for NR air interface | Apple |
R1-2504925 | Session Notes of AI 9.15.1 | Ad-Hoc Chair (AT&T) |
TDoc | Title | Source |
---|---|---|
R1-2503279 | UE features for NR MIMO Phase 5 | Huawei, HiSilicon |
R1-2503305 | UE features for NR MIMO Phase 5 | MediaTek Inc. |
R1-2503386 | Discussion on UE features for NR MIMO Phase 5 | vivo |
R1-2503400 | NR MIMO Phase 5 UE features | Nokia |
R1-2503592 | UE features for NR MIMO Phase 5 | Samsung |
R1-2503673 | Discussion on UE features for NR MIMO Phase 5 | ZTE Corporation, Sanechips |
R1-2503741 | Views on UE features for NR MIMO Phase 5 | Ofinno |
R1-2503754 | UE features for NR MIMO Phase 5 | Ericsson |
R1-2503782 | Further discussion on UE features for NR MIMO Phase 5 | CATT |
R1-2503851 | Discussion on UE features for NR MIMO Phase 5 | CMCC |
R1-2503901 | Discussion on UE features for NR MIMO Phase 5 | Xiaomi |
R1-2504232 | UE features for NR MIMO Phase 5 | OPPO |
R1-2504353 | Views on UE features for NR MIMO Phase 5 | Apple |
R1-2504370 | Summary of UE features for NR MIMO Phase 5 | Moderator (AT&T) |
R1-2504420 | UE features for NR MIMO phase 5 | Qualcomm Incorporated |
R1-2504524 | Discussion on UE features for NR MIMO Phase 5 | NTT DOCOMO, INC. |
R1-2504926 | Session Notes of AI 9.15.2 | Ad-Hoc Chair (AT&T) |
TDoc | Title | Source |
---|---|---|
R1-2503264 | UE features for evolution of NR duplex operation | Huawei, HiSilicon |
R1-2503333 | Discussion on UE features for Rel-19 SBFD | ZTE Corporation, Sanechips |
R1-2503387 | Discussion on UE features for evolution of NR duplex operation: SBFD | vivo |
R1-2503401 | SBFD UE features | Nokia |
R1-2503444 | Discussion on UE features for evolution of NR duplex operation | MediaTek Inc. |
R1-2503533 | Discussion on UE features for evolution of NR duplex operation: SBFD | Spreadtrum, UNISOC |
R1-2503593 | UE features for Rel-19 Duplex Evolution for NR | Samsung |
R1-2503742 | Discussion on Rel-19 NR UE features for evolution of NR duplex operation | Ofinno |
R1-2503783 | UE features for SBFD | CATT |
R1-2503852 | Discussion on UE features for evolution of NR duplex operation: SBFD | CMCC |
R1-2503902 | UE features for SBFD | Xiaomi |
R1-2504212 | Discussion on UE features for Rel-19 NR Duplex | OPPO |
R1-2504354 | Views on UE features for Rel-19 SBFD | Apple |
R1-2504421 | UE features for evolution of NR duplex operation | Qualcomm Incorporated |
R1-2504525 | Discussion on UE features for evolution of NR duplex operation | NTT DOCOMO, INC. |
R1-2504614 | UE features for SBFD | Ericsson |
R1-2504657 | Summary of discussion on Rel-19 NR UE features for SBFD | Moderator (NTT DOCOMO, INC.) |
R1-2504658 | Session Notes of AI 9.15.3 | Ad-Hoc Chair (NTT DOCOMO, INC.) |
R1-2504801 | Summary#2 of discussion on Rel-19 NR UE features for SBFD | Moderator (NTT DOCOMO, INC.) |
R1-2504840 | Summary#3 of discussion on Rel-19 NR UE features for SBFD | Moderator (NTT DOCOMO, INC.) |
TDoc | Title | Source |
---|---|---|
R1-2503236 | Discussion of Rel-19 NES UE Features | FUTUREWEI |
R1-2503270 | UE features for Rel-19 NES | Huawei, HiSilicon |
R1-2503322 | Discussion on NES features | ZTE Corporation, Sanechips |
R1-2503388 | Discussion on UE features for enhancements of network energy savings for NR | vivo |
R1-2503402 | Network Energy Saving Enhancement UE features | Nokia |
R1-2503594 | UE features for enhancements of network energy savings for NR | Samsung |
R1-2503784 | Discussion on UE features for Rel-19 NES | CATT |
R1-2503853 | Discussion on UE features for enhancements of network energy savings for NR | CMCC |
R1-2503903 | UE features for NES enhancements | Xiaomi |
R1-2504021 | UE features for R19 NES | Ericsson |
R1-2504057 | Discussion on UE features for Rel-19 Network Energy Saving | China Telecom |
R1-2504195 | Discussion on UE features for enhancements of network energy savings for NR | OPPO |
R1-2504256 | Discussion on UE features for enhancements of NES | LG Electronics |
R1-2504355 | Views on UE features for Rel-19 NES | Apple |
R1-2504371 | Summary of UE features for enhancements of network energy savings for NR | Moderator (AT&T) |
R1-2504422 | UE features for Rel-19 NES | Qualcomm Incorporated |
R1-2504526 | Discussion on UE features for eNES | NTT DOCOMO, INC. |
R1-2504927 | Session Notes of AI 9.15.4 | Ad-Hoc Chair (AT&T) |
TDoc | Title | Source |
---|---|---|
R1-2503293 | UE features for Rel-19 LP-WUS | Huawei, HiSilicon |
R1-2503323 | Discussion on WUR features | ZTE Corporation, Sanechips |
R1-2503389 | UE feature for Rel-19 LP-WUS/WUR | vivo |
R1-2503403 | LP-WUS/WUR UE features | Nokia |
R1-2503595 | Discussion on UE features for LP-WUS/WUR | Samsung |
R1-2503785 | LP-WUS/WUR UE feature | CATT |
R1-2503854 | Discussion on UE features for low-power wake-up signal and receiver for NR | CMCC |
R1-2503904 | UE features for NR LP-WUS/WUR | Xiaomi |
R1-2504022 | UE features for Rel-19 LP-WUS/WUR WI | Ericsson |
R1-2504190 | Discussion for UE features of LP-WUS/WUR | OPPO |
R1-2504257 | UE features for LP-WUS/WUR for NR | LG Electronics |
R1-2504356 | On Rel-19 LP-WUS/WUR UE features | Apple |
R1-2504423 | UE features for LP-WUS/WUR for NR | Qualcomm Incorporated |
R1-2504485 | UE features for LP-WUS/WUR for NR | MediaTek Inc. |
R1-2504527 | Discussion on UE features for LP-WUS/WUR for NR | NTT DOCOMO, INC. |
R1-2504659 | Summary of discussion on Rel-19 NR UE features for LP-WUS/WUR | Moderator (NTT DOCOMO, INC.) |
R1-2504660 | Session Notes of AI 9.15.5 | Ad-Hoc Chair (NTT DOCOMO, INC.) |
R1-2504841 | Summary#2 of discussion on Rel-19 NR UE features for LP-WUS/WUR | Moderator (NTT DOCOMO, INC.) |
TDoc | Title | Source |
---|---|---|
R1-2503260 | UE features for NR mobility enhancements phase 4 | Huawei, HiSilicon |
R1-2503390 | Discussion on UE features for NR mobility enhancements Phase 4 | vivo |
R1-2503404 | NR mobility enhancements Phase 4 UE features | Nokia |
R1-2503596 | UE features for NR mobility enhancements Phase 4 | Samsung |
R1-2503674 | Discussion on UE features for NR mobility enhancements Phase 4 | ZTE Corporation, Sanechips |
R1-2503810 | Discussion on UE features for NR mobility enhancements Phase 4 | CATT |
R1-2503855 | Discussion on UE features for NR mobility enhancements Phase 4 | CMCC |
R1-2503905 | Discussion on UE features for NR mobility enhancements Phase 4 | Xiaomi |
R1-2504185 | UE features for NR mobility enhancements phase 4 | Ericsson |
R1-2504234 | Discussion on UE features for NR mobility enhancements | OPPO |
R1-2504372 | Summary of UE features for NR mobility enhancements Phase 4 | Moderator (AT&T) |
R1-2504424 | UE features for NR mobility enhancement Phase 4 | Qualcomm Incorporated |
R1-2504528 | Discussion on UE features for NR mobility enhancemens Phase4 | NTT DOCOMO, INC. |
R1-2504928 | Session Notes of AI 9.15.6 | Ad-Hoc Chair (AT&T) |
TDoc | Title | Source |
---|---|---|
R1-2503289 | UE feature for R19 XR | Huawei, HiSilicon |
R1-2503324 | Discussion on XR features | ZTE Corporation, Sanechips |
R1-2503391 | Discussion on Rel-19 UE features for XR for NR Phase 3 | vivo |
R1-2503411 | UE features for XR for NR Phase 3 | Nokia |
R1-2503597 | UE features for XR for NR Phase 3 | Samsung |
R1-2504215 | Discussion on UE features for Rel-19 XR | OPPO |
R1-2504425 | UE features for Rel-19 XR for NR Phase3 | Qualcomm Incorporated |
R1-2504529 | Discussion on UE features for Rel-19 XR enhancements | NTT DOCOMO, INC. |
R1-2504621 | UE features for XR enhancements Phase 3 | Ericsson |
R1-2504661 | Summary of discussion on Rel-19 NR UE features for XR Phase 3 | Moderator (NTT DOCOMO, INC.) |
R1-2504662 | Session Notes of AI 9.15.7 | Ad-Hoc Chair (NTT DOCOMO, INC.) |
R1-2504802 | Summary#2 of discussion on Rel-19 NR UE features for XR Phase 3 | Moderator (NTT DOCOMO, INC.) |
TDoc | Title | Source |
---|---|---|
R1-2503285 | UE features for NTN for NR phase 3 | Huawei, HiSilicon |
R1-2503306 | On UE features for NR-NTN Phase 3 | Ericsson |
R1-2503392 | Discussion on UE features for NTN for NR Phase 3 | vivo |
R1-2503405 | NR-NTN phase 3 UE features | Nokia |
R1-2503534 | Discussion on UE features for NTN | Spreadtrum, UNISOC |
R1-2503598 | UE features for NTN for NR Phase 3 | Samsung |
R1-2503640 | Discussion on the UE feature for NR-NTN Phase-3 | ZTE Corporation, Sanechips |
R1-2503856 | Discussion on UE features for UE features for NTN for NR Phase 3 | CMCC |
R1-2503906 | UE features for NTN for NR Phase 3 | Xiaomi |
R1-2504196 | Discussion on UE features for NTN for NR Phase 3 | OPPO |
R1-2504357 | On Rel-19 NR-NTN UE Features | Apple |
R1-2504426 | UE features for NR NTN | Qualcomm Incorporated |
R1-2504530 | Discussion on UE features for Rel-19 NR NTN | NTT DOCOMO, INC. |
R1-2504663 | Summary of discussion on Rel-19 NR UE features for NR-NTN Phase 3 | Moderator (NTT DOCOMO, INC.) |
R1-2504664 | Session Notes of AI 9.15.8 | Ad-Hoc Chair (NTT DOCOMO, INC.) |
R1-2504842 | Summary#2 of discussion on Rel-19 NR UE features for NR-NTN Phase 3 | Moderator (NTT DOCOMO, INC.) |
TDoc | Title | Source |
---|---|---|
R1-2503286 | UE features for IoT-NTN Phase 3 | Huawei, HiSilicon |
R1-2503307 | On UE features for IoT-NTN Phase 3 | Ericsson |
R1-2503393 | Discussion on UE features for NTN for IoT Phase 3 | vivo |
R1-2503406 | NTN for Internet of Things (IoT) Phase 3 UE features | Nokia |
R1-2503599 | UE features for NTN for Internet of Things (IoT) Phase 3 | Samsung |
R1-2503641 | Discussion on the UE feature for IoT-NTN Phase-3 | ZTE Corporation, Sanechips |
R1-2503857 | Discussion on UE features for NTN for IoT Phase 3 | CMCC |
R1-2503907 | UE features for NTN for Internet of Things (IoT) Phase 3 | Xiaomi |
R1-2504197 | Discussion on UE features for NTN for Internet of Things Phase 3 | OPPO |
R1-2504279 | UE Features IoT NTN Ph3 | MediaTek Inc. |
R1-2504358 | On Rel-19 IoT-NTN UE Features | Apple |
R1-2504427 | UE features for IOT NTN | Qualcomm Incorporated |
R1-2504665 | Summary of discussion on Rel-19 LTE UE features for IoT-NTN Phase 3 | Moderator (NTT DOCOMO, INC.) |
R1-2504666 | Session Notes of AI 9.15.9 | Ad-Hoc Chair (NTT DOCOMO, INC.) |
R1-2504866 | Summary#2 of discussion on Rel-19 LTE UE features for IoT-NTN Phase 3 | Moderator (NTT DOCOMO, INC.) |
TDoc | Title | Source |
---|---|---|
R1-2503287 | UE features for IoT-NTN TDD mode | Huawei, HiSilicon |
R1-2503394 | Discussion on UE features for IoT-NTN TDD mode | vivo |
R1-2503407 | NTN for Internet of Things (IoT) TDD mode UE features | Nokia |
R1-2503600 | UE features for IoT-NTN TDD mode | Samsung |
R1-2503642 | Discussion on the UE feature for IoT-NTN TDD | ZTE Corporation, Sanechips |
R1-2503908 | Discussion on UE features for IoT-NTN TDD mode | Xiaomi |
R1-2504198 | Discussion on UE features for IoT-NTN TDD mode | OPPO |
R1-2504359 | On Rel-19 IoT-NTN TDD mode UE Features | Apple |
R1-2504428 | UE features for IOT-NTN TDD Mode | Qualcomm Incorporated |
R1-2504531 | Discussion on UE features for for IoT-NTN TDD mode | NTT DOCOMO, INC. |
R1-2504577 | On R19 TDD IoT-NTN features | Nordic Semiconductor ASA |
R1-2504667 | Summary of discussion on Rel-19 LTE UE features for IoT-NTN TDD mode | Moderator (NTT DOCOMO, INC.) |
R1-2504668 | Session Notes of AI 9.15.10 | Ad-Hoc Chair (NTT DOCOMO, INC.) |
TDoc | Title | Source |
---|---|---|
R1-2503272 | UE features for Rel-19 MCE | Huawei, HiSilicon |
R1-2503334 | Discussion on UE features for Rel-19 MCE | ZTE Corporation, Sanechips |
R1-2503395 | Discussion on UE features for MCE for NR Phase 3 | vivo |
R1-2503408 | NR Multi-carrier Enhancements Phase 3 UE features | Nokia |
R1-2503535 | Discussion on UE features for MCE | Spreadtrum, UNISOC |
R1-2503601 | UE features for multi-carrier enhancements | Samsung |
R1-2503608 | UE features for MCE for NR Phase 3 | Ericsson |
R1-2503658 | Discussion on UE feature for Rel-19 Multi-Carrier Enhancements | Lenovo (Rapporteur) |
R1-2504218 | Discussion on UE feature for multi-cell scheduling with a single DCI | OPPO |
R1-2504277 | MCE phase 2 UE features | MediaTek Inc. |
R1-2504360 | On UE features for Rel-19 multi-carrier enhancements | Apple |
R1-2504429 | UE features for MCE for NR Phase 2 | Qualcomm Incorporated |
R1-2504532 | Discussion on UE features for multi-cell PUSCH/PDSCH scheduling with a single DCI | NTT DOCOMO, INC. |
R1-2504669 | Summary of discussion on Rel-19 NR UE features for MCE for NR Phase 3 | Moderator (NTT DOCOMO, INC.) |
R1-2504670 | Session Notes of AI 9.15.11 | Ad-Hoc Chair (NTT DOCOMO, INC.) |
R1-2504867 | Summary#2 of discussion on Rel-19 NR UE features for MCE for NR Phase 3 | Moderator (NTT DOCOMO, INC.) |
TDoc | Title | Source |
---|---|---|
R1-2503274 | UE features for low band CA via switching | Huawei, HiSilicon |
R1-2503326 | UE features for low band CA via switching | TELUS |
R1-2503335 | Discussion on UE features for Rel-19 low band carrier via switching | ZTE Corporation, Sanechips |
R1-2503396 | Discussion on UE features for Low band carrier aggregation via switching | vivo |
R1-2503409 | LB-CA switching UE features | Nokia |
R1-2503602 | UE features for low band CA via switching | Samsung |
R1-2503659 | Discussion on UE feature for low band CA via switching | Lenovo |
R1-2504219 | Discussion on UE feature for low-band CA via switching | OPPO |
R1-2504361 | On UE features for Rel-19 low band carrier aggregation via switching | Apple |
R1-2504430 | UE features for low band CA via switching | Qualcomm Incorporated |
R1-2504441 | UE-features for low band carrier aggregation through switching | Ericsson |
R1-2504484 | UE features for low band CA via switching | MediaTek Inc. |
R1-2504533 | Discussion on UE features for Low band carrier aggregation via switching | NTT DOCOMO, INC. |
R1-2504671 | Summary of discussion on Rel-19 NR UE features for low band CA via switching | Moderator (NTT DOCOMO, INC.) |
R1-2504672 | Session Notes of AI 9.15.12 | Ad-Hoc Chair (NTT DOCOMO, INC.) |
TDoc | Title | Source |
---|---|---|
R1-2503250 | UE features for LTE based 5G broadcast Phase 2 | Huawei, HiSilicon |
R1-2503336 | Discussion on UE features for Rel-19 LTE based 5G broadcast | ZTE Corporation, Sanechips |
R1-2503603 | UE features for LTE-based 5G broadcast | Samsung |
R1-2504373 | Summary of UE features for LTE based 5G broadcast Phase 2 | Moderator (AT&T) |
R1-2504431 | UE features for LTE based 5G Broadcast | Qualcomm Incorporated |
R1-2504651 | UE feature list for Rel-19 LTE-based 5G Broadcast after RAN1#120 | EBU |
R1-2504929 | Session Notes of AI 9.15.13 | Ad-Hoc Chair (AT&T) |
TDoc | Title | Source |
---|---|---|
R1-2503410 | TEI UE features | Nokia |
R1-2503604 | UE features for Rel-19 TEI | Samsung |
R1-2504278 | TEI19 UE features | MediaTek Inc., Nokia, Apple, Ericsson, NTT DOCOMO, Orange |
R1-2504362 | Clarification on UE feature for Rel-19 TEI SRSCS_ULTxSwitch | Apple |
R1-2504374 | Summary of UE features for Rel-19 TEI and other relevant issues | Moderator (AT&T) |
R1-2504534 | Discussion on UE features for Rel-19 TEI | NTT DOCOMO, INC. |
R1-2504578 | UE features for Rel-19 TEI | EBU |
R1-2504647 | UE features for CSI-RS active resource counting | Huawei, HiSilicon |
R1-2504930 | Session Notes of AI 9.15.14 | Ad-Hoc Chair (AT&T) |
TDoc | Title | Source |
---|---|---|
R1-2504834 | RAN1 leadership’s tribute to Patrick Merias | RAN1, Ericsson |
R1-2504835 | Thank You Patrick e-book | RAN1, Ericsson |
R1-2504836 | Thank You Younsun e-book | RAN1, Ericsson |
R1-2504837 | RAN1 Style tribute to Younsun Kim | RAN1, Ericsson |